JP2016157752A5 - - Google Patents
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- Publication number
- JP2016157752A5 JP2016157752A5 JP2015033418A JP2015033418A JP2016157752A5 JP 2016157752 A5 JP2016157752 A5 JP 2016157752A5 JP 2015033418 A JP2015033418 A JP 2015033418A JP 2015033418 A JP2015033418 A JP 2015033418A JP 2016157752 A5 JP2016157752 A5 JP 2016157752A5
- Authority
- JP
- Japan
- Prior art keywords
- laminated film
- flexible wiring
- breaking stress
- wiring board
- mpa
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015033418A JP6403095B2 (ja) | 2015-02-23 | 2015-02-23 | フレキシブル配線用基板およびフレキシブル配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015033418A JP6403095B2 (ja) | 2015-02-23 | 2015-02-23 | フレキシブル配線用基板およびフレキシブル配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016157752A JP2016157752A (ja) | 2016-09-01 |
| JP2016157752A5 true JP2016157752A5 (cg-RX-API-DMAC7.html) | 2017-06-22 |
| JP6403095B2 JP6403095B2 (ja) | 2018-10-10 |
Family
ID=56826490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015033418A Active JP6403095B2 (ja) | 2015-02-23 | 2015-02-23 | フレキシブル配線用基板およびフレキシブル配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6403095B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6904195B2 (ja) * | 2017-09-22 | 2021-07-14 | 住友金属鉱山株式会社 | フレキシブル配線基板及びその製造方法 |
| JP6904194B2 (ja) * | 2017-09-22 | 2021-07-14 | 住友金属鉱山株式会社 | 配線基板用積層体及びその製造方法 |
| JP7550599B2 (ja) * | 2020-10-14 | 2024-09-13 | 日東電工株式会社 | 金属層、導電性フィルム、および、金属層の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008149772A1 (ja) * | 2007-06-08 | 2008-12-11 | Mitsui Mining & Smelting Co., Ltd. | 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置 |
| JP5391366B2 (ja) * | 2011-06-28 | 2014-01-15 | 古河電気工業株式会社 | 電解銅箔、該電解銅箔を使用した配線板及びフレキシブル配線板 |
| WO2013161507A1 (ja) * | 2012-04-24 | 2013-10-31 | 住友金属鉱山株式会社 | ２層フレキシブル配線用基板及びフレキシブル配線板並びにそれらの製造方法 |
| JP5769030B2 (ja) * | 2012-04-26 | 2015-08-26 | 住友金属鉱山株式会社 | 金属化樹脂フィルムおよびその製造方法 |
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2015
- 2015-02-23 JP JP2015033418A patent/JP6403095B2/ja active Active