JP2016134593A - Electronic component storing package, electronic device, and manufacturing method for electronic component storing package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic component storing package in which a storing part is formed by a pressing process, and an electronic component storing package and the like which can reduce deterioration in conductivity of a side conductor and occurence of disconnection.SOLUTION: An electronic component storing package comprises: an insulation substrate 101 having a recessed part 104 on an upper surface thereof; a first connection conductor 105 provided to contact an edge of the recessed part 104 in a planar view; a second connection conductor 106 provided on a bottom face of the recessed part 104 to contact an inner face of the recessed part 104; and a side conductor 107 that is provided across a lower end and an upper end of the inner face, on the inner face of the recessed part 104, and connected to the first connection conductor 105 and the second connection conductor 106. The second connection conductor 106 is embedded in the bottom face of the recessed part 104, where the embedding of the second connection conductor 106 is deeper than other parts in a connection part thereof to the side conductor 107. This makes thickness of the connection part of the second connection conductor 106 to the side conductor 107 larger, which makes conductivity higher.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component storage package for electronically storing electronic components, an electronic device, and a method for manufacturing an electronic component storage package.

  2. Description of the Related Art Conventionally, as an electronic component storage package for mounting an electronic component such as a piezoelectric vibrator or a semiconductor element, an insulating substrate made of a ceramic sintered body or the like is generally provided, and an electronic component receiving portion (recess) is provided on the insulating substrate. The one provided with is used. An electronic component is accommodated in the recess, and the recess is closed with a lid, or the entire electronic component is covered with a resin, and hermetic sealing is performed.

  As a more specific example of such an electronic component storage package, a flat lower insulating layer having a mounting portion for an electronic component on the upper surface, and a frame-like shape laminated around the mounting portion on the upper surface of the lower insulating layer. Examples include an insulating substrate having an upper insulating layer and a wiring conductor provided on the surface of the insulating substrate. A recess is formed by the inner side surface of the upper insulating layer and the upper surface of the lower insulating layer located inside the upper insulating layer. Further, a side conductor may be provided on the inner side surface of the recess from its lower end to its upper end. The side conductor is provided, for example, to electrically lead a part of the wiring conductor to the upper surface of the upper insulating layer. After the electronic component is accommodated in the recess and each electrode of the electronic component is electrically connected to the wiring conductor, the electronic component is hermetically sealed as described above to manufacture the electronic device.

  The insulating substrate having such a recess is produced, for example, by laminating a frame-shaped ceramic green sheet serving as an upper insulating layer on the upper surface of a flat ceramic green sheet serving as a lower insulating layer, and firing it integrally. .

  In recent years, as a means for improving the productivity of such an electronic component storage package, it has been proposed to form a recess by pressurizing a predetermined portion of the upper surface of the ceramic green sheet into a concave shape. . Thus, for example, the steps of producing a plurality of ceramic green sheets and laminating them are omitted, so that an electronic component storage package having a recess can be efficiently manufactured. In the step of forming the recess, a metal paste to be a wiring conductor or a side conductor is applied in advance to the upper surface of the ceramic green sheet with an appropriate pattern, and the metal paste is pressed and bent by pressurization. A metal paste can be arranged in a predetermined pattern on the side surface.

International Publication WO2006 / 114974

However, in the conventional electronic component storage package, since the metal paste is pressed to form the side conductors and the like, the thickness of the side conductors tends to be reduced, and the connection portion between the side conductors and the wiring conductors There was a problem that it was difficult to increase the electrical conductivity of the film. In other words, when a side conductor is formed on the inner side surface of the recess, the metal paste that becomes the side conductor is stretched more than other regions, resulting in a reduced thickness. In this case, there is a possibility that a decrease in conductivity may occur due to a decrease in the connection area between the side conductor and the wiring conductor.

  An electronic component storage package according to one aspect of the present invention includes an insulating substrate having a recess on an upper surface, and at least one first connection conductor provided on the upper surface so as to be in contact with the recess in a plan view. At least one second connection conductor provided on the bottom surface of the recess in contact with the inner surface of the recess, and provided on the inner surface of the recess from the lower end to the upper end of the inner surface, A connection conductor and a side conductor connected to the second connection conductor, the second connection conductor being embedded in the bottom surface portion of the recess of the insulating substrate, and the insulating substrate of the second connection conductor The embedding is deeper than the other portions in the connection portion with the side conductor.

  An electronic device according to one aspect of the present invention includes the electronic component storage package described above and an electronic component accommodated in the recess.

