JP2016163026A - High-temperature superconducting coil - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-temperature superconducting coil capable of improving anti-deterioration performance of a thin film tape wire by means of a metal plate provided to the outermost periphery of a pancake coil.SOLUTION: A superconducting coil 10 includes: a pancake coil 11 which is constituted of a laminate of a wound thin film superconducting tape wire including at least superconducting layer; a flexible conductive reinforcement wire 13 which is stuck on the outer surface 12 at the outermost periphery of the pancake coil 11; and a metal plate 14 which is stuck being bridged across two neighboring reinforcement wires 13 in the plural pancake coils 11 piled up in a winding axial direction A.SELECTED DRAWING: Figure 3

Description

  Embodiments of the present invention relate to a high-temperature superconducting coil using a high-temperature superconducting wire composed of laminated thin layers and formed into a tape shape.

In recent years, research on high-temperature superconducting coils using a high-temperature superconducting wire typified by REBCO wire using (RE) Ba ₂ Cu ₃ O ₇ including rare earth (RE) has been actively conducted.

In particular, a high temperature superconducting wire (hereinafter referred to as “thin film tape wire”) produced by forming a plurality of types of layers on a substrate having a thickness of about 100 μm has a large current capacity under a high magnetic field. There is.
Therefore, realization of a high-temperature superconducting coil having a high current density and a high allowable stress necessary for generating a high magnetic field is expected.
The methods for forming high-temperature superconducting coils that are put into practical use can be broadly classified into several groups depending on the method of winding the thin film tape wire.

A typical example of these forming methods is a method of stacking a plurality of pancake coils in which thin film tape wires are concentrically wound in the winding axis direction to form one high-temperature superconducting coil.
Adjacent pancake coils are electrically connected with either one of the innermost circumference or the outermost circumference with a metal plate installed in a stepwise manner.
All pancake coils stacked by this metal plate form one path through which the superconducting current flows.

The thin film tape wire is also characterized in that the superconducting properties are not lost even when a high external force is applied in the longitudinal direction of the tape.
On the other hand, this thin film tape wire is fragile to the external force applied in the stacking direction of the plurality of layers described above, and easily deteriorates the superconducting characteristics with a small external force.
For example, when a bending stress is locally applied to the thin film tape wire, peeling of the layer or breaking of the layer easily occurs, and the superconducting characteristics are deteriorated.
Conventionally, a device has been devised to prevent the thin film tape wire from being unnecessarily distorted by fixing an electrode connected to the starting end of the thin film tape wire to the reel (for example, see Patent Document 1).

JP 2010-98267 A

However, when a metal plate is installed on the thin film tape wire, there is a problem that the thin film tape wire around the periphery of the metal plate deteriorates.
The stress applied to the thin film tape line becomes discontinuous at the periphery of the metal plate which is the boundary between the portion where the metal plate is joined and the portion where the metal plate is not joined.
In this case, the stress is concentrated around the periphery because the vicinity of the periphery of the thin film tape line is slightly deformed.

As described above, since the thin film tape wire is vulnerable to the stress in the layer stacking direction, the stress may cause the thin film tape wire to peel off or break.
In other words, when a metal plate is installed on the thin film tape wire, the thin film tape wire around the periphery of the metal plate may be deteriorated due to thermal stress when soldering the metal plate or stress concentration during cooling. .
Such deterioration becomes remarkable particularly when the stabilization layer bonded to the uppermost layer or the lowermost layer of the laminate is formed thin.

  The present invention has been made in consideration of such circumstances, and an object of the present invention is to provide a high-temperature superconducting coil having improved deterioration resistance performance of a thin film tape wire by installing a metal plate on the outermost periphery of the pancake coil.

  The high-temperature superconducting coil according to the present embodiment is bonded to a pancake coil formed by winding a thin film superconducting tape wire composed of a laminate including at least a high-temperature superconducting layer, and an outermost surface of the pancake coil. A flexible conductor reinforcing wire, and a metal plate laid on the reinforcing wire bonded to two adjacent pancake coils stacked in the winding axis direction, and Is provided.

