JP2016140938A5 - - Google Patents
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- Publication number
- JP2016140938A5 JP2016140938A5 JP2015017694A JP2015017694A JP2016140938A5 JP 2016140938 A5 JP2016140938 A5 JP 2016140938A5 JP 2015017694 A JP2015017694 A JP 2015017694A JP 2015017694 A JP2015017694 A JP 2015017694A JP 2016140938 A5 JP2016140938 A5 JP 2016140938A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- resin
- abrasive
- pad according
- containing solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005498 polishing Methods 0.000 claims 12
- 229920005989 resin Polymers 0.000 claims 10
- 239000011347 resin Substances 0.000 claims 10
- 239000000463 material Substances 0.000 claims 6
- 239000004745 nonwoven fabric Substances 0.000 claims 6
- 238000005296 abrasive Methods 0.000 claims 5
- 239000006061 abrasive grain Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- 239000000835 fiber Substances 0.000 claims 2
- -1 polyethylene terephthalate Polymers 0.000 claims 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims 2
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 239000000057 synthetic resin Substances 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920005749 polyurethane resin Polymers 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
Claims (9)
硬化性樹脂と砥粒を含む砥粒含有溶液が前記基材に塗布され、前記硬化性樹脂が硬化して形成された研磨層と
を具備する研磨パッド。 A base material made of a material having voids;
A polishing pad comprising: a polishing layer formed by applying an abrasive-containing solution containing a curable resin and abrasive grains to the substrate and curing the curable resin.
前記基材の空隙は、硬化前の前記硬化性樹脂が通過可能であり、前記砥粒が通過不能な大きさに設けられている
研磨パッド。 The polishing pad according to claim 1 ,
The gap of the base material is provided with a size that allows the curable resin before curing to pass therethrough and prevents the abrasive grains from passing therethrough.
前記基材は、合成樹脂が含浸された不織布である
研磨パッド。 The polishing pad according to claim 1 or 2,
The substrate is a non-woven fabric impregnated with a synthetic resin.
前記基材は、ポリウレタン樹脂が含浸されたポリエステル繊維からなる不織布である
研磨パッド。 The polishing pad according to claim 3,
The base material is a non-woven fabric made of polyester fiber impregnated with polyurethane resin.
前記基材は、合成樹脂からなる樹脂シートと、前記樹脂シートに積層された不織布とを有し、前記砥粒含有溶液は前記不織布に塗布されている
研磨パッド。 The polishing pad according to claim 1 or 2,
The said base material has the resin sheet which consists of synthetic resins, and the nonwoven fabric laminated | stacked on the said resin sheet, The said abrasive grain containing solution is apply | coated to the said nonwoven fabric. Polishing pad.
前記樹脂シートは、ポリエチレンテレフタレート樹脂からなり、
前記不織布は、ポリエチレンテレフタレート繊維からなる不織布である
研磨パッド。 The polishing pad according to claim 5, wherein
The resin sheet is made of polyethylene terephthalate resin,
The said nonwoven fabric is a nonwoven fabric which consists of a polyethylene terephthalate fiber Polishing pad.
前記硬化性樹脂は、フェノール樹脂とエポキシ樹脂を含む
研磨パッド。 The polishing pad according to claim 1,
The curable resin includes a phenolic resin and an epoxy resin.
前記砥粒含有溶液は、さらに溶媒を含む
研磨パッド。 The polishing pad according to claim 1,
The abrasive-containing solution further includes a solvent.
前記砥粒含有溶液を、空隙を有する材料からなる基材に塗布し、
前記砥粒含有溶液に含まれる硬化性樹脂を硬化させる
研磨パッドの製造方法。 Prepare an abrasive-containing solution containing a curable resin and abrasive grains,
Applying the abrasive-containing solution to a substrate made of a material having voids,
A method for producing a polishing pad, wherein a curable resin contained in the abrasive-containing solution is cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015017694A JP6465676B2 (en) | 2015-01-30 | 2015-01-30 | Polishing pad and polishing pad manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015017694A JP6465676B2 (en) | 2015-01-30 | 2015-01-30 | Polishing pad and polishing pad manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016140938A JP2016140938A (en) | 2016-08-08 |
| JP2016140938A5 true JP2016140938A5 (en) | 2018-02-01 |
| JP6465676B2 JP6465676B2 (en) | 2019-02-06 |
Family
ID=56569459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015017694A Active JP6465676B2 (en) | 2015-01-30 | 2015-01-30 | Polishing pad and polishing pad manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6465676B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7129850B2 (en) * | 2018-08-22 | 2022-09-02 | アルテミラ製缶株式会社 | Inner wall cleaning device |
| CN114523429A (en) * | 2022-02-22 | 2022-05-24 | 阳江市伟艺抛磨材料有限公司 | Non-woven fabric grinding block for stone polishing and manufacturing method thereof |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06254772A (en) * | 1993-03-04 | 1994-09-13 | Dainippon Printing Co Ltd | Wet type polishing tape and wet type polishing method using the tape |
| JPH08294873A (en) * | 1995-04-27 | 1996-11-12 | Fuji Photo Film Co Ltd | Polishing body |
| JP2902637B1 (en) * | 1998-06-15 | 1999-06-07 | 日本ミクロコーティング株式会社 | Polishing sheet and method for producing the same |
| JP2002158197A (en) * | 2000-11-20 | 2002-05-31 | Toray Ind Inc | Polishing pad as well as apparatus and method for polishing using the same |
| JP2002172563A (en) * | 2000-11-24 | 2002-06-18 | Three M Innovative Properties Co | Abrasive tape |
| JP2002233962A (en) * | 2001-02-07 | 2002-08-20 | Dainippon Printing Co Ltd | Polishing body |
| JP4606733B2 (en) * | 2003-12-22 | 2011-01-05 | 東洋ゴム工業株式会社 | Polishing pad and semiconductor wafer polishing method |
| JP2008194761A (en) * | 2007-02-08 | 2008-08-28 | Roki Techno Co Ltd | Grinding sheet and manufacturing method therefor |
| JP5688590B2 (en) * | 2010-11-12 | 2015-03-25 | 学校法人立命館 | Surface treatment agent for polishing pad and spray for polishing pad |
| JP5972032B2 (en) * | 2012-05-01 | 2016-08-17 | 新技術開発株式会社 | Polishing tool for high-efficiency precision machining and its manufacturing method |
| DE102013203116A1 (en) * | 2013-02-26 | 2014-08-28 | Robert Bosch Gmbh | Abrasive device |
-
2015
- 2015-01-30 JP JP2015017694A patent/JP6465676B2/en active Active
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