JP2016165746A - Manufacturing method of joint structure, joint structure, and laser device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser device which inhibits energy loss in laser processing, and to provide a joint structure manufactured by using the laser device and a manufacturing method of the joint structure.SOLUTION: A manufacturing method of a joint structure includes a joint step in which a second member (a resin member 3) is placed to face a first member (a metal member 2) and joined thereto. The manufacturing method of the joint structure includes a recessed part formation step in which a recessed part o, which is to be filled with the second member, is formed on a joint surface BP in the first member before the joint step. The recessed part formation step is performed in a state that the first member (the metal member 2) is rotating so that the joint surface BP of the first member (the metal member 2) is arranged perpendicular to a radiation direction of a processing laser 11a which forms the recessed part o in the first member (the metal member 2).SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for manufacturing a bonded structure, a bonded structure, and a laser device.

  Conventionally, Patent Document 1 is known as a document describing a three-dimensional laser processing machine.

  Patent Document 1 discloses a three-dimensional laser processing machine that performs high-precision laser processing on a workpiece by setting the focal position of laser light applied to the workpiece to a predetermined position. 3D shape measuring device that measures the 3D shape of the 3D laser processing that sets the focal position of the laser beam based on the 3D shape data of the workpiece measured by the 3D shape measuring device A machine is disclosed.

  According to this three-dimensional laser processing machine, laser processing is performed by setting the distance between the laser beam and the workpiece based on the three-dimensional shape data of the workpiece measured by the three-dimensional shape measuring instrument. Can do.

JP 2014-133248 A

  However, when the workpiece is laser processed with the three-dimensional laser processing machine of Patent Document 1, there are the following disadvantages. This point will be described below with reference to FIGS. 15A and 15B. FIG. 15A is a schematic diagram illustrating a conventional laser processing method, and FIG. 15B is an explanatory diagram illustrating a workpiece processed by the conventional laser processing method.

  In the laser processing method of Patent Document 1, when the laser irradiation surface of the workpiece 200 is, for example, the convex surface 210, when the laser light from the processing laser L is irradiated toward the workpiece 200, the reflected light R is reflected by the convex surface 210. Occurs. When the reflected light R is generated in this way, an energy loss corresponding to the reflected light R occurs, so that there is a problem that the processing depth of the concave portion 220 of the workpiece 200 is processed to be shallower than the setting.

  The present invention has been made in view of the above points, and its object is to provide a laser device capable of suppressing energy loss in laser processing, and a bonded structure manufactured using the laser device, Another object of the present invention is to provide a method for manufacturing the joined structure.

  In order to achieve the above object, the present invention is configured as follows.

  The method for manufacturing a bonded structure according to the present invention is a method for manufacturing a bonded structure including a bonding process in which a second member is opposed to a first member and bonded to the first member. A concave portion forming step of forming a concave portion filled with the second member on a joint surface of one member is provided, and the concave portion forming step is a processing laser for forming a concave portion on the first member. The first member is rotated so that the bonding surface of the first member is perpendicular to the irradiation direction.

  Moreover, it is a manufacturing method of the said joining structure, Comprising: The said laser irradiation may be performed, adjusting a focus position with respect to the joint surface of a said 1st member.

  Further, in the manufacturing method of the bonded structure, the bonding step is such that the bonding surface is perpendicular to the irradiation direction of a bonding laser for bonding the first member and the second member. The first member and the second member may be rotated.

  Moreover, it is a manufacturing method of the said joining structure, Comprising: A convex shape may be sufficient as the surface facing the said 2nd member in a said 1st member.

  Moreover, it is a manufacturing method of the said junction structure, Comprising: In the said recessed part formation process, you may form the said recessed part by irradiating the laser with which 1 pulse consists of several subpulses.

  Moreover, it is a manufacturing method of the said joining structure, Comprising: A metal, a thermoplastic resin, or a thermosetting resin may be used for the said 1st member.

  In the method for manufacturing the bonded structure, a resin that transmits a laser may be used for the second member.

  The bonded structure according to the present invention is manufactured by the method for manufacturing a bonded structure.