  According to the present invention, there is provided a high temperature superconducting coil having improved deterioration resistance performance of a thin film tape wire by installing a metal plate on the outermost periphery of the pancake coil.

The composition perspective view of a general thin film tape line. The cross-sectional perspective view of the high temperature superconducting coil concerning 1st Embodiment. The perspective view of the stacked pancake coil used for the high temperature superconducting coil concerning 1st Embodiment. (A) is a side view which shows the suitable example of the reinforcing wire seen from the winding axis direction, (B) is a side view which shows the modification of the reinforcing wire seen from the winding axis direction. (A) is a front view showing an example of the shape of the reinforcing wire seen from the radial direction, (B) is a front view showing a modification of the shape of the reinforcing wire seen from the radial direction, and (C) is a diagram of the reinforcing wire seen from the radial direction. The front view which shows the modification of a shape, (D) is a front view which shows the modification of the shape of the reinforcing wire seen from radial direction. The perspective view of the modification of the stacked pancake coil used for the high temperature superconducting coil concerning 1st Embodiment. The expanded sectional view which looked at the construction location of the metal plate of the high temperature superconducting coil concerning 2nd Embodiment from the winding axis direction. The cross-sectional perspective view of the bismuth-type superconducting wire used as a reinforcing wire in 2nd Embodiment. The expanded sectional view which looked at the installation location of the metal plate of the high temperature superconducting coil concerning 3rd Embodiment from the winding axis direction. The cross-sectional perspective view of the modification of the thin film tape wire used with the high temperature superconducting coil concerning 3rd Embodiment. The upper surface sectional view of the pancake coil which constitutes the high temperature superconducting coil concerning a 4th embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
First, the structure of a tape-shaped high-temperature superconducting wire 20 having a layer structure (hereinafter referred to as “thin film tape wire 20”) will be described with reference to FIG.
FIG. 1 is a structural perspective view of a general thin film tape wire 20.
The thin film tape wire 20 is a wire material such as a REBCO wire material including a high-temperature superconducting layer 25 made of RE oxide (hereinafter referred to as “superconducting layer 25”).

The thin film tape wire 20 is caused by, for example, a substrate 22 made of a high-strength metal material such as a nickel base alloy, stainless steel, or copper, and a thermal contraction of the substrate 22 and the superconducting layer 25 formed on the substrate 22. An intermediate layer 24 for preventing thermal distortion, an alignment layer 23 made of magnesium or the like for aligning the intermediate layer 24 on the surface of the substrate 22, a superconducting layer 25 made of an oxide formed on the intermediate layer 24, silver And a protective layer 26 that protects the superconducting layer 25 by preventing oxygen contained in the superconducting layer 25 from diffusing from the superconducting layer 25, and a highly conductive metal such as copper or aluminum. And a stabilizing layer 21 that serves as a detour path for excess superconducting current to the superconducting layer 25 and prevents the quenching phenomenon.
However, the kind and number of each layer which comprise the thin film tape wire | line 20 are not limited to this, You may increase or decrease as needed.

(First embodiment)
FIG. 2 is a cross-sectional perspective view of the high-temperature superconducting coil 10 (hereinafter simply referred to as “superconducting coil 10”) according to the first embodiment.
FIG. 3 is a perspective view of the stacked pancake coils 11 used in the superconducting coil 10 according to the first embodiment.
In FIG. 2, the reel 19 shown in FIG. 3 is omitted.

  As shown in FIGS. 1 to 3, the superconducting coil 10 according to the first embodiment is wound with a thin film superconducting tape wire 20 (thin film tape wire 20) composed of a laminate 40 including at least the superconducting layer 25. A pancake coil 11, a flexible conductor reinforcing wire 13 bonded to the outermost outer surface 12 of the pancake coil 11, and a plurality of pancake coils stacked in the winding axis direction A 11, and a metal plate 14 installed on the reinforcing wire 13 bonded to two adjacent ones.

A plurality of pancake coils 11 are insulated in the winding axis direction A by an insulator (not shown) or the like and stacked.
The stacked pancake coils 11 are usually fixed by flanges 16 from both ends in the winding axis direction A.
A lead electrode 17 is connected to the pancake coil 11 in contact with the flange 16, and the superconducting current I flowing through the pancake coil 11 flows in or out.