  According to one aspect of the present invention, there is provided a method for manufacturing an electronic component storage package, comprising: a step of producing a ceramic green sheet in which a plurality of wiring board regions are arranged; and a top surface of each of the plurality of wiring board regions of the ceramic green sheet. A step of applying a first metal paste to the periphery of the wiring board region and applying a second metal paste having one end in contact with an inner periphery of the first metal paste; and the first metal paste and the second metal paste. A step of providing a paste for a through conductor penetrating at least part of the thickness direction of the ceramic green sheet at a connection portion with the metal paste, and an inner side of the first metal paste in each of the plurality of wiring board regions Pressure is applied to the ceramic green sheet against the thickness direction of the ceramic green sheet. Characterized in that it comprises a step of pushing said second metallic paste-side portion of the second metal paste and the through conductor paste on the lower side.

  According to the electronic component storage package of one aspect of the present invention, the second connection conductor has an embedded portion embedded in the upper surface portion of the insulating substrate, and the embedded portion is connected to the side conductor in the other portion. It is deeper than the part.

  That is, the thickness of the second connection conductor can be increased at the connection portion with the side conductor. Therefore, even if the thickness of the side conductor becomes relatively small, it is easy to secure a large mutual connection surface at the connection portion between the side conductor and the second connection conductor (embedded portion), and the conductivity is high. can do.

  According to the electronic device of one aspect of the present invention, since the electronic component is housed in the electronic component housing package having the above-described configuration, the conductivity at the connection portion between the side conductor and the second connection conductor, and An electronic device with excellent electrical connection reliability and the like can be provided.

  Moreover, according to the manufacturing method of the electronic component storage package of this invention, since each said process is included, even if it forms a recessed part by pressurization, the disconnection of the paste for penetration conductors used as a side conductor can be suppressed. That is, when the second metal paste and the through-conductor paste are pressed, a part of each paste is pushed into the lower-surface side of the ceramic green sheet and into the through-conductor paste (outer peripheral direction) that becomes the side conductor. Buried. For this reason, a large cross-sectional area can be secured at the connection portion between the second connection conductor and the side conductor, and an electronic component storage package having excellent electrical reliability between the side conductor and the second connection conductor is manufactured. be able to.

(A) is a top view which shows the electronic component storage package of embodiment of this invention, (b) is sectional drawing in the X-X 'line | wire of (a). (A) is an expanded sectional view which shows the principal part of FIG.1 (b). (A) is a top view which shows the electronic component storage package of other embodiment of this invention, (b) is sectional drawing in the Y-Y 'line | wire of (a). (A)-(f) is sectional drawing which shows the manufacturing method of the electronic component storage package of embodiment of this invention in order of a process.

An electronic component storage package and the like of the present invention will be described with reference to the accompanying drawings. FIG. 1A is a top view showing an electronic component storage package according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line XX ′ of FIG. The insulating substrate 101 constituting the electronic component storage package has a concave portion 104 in which the electronic component 110 is stored on the upper surface. The insulating substrate 101 can also be regarded as including a flat plate-like base portion 102 and a frame portion 103 provided thereon. On the upper surface of the insulating substrate 101, for example, a first connection conductor 105 connected to an electronic component 110 by a bonding wire (hereinafter referred to as a wire) 111 is provided. The first connection conductor 104 is provided so as to be in contact with the edge of the recess 104 in plan view in consideration of the connection with the electronic component 110 by a bonding wire. That is, a strip-shaped first connection conductor 105 extending outward from the edge of the recess 104 is provided on the upper surface of the insulating base 101. Further, the recess 104 has a groove (not indicated) on the inner surface, and a side conductor 107 is formed so as to fill the groove. A second connection conductor 106 is formed on the bottom surface of the recess 104. The second connection conductor 106 is, for example, an insulating substrate 101.
Is directly connected to a wiring conductor (not shown) such as a via conductor provided inside the.

Further, the insulating substrate 101 has a wiring conductor such as the above as a conductive path between the electronic component 110 mounted on the mounting portion (not shown) on the bottom surface of the recess 104 (not shown) and an external electric circuit (not shown). A connection conductor 109 or the like is provided. In this example, four first connection conductors 105, side conductors 107, and second connection conductors 106 are provided on both sides of the rectangular insulating substrate 101 on the short side. The first connection conductor 105, the side conductor 107, and the second connection conductor 106 are electrically connected to each other. In other words, a conductive path (not denoted by reference numeral) composed of the first connection conductor 105, the side conductor 107, and the second connection conductor 106 is provided from the bottom surface of the recess 104 to the upper surface of the insulating substrate 101 through the inner surface of the recess 104. ing. This conductive path is provided at four locations on both short sides of the insulating substrate 101.

