JP2016140938A5 - - Google Patents

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JP2016140938A5
JP2016140938A5 JP2015017694A JP2015017694A JP2016140938A5 JP 2016140938 A5 JP2016140938 A5 JP 2016140938A5 JP 2015017694 A JP2015017694 A JP 2015017694A JP 2015017694 A JP2015017694 A JP 2015017694A JP 2016140938 A5 JP2016140938 A5 JP 2016140938A5
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Japan
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polishing pad
resin
abrasive
pad according
containing solution
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JP2015017694A
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Japanese (ja)
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JP6465676B2 (ja
JP2016140938A (ja
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JP2015017694A 2015-01-30 2015-01-30 研磨パッド及び研磨パッドの製造方法 Active JP6465676B2 (ja)

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JP2015017694A JP6465676B2 (ja) 2015-01-30 2015-01-30 研磨パッド及び研磨パッドの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015017694A JP6465676B2 (ja) 2015-01-30 2015-01-30 研磨パッド及び研磨パッドの製造方法

Publications (3)

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JP2016140938A JP2016140938A (ja) 2016-08-08
JP2016140938A5 true JP2016140938A5 (cg-RX-API-DMAC7.html) 2018-02-01
JP6465676B2 JP6465676B2 (ja) 2019-02-06

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JP (1) JP6465676B2 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7129850B2 (ja) * 2018-08-22 2022-09-02 アルテミラ製缶株式会社 内壁清掃装置
CN114523429A (zh) * 2022-02-22 2022-05-24 阳江市伟艺抛磨材料有限公司 一种用于石材抛光的无纺布磨块及其制作方法
CN116787323B (zh) * 2022-03-17 2025-12-30 万华化学集团电子材料有限公司 一种化学机械抛光垫缓冲层的制备方法、缓冲层及含其的抛光垫和应用
CN116638437B (zh) * 2023-06-30 2026-01-02 万桦（常州）新材料科技有限公司 一种新型抛光衬垫及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06254772A (ja) * 1993-03-04 1994-09-13 Dainippon Printing Co Ltd 湿式研磨テープ及びそれを用いた湿式研磨方法
JPH08294873A (ja) * 1995-04-27 1996-11-12 Fuji Photo Film Co Ltd 研磨体
JP2902637B1 (ja) * 1998-06-15 1999-06-07 日本ミクロコーティング株式会社 研磨シート及びその製造方法
JP2002158197A (ja) * 2000-11-20 2002-05-31 Toray Ind Inc 研磨用パッドおよびそれを用いた研磨装置ならびに研磨方法
JP2002172563A (ja) * 2000-11-24 2002-06-18 Three M Innovative Properties Co 研磨テープ
JP2002233962A (ja) * 2001-02-07 2002-08-20 Dainippon Printing Co Ltd 研磨体
JP4606733B2 (ja) * 2003-12-22 2011-01-05 東洋ゴム工業株式会社 研磨パッドおよび半導体ウエハの研磨方法
JP2008194761A (ja) * 2007-02-08 2008-08-28 Roki Techno Co Ltd 研磨シート及びその製造方法
JP5688590B2 (ja) * 2010-11-12 2015-03-25 学校法人立命館 研磨パッド用表面処理剤及び研磨パッド用スプレー
JP5972032B2 (ja) * 2012-05-01 2016-08-17 新技術開発株式会社 高効率精密加工用研磨工具及びその製法
DE102013203116A1 (de) * 2013-02-26 2014-08-28 Robert Bosch Gmbh Schleifmittelvorrichtung

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