JP2016135504A5 - - Google Patents

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Publication number
JP2016135504A5
JP2016135504A5 JP2015011778A JP2015011778A JP2016135504A5 JP 2016135504 A5 JP2016135504 A5 JP 2016135504A5 JP 2015011778 A JP2015011778 A JP 2015011778A JP 2015011778 A JP2015011778 A JP 2015011778A JP 2016135504 A5 JP2016135504 A5 JP 2016135504A5
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JP
Japan
Prior art keywords
laser beam
film
translucent member
elastic member
reaches
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JP2015011778A
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English (en)
Japanese (ja)
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JP2016135504A (ja
JP6474623B2 (ja
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Priority to JP2015011778A priority Critical patent/JP6474623B2/ja
Priority claimed from JP2015011778A external-priority patent/JP6474623B2/ja
Priority to CN201610033573.3A priority patent/CN105817765B/zh
Publication of JP2016135504A publication Critical patent/JP2016135504A/ja
Publication of JP2016135504A5 publication Critical patent/JP2016135504A5/ja
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Publication of JP6474623B2 publication Critical patent/JP6474623B2/ja
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JP2015011778A 2015-01-23 2015-01-23 パターニング方法、およびパターニング加工物品 Expired - Fee Related JP6474623B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015011778A JP6474623B2 (ja) 2015-01-23 2015-01-23 パターニング方法、およびパターニング加工物品
CN201610033573.3A CN105817765B (zh) 2015-01-23 2016-01-19 构图方法及构图加工物品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015011778A JP6474623B2 (ja) 2015-01-23 2015-01-23 パターニング方法、およびパターニング加工物品

Publications (3)

Publication Number Publication Date
JP2016135504A JP2016135504A (ja) 2016-07-28
JP2016135504A5 true JP2016135504A5 (enExample) 2018-02-08
JP6474623B2 JP6474623B2 (ja) 2019-02-27

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Family Applications (1)

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JP2015011778A Expired - Fee Related JP6474623B2 (ja) 2015-01-23 2015-01-23 パターニング方法、およびパターニング加工物品

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JP (1) JP6474623B2 (enExample)
CN (1) CN105817765B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107396558B (zh) * 2017-06-30 2021-05-04 捷开通讯(深圳)有限公司 实现壳体表面纹理的方法及终端
CN108817686A (zh) * 2018-07-03 2018-11-16 京东方科技集团股份有限公司 基板承载台及切割装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3210251B2 (ja) * 1996-07-09 2001-09-17 シャープ株式会社 レーザーパターニング装置
JP2000296698A (ja) * 1999-04-14 2000-10-24 Art Laser Giken:Kk 文字又は絵柄等の描画方法
JP2001009583A (ja) * 1999-06-29 2001-01-16 Canon Inc レーザ加工装置
JP4287560B2 (ja) * 1999-11-16 2009-07-01 株式会社カネカ 薄膜光電変換モジュールの製造方法
WO2003055636A1 (en) * 2001-12-21 2003-07-10 Ifire Technology Inc. Method of laser ablation for patterning thin film layers for electroluminescent displays
JP2006216820A (ja) * 2005-02-04 2006-08-17 Advanced Lcd Technologies Development Center Co Ltd レーザ加工方法、レーザ加工装置および結晶化装置
JP4872503B2 (ja) * 2005-11-16 2012-02-08 株式会社デンソー ウェハおよびウェハの加工方法
US20090190225A1 (en) * 2006-06-30 2009-07-30 Kazuhiro Yamada Optical member and optical device including the optical member
JP2009101384A (ja) * 2007-10-23 2009-05-14 Olympus Corp レーザ加工方法
US20110155219A1 (en) * 2009-12-29 2011-06-30 Du Pont Apollo Limited Thin film solar cell and method for fabricating the same
CN202114400U (zh) * 2011-04-27 2012-01-18 瑞世达科技(厦门)有限公司 激光光刻机
US9182660B2 (en) * 2012-06-01 2015-11-10 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for electron beam patterning

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