The insulating substrate 101 is, for example, a rectangular shape with a side length of about 1.6 to 10 mm and a thickness of about 0.3 to 2 mm in a plan view, and has a concave portion 104 as described above on the upper surface. Have. The base portion 102 and the frame portion 103 constituting the insulating substrate 101 may each be configured by laminating a plurality of insulating layers.

Such an electronic component storage package includes, for example, a mother board (an assembly of insulating boards 101) (not shown) in which a plurality of wiring board regions (not shown here) to be the insulating boards 101 are arranged vertically and horizontally. As produced. The substrate obtained by dividing the mother board into individual pieces becomes the insulating board 101 of each electronic component storage package.

When the plurality of wiring board regions are divided into individual pieces and the insulating substrate 101 (electronic component storage package) is manufactured, for example, the concave portion 104 is formed at the center of the upper surface of each wiring board region.
Have A method for forming the recess 104 will be described later.

The insulating substrate 101 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. Insulating substrate 101
For example, the above material is formed into a predetermined shape together with an organic binder or the like, and the formed body is baked. In the case of the mother substrate, as in the case of the insulating substrate 101, the ceramic material is molded into a predetermined shape and then fired to produce the mother substrate. Details of these manufacturing methods will be described later.

In addition, a ceramic green sheet (not shown here) serving as the insulating substrate 101 is manufactured by forming a slurry containing ceramic powder, an organic binder, a solvent, and a thermoplastic resin into a sheet shape. At this time, the slurry is applied on a PET film or paper sheet by a forming means such as a doctor blade or a lip coater, and then formed into a sheet shape while being dried by hot air drying or far-infrared drying.

Details of the first connection conductor 105, the second connection conductor 106, and the side conductor 107, and details of the formation method thereof will be described later.

The second connection conductor 106 is buried in the bottom surface portion of the recess 104 of the insulating substrate 101. That is, the second connection conductor 106 has a buried portion 108. Further, the buried portion 108 is deeper than the other portions at the connection portion with the side conductor 107.

That is, the thickness of the second connection conductor 106 can be increased at the connection portion with the side conductor 107. For this reason, even if the thickness of the side conductor 107 becomes relatively small, the cross-sectional area of the second connecting conductor 106 in the thickness direction is increased by the embedded portion 108. As a result, it is easy to increase the connection area at the connection portion between the side conductor 107 and the second connection conductor 106, and the conductivity and the like can be increased.

In addition, the strength of the bonding to the insulating substrate 101 is also increased in the second connection conductor 106 by the anchor effect of the embedded portion 108 that is buried deeper in the insulating substrate 101 (the bottom surface of the recess 104) at the connection portion.

As described above, the insulating substrate 101 having the recess 104, the first connection conductor 105, the second connection conductor 106, and the side conductor 107 is made of a ceramic material having a predetermined shape (such as the shape of the insulation substrate 101 having the recess 104). ) And this molded body is fired to produce. In this case, a metal paste is applied to the molded body in a predetermined pattern in advance, and this metal paste is simultaneously fired with the molded body to form the first connection conductor 105, the second connection conductor 106, and the side conductor 107. For example, the metal paste is applied to the molded body as follows. In the following description, the metal pastes corresponding to the first connection conductor 105, the second connection conductor 106, and the side conductor 107 are distinguished from each other as different names.

That is, for example, on the main surface of the ceramic green sheet serving as the insulating substrate 101, a through conductor paste (not shown here) serving as the side conductor 107, and a metal paste serving as the first connecting conductor 105 and the second connecting conductor 106 are provided. (To distinguish, the first connecting conductor 105 and the second connecting conductor 106
Is formed by screen printing or the like. Next, the ceramic green sheet heated at a temperature equal to or higher than the glass transition temperature of the thermoplastic resin (such as the above organic binder) is subjected to pressure processing only on the portion where the recess 104 is formed. At this time, for example, pressure processing is performed so that the height of the through-conductor paste (the dimension in the thickness direction of the ceramic green sheet) is about ½ (mainly compressed in the height direction). Through the above steps, an electronic component housing package is basically formed in which the insulating substrate 101 has the recess 104 and the insulating substrate 101 is provided with the first connection conductor 105, the second connection conductor 106, and the side conductor 107. Can do.

At this time, a part of the ceramic green sheet is recessed by pressurization, and the recess 104 is formed as described above. The bottom surface of the recessed portion is the bottom surface of the recess 104. In this portion, a metal paste to be the second connection conductor 106 is printed in advance. The pressed portion of the through-conductor paste pushes down the metal paste that becomes the second connection conductor 106 and embeds it in the ceramic green sheet (the bottom surface of the recess 104). A buried portion 108 is formed at a connection portion with the conductor 107. That is, a part of the embedded portion 108 of the second connection conductor 106 can be regarded as a product obtained by firing the through conductor paste.