  The laser apparatus according to the present invention includes a laser that irradiates a laser beam toward the irradiated member, and a rotating unit that rotates the irradiated member so that the irradiated member is perpendicular to the irradiation direction of the laser. The laser is characterized in that one pulse irradiates a plurality of sub-pulses.

  ADVANTAGE OF THE INVENTION According to this invention, the laser apparatus which can suppress energy loss in laser processing, the junction structure manufactured using this laser apparatus, and the manufacturing method of this junction structure can be provided.

It is explanatory drawing explaining the structure of the laser apparatus based on this invention. It is explanatory drawing explaining the recessed part formation process in the manufacturing method of the joining structure which concerns on this invention. It is explanatory drawing explaining the recessed part formation process in the manufacturing method of the joining structure which concerns on this invention. It is explanatory drawing explaining the joining process in the manufacturing method of the joining structure which concerns on this invention. It is explanatory drawing explaining the joining process in the manufacturing method of the joining structure which concerns on this invention. It is explanatory drawing explaining the joining process in the manufacturing method of the joining structure which concerns on this invention. It is explanatory drawing explaining the joining process in the manufacturing method of the joining structure which concerns on this invention. It is a perspective view of the junction structure concerning the present invention. It is explanatory drawing explaining the recessed part formation process in the manufacturing method of the other joining structure which concerns on this invention. It is explanatory drawing explaining the recessed part formation process in the manufacturing method of the other joining structure which concerns on this invention. It is explanatory drawing explaining the joining process in the manufacturing method of the other joined structure which concerns on this invention. It is explanatory drawing explaining the joining process in the manufacturing method of the other joined structure which concerns on this invention. It is explanatory drawing explaining the joining process in the manufacturing method of the other joined structure which concerns on this invention. It is a perspective view of the other junction structure concerning the present invention. It is a schematic diagram which shows the conventional laser processing method. It is explanatory drawing explaining the to-be-processed object processed with the conventional laser processing method.

  Hereinafter, after describing an embodiment of a laser device according to the present invention, an embodiment of a method for manufacturing a bonded structure using the laser device will be described. In addition, description of the joining structure which concerns on this invention replaces with this by description of the manufacturing method of a joining structure.

  FIG. 1 is an explanatory diagram for explaining a configuration of a laser device, FIGS. 2 and 3 are explanatory diagrams for explaining a concave portion forming process, FIGS. 4 to 7 are explanatory diagrams for explaining a joining process, and FIG. It is a perspective view of a junction structure.

[Laser device]
The laser apparatus 10 according to the present invention includes a laser that irradiates a target member with laser, a scanning unit 12, a position adjusting unit 13, and a rotating unit 14 (see FIG. 1).

  The irradiated member is, for example, a first member (metal member 2) or a second member (resin member 3) in the case of a bonded structure according to the present invention described later.

As an example of the laser, a processing laser 11a for processing the metal member 2 can be given. As the type of the processing laser 11a, a fiber laser, a YAG laser, a YVO ₄ laser, a semiconductor laser, a carbon dioxide gas laser, or an excimer laser can be selected. Considering the wavelength of the laser, a fiber laser, a YAG laser, a second harmonic of a YAG laser, a YVO ₄ laser, and a semiconductor laser are preferable. Further, a laser capable of pulse oscillation may be used according to the processing shape of the metal member 2, and one pulse may be composed of a plurality of subpulses.

  The scanning unit 12 scans the laser beam irradiated from the processing laser 11a in the horizontal direction (X direction and Y direction in FIG. 1) with respect to the irradiation surface of the irradiated member (metal member 2 or resin member 3). It is. As an example, there is a means for scanning the irradiated member in the horizontal direction using a galvano mirror and a telecentric fθ lens. That is, by operating the galvanometer mirror, the laser beam is reflected within a scanning range A (see FIG. 1) that can be scanned by the galvanometer mirror, and the laser beam is perpendicular to the irradiation surface of the irradiated member by the collimation lens. Can be irradiated. The laser scanning may be performed by the position adjusting unit 13 as described later.