Adjacent pancake coils 11 are electrically connected with either one of the innermost circumference or the outermost circumference with a metal plate 14 installed in a stepwise manner.
The metal plate 14 is a metal suitably composed of, for example, indium, copper, silver, gold, or an alloy thereof.
With this metal plate 14, all the stacked pancake coils 11 form one path through which the superconducting current I flows.

That is, for example, the superconducting current I flowing from the lead electrode 17 connected to the innermost periphery of the pancake coil 11 flows while circulating the pancake coil 11 from the inner periphery toward the outer periphery.
The superconducting current I that has reached the outermost periphery of the pancake coil 11 flows into the outermost periphery of the adjacent pancake coil 11 by the metal plate 14.
The superconducting current I flowing into the pancake coil 11 flows while circulating from the outer periphery toward the inner periphery.
The superconducting current I that has reached the innermost periphery of the pancake coil 11 flows into the adjacent pancake coil 11 from the metal plate 14 provided on the inner surface 18 of the innermost periphery.

The metal plate 14 is not directly bonded to the outer surface 12 of the thin film tape wire 20 but is bonded to the reinforcing wire 13 bonded to the outer surface 12 with solder or the like.
The reinforcing wire 13 is a wire suitably formed of, for example, indium, copper, silver, gold, or an alloy thereof like the metal plate 14.
Since the reinforcing wire 13 is thin and flexible, a layer that is deformed with the deformation of the thin film tape wire 20 is added.
That is, the reinforcing wire 13 has an effect of reinforcing the portion of the stabilization layer 21 that is normally the outer surface 12 by thickening the portion where the metal plate 14 is laid.

The wire width of the reinforcing wire 13 is preferably adjusted to be the same as or slightly narrower than the wire width of the thin film tape wire 20 so as not to protrude from the thin film tape wire 20.
This is to prevent local stress from being generated on the thin film tape wire 20 due to the portion protruding from the thin film tape wire 20 and short circuit to the adjacent pancake coil 11.
The wire width of the thin film tape wire 20 refers to the length in the winding axis direction A when the thin film tape wire 20 is used as the pancake coil 11.
Similarly, the wire width of the reinforcing wire 13 refers to the length in the winding axis direction A when the reinforcing wire 13 is bonded along the outermost periphery of the pancake coil 11.

On the other hand, the length of the reinforcing wire 13 in the circumferential direction B is adjusted to be longer than the length of the metal plate 14 in the circumferential direction B.
By extending the length of the reinforcing wire 13 in the circumferential direction B, the metal plate 14 is bonded with a wider contact area than directly joining the thin film tape wire 20.
By increasing the contact area, the connection resistance is reduced, and the stress applied to the thin film tape wire 20 at the connection portion is dispersed as will be described later.
The reinforcing wire 13 may cover the outer surface 12 once.

By the way, as described above, when the metal plate 14 is directly provided on the thin film tape wire 20, the external force applied to the periphery of the metal plate 14 generates stress unevenly distributed on the periphery of the metal plate 14.
Such uneven distribution of stress can occur in the end side 27 of the reinforcing wire 13 as well.
However, the reinforcing wire 13 used in the superconducting coil 10 is thinner in the radial direction C than the metal plate 14.

By making the reinforcing wire 13 thinner, the discontinuous steps due to the reinforcing wire 13 provided on the thin film tape wire 20 are reduced, and the connection shape between the thin film tape wire 20 and the reinforcing wire 13 becomes smooth.
By smoothing the connection shape, stress concentration around the edge 27 can be prevented.

Further, since the reinforcing wire 13 has flexibility, it deforms with the deformation of the thin film tape wire 20 and the reinforcing wire 13 does not restrain the thin film tape wire 20 as much as when the metal plate 14 is directly joined.
Therefore, the deterioration of the thin film tape wire 20 due to the end side 27 of the reinforcing wire 13 is significantly reduced as compared with the case where the metal plate 14 is directly joined.