In addition, the possibility of taper of the side conductor 107 (relative thinning on the bottom surface side of the recess 104) is reduced. That is, about half of the through conductor paste is pressed to form the side conductor 107. Therefore, the planar metal paste applied only to the surface of the ceramic green sheet as in the prior art is not stretched in the depth direction by pressure processing. For this reason, the metal paste that becomes the side conductor 107 is stretched to be prevented from being thinned or tapered as a whole. Accordingly, the conductivity and the like at the connection portion between the side conductor 107 and the second connection conductor 106 can be increased.

  In addition, the side conductor 107 may have a protruding portion 112 that is largely embedded in the inner side surface portion of the recess 104 of the insulating substrate 101 in the connection portion with the second connection conductor 106 than in other portions.

With this structure, the thickness of the second connection conductor 106 can be increased at the connection portion between the second connection conductor 106 and the side conductor 107. In other words, not only the second connection conductor 106 but also the side conductors 107 can be made thicker (the mutual bonding area) at the connection portion between the second connection conductor 106 and the side conductor 107. Therefore, the cross-sectional area as a conductor is also increased by the protrusion 112 formed in the horizontal plane direction of the recess 104, and the conductivity and the like at the connection portion between the side conductor 107 and the second connection conductor 106 can be further increased.

  In addition, the second connection conductor 106 is more likely to have an anchor effect on the insulating substrate 101 at the connection portion, and the bonding strength to the insulating substrate 101 is increased.

As the shape of the protruding portion 112, as shown in the cross-sectional view of the main part in FIG. 2, for example, the protruding portion 112 may be formed so that the horizontal embedding of the protruding portion 112 increases toward the lower side of the side conductor 107. FIG. 2 is an enlarged cross-sectional view showing a main part of the electronic component storage package shown in FIG. In FIG. 2, the same parts as those in FIG.

In addition, the portion where the protrusion 112 is embedded most in the horizontal direction may be positioned below the bottom surface of the recess 104. In this way, the anchor effect works more effectively because the portion where the protrusion 112 is embedded most plays the role of an anchor. Therefore, in this case, the second connection conductor 106 is more effectively suppressed from peeling upward.

The electronic component 110 housed in the recess 104 is an IC, and may be a connection method using bumps 113 as shown in FIGS. 3A and 3B, for example. 3A is a top view showing an electronic component storage package according to another embodiment of the present invention, and FIG. 3B is a cross-sectional view taken along line YY ′ of FIG. is there. In FIG. 3, the same parts as those in FIG.

In this case, after the electronic component 110 is fixed to the bottom surface of the recess 104 with a bump 113 such as a solder ball, the second connection conductor 106 and a terminal (not shown) on the lower surface of the electronic component 110 are connected by the bump 113. Is done. As a result, the electronic component 110 is electrically led out to the upper surface of the insulating substrate 101 via the second connection conductor 106, the side conductor 107, and the first connection conductor 105. In other words, the electronic component 110 is fixed to the total of the eight second connection conductors 106 formed in the recess 104 by the bumps 113, but the second connection conductor 106
Since the embedded portion 108 and the protruding portion 112 are formed in the connection portion between the side conductor 107 and the side conductor 107, the strength of the bonding to the insulating substrate 101 is increased, and the connection portion between the side conductor 107 and the second connection conductor 106 is increased. A package structure with good electrical conductivity can be realized.

The electronic component storage package is provided with a plurality of second connection conductors 106, and the top surfaces of the plurality of second connection conductors 106 and the bottom surfaces of the recesses 104 may be located on the same plane. . With such a structure, unevenness on the bottom surface of the recess 104 is further reduced, flatness is ensured, and the accommodation property (positioning accuracy, connection reliability, etc.) of the electronic component 110 in the recess 104 is improved.

If the electronic component 110 is an IC and, for example, the connection method using the wire 111 as shown in FIGS. 1A and 1B, after the electronic component 110 is fixed to the bottom surface of the recess 104 with a potting resin or the like, The first connecting conductor 105 and a terminal (not shown) on the upper surface of the electronic component 110 are connected by a wire 111, and the electronic component 110 is externally connected via the first connecting conductor 105, the side conductor 107, and the second connecting conductor 106. Connected to the connecting conductor 109. At this time, since the unevenness on the bottom surface of the recess 104 is more effectively reduced, it is easier to reliably fix the electronic component 110 to the main surface of the recess 104.