  The position adjusting means 13 adjusts the focal position of the laser beam from the processing laser 11a. In the present embodiment, the focal position of the laser beam is adjusted by operating a stage 14a described later in the vertical direction. Further, the position adjusting means 13 is not limited to the vertical operation, and the stage 14a may be operated in the horizontal direction. Thereby, even if it is the range exceeding the scanning range A of a galvanometer mirror, a laser beam can be irradiated perpendicularly | vertically with respect to the irradiation surface in a to-be-irradiated member. The position adjusting means 13 is not limited to the above-described form, and the processing laser 11a itself may be operated in the vertical or horizontal direction.

  The rotating means 14 rotates the irradiated member so that the irradiated member (metal member 2 or resin member 3) is perpendicular to the irradiation direction of the laser beam emitted from the processing laser 11a. A stage 14a on which the irradiated member is placed and a rotating shaft 14b for rotating the stage 14a are provided (see FIG. 1). In the illustrated example, the rotation shaft 14b can be rotated around the X axis and can also be rotated around the Y axis. The rotating unit 14 and the position adjusting unit 13 may be controlled so as to perform laser processing by irradiating a laser at a desired position in synchronization with the scanning speed of the scanning unit 12 described above.

As described above, the laser device 10 according to the present invention has been described with respect to the embodiment in which the laser is the processing laser 11a (FIG. 1). However, as a modified example of the laser, the laser 11 for bonding is used instead of the processing laser 11a. (See FIG. 5). In this case, the bonding laser 11b is, for example, a fiber laser, a YAG laser, a YVO ₄ laser, a semiconductor laser, a carbon dioxide laser, or an excimer laser.

[Method of manufacturing joined structure]
Two embodiments of the method for manufacturing a bonded structure according to the present invention will be described.

-First embodiment-
The manufacturing method of the bonded structure according to the present embodiment is a method of manufacturing a bonded structure in which the second member is opposed to the first member and bonded, and includes a concave portion forming step and a bonding step. .

  The first member is the metal member 2, and examples of the metal include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof. Moreover, a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.

  The surface of the first member (metal member 2) that faces a second member (resin member 3) described later has a convex shape. The convex shape of this embodiment is a curved surface.

  The 2nd member is the flexible resin member 3 which permeate | transmits a laser, and is a thermoplastic resin or a thermosetting resin. Examples of thermoplastic resins include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile styrene), ABS (acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP ( Polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF (polysulfone) ), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyethersulfone), PEEK (polyetheretherketone), PAI ( Riamidoimido), LCP (liquid crystal polymer), PVDC (polyvinylidene chloride), PTFE (polytetrafluoroethylene), PCTFE (polychlorotrifluoroethylene), and include PVDF (poly (vinylidene fluoride)) it is. TPE (thermoplastic elastomer) may also be used, and examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.

  Examples of thermosetting resins include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone) Is mentioned. Further, it may be FRP (fiber reinforced plastic).

  Note that a filler may be added to the thermoplastic resin and the thermosetting resin. Examples of the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.

  The second member (resin member 3) is preferably made of a material that transmits laser light when the laser beam is irradiated from above the resin member 3 in the joining step described later. The transmittance is 3 mm. Sometimes it is preferably 15% or more. On the other hand, in the joining process described later, when the laser beam is irradiated from below the resin member 3, the resin member 3 may not have laser transparency.

  A surface (bonding surface BP) facing the metal member 2 in the resin member 3 has a concave shape corresponding to the curved surface of the metal member 2 described above.

  Hereinafter, each process of the manufacturing method of the junction structure concerning this embodiment is explained.

-Concave part formation process A concave part formation process is a process of forming the concave part o by which the resin member 3 is filled in the joint surface BP in the metal member 2, and uses the laser apparatus 10 provided with the processing laser 11a. Done. As an example of the processing laser 11a, an Omron fiber laser marker MXZ2000 or MX-Z2050 can be cited.

  First, the metal member 2 is placed on the stage 14a (see FIG. 1). In this embodiment, first, the concave portion o is formed by the position adjusting means 13 in order to form the concave portion o on the joint surface BP of the metal member 2 at a position exceeding the scanning range A of the scanning means 12. The stage 14a is moved so that the position falls within the scanning range A.

  Next, the stage 14a is rotated by the rotating shaft 14b so that the laser beam from the processing laser 11a is irradiated perpendicularly to the joint surface BP of the metal member 2 by the rotating shaft 14b (see FIG. 2).

  Next, the position adjusting means 13 adjusts the position of the focal point of the laser light emitted from the processing laser 11 a to the joint surface BP of the metal member 2. That is, the stage 14a is moved up and down.

  And the pulsed light (preferably subpulsed light) is irradiated to the position which forms the recessed part o in the metal member 2 as a laser beam from the processing laser 11a.

  Here, in the fiber laser marker made from OMRON, it is possible to irradiate the laser beam which 1 pulse consists of several subpulses. For this reason, the energy of the laser beam is easily concentrated in the depth direction, which is suitable for forming the concave portion o.

  Specifically, when the metal member 2 is irradiated with laser light, the metal member 2 is locally melted to advance the formation of the concave portion o. At this time, since the laser beam is composed of a plurality of sub-pulses, the molten metal member 2 is not easily scattered and easily deposited in the vicinity of the concave portion o. Then, as the formation of the concave portion o proceeds, the molten metal member 2 is deposited inside the concave portion o, so that a protruding portion t protruding inward is formed on the inner peripheral surface of the concave portion o. .

  In the present embodiment, the projecting portion t is formed at a position near the opening of the concave portion o, but may be formed at the opening end depending on the processing conditions by the fiber laser marker, or may be near the bottom of the concave portion o. It may be formed.

  As a processing condition by the fiber laser marker, it is preferable that one period of the sub-pulse is 15 ns or less. This is because when one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it becomes difficult to form the concave portion o having the protruding portion t. Note that one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.

  Further, as a processing condition by the fiber laser marker, the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because if the number of subpulses exceeds 50, the output per unit of subpulses becomes small, and it becomes difficult to form the concave portion o having the protruding portion t.

  The opening diameter of the concave portion o is preferably 30 μm or more and 100 μm or less. This is because if the opening diameter is less than 30 μm, the laser beam from the irradiated bonding laser 11b (see FIG. 4) is not sufficiently confined in the concave portion o in the bonding step described later, and the energy of the laser beam is reduced. This is because the conversion efficiency for conversion into heat may be reduced. On the other hand, if the opening diameter exceeds 100 μm, the number of concave portions o per unit area decreases, and conversion efficiency for converting the energy of the laser light into heat may decrease.

  Moreover, it is preferable that the depth of the recessed part o is 10 micrometers or more. This is because if the depth is less than 10 μm, the conversion efficiency for converting the energy of laser light from the bonding laser 11b described later into heat may be reduced. In the present embodiment, the processing depth of the concave portion o is 43 μm to 45 μm.

  After forming the first concave portion o, the second concave portion o is formed in the metal member 2. Here, when the position formed by the second concave portion o is within the scanning range A, as described above, the stage 14a is rotated by the rotating shaft 14b and moved up and down by the position adjusting means 13, The concave portion o is formed. On the other hand, if not within the scanning range A, after the stage 14a is moved into the scanning range A by the position adjusting means 13, the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 as described above. The concave portion o is formed by raising and lowering.

The above-described steps are repeated for the number of the concave portions o to be formed (FIG. 3 schematically illustrates a state in which the third concave portion o is formed).
Here, the interval between the concave portions o (the distance between the center of the predetermined concave portion o and the center of the concave portion o adjacent to the predetermined concave portion o) is preferably 200 μm or less. This is because when the interval between the concave portions o exceeds 200 μm, the number of the concave portions o per unit area decreases, and the conversion efficiency for converting the energy of laser light from the bonding laser 11b described later into heat decreases. This is because there are cases. An example of the lower limit of the interval between the concave portions o is a distance at which the concave portions o are not overlapped and crushed. Moreover, it is preferable that the interval of the recessed part o is an equal interval. This is because when the concave portions o are equally spaced, the heat distribution when the bonding laser is irradiated becomes isotropic.

  As described above, in the concave portion forming step, since the concave portion forming step can irradiate the laser beam in the direction perpendicular to the laser light irradiation surface (bonding surface BP) in the metal member 2, as shown in FIG. 15B. Unlike the prior art, the metal member 2 can be processed while suppressing energy loss corresponding to reflected light.

  In the present embodiment, the term “perpendicular to the bonding surface BP of the metal member 2” does not require the angle between the bonding surface BP and the laser light to be strictly 90 °, and is in the range of 80 ° to 100 °. I just need it. If it is the said range, the energy loss equivalent to reflected light can be reduced.

  Further, according to the concave portion forming step of the present embodiment, since the focal position is adjusted by the position adjusting means 13, processing variations due to the shift of the focal length can be reduced.

  An example of the processing conditions of the processing laser in the concave portion forming step will be described below.

<Processing conditions for processing laser>
Laser: Fiber laser (wavelength 1062nm)
Frequency: 10kHz
Output: 3.8W
Scanning speed: 650mm / sec
Number of scans: 40 times Irradiation interval: 65 μm
Number of subpulses: 20

Bonding process The bonding process is a process of bonding the metal member 2 and the resin member 3 to each other, and is performed using a laser apparatus including the bonding laser 11b described above.

  In the present embodiment, a mode in which the metal member 2 and the resin member 3 are laser bonded will be described. However, the present invention is not limited to this mode, and the resin member 3 is heated and melted with a heater or the like, or the metal member 2 is bonded. For example, a method of insert molding using a mold that accommodates the material may be used.

  Further, as a method of laser joining of the metal member 2 and the resin member 3, heat is transmitted to the resin member 3 in contact with the metal member 2 by heating the metal member 2 with the joining laser 11b, and the resin member. And a method in which the resin member 3 itself is heated and melted by the bonding laser 11b and bonded to the metal member 2.

  In the present embodiment, the laser beam from the bonding laser 11b is irradiated to the bonding surface BP between the translucent resin member 3 and the metal member 2, and the metal member 2 is heated to come into contact with the metal member 2. A method of transferring heat to the existing resin member 3 and melting and bonding the resin member 3 will be described.

  First, the resin member 3 is placed on the joint surface BP of the metal member 2 placed on the stage 14a (see FIG. 4). First, in order to fill the resin member 3 into the concave portion o of the metal member 2 at a position exceeding the scanning range A (see FIG. 5) of the scanning means 12, the position where the concave portion o is formed by the position adjusting means 13 The stage 14a is moved so that is within the scanning range A.

  Next, the stage 14a is rotated by the rotating shaft 14b so that the laser beam from the bonding laser 11b is irradiated perpendicularly to the bonding surface BP of the metal member 2 by the rotating shaft 14b (see FIG. 6).

  Next, the position adjustment means 13 adjusts the focal position of the laser light emitted from the bonding laser 11 b to the bonding surface BP of the metal member 2. That is, the stage 14a is moved up and down.

  Then, the laser beam from the bonding laser 11b is irradiated to the position where the concave portion o in the metal member 2 is formed by continuous oscillation.

  By irradiating the joint surface BP between the resin member 3 and the metal member 2 with laser light, the energy of the laser light is converted into heat inside the metal member 2 and the surface temperature of the metal member 2 is increased. Thereby, the resin member 3 in the vicinity of the surface of the metal member 2 is melted, and the resin member 3 is filled in the concave portion o. In the present embodiment, since the laser beam from the bonding laser 11b is scanned by the scanning unit 12 and the laser beam is continuously oscillated, the heat in the metal member 2 is prevented from diffusing and the temperature is lowered, and the efficiency is improved. The temperature of the metal member 2 can be increased by storing heat.

  After the first concave portion o is filled with the resin member 3, the second concave portion o is filled with the resin member 3. Here, when the position of the second concave portion o is within the scanning range A, as described above, the stage 14a is rotated by the rotating shaft 14b and moved up and down by the position adjusting means 13 to form a concave shape. The portion o is filled with the resin member 3. On the other hand, if not within the scanning range A, after the stage 14a is moved into the scanning range A by the position adjusting means 13, the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 as described above. The concave member o is filled with the resin member 3 by moving up and down.

The above-described steps are repeated for the number of the concave portions o (FIG. 7 schematically illustrates a state where the third concave portion o is filled with the resin member 3).
In this way, in the joining step, the metal member 2 and the resin member 3 are reflected by filling the resin member 3 into the concave portion o formed in the direction perpendicular to the joining surface BP in the concave portion forming step. A bonded structure 1 (see FIG. 8) bonded with suppressing energy loss due to light can be manufactured.

  In addition, since the focal position of the laser beam is adjusted by the position adjusting means 13 while the concave portion o is filled with the resin member 3, the bonded structure 1 in which the bonding variation due to the shift of the focal length is reduced is manufactured. be able to.

  Further, since the resin member 3 is filled in the concave portion o formed in the direction perpendicular to the bonding surface BP, the direction in which the concave portion o as in the prior art of FIG. 15B is formed is one direction. An anchor effect can be heightened compared with what is prepared. Therefore, it is possible to manufacture the bonded structure 1 in which the bonding strength between the metal member 2 and the resin member 3 is improved. This will be described in detail in the experimental example of the first embodiment.

  An example of irradiation conditions of the bonding laser in the bonding process is described below.

<Laser irradiation conditions for bonding>
Laser: Semiconductor laser (wavelength 808 nm)
Oscillation mode: Continuous oscillation output: 30W
Focal diameter: 4mm
Scanning speed: 1mm / sec
Contact pressure: 0.6 MPa

-Experimental example of the first embodiment-
Next, the evaluation of the bonding strength performed to confirm the effect of the first embodiment described above will be described while comparing the examples according to the present invention and the comparative examples. In addition, as for the joining structure of an Example and the joining structure of a comparative example, the material of the resin member was PMMA, and the material of the metal member was SUS304.

  In the Example which concerns on this invention, the recessed part formation process mentioned above and the joining process were performed, and the joining structure was manufactured (for example, refer FIG. 6).

  In the comparative example, in the above-described concave portion forming step, the processing laser is not irradiated perpendicularly to the joint surface of the metal member (see, for example, FIGS. 15A and 15B). That is, as described in FIGS. 15A and 15B, the bonded structure of the comparative example generates reflected light R when the metal member is irradiated with laser light. The energy of the laser light corresponding to the reflected light R is generated. Therefore, the concave portion of the metal member is processed shallower than the setting.

  Moreover, in the joint structure of the comparative example, the direction in which each concave portion is formed is aligned in one direction. That is, the formation angle of the concave portion with respect to the joint surface in the metal member is not constant.

  Evaluation of the joint strength of the joint structure according to the above-described example and the joint structure according to the comparative example was performed by a thermal shock test using a thermal shock apparatus TSD-100 manufactured by ESPEC. Specifically, a thermal shock of one cycle of 1 hour, 30 minutes in an environment of −40 ° C. and 30 minutes in an environment of 85 ° C., was continuously applied to the examples and comparative examples until the bonding interface reached peeling.

  The confirmation of whether or not the bonding interface had been peeled was performed after applying thermal shocks of 100, 250, 500, 750, 1000, and 1500 cycles (times), respectively. And when the joining interface reached peeling in a certain cycle, the cycle in which peeling of the previous joining interface was not confirmed was adopted as the thermal shock test resistance. For example, when peeling of the bonding interface was confirmed after 1000 thermal shocks were applied, the previous 750 times were regarded as thermal shock test resistance. Table 1 shows the thermal shock test resistance obtained for the examples and comparative examples.

  From the above evaluation results, it was confirmed that the bonded structures of the examples according to the present invention were peeled after 1500 cycles of the thermal shock test, and thus the thermal shock test resistance was 1000 cycles.

  On the other hand, the bonded structure of the comparative example was confirmed to be peeled after 500 cycles of the thermal shock test, and thus the thermal shock test resistance was 250 cycles.

  From the above, it was confirmed that the bonded structure according to the present invention has improved thermal shock test resistance as compared with the prior art.

-Second Embodiment-
A second embodiment of the method for manufacturing a joined structure will be described with reference to FIGS. 9 and 10 are explanatory views for explaining a concave portion forming step in the method for manufacturing a joined structure, FIGS. 11 to 13 are explanatory views for explaining a joining step in the method for producing a joined structure, and FIG. It is a perspective view of a junction structure.

  Since the present embodiment is different from the first embodiment described above only in the shapes of the metal member and the resin member, the following describes matters related to the differences, and the same components are denoted by the same reference numerals. A description thereof will be omitted.

  The manufacturing method of the bonded structure according to the present embodiment is a method of manufacturing a bonded structure in which the second member is opposed to the first member and bonded, and includes a concave portion forming step and a bonding step. .

  A surface (bonding surface BP ′) that faces a second member (resin member 3 ′), which will be described later, in the first member (metal member 2 ′) has a convex shape. A bulged rectangular bulging portion B ′ is provided. Further, the side peripheral surface of the bulging portion B ′ is an inclined surface TP ′.

  The surface of the resin member 3 ′ facing the metal member 2 ′ has a concave shape corresponding to the bulging portion B ′ of the metal member 2 ′ described above.

  Hereinafter, each process of the manufacturing method of the junction structure concerning this embodiment is explained.

-Concave part formation process First, metal member 2 'is mounted in the stage 14a of the rotation means 14. As shown in FIG. In this embodiment, first, the concave portion o is formed by the position adjusting means 13 in order to form the concave portion o on the joint surface BP ′ of the metal member 2 ′ at a position exceeding the scanning range A of the scanning means 12. The stage 14a is moved so that the position to be formed falls within the scanning range A.

  Next, the stage 14a is rotated by the rotating shaft 14b so that the laser beam from the processing laser 11a is irradiated perpendicularly to the joint surface BP of the metal member 2 'by the rotating shaft 14b (see FIG. 9). . In the present embodiment, first, in order to form the concave portion o in the substantially horizontal plane of the metal member 2 ′, the stage 14a is moved by the rotating shaft 14b so that the laser beam is irradiated perpendicularly to the metal member 2 ′. Make fine adjustments.

  Next, the position adjusting means 13 adjusts the focal position of the laser light emitted from the processing laser 11a to the bonding surface BP ′ of the metal member 2 ′. That is, the stage 14a is moved up and down.

  Then, pulse light (preferably sub-pulse light) is irradiated as laser light from the processing laser 11a to a position where the concave portion o in the metal member 2 ′ is formed.

  After forming the first concave portion o, the second concave portion o is formed in the metal member 2 ′. Here, when the position formed by the second concave portion o is within the scanning range of the scanning means, as described above, the stage 14a is rotated by the rotating shaft 14b and moved up and down by the position adjusting means 13. Then, the concave portion o is formed. On the other hand, if not within the scanning range, after the stage 14a is moved into the scanning range by the position adjusting means 13, the stage 14a is rotated by the rotating shaft 14b and moved up and down by the position adjusting means 13 as described above. Thus, the concave portion o is formed.

  The above-described steps are repeated for the number of the concave portions o to be formed (FIG. 10 schematically illustrates a state in which the second concave portion o is formed).

-Joining process A joining process is a process of joining metal member 2 'and resin member 3' mutually, and is performed using a laser device provided with laser 11b for joining mentioned above.

  In the present embodiment, the laser beam from the bonding laser 11b is applied to the bonding surface BP ′ between the translucent resin member 3 ′ and the metal member 2 ′, and the metal member 2 ′ is heated to thereby heat the metal member 2 ′. A method for transferring heat to the resin member 3 ′ in contact with ′ and melting and bonding the resin member 3 ′ will be described.

  First, the resin member 3 ′ is placed on the joint surface BP ′ of the metal member 2 ′ placed on the stage 14a (see FIG. 11). First, the resin member 3 'is filled in the concave portion o of the metal member 2' at a position beyond the scanning range of the scanning means 12, so that the position where the concave portion o is formed by the position adjusting means 13 is within the scanning range. The stage 14a is moved to enter.

  Next, the stage 14a is rotated by the rotating shaft 14b so that the rotating shaft 14b irradiates the laser beam from the bonding laser 11b perpendicularly to the bonding surface BP ′ of the metal member 2 ′. In the present embodiment, first, in order to fill the resin member 3 ′ into the substantially horizontal concave portion o of the metal member 2 ′, the stage 14 a is irradiated with the laser beam perpendicularly to the resin member 3 ′. Is finely adjusted by the rotating shaft 14b (see FIG. 12).

  Next, the position adjusting means 13 adjusts the focal position of the laser beam emitted from the bonding laser 11b on the bonding surface BP ′ of the metal member 2 ′. That is, the stage 14a is moved up and down.

  Then, the laser beam from the bonding laser 11b is irradiated by continuous oscillation to a position where the concave portion o in the metal member 2 ′ is formed.

  By irradiating the bonding surface BP ′ between the resin member 3 ′ and the metal member 2 ′ with the laser beam from the bonding laser 11 b, the energy of the laser beam is converted into heat inside the metal member 2 ′. The surface temperature of ′ becomes high. Thereby, the resin member 3 ′ in the vicinity of the surface of the metal member 2 ′ is melted, and the resin member 3 ′ is filled in the concave portion o.

  After the first concave portion o is filled with the resin member 3 ′, the second concave portion o is filled with the resin member 3 ′. Here, when the position of the second concave portion o is within the scanning range of the scanning means, as described above, the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 is moved up and down. The resin member 3 is filled in the concave portion o. On the other hand, if not within the scanning range, after the stage 14a is moved into the scanning range by the position adjusting means 13, the stage 14a is rotated by the rotating shaft 14b and moved up and down by the position adjusting means 13 as described above. Then, the concave member o is filled with the resin member 3 '.

  The above-described steps are repeated for the number of the concave portions o (FIG. 13 schematically illustrates a state where the second concave portion o is filled with the resin member 3 ′).

  As described above, in the bonding step, the metal member 2 ′ and the resin member 3 ′ are filled by filling the resin member 3 ′ in the concave portion o formed in the direction perpendicular to the bonding surface BP ′ in the concave portion formation step. Can be manufactured (see FIG. 14).

  The above-described embodiments and examples of the present invention are all examples of the present invention, and are not of a nature that limits the technical scope of the present invention. For example, the first member may be a thermoplastic resin or a thermosetting resin, and the second member may be a metal.

DESCRIPTION OF SYMBOLS 10 Laser apparatus 11a Processing laser 11b Joining laser 12 Scanning means 13 Position adjusting means 14 Rotating means 14a Stage 14b Rotating shaft 2 Metal member 3 Resin member O Concave part t Protruding part BP Joint surface B Swelling part TP Inclined surface

Claims (9)

A method for manufacturing a joined structure including a joining step of joining a first member with a second member facing each other,
Before performing the joining step, a concave portion forming step of forming a concave portion filled with the second member on the joining surface of the first member is provided,
The concave portion forming step is performed by rotating the first member so that the joining surface of the first member is perpendicular to the irradiation direction of the processing laser for forming the concave portion on the first member. The manufacturing method of the joining structure characterized by the above-mentioned. A method for manufacturing a joined structure according to claim 1,
The method of manufacturing a joined structure, wherein the laser irradiation is performed while adjusting a focal position with respect to a joining surface of the first member. It is a manufacturing method of the joined structure according to claim 1 or 2,
In the joining step, the first member and the second member are rotated so that the joining surface becomes perpendicular to the irradiation direction of the joining laser for joining the first member and the second member. The manufacturing method of the junction structure characterized by the above-mentioned. It is a manufacturing method of the joined structure given in any 1 paragraph of Claims 1-3,
The method of manufacturing a joined structure, wherein a surface of the first member facing the second member is a convex shape. It is a manufacturing method of the joined structure given in any 1 paragraph of Claims 1-4,
In the concave portion forming step, the concave portion is formed by irradiating a laser in which one pulse is composed of a plurality of subpulses. It is a manufacturing method of the joined structure given in any 1 paragraph of Claims 1-5,
A metal, a thermoplastic resin, or a thermosetting resin is used for said 1st member, The manufacturing method of the joining structure characterized by the above-mentioned. It is a manufacturing method of the joined structure given in any 1 paragraph of Claims 1-6,
A method of manufacturing a bonded structure, wherein the second member is made of a resin that transmits laser.   The joining structure manufactured by the manufacturing method of the joining structure described in any one of Claims 1-7. A laser that emits laser light toward the irradiated member;
Rotating means for rotating the irradiated member so that the irradiated member is perpendicular to the laser irradiation direction;
Is provided,
In the laser apparatus, one pulse irradiates a plurality of sub-pulses.

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