Next, a suitable example of the reinforcing wire 13 will be described with reference to FIGS.
FIG. 4A is a side view showing a preferred example of the reinforcing wire 13 viewed from the winding axis direction A. FIG.
As shown in FIG. 4A, by providing a taper 28 on the end side 27 of the reinforcing wire 13 with respect to the radial direction C of the pancake coil 11, a more continuous and smooth connection shape can be obtained. it can.
FIG. 4B is a side view showing a modification of the reinforcing wire 13 viewed from the winding axis direction A. FIG.
As shown in FIG. 4B, the reinforcing wire 13 in contact with the outer surface 12 may be formed as a taper 28 by laminating a plurality of reinforcing wires 13 having the maximum surface area.

5A to 5D are front views showing examples of the shape of the reinforcing wire 13 viewed from the radial direction C. FIG.
It is desirable that the end side 27 of the reinforcing wire 13 be as long as possible to disperse the stress applied to the periphery of the end side 27.
Therefore, as shown in FIG. 5A, it is desirable to increase the length of the end side 27 by providing the end side 27 with a gradient that makes the angle θ from the winding axis direction A finite.

Further, as shown in FIG. 5B, the length of the end side 27 can be increased by projecting the central portion of the end side 27 so as to be the longest in the circumferential direction B.
Further, as shown in FIG. 5C, the end side 27 may have a curvature.
In addition, as shown in FIG. 5D, it may naturally be cut without an angle θ with respect to the winding axis direction A.

FIG. 6 is a perspective view of a modified example of the stacked pancake coils 11 used in the superconducting coil 10 according to the first embodiment.
Of the reinforcing wire 13, the part that becomes the flow path of the superconducting current I is particularly required to be protected by considering the shape of the end 27 and considering the bonding area.

For example, as shown in FIG. 6, the first reinforcing wire 13 a (13) provided in the first pancake coil 11 a (11) in the upper stage in the drawing is moved in front of the metal plate 14 with respect to the traveling direction of the superconducting current I and Consider the rear part divided into a first section E and a second section F, respectively.
Similarly, the second reinforcing wire 13b (13) provided in the second pancake coil 11b (11) connected to the first pancake coil 11a and the metal plate 14 is attached to the front and rear portions of the metal plate 14. Each is divided into a third section G and a fourth section H.

After the superconducting current I flows into the first section E, most of it flows out to the fourth section H via the metal plate 14.
Therefore, the superconducting current I hardly flows in the second section F and the third section G.
In other words, in the end sides 27 of the second section F and the third section G, even if the superconducting layer 25 or the like is somewhat broken, the influence on the superconducting characteristics of the superconducting coil 10 is small.

On the other hand, since the first section E and the fourth section H serve as a path for the superconducting current I, it is necessary to prevent the laminate 40 from being peeled off or broken due to the stress concentration around the edges 27. .
Therefore, the size and shape of these sections may be determined as necessary, for example, as shown in FIG.

  As described above, according to the superconducting coil 10 according to the first embodiment, the deterioration resistance performance of the thin film tape wire 20 by the construction of the metal plate 14 on the outermost periphery of the pancake coil 11 is improved, and the deterioration is prevented. Can do.

(Second Embodiment)
FIG. 7 is an enlarged cross-sectional view of the installation location of the metal plate 14 of the superconducting coil 10 according to the second embodiment when viewed from the winding axis direction A.

  As shown in FIG. 7, the reinforcing wire 13 of the superconducting coil 10 according to the second embodiment is a superconducting material in which the reduction ratio of the superconducting characteristics with respect to the peeling stress in the stacking direction of the laminate 40 is lower than that of the thin film tape wire 20. Tape wire 30 is used.

FIG. 8 is a cross-sectional perspective view of a bismuth-based superconducting wire 30A (30) used as the reinforcing wire 13 in the second embodiment.
In FIG. 8, a part of the tape-like bismuth superconducting wire 30A is cut in the longitudinal direction of the tape to show a cut section.
The superconducting tape wire 30 is, for example, the bismuth-based superconducting wire 30A shown in FIG.

The bismuth-based superconducting wire 30A is greatly different from the structure of the laminated thin film tape wire 20 and has a structure in which a plurality of superconducting filaments 32 are embedded in parallel in a silver matrix 31 as a base material.
In general, Bi ₂ Sr ₂ Ca ₂ Cu ₃ O ₁₀ or the like is used as the material of the superconducting filament 32.

Since the bismuth-based superconducting wire 30 </ b> A does not have a laminated structure, the allowable stress in the peeling direction C is larger than that of the thin film tape wire 20.
Therefore, it can be used as the reinforcing wire 13 in the form of a tape-shaped wire rod in accordance with the thin film tape wire 20.

Since the bismuth-based superconducting wire 30A is a superconducting wire, a current can flow at a low resistance at a very low temperature compared to the normal conductor exemplified in the first embodiment.
That is, even when the thin film tape wire 20 deteriorates at the portion where the bismuth-based superconducting wire 30A is bonded, the superconducting current I can be bypassed to the bismuth-based superconducting wire 30A.
Furthermore, unlike the thin film tape wire 20, the bismuth-based superconducting wire 30A does not include a high resistance layer such as the substrate 22 (FIG. 1).
That is, the superconducting current I can be traversed in the direction perpendicular to the superconducting filament 32 at a very low temperature with a lower electrical resistance than the thin film tape wire 20.

Since the second embodiment has the same structure and operation procedure as the first embodiment except that the bismuth-based superconducting wire 30A is used as the reinforcing wire 13, the redundant description is omitted.
Also in the drawings, portions having a common configuration or function are denoted by the same reference numerals, and redundant description is omitted.

  As described above, according to the superconducting coil 10 according to the second embodiment, the superconducting current I can be caused to flow into the metal plate 14 with a lower electric resistance in addition to the effects of the first embodiment.

(Third embodiment)
FIG. 9 is an enlarged cross-sectional view of the installation location of the metal plate 14 of the superconducting coil 10 according to the third embodiment when viewed from the winding axis direction A.

  As shown in FIGS. 9 and 1, the superconducting coil 10 according to the third embodiment has a side surface opposite to the superconducting layer 25 with respect to the substrate 22 among the side surfaces of the thin film tape wire 20 in the configuration of the first embodiment and the like. The reinforcing wire 13 is provided on 38 (hereinafter referred to as “back surface 38”).

Usually, other layers such as the superconducting layer 25 are formed on the surface of the substrate 22 in order to facilitate the formation of the layers.
That is, the thin film tape wire 20 that is usually the laminate 40 includes the substrate 22 as a layer.
The substrate 22 made of a normal conductor such as stainless steel and having a thick layer has a high electric resistance.

On the other hand, the other layers such as the stabilization layer 21 are thin and easily allow the superconducting current I flowing through the superconducting layer 25 to pass therethrough.
Therefore, current flows out from the side surface 39 of the thin film tape wire 20 on the same side as the superconducting layer 25 with respect to the substrate 22 (hereinafter, referred to as “surface 39”).
Therefore, normally, when the superconducting current I flows out to another conductor, this conductor is joined to the surface 39.

However, since the layers other than the substrate 22 such as the stabilization layer 21 are thin, the external force easily received is propagated to other layers.
In particular, when the thin film tape wire 20 in which the stabilization layer 21 is formed thin is used, the deterioration of the superconducting characteristics of the thin film tape wire 20 becomes remarkable.
Therefore, the thin film tape wire 20 is wound so that the back surface 38 becomes the outer surface 12 at the outermost periphery of the pancake coil 11, and the reinforcing wire 13 is joined to the back surface 38 of the thin film tape wire 20.
By joining the reinforcing wire 13 to the back surface 38, the substrate 22 can prevent the external force from being propagated to a layer where the stress concentrated around the edge 27 (FIG. 6 and the like) is easily peeled off or broken.

FIG. 10 is a cross-sectional perspective view of a modification of the thin film tape wire 20 used in the superconducting coil 10 according to the third embodiment.
In FIG. 10, the layers shown in FIG. 1 other than the superconducting layer 25, the substrate 22, and the stabilization layer 21 are omitted.