Here, as shown in FIG. 1B, the first connection conductor 105 is formed such that the upper surface of the first connection conductor 105 and the upper surface of the frame portion 103 of the insulating substrate 101 are located on the same plane. Then, the first connection conductors 105 connecting the wires 111 are located on the same plane, and the connection reliability of the wires 111 can be improved. Further, if the lower surface of the external connection conductor 109 is formed on the same plane as the lower surface of the base portion 102, it is possible to further reduce the height of the electronic device.

In addition, if the electronic component 110 is an IC and, for example, the connection method using the bump 113 as shown in FIGS. 3A and 3B, the electronic component 110 is formed by a bump 113 made of solder on the bottom surface of the recess 104. After being fixed, the second connection conductor 106 and a terminal (not shown) on the lower surface of the electronic component 110 are connected to the bump 113.
Thus, the electronic component 110 is integrally connected via the second connection conductor 106, the side conductor 107, and the first connection conductor 105.

Note that a lead terminal (not shown) or the like may be further joined to the first connection conductor 105 and connected to the external circuit board. At this time, since the unevenness on the main surface of the recess 104 is effectively reduced, the bottom surface of the electronic component 110 is more effectively suppressed from contacting the top surface of the recess 104. Therefore, the electronic component 110 can be more easily and reliably connected and fixed by the second connection conductor 106 formed on the bottom surface of the recess 104.

Further, as shown in FIG. 3B, the first connection conductor 105 includes an upper surface of the first connection conductor 105 and a frame portion 103.
When the lead terminals are connected to each other, a total of eight first connection conductors 105 are positioned on the same plane when the lead terminals are connected. Connection reliability of lead terminals by positioning such as can be improved. Note that the electronic component 110 housed in the recess 104 is not limited to an IC, and may be another electronic component 110 such as a light emitting element, a piezoelectric element, or a crystal vibrating element.

In the electronic component storage package, the exposed surface of the side conductor 107 may have a curved portion 114 in a cross-sectional view of the insulating substrate 101 in the thickness direction. In other words, the lower end portion of the side conductor 107 may protrude in a curved shape in the inner direction of the recess 104. With such a structure, it becomes easier to accommodate the electronic component 110 in the recess 104 along the curved portion 114 of the side conductor 107.

Further, for example, when the position of the second connection conductor 106 is confirmed by image inspection or the like, the light from the lighting device is bent by the curved portion 114 (the side conductor 107 and the second connection conductor 106 are covered with a plating layer) and inside the recess 104. Reflected effectively by direction. Therefore, the position of the second connection conductor 106 can be confirmed more easily. Therefore, the mountability of the electronic component 110 on the bottom surface of the recess 104 is further improved.

An example of such a curved portion 114 is shown in FIG. A curved portion 114 is formed on the exposed surface of the side conductor 107 in a cross-sectional view of the connection portion between the second connection conductor 106 and the side conductor 107. The curved portion 114 is formed so that the inclination gradually decreases from the upper side to the lower side of the concave portion 104, for example.

  The upper surface of the recess 104 is flat including the portion where the second connection conductor 106 is provided, and the intersecting angle between the curved portion 114 and the bottom surface of the recess 104 in the sectional view is an obtuse angle. Yes. Thus, when the electronic component 110 is accommodated in the recess 104, mounted on the bottom surface thereof, and mounted, the electronic component 110 is guided to the mounting position by the curved portion 114 that is gently inclined. Therefore, the electronic component 110 can be accommodated in the recess 104.

In order to form such a curved portion 114, for example, the following may be performed. That is,
As described above, when the ceramic green sheet is pressed so that the height of the through-conductor paste becomes about ½, the lower surface portion of the pressing jig (not shown here) (when pressed) The outer peripheral portion of the portion pressed against the ceramic green sheet may be curved. When the lower surface portion of the pressing jig pushes the ceramic green sheet to form the recess 104 and the side conductor 107, the curved portion 114 is formed on the side conductor 107 in accordance with the bending portion 114 of the pressing jig. That is, by using the pressurizing jig as described above, the curved portion 114 that is gently inclined can be formed on the exposed surface of the side conductor 107.

  Further, in the case of the manufacturing method including the step of pressing the ceramic green sheet and the through conductor paste as described above, the pressure due to this pressurization is not limited to the downward direction, but the concave portion 104 This also acts in the horizontal direction parallel to the bottom surface (the outward direction of the recess 104). Therefore, the protrusion 112 can be formed effectively.

  In addition, it is easy to insert the pressure jig into the ceramic green sheet when pressing each metal paste including the ceramic green sheet and the through conductