JP2016143839A - Electronic component built-in multilayer wiring board and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the need for a mold process to achieve simplification of the manufacturing process and construction material and concurrently improve the flatness and reliability of a substrate.SOLUTION: An electronic component built-in multilayer wiring board includes: a multilayer wiring board formed by laminating first printed wiring boards; a first electronic component mounted on the multilayer wiring board; and a lamination body formed by second printed wiring boards laminated on the multilayer wiring board. The lamination body includes a first opening part which is closed at an upper side so as to seal the first electronic component mounted on the multilayer wiring board.SELECTED DRAWING: Figure 1

Description

  TECHNICAL FIELD The present invention relates to an electronic component built-in multilayer wiring board that incorporates electronic components and a method for manufacturing the same, and more particularly to an electronic component built-in multilayer wiring board that can simplify the manufacturing process and constituent materials and the method for manufacturing the same.

  As an electronic component built-in multilayer wiring board having a built-in electronic component and modularized, for example, one disclosed in Patent Document 1 below is known. Such a multilayer wiring board with built-in electronic components accommodates electronic components by providing openings in, for example, a printed wiring board corresponding to an intermediate layer. Moreover, after mounting electronic components by soldering or the like, a molding process such as underfill or resin sealing is performed. And after that, a manufacturing process such as singulation is performed and manufactured. Therefore, it is manufactured by combining various processes and materials.

JP 2011-211099 A

  The multilayer electronic circuit board with a built-in electronic component as described above is required to have reflow resistance multiple times in order to withstand, for example, repeated heat history. For this reason, the affinity between each member such as the base material and the sealing resin, the electronic component and the sealing resin, the electronic component and the underfill material, and the underfill material and the base material, that is, the matching of the thermal expansion coefficients and the materials It is necessary to improve compatibility such as adhesion.

  For this reason, work such as material selection and manufacturing process condition determination is required on a trial and error basis, and it has been difficult to simplify the manufacturing process including the molding process and the constituent materials of the entire substrate. In addition, when a process design including a plurality of thermal histories is performed, the number of manufacturing processes for the entire substrate increases and the constituent materials and the like are diverse, so it is difficult to improve the flatness of the substrate and improve the reliability. .

  The present invention eliminates the problems caused by the prior art described above, eliminates the molding process, simplifies the manufacturing process and simplifies the constituent materials, and improves the flatness and reliability of the substrate. An object of the present invention is to provide a multilayer wiring board and a manufacturing method thereof.

  An electronic component built-in multilayer wiring board according to the present invention includes a multilayer wiring board configured by laminating a plurality of first printed wiring boards, a first electronic component mounted on the multilayer wiring board, and the multilayer. A laminated body composed of a plurality of second printed wiring boards stacked on the wiring board, and the laminated body seals the first electronic component mounted on the multilayer wiring board inside. It has the 1st opening part by which upper direction was closed, It is characterized by the above-mentioned.

  According to the multilayer wiring board with built-in electronic components according to the present invention, the upper layer is closed so that the laminated body laminated on the multilayer wiring board seals the first electronic component mounted on the multilayer wiring board inside. The first opening is provided. This eliminates the need for a separate molding step for sealing the first electronic component, which can greatly simplify the manufacturing process and reduce the thermal history to increase reliability. Become.

  In an embodiment of the present invention, the first opening is formed in accordance with a mounting position and a mounting height of the first electronic component on the multilayer wiring board.

  In another embodiment of the present invention, the multilayer wiring board includes a second opening, and a second electronic component is built in the second opening.

  In still another embodiment of the present invention, the laminate is laminated in an electrically non-connected state with the multilayer wiring board.

  In still another embodiment of the present invention, the first electronic component includes a dummy component that is not electrically connected to the multilayer wiring board. Thereby, the flatness of the substrate can be improved.

  In still another embodiment of the present invention, the first and second printed wiring boards have the insulating layer, the wiring layer, and the adhesive layer formed of materials of the same type or the same characteristics. Thereby, simplification of a constituent material can be achieved.

  A method of manufacturing a multilayer wiring board with built-in components according to the present invention includes a step of manufacturing a plurality of first and second printed wiring boards, and a multilayer wiring board formed by laminating a plurality of manufactured first printed wiring boards. A step of forming, and a step of forming a first opening capable of sealing the first electronic component in a predetermined second printed wiring board among the plurality of second printed wiring boards manufactured, The predetermined second printed wiring board is stacked in the first opening so that the first electronic component can be accommodated, and at least one second printed wiring board is placed in the first opening. Laminating so as to block the part, producing a laminate, mounting the first electronic component on the multilayer wiring board, and on the multilayer wiring board on which the first electronic component is mounted, The first electronic part in the first opening And stacking the multilayer wiring board and the stacked body together by thermocompression bonding so that the first electronic component is sealed inside the first opening. And a step of performing.

  According to the method for manufacturing an electronic component built-in multilayer wiring board according to the present invention, the same operational effects as those of the electronic component built-in multilayer wiring board according to the present invention can be obtained.

  In one embodiment of the present invention, in the step of manufacturing the multilayer wiring board, a second electronic component can be accommodated in a predetermined first printed wiring board of the plurality of first printed wiring boards. After the second opening is formed, the plurality of first printed wiring boards are collectively laminated by thermocompression bonding with the second electronic component built in the second opening.

  In another embodiment of the present invention, in the batch stacking step, the stacked body is thermocompression bonded in a state where it is not electrically connected to the multilayer wiring board.

  According to the present invention, the laminated body laminated on the multilayer wiring board has the first opening whose top is closed so as to seal the first electronic component mounted on the multilayer wiring board inside. Since it is provided, a molding process for sealing the first electronic component is not required, and the manufacturing process can be simplified and the reliability can be improved.

It is sectional drawing which shows the structure of the multilayer wiring board with a built-in electronic component which concerns on the 1st Embodiment of this invention. It is a flowchart which shows the manufacturing process of the same electronic component built-in multilayer wiring board. It is a flowchart which shows the manufacturing process of the electronic component built-in module board in the same electronic component built-in multilayer wiring board. It is a flowchart which shows the manufacturing process of the laminated body in the same electronic component built-in multilayer wiring board. It is sectional drawing which shows the manufacturing process of the electronic component built-in module board | substrate in the multilayer wiring board with a built-in electronic component. It is sectional drawing which shows the manufacturing process of the laminated body in the same electronic component built-in multilayer wiring board. It is a disassembled perspective view of the laminated body in the same electronic component built-in multilayer wiring board. It is sectional drawing which shows the manufacturing process of the same electronic component built-in multilayer wiring board. It is sectional drawing which shows the manufacturing process of the component built-in multilayer wiring board based on the 2nd Embodiment of this invention. It is sectional drawing which shows the structure of the multilayer wiring board with a built-in component which concerns on the 3rd Embodiment of this invention.

  Hereinafter, a multilayer wiring board with built-in electronic components and a method for manufacturing the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]
FIG. 1 is a cross-sectional view showing a structure of a multilayer wiring board 1 with built-in electronic components according to a first embodiment of the present invention, and FIG. 2 is a flowchart showing manufacturing steps of the multilayer wiring board 1 with built-in electronic components. FIG. 3 is a flowchart showing a manufacturing process of the electronic component built-in module substrate 100 in the electronic component built-in multilayer wiring board 1, and FIG. 4 is a flowchart showing a manufacturing process of the laminate 200 in the electronic component built-in multilayer wiring board 1.

  FIG. 5 is a cross-sectional view showing a manufacturing process of the electronic component built-in module board 100 in the electronic component built-in multilayer wiring board 1, and FIG. 6 is a cross-sectional view showing a manufacturing process of the laminate 200 in the electronic component built-in multilayer wiring board 1. is there. Further, FIG. 7 is an exploded perspective view of the multilayer body 200 in the multilayer wiring board 1 with built-in electronic components, and FIG. 8 is a cross-sectional view showing the manufacturing process of the multilayer wiring board 1 with built-in electronic components.

  As shown in FIG. 1, an electronic component built-in multilayer wiring board 1 according to the first embodiment includes an electronic component built-in module board 100 as a multilayer wiring board, and a laminated body laminated on the electronic component built-in module board 100. 200. The electronic component built-in multilayer wiring board 1 has a structure in which an electronic component built-in module substrate 100 and a laminate 200 are laminated together by, for example, thermocompression bonding.

  As shown in FIGS. 1 and 5, the electronic component built-in module board 100 includes, for example, a first layer printed wiring board 10, a second layer printed wiring board 20, a third layer printed wiring board 30, and a fourth layer printed wiring board 40. Consists of. The number of printed wiring boards constituting the electronic component built-in module substrate 100 is not limited to this. In addition, the electronic component built-in module substrate 100 includes a built-in component 210 as a second electronic component in a second opening 290 formed in the third layer printed wiring board 30, for example. The second opening 290 is formed to have a size (height and opening diameter) in which the built-in component 210 can be accommodated and sealed.

  On the other hand, as shown in FIGS. 1 and 6, the laminate 200 includes, for example, a fifth layer printed wiring board 50, a sixth layer printed wiring board 60, a seventh layer printed wiring board 70, an eighth layer printed wiring board 80, and It consists of a ninth layer printed wiring board 90. The number of printed wiring boards constituting the laminate 20 is not limited to this. The multilayer body 200 includes a first opening that seals the mounting component 105A, the mounting component 105B, and the dummy component 106 as the first electronic component mounted on the electronic component built-in module substrate 100 together with the electronic component built-in module substrate 100. A sealing opening 110A, a sealing opening 110B, and a sealing opening 110C are provided.

  In addition, the 1st layer-4th layer printed wiring board 10-40 of the electronic component built-in module board 100 function as a 1st printed wiring board in this invention. Further, the fifth to ninth layer printed wiring boards 50 to 90 of the multilayer body 200 function as the second printed wiring board in the present invention. These first to ninth layer printed wiring boards are constituted by FPC (Flexible Printed Circuit) as an example. The insulating layers, wiring layers and adhesive layers of the fifth to ninth layer printed wiring boards 50 to 90 are the same as the insulating layers, wiring layers and adhesive layers of the first to fourth layer printed wiring boards 10 to 40. It is made of a material of the same type or characteristics.

  As shown in FIGS. 1 and 5, the first-layer printed wiring board 10, the second-layer printed wiring board 20, and the fourth-layer printed wiring board 40 of the electronic component built-in module substrate 100 are, for example, a single-sided CCL (single-sided wiring board). Consists of. And the 3rd layer printed wiring board 30 consists of double-sided CCL (double-sided wiring board), for example. Further, the fifth to ninth layer printed wiring boards 50 to 90 of the multilayer body 200 are made of, for example, a single-sided CCL. These first layer to ninth layer printed wiring boards 10 to 90 can select a single-sided CCL and a double-sided CCL as appropriate depending on the circuit design.

  The first to fourth layer printed wiring boards 10 to 40 each include a first resin base material 11, a second resin base material 21, a third resin base material 31, and a fourth resin base material 41 that are insulating layers. The first layer printed wiring board 10, the second layer printed wiring board 20, and the fourth layer printed wiring board 40 are arranged on one side of the first resin base material 11, the second resin base material 21, and the fourth resin base material 41 ( A wiring circuit 12, such as a wiring pattern formed on one side), a wiring circuit 22, and a wiring circuit 42 are provided. The wiring circuit 12, the wiring circuit 22, and the wiring circuit 42 function as a wiring layer.

  The third layer printed wiring board 30 includes a wiring circuit 32 such as a wiring pattern formed on one side and the other side (both sides) of the third resin base 31. The third-layer printed wiring board 30 includes a second opening 290 that is formed through the third resin base 31 by laser processing, drilling, or the like.

  As shown in FIG. 5, the first layer printed wiring board 10, the second layer printed wiring board 20, and the fourth layer printed wiring board 40 include a first resin substrate 11, a second resin substrate 21, and a fourth resin substrate. The material 41 includes an adhesive layer 9a, an adhesive layer 9b, and an adhesive layer 9c formed on the side opposite to the wiring circuit 12, the wiring circuit 22, and the wiring circuit 42 side. The adhesive layer 9a, the adhesive layer 9b, and the adhesive layer 9c are made of an organic adhesive containing a volatile component, such as an epoxy adhesive or an acrylic adhesive, for example.

  Further, the first layer printed wiring board 10, the second layer printed wiring board 20, and the fourth layer printed wiring board 40 are composed of the first resin base material 11, the second resin base material 21, the fourth resin base material 41, and the adhesive layer. 9a, the adhesive layer 9b, and the via 13, the via 23, and the via 43 formed by filling a conductive paste in the through holes formed in the adhesive layer 9c. The third-layer printed wiring board 30 includes a plated via 33. The plating via 33 does not penetrate the wiring circuit 32 on the one surface side of the third resin base material 31, and plating is performed in the through hole formed by using a laser, a drill, or the like from the other wiring circuit 32 side. Provided with the applied structure.

  The via 33 is formed by, for example, copper plating. When the via 33 is formed by plating as described above, a plating layer (not shown) is formed on one wiring circuit 32. In addition, although illustration is abbreviate | omitted, the via | veer 33 may be formed by filling the through-hole formed in the 3rd resin base material 31 with an electrically conductive paste.

  Further, the via 33 may be configured by a plated through hole having a structure in which plating is performed in a through hole (TH) penetrating between the wiring circuits 32. The via 13, the via 23 and the via 43 thus formed electrically connect the wiring circuits 12 to 42 of the first to fourth layer printed wiring boards 10 to 40, and the via 33 is the third layer. The wiring circuits 32 formed on both sides of the printed wiring board 30 are electrically connected.

  The built-in component 210 is housed in the second opening 290 of the third layer printed wiring board 30 with the electrode 210 a connected to the via 23 of the second layer printed wiring board 20. The built-in component 210 is sealed in the second opening 290 by, for example, an adhesive layer 9b and an adhesive layer 9c, which will be described later, which flowed and flowed during thermocompression bonding.

  The electronic component built-in module substrate 100 includes, for example, an adhesive layer 49 and vias 48 formed on the wiring circuit 42 side of the fourth resin substrate 41 in the fourth layer printed wiring substrate 40, as shown in FIG. 5C. Is further provided. The adhesive layer 49 is made of the same material as the adhesive layer 9a, the adhesive layer 9b, and the adhesive layer 9c, and the via 48 is formed for component mounting.

  On the other hand, as shown in FIG.1 and FIG.6, the 5th layer-8th layer printed wiring boards 50-80 of the laminated body 200 consist of double-sided CCL, for example. The ninth layer printed wiring board 90 is made of, for example, a single-sided CCL. The fifth to ninth layer printed wiring boards 50 to 90 are respectively a fifth resin base 51, a sixth resin base 61, a seventh resin base 71, an eighth resin base 81, and a ninth base which are insulating layers. A resin base material 91 is provided.

  In addition, the fifth to eighth layer printed wiring boards 50 to 80 have wiring circuits 52 such as wiring patterns formed on one and other surfaces (both sides) of the fifth to eighth resin bases 51 to 81, wiring A circuit 62, a wiring circuit 72, and a wiring circuit 82 are provided. Furthermore, the ninth layer printed wiring board 90 includes a wiring circuit 92 such as a wiring pattern formed on one surface (one surface) of the ninth resin base material 91. These wiring circuits 52 to 92 function as a wiring layer.

  In addition, the wiring circuit 92 of the ninth layer printed wiring board 90 of the multilayer body 200 in the first embodiment is formed with a solid pattern that fills one surface of the ninth resin base material 91, for example. And the wiring circuits 52 to 82 of the other fifth to eighth layer printed wiring boards 50 to 80 are pattern-formed at positions overlapping each other in the stacking direction, for example.

  In the first embodiment, the multilayer body 200 is laminated on the electronic component built-in module substrate 100 in a state of being electrically disconnected from the electronic component built-in module substrate 100. In addition, each of the wiring circuits 52 to 92 in the stacked body 200 is a dummy wiring circuit that is not interconnected between layers.

  As shown in FIG. 6, the fifth to eighth layer printed wiring boards 50 to 80 have adhesive layers 19a, adhesive layers 19b, and adhesive layers 19c formed on one surface side of the resin base materials 51 to 81, respectively. And an adhesive layer 19d. The ninth layer printed wiring board 90 includes an adhesive layer 99 formed on the opposite side of the resin base material 91 from the wiring circuit 92 side. The adhesive layers 19 a to 19 d and the adhesive layer 99 are made of the same type or the same characteristics as the adhesive layers 9 a to 9 c and the adhesive layer 48 of the electronic component built-in module substrate 100.

  As shown in FIGS. 6 and 7, the sealing opening 110 </ b> A, the sealing opening 110 </ b> B, and the sealing opening 110 </ b> C of the stacked body 200 are configured as follows, for example. That is, the sealing opening 110A is formed by combining the opening hole 110Aa formed through the fifth layer printed wiring board 50 and the opening hole 110Ab formed through the sixth layer printed wiring board 60 in the stacking direction. .

  Further, the sealing opening 110B is formed by combining the opening hole 110Ba, the opening hole 110Bb, the opening hole 110Bc, and the opening hole 110Bd that are formed through the fifth to eighth layer printed wiring boards 50 to 80 in the stacking direction. . Further, the sealing opening 110 </ b> C includes an opening hole 110 </ b> Ca formed through the fifth layer printed wiring board 50.

  That is, the sealing opening 110A, the sealing opening 110B, and the sealing opening 110C are, for example, the mounting position and mounting of the mounting component 105A, the mounting component 105B, and the dummy component 106 on the electronic component built-in module substrate 100. According to the height, each opening hole 110Aa to 110Ca that is formed to penetrate is combined in the stacking direction.

  In addition, the opening 110Aa and the opening 110Ab that are formed through the fifth layer printed wiring board 50 and the sixth layer printed wiring board 60 are covered with the seventh layer printed wiring board 70. Thus, the upper portion is formed in a closed state. The sealing opening 110B includes an opening hole 110Ba, an opening hole 110Bb, an opening hole 110Bc, and an opening hole 110Bd that are formed through the fifth to eighth layer printed wiring boards 50 to 80, and the ninth layer printed wiring. It is formed in a state where the upper side is closed by being covered with the substrate 90. Further, the sealing opening 110 </ b> C is formed in a state in which the opening hole 110 </ b> Ca penetratingly formed in the fifth layer printed wiring board 50 is closed by the sixth layer printed wiring board 60 being covered. ing.

  The mounting component 105A accommodated in the sealing opening 110A is sealed by the adhesive layer 48, the adhesive layer 19a, the adhesive layer 19b, and the adhesive layer 19c in the sealing opening 110A. The mounting component 105B accommodated in the sealing opening 110B is sealed with the adhesive layer 48, the adhesive layer 19a, the adhesive layer 19b, the adhesive layer 19c, the adhesive layer 19d, and the adhesive layer 99. Further, the dummy component 106 accommodated in the sealing opening 110C is sealed by the adhesive layer 48, the adhesive layer 19a, and the adhesive layer 19b.

  The first to fourth layer printed wiring boards 10 to 40 of the electronic component built-in module substrate 100 and the fifth to ninth layer printed wiring boards 50 to 90 of the laminated body 200 are configured as follows, for example. That is, the 1st-9th resin base materials 11-91 are comprised by the resin film, for example.

  As the resin film, a resin film made of polyimide (PI), polyamide (PA), polyolefin (PO), liquid crystal polymer (LCP), or the like can be used. Moreover, as another resin film, the resin film etc. which consist of a thermosetting epoxy resin etc. can be used.

  The wiring circuits 12 to 92 are formed by patterning a conductive material such as copper foil. In addition, the conductive paste constituting the via 13, the via 23, the via 43, and the via 48 (including the via 33 when the via 33 is formed of a conductive paste) includes at least one kind of low electrical resistance metal particles, One type of low melting point metal particles.

  The low electrical resistance metal particles described above are selected from, for example, nickel (Ni), gold (Au), silver (Ag), copper (Cu), aluminum (Al), iron (Fe), and the like. The low melting point metal particles described above are selected from tin (Sn), bismuth (Bi), indium (In), lead (Pb), and the like.

  The conductive paste is made of a paste obtained by mixing these metal particles with a binder component mainly composed of epoxy, acrylic, urethane, or the like. In such a conductive paste, the contained low melting point metal can be melted at a temperature of, for example, 200 ° C. or less to form an alloy. This conductive paste has characteristics that can form intermetallic compounds with copper and silver.

  That is, although detailed illustration is omitted, for example, the first printed wiring board 10 and the second layer printed wiring board 20 are taken as an example, and when these are thermocompression bonded, both ends in the stacking direction of the vias 13 made of conductive paste are used. The contact portion (connection surface) between the portion and the wiring circuit 12 and the wiring circuit 22 is alloyed with an intermetallic compound. Thereby, the via 13 and the wiring circuit 12 and the wiring circuit 22 are securely and reliably electrically connected.

  Thus, the contact portions of the via 13, the via 23, the via 43, and the via 48 with the wiring circuit 12, the wiring circuit 22, the wiring circuit 32, and the wiring circuit 42 are alloyed by an intermetallic compound at the time of thermocompression bonding, for example. Is done. Similarly, the contact portion between the electrode 210a and the via 23 of the built-in component 210 is alloyed with an intermetallic compound.

  Further, at the time of thermocompression bonding after mounting the mounted component 105A, the mounted component 105B, and the dummy component 106 on the electronic component built-in module substrate 100, for example, the contact portion between the electrode 106a and the via 48 of the dummy component 106 is similarly alloyed. It becomes.

  The conductive paste can also be constituted by a nanopaste in which fillers such as gold, silver, copper, nickel, etc. having a nanometer particle diameter are mixed with the binder component as described above. In addition, the conductive paste can also be configured by a paste in which metal particles such as nickel are mixed with the binder component as described above.

  In this case, the conductive paste has a characteristic that electrical connection is made when the metal particles come into contact with each other. As a method for filling such through holes in the conductive paste, for example, a printing method, a spin coating method, a spray coating method, a dispensing method, a laminating method, and various methods using these in combination can be used.

  The built-in component 210 built in the electronic component built-in module substrate 100 is made of, for example, a semiconductor element such as a transistor, an integrated circuit (IC), or a diode. The mounting component 105A and the mounting component 105B mounted on the electronic component built-in module substrate 100 include, for example, a resistor, a capacitor, a relay, and a piezoelectric element.

  The dummy component 106 mounted on the electronic component built-in module substrate 100 is used to adjust the strength, flatness, or flexibility of the electronic component built-in multilayer wiring substrate 1. For example, the electrode 106 a of the dummy component 106 is in contact with a via 48 on the dummy wiring circuit 42 formed so as to be electrically independent from the other wiring circuits 42 of the fourth layer printed wiring board 40. Has been implemented. Therefore, the dummy component 106 is mounted in an electrically non-connected state with the electronic component built-in module substrate 100.

  The electronic component built-in multilayer wiring board 1 is configured in this manner, so that the mounting component 105A, the mounting component 105B, and the dummy component 106 can be connected to the fifth to ninth layers without undergoing steps such as resin sealing and underfill. The layer printed wiring boards 50 to 90 can be built in a state of being sealed inside by a laminate 200 in which the layers are printed. That is, mounting components 105A, mounting components 105B, and dummy components 106 having different mounting heights on the electronic component built-in module substrate 100 are mounted by batch lamination by thermocompression bonding, for example, without producing a separate mold and performing molding processing. -Can be sealed and built-in.

  In this way, the laminate 200 can function as a substitute for the mold on the electronic component built-in module substrate 100. Further, if the materials of the members of the electronic component built-in module substrate 100 and the laminate 200 are of the same type and the same characteristics, the thermal expansion coefficients between the members can be matched and the material cost can be reduced. Therefore, it is possible to simplify the manufacturing process of the electronic component built-in multilayer wiring board 1 and simplify the constituent materials.

  Further, since the electronic component built-in multilayer wiring board 1 can be manufactured by batch lamination by thermocompression bonding after the thermal expansion coefficients of the respective members are matched, the thermal history can be reduced as compared with the prior art. As a result, it is possible to improve the overall reliability of the electronic component built-in multilayer wiring board 1.

  Further, the configuration of the laminated body 200 is freely selected according to the configuration of the wiring circuits 12 to 42 of the electronic component built-in module substrate 100, the mounting position and mounting height of the mounting component 105A, the mounting component 105B, or the dummy component 106. be able to. That is, the laminate 200 conforming to the flatness and flexibility of the electronic component built-in module substrate 100 can be configured, and can be easily mounted in a batch lamination process as an alternative to the mold. For this reason, it becomes possible to improve the flatness and flexibility of the entire electronic component built-in multilayer wiring board 1.

Next, the manufacturing method of the electronic component built-in multilayer wiring board 1 according to the first embodiment will be described with reference to the flowcharts of FIGS.
As shown in FIG. 2, first, the first to ninth layer printed wiring boards 10 to 90 are manufactured as a plurality of first and second printed wiring boards (step S100). The built-in component 210, the mounting component 105A, the mounting component 105B, or the dummy component 106 may be separately prepared or prepared in advance.

  For the first to ninth layer printed wiring boards 10 to 90 excluding the third layer printed wiring board 30, first, a solid state (solid pattern) is formed on one surface of the first to ninth resin base materials 11 to 91. A single-sided CCL on which a conductor layer made of copper foil or the like is formed is prepared. On the other hand, for the third-layer printed wiring board 30, a double-sided CCL in which a conductor layer made of a solid copper foil or the like is formed on both sides of the third resin base material is prepared.

  Next, etching is performed after forming an etching resist on the conductor layers of the first to eighth resin base materials 11 to 81 excluding the conductor layer of the ninth resin base material by, for example, photolithography, and the results are shown in FIG. Such wiring circuits 12 to 82 are patterned. Here, the single-sided CCL has a structure in which a resin base material having a thickness of about 20 μm is bonded to a conductor layer made of, for example, a copper foil having a thickness of about 12 μm.

  When the conductor layer is made of copper, as the single-sided CCL, for example, a coating produced by applying a polyimide varnish to a copper foil and curing the varnish by a known casting method can be used. In addition, as single-sided CCL, a seed layer is formed on a polyimide film by sputtering, copper is grown by plating to form a conductor layer, or rolled or electrolytic copper foil and polyimide film are bonded together with an adhesive. The produced one can be used.

  In addition, the resin base material used for the electronic component built-in multilayer wiring board 1 does not necessarily need to be made of polyimide. Therefore, it may be made of a plastic film such as a liquid crystal polymer as described above. Etching can be performed using an etchant mainly composed of ferric chloride or cupric chloride.

  After the wiring circuits 12 to 82 are formed, an adhesive is bonded to the other surfaces of the first resin base material 11, the second resin base material 21, and the fourth resin base material 41, and the adhesive layer 9a, the adhesive layer 9b, and the adhesive layer 9c is formed. In addition, an adhesive is bonded to one surface of the fifth to ninth resin substrates 51 to 91 to form an adhesive layer 19a, an adhesive layer 19b, an adhesive layer 19c, an adhesive layer 19d, and an adhesive layer 99.

  And about the 1st resin base material 11, the 2nd resin base material 21, and the 4th resin base material 41, the contact bonding layer 9a, the contact bonding layer 9b, the contact bonding layer 9c, the 1st resin base material 11, and the 2nd resin base material 21 And the through-hole which penetrates the 4th resin base material 1141, respectively, and reaches the wiring circuit 12, the wiring circuit 22, and the wiring circuit 42 is formed in a predetermined location, and the desmear process is performed in the formed through-hole. As the adhesive layers 9a to 9c, for example, an adhesive in which an epoxy thermosetting resin having a thickness of about 25 μm is semi-cured can be used.

  For example, a vacuum laminator is used for thermocompression bonding when bonding the adhesive layers 9a to 9c. That is, the adhesive layers 9 a to 9 c are pressed at a temperature at which the adhesive layers 9 a to 9 c are not cured in an atmosphere under reduced pressure, and the adhesive layers 9 a to 9 c are applied to the first resin base material 11, the second resin base material 21, and the fourth resin base material 41. to paste together. The adhesive layers 9a to 9c, the adhesive layers 19a to 19d, the adhesive layer 49, and the adhesive layer 99 used in the electronic component multilayer wiring board 1 are not only epoxy-based thermosetting resins but also epoxy-based thermosetting. It is possible to use a prepreg which is made semi-cured by applying a functional resin to a glass cloth or the like, or various resins.

The through hole is formed at a predetermined location using, for example, a UV-YAG laser. In addition, the through hole may be formed by a carbon dioxide gas laser, an excimer laser, or the like, or may be formed by drilling, chemical etching, or the like. In the case of plasma desmear, the desmear treatment can be performed with a mixed gas of CF ₄ and O ₂ (tetrafluoromethane + oxygen). Other inert gases such as Ar (argon) can also be used. Further, the desmear process may be a wet process using a chemical solution instead of a so-called dry process.

  After the through holes are formed, the vias 13, the vias 23, and the vias 43 are formed by filling the through holes with the conductive paste as described above by screen printing or the like. Thereby, the 1st layer printed wiring board 10, the 2nd layer printed wiring board 20, and the 4th layer printed wiring board 40 as shown to Fig.5 (a) can be manufactured. The third layer printed wiring board 30 and the fifth to ninth layer printed wiring boards 50 to 90 are similarly manufactured and prepared.

  Here, the built-in component 210 is manufactured as follows, for example, although illustration is omitted. First, a wafer before dicing on which an inorganic insulating layer is formed is prepared. Then, an electrode 210a made of, for example, a rewiring electrode is formed on the surface of the wafer, and an insulating layer or the like is formed. Then, after carrying out an inspection, the built-in component 210 is manufactured by thinning and dicing into individual pieces.

  Next, when the first to fourth layer printed wiring boards 10 to 40 and the built-in component 210 are manufactured in this way, the electronic component built-in module substrate 100 is manufactured (step S102). Here, the electronic component built-in module substrate 100 is manufactured, for example, as shown in FIG. That is, as shown in FIG. 3, the second opening 290 is formed in, for example, the third-layer printed wiring board 30 as the predetermined first printed wiring board (step S200).

  The second opening 290 uses a UV-YAG laser or the like as in the case of forming the through-hole, and the wiring circuit 32 and the third resin base material 31 in the part in which the built-in component 210 that is the second electronic component is built. As a result, the third layer printed wiring board 30 is formed penetrating. Then, the first to fourth layer printed wiring boards 10 to 40 and the built-in component 210 are aligned and laminated as shown in FIG. 5A (step S202), and thermocompression bonding is performed (step S204). As shown in FIG. Thereby, the electronic component built-in module substrate 100 incorporating the built-in component 210 can be manufactured.

  Note that the thermocompression bonding in step S204 may be of the order of temporary pressure bonding. In the first embodiment, the adhesive layer 49 and the via 48 as described above are formed on the fourth layer printed wiring board 40 of the electronic component built-in module substrate 100 thus manufactured as shown in FIG. It is formed by the method.

  When the component built-in module substrate 100 is manufactured in this way, the stacked body 200 is manufactured (step S104). Here, the laminated body 200 is produced as shown in FIG. 4, for example. First, as shown in FIG. 6A and FIG. 7, the fifth layer which is a predetermined second printed wiring board among the fifth layer to the ninth layer printed wiring boards 50 to 90 constituting the stacked body 200. To the eighth layer printed wiring boards 50 to 80, the opening 110A for sealing, the opening 110B for sealing, and the opening 110Ab constituting the opening 110C for sealing, The opening hole 110Ba, the opening hole 110Bb, the opening hole 110Bc, the opening hole 110Bd, and the opening hole 110Ca are formed to penetrate (Step S300).

  The opening hole 110Aa, the opening hole 110Ab, the opening hole 110Ba, the opening hole 110Bb, the opening hole 110Bc, the opening hole 110Bd, and the opening hole 110Ca are also formed using a UV-YAG laser or the like in the same manner as the second opening 290. be able to. Note that the opening hole 110Aa and the opening hole 110Ab coincide with each other in the stacking direction. Further, the opening hole 110Ba, the opening hole 110Bb, the opening hole 110Bc, and the opening hole 110Bd also coincide with each other in the stacking direction.

  After forming the opening hole 110Aa, the opening hole 110Ab, the opening hole 110Ba, the opening hole 110Bb, the opening hole 110Bc, the opening hole 110Bd, and the opening hole 110Ca, for example, the fifth to ninth layer printed wiring boards 50 to 90 are temporarily pressure bonded. (Step S302) and laminate. Thereby, the laminated body 200 which has the opening 110A for sealing, the opening 110B for sealing, and the opening 110C for sealing as shown in FIG.65 (b) is producible.

  Note that the sealing opening 110A, the sealing opening 110B, the sealing opening 110C, and the second opening 290 are the mounting part 105A and the mounting part having a rectangular outer shape in the first embodiment. It is formed in a rectangular shape in accordance with the shape of 105B or dummy component 106. In addition, the sealing opening 110A, the sealing opening 110B, the sealing opening 110C, and the second opening 290 have various shapes such as a circle and a polygon according to the outer shape of the components to be accommodated. obtain.

  Next, the mounting component 105A, the mounting component 105B, and the dummy component 106, which are first electronic components, are mounted on the component built-in module substrate 100 (step S106). In step S106, as shown in FIG. 8A, the mounting component 105A, the mounting component 105B, and the dummy component 106 are aligned on the electronic component built-in module substrate 100 using a mounting mounter device (not shown). Implement. The component mounting in step S106 may be about so-called temporary mounting.

  When the mounting component 105A, the mounting component 105B, and the dummy component 106 are mounted on the electronic component built-in module substrate 100 in this way, the laminate 200 is disposed on the electronic component built-in module substrate 100 as shown in FIG. S108). In step S108, the stacked body 200 ensures that the mounting component 105A, the mounting component 105B, and the dummy component 106 are contained within the sealing opening 110A, the sealing opening 110B, and the sealing opening 110C. Aligned and arranged.

  Finally, the electronic component built-in module substrate 100 and the laminated body 200 are subjected to thermocompression bonding (step S110), whereby the electronic component built-in module substrate 100, the mounted component 105A, the mounted component 105B, the dummy component 106, and the laminated body 200 are batched. The multilayered wiring board 1 with built-in electronic components according to the first embodiment as shown in FIG. In addition, the order of the process of step S102 and step S104 mentioned above is not ask | required. Moreover, the process of step S106 mentioned above may be performed prior to the process of step S104 as long as it is after the process of step S102.

  As described above, according to the multilayer wiring board 1 with built-in electronic components and the manufacturing method thereof according to the first embodiment, the manufacturing process can be greatly simplified and the thermal history can be reduced to improve reliability. Can be increased. In addition, the flatness of the substrate can be improved and the constituent materials can be simplified.

[Second Embodiment]
FIG. 9 is a cross-sectional view showing a manufacturing process of the component built-in multilayer wiring board 1B according to the second embodiment of the present invention. In FIG. 9, the same components as those in the first embodiment are denoted by the same reference numerals, and hence redundant description is omitted below.

As shown in FIG. 9, in the component built-in multilayer wiring board 1B according to the second embodiment, in the manufacturing process, for example, the laminate 200 arranged on the component built-in module substrate 100 in the step S108 described above is The fifth to ninth layer printed wiring boards 50 to 90 are arranged in a state of being separated from each other. In this respect, in the multilayer wiring board 1 with a built-in component according to the first embodiment described above, the electronic component is formed in a state in which the fifth to ninth layer printed wiring boards 50 to 90 are in a laminated body 200 temporarily bonded to each other. This is different from the arrangement on the built-in module substrate 100.
Even if manufactured in this way, the mounting component 105A, the mounting component 105B, and the dummy component 106 are replaced with the mold in the sealing opening 110A, the sealing opening 110B, and the sealing opening 110C of the laminate 200. Since it can seal, the effect similar to the effect in 1st Embodiment can be show | played.

[Third Embodiment]
FIG. 10 is a cross-sectional view showing the structure of a component built-in multilayer wiring board according to the third embodiment of the present invention. In FIG. 10, the same components as those in the first embodiment are denoted by the same reference numerals, and hence redundant description is omitted below.

As shown in FIG. 10, in the component built-in multilayer wiring board 1C according to the third embodiment, the multilayer wiring board on which the mounting component 105A, the mounting component 105B, and the dummy component 106 are mounted does not include the built-in component 210 (built-in component). No) type general multilayer printed wiring board 100A. This is different from the electronic component built-in multilayer wiring board 1 according to the first embodiment described above in that the multilayer wiring board is configured by the electronic component built-in module substrate 100 in which the built-in component 210 is built.
Even in such a configuration, the mounting component 105A, the mounting component 105B, and the dummy component 106 are replaced with a mold in the sealing opening 110A, the sealing opening 110B, and the sealing opening 110C of the multilayer body 200. Therefore, the same operational effects as the operational effects of the first embodiment can be achieved.

  As mentioned above, although several embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... Electronic component built-in multilayer wiring board, 9a-9c, 19a-19d, 49,99 ... Adhesive layer, 10 ... 1st layer printed wiring board, 11 ... 1st resin base material, 12-92 ... Wiring circuit, 13- 43, 48 ... via, 20 ... second layer printed wiring board, 21 ... second resin base, 30 ... third layer printed wiring board, 31 ... third resin base, 40 ... fourth layer printed wiring board, 41 ... 4th resin base material, 50 ... 5th layer printed wiring board, 51 ... 5th resin base material, 60 ... 6th layer printed wiring board, 61 ... 6th resin base material, 70 ... 7th layer printed wiring board, 71: seventh resin base material, 80: eighth layer printed wiring board, 81: eighth resin base material, 90: ninth layer printed wiring board, 91: ninth resin base material, 100: module board with built-in electronic components, 100A ... multilayer printed wiring board, 105A, 105B ... mounting Goods, 106 ... dummy parts, 106a, 210a ... electrode, 110Aa～110Ca ... openings, 110A-110C ... sealing openings 200 ... laminate, 210 ... internal parts, 290 ... second opening

As shown in FIG. 6, the fifth to eighth layer printed wiring boards 50 to 80 have adhesive layers 19a, adhesive layers 19b, and adhesive layers 19c formed on one surface side of the resin base materials 51 to 81, respectively. And an adhesive layer 19d. The ninth layer printed wiring board 90 includes an adhesive layer 99 formed on the opposite side of the resin base material 91 from the wiring circuit 92 side. These adhesive layers 19a~19d and the adhesive layer 99 is made of a material of the adhesive layer 9a~9c and the adhesive layer 4 9 and the same kind or the same characteristics of the electronic component built-in module board 100.

The mounting component 105A housed in the sealing opening 110A is sealed by the adhesive layer 4 9 , the adhesive layer 19a, the adhesive layer 19b, and the adhesive layer 19c in the sealing opening 110A. The mounting component 105B accommodated in the sealing opening 110B is sealed with the adhesive layer 4 9 , the adhesive layer 19a, the adhesive layer 19b, the adhesive layer 19c, the adhesive layer 19d, and the adhesive layer 99. Furthermore, dummy parts 106 housed in the sealing opening 110C, the adhesive layer 4 9, are sealed by the adhesive layer 19a and adhesive layers 19b.

Claims (9)

A multilayer wiring board configured by laminating a plurality of first printed wiring boards;
A first electronic component mounted on the multilayer wiring board;
A laminate composed of a plurality of second printed wiring boards stacked on the multilayer wiring board,
The multilayer body includes a first opening having an upper portion closed so as to seal the first electronic component mounted on the multilayer wiring board. Wiring board. The multilayer wiring board with built-in electronic components according to claim 1, wherein the first opening is formed in accordance with a mounting position and a mounting height of the first electronic component on the multilayer wiring board. . The multilayer wiring board with built-in electronic components according to claim 1 or 2, wherein the multilayer wiring board includes a second opening, and the second electronic component is built in the second opening. The multilayered wiring board with built-in electronic components according to any one of claims 1 to 3, wherein the laminated body is laminated in a state of being electrically disconnected from the multilayered wiring board. 5. The electronic component built-in multilayer wiring board according to claim 1, wherein the first electronic component includes a dummy component that is not electrically connected to the multilayer wiring board. The insulating layer, wiring layer, and adhesive layer of the first and second printed wiring boards are formed of the same type or material having the same characteristics. Multi-layer wiring board with built-in electronic components. Producing a plurality of first and second printed wiring boards;
Laminating a plurality of first printed wiring boards produced to produce a multilayer wiring board;
Forming a first opening capable of sealing the first electronic component on a predetermined second printed wiring board among the plurality of second printed wiring boards produced;
The predetermined second printed wiring board is stacked in the first opening so that the first electronic component can be accommodated, and at least one second printed wiring board is placed in the first opening. Laminating so as to block the part, producing a laminate,
Mounting the first electronic component on the multilayer wiring board;
Disposing the laminate on the multilayer wiring board on which the first electronic component is mounted so that the first electronic component is contained in the first opening;
A step of laminating the multilayer wiring board and the laminated body by thermocompression bonding so that the first electronic component is sealed inside the first opening. Manufacturing method of built-in multilayer wiring board. In the step of producing the multilayer wiring board,
A second opening capable of accommodating a second electronic component is formed in a predetermined first printed wiring board of the plurality of first printed wiring boards, and the second opening is formed in the second opening. The method of manufacturing a multilayer wiring board with built-in electronic components according to claim 7, wherein the plurality of first printed wiring boards are collectively laminated by thermocompression bonding with the second electronic component built-in. The method of manufacturing a multilayer wiring board with built-in electronic components according to claim 7 or 8, wherein, in the batch stacking step, the multilayer body is thermocompression bonded in a state of being electrically disconnected from the multilayer wiring board.

Images