As shown in FIG. 10, a thin film tape wire 20 in which the outer periphery of the laminated body 40 excluding the stabilization layer 21 is covered with the stabilization layer 21 may be used.
By covering the outer periphery with the stabilization layer 21, the superconducting current I flowing through the superconducting layer 25 can flow through the stabilization layer 21 and bypass the substrate 22 to reach the back surface 38.
That is, by covering with the stabilization layer 21, the superconducting current I can flow into the metal plate 14 with lower electrical resistance than when the superconducting current I crosses the substrate 22 directly.

The third embodiment is the first embodiment except that the thin film tape wire 20 is wound so that the back surface 38 of the thin film tape wire 20 becomes the outer surface 12, and the reinforcing wire 13 is joined to the back surface 38. The same structure and operation procedure as those in FIG.
Also in the drawings, portions having a common configuration or function are denoted by the same reference numerals, and redundant description is omitted.

  Thus, according to the superconducting coil 10 according to the third embodiment, in addition to the effects of the first embodiment, the deterioration of the thin film tape wire 20 due to the provision of the reinforcing wire 13 can be further effectively prevented.

(Fourth embodiment)
FIG. 11 is a top sectional view of the pancake coil 11 constituting the superconducting coil 10 according to the fourth embodiment.

In the superconducting coil 10 according to the fourth embodiment, as shown in FIG. 11, an adhesive (not shown) is disposed in the gap between the opposing surfaces of the thin film tape wires 20 that are wound to oppose each other. The mold release process for suppressing the adhesive force to the facing surface is performed.
For example, a release layer 43 is formed on a part of the surface of the adhesive by applying a fluororesin tape, paraffin, grease, silicon oil, etc., and a part of the adhesive is easily released.

For example, when the superconducting current I flows through the superconducting coil 10 and a high magnetic field is generated, an external force is applied to the superconducting coil 10 outward in the radial direction C.
Further, when the superconducting coil 10 is cooled to a very low temperature, uneven stress may be generated due to the difference in thermal contraction of various members fixed to the thin film tape wire 20.

As described above, since the thin film tape wire 20 is very fragile to the stress in the peeling direction C (that is, the radial direction C), the superconducting characteristics are easily deteriorated by such stress.
Therefore, the adhesive is subjected to a release treatment so that it is constrained by adhesives having different thermal shrinkage rates and free heat shrinkage of the thin film tape wire 20 is hindered and unnecessary peeling stress is not generated in the thin film tape wire 20. Sometimes.

However, when the mold release process is performed, the degree of freedom of deformation of the pancake coil 11 is increased. Moreover, the rigidity of the pancake coil 11 also decreases as the mold release is repeated.
Therefore, the concentration of stress due to the deformation of the pancake coil 11 is more likely to occur on the periphery of the metal plate 14 by installing the metal plate 14.
Therefore, when using the pancake coil 11 subjected to such a release process, it is particularly effective to use the reinforcing wire 13 shown in the first to third embodiments.

Since the fourth embodiment has the same structure and operation procedure as the first embodiment except that the pancake coil 11 constituting the superconducting coil 10 is subjected to a mold release process, the redundant description is omitted. .
Also in the drawings, portions having a common configuration or function are denoted by the same reference numerals, and redundant description is omitted.

  As described above, according to the superconducting coil 10 according to the fourth embodiment, in addition to the effects of the first embodiment, the superconducting characteristics are reduced even in the pancake coil 11 which is subjected to the release process and has a high degree of freedom of deformation. Can be prevented.

  According to the superconducting coil 10 of at least one embodiment described above, the metal plate 14 is installed via the reinforcing wire 13, so that the thin film tape wire 20 by the installation of the metal plate 14 on the outermost periphery of the pancake coil 11. It becomes possible to improve the deterioration resistance.

Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention.
These embodiments can be implemented in various other forms, and various omissions, replacements, changes, and combinations can be made without departing from the scope of the invention.

For example, the reinforcing wire 13 and the metal plate 14 may be integrally formed.
These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 10 ... High temperature superconducting coil (superconducting coil), 11 ... Pancake coil, 11a (11) ... 1st pancake coil, 11b (11) ... 2nd pancake coil, 12 ... Outer surface, 13 (13a, 13b) ... Reinforcing wire (first reinforcing wire, second reinforcing wire), 14 ... metal plate, 16 ... flange, 17 ... lead electrode, 18 ... inner surface, 19 ... reel, 20 ... high temperature superconducting wire (thin film superconducting tape wire, thin film) Tape line), 21 ... stabilization layer, 22 ... substrate, 23 ... alignment layer, 24 ... intermediate layer, 25 ... high temperature superconducting layer (superconducting layer), 26 ... protective layer, 27 ... edge, 28 ... taper, 30 ( 30A) ... superconducting tape wire (bismuth-based superconducting wire), 31 ... silver matrix, 32 ... superconducting filament, 38 ... back surface, 39 ... surface, 40 ... laminate, 43 ... release layer, A ... winding axis direction, B ... Circumferential direction, C ... Diameter Direction (peeling direction), E ... first segment, F ... second interval, G ... third section, H ... fourth section, I ... supercurrent, theta ... angle.

Claims (15)

A pancake coil formed by winding a thin film superconducting tape wire composed of a laminate including at least a high-temperature superconducting layer;
A reinforcing wire of a flexible conductor that is bonded to the outermost outer surface of the pancake coil;
A high-temperature superconducting coil comprising: a metal plate laid on the reinforcing wire bonded to two adjacent pancake coils stacked in the winding axis direction. 2. The high-temperature superconducting coil according to claim 1, wherein an end side of the reinforcing wire is provided with a taper with respect to a radial direction of the pancake coil. The high-temperature superconducting coil according to claim 2, wherein the taper is formed by laminating a plurality of the reinforcing wires having a maximum surface area that is the reinforcing wire in contact with the outer surface. The high temperature superconducting coil according to any one of claims 1 to 3, wherein an end side of the reinforcing wire has a gradient with respect to a direction of the winding axis of the pancake coil. The high-temperature superconducting coil according to claim 3, wherein a circumferential length of the pancake coil of the reinforcing wire is longer than a circumferential length of the metal plate. 6. The superconducting tape wire according to claim 1, wherein the reinforcing wire is a superconducting tape wire in which a reduction ratio of superconducting properties with respect to peeling stress in the stacking direction of the laminate is lower than that of the thin film superconducting tape wire. The high-temperature superconducting coil described. The high-temperature superconducting coil according to claim 6, wherein the superconducting tape wire is a bismuth-based superconducting wire. The high-temperature superconducting coil according to any one of claims 1 to 7, wherein at least one of the material of the reinforcing wire and the metal plate is selected from at least one of indium, copper, silver, and gold. The high-temperature superconducting coil according to any one of claims 1 to 8, wherein the reinforcing wire has a thickness in a radial direction of the pancake coil that is smaller than that of the metal plate. The laminate includes a substrate as a layer,
10. The high-temperature superconducting coil according to claim 1, wherein the reinforcing wire is provided on a side surface of the thin film superconducting tape wire opposite to the high-temperature superconducting layer with respect to the substrate. An adhesive is placed in the gap between the opposing surfaces of the thin film superconducting tape wire that is wound and opposed,
The high-temperature superconducting coil according to any one of claims 1 to 10, wherein the adhesive is subjected to a release treatment for suppressing an adhesive force to the facing surface. The high-temperature superconducting coil according to claim 11, wherein the release treatment is performed by forming a release layer composed of at least one selected from the group consisting of fluororesin tape, paraffin, grease, and silicon oil. The high-temperature superconducting coil according to any one of claims 1 to 12, wherein one metal plate and one reinforcing wire are integrally formed. The layers at both ends of the laminate are stabilization layers composed of normal conductors,
The high-temperature superconducting coil according to any one of claims 1 to 13, wherein the stabilizing layers at both ends are electrically connected to each other. The high-temperature superconducting coil according to any one of claims 1 to 14, wherein the metal plate and the reinforcing wire are integrally formed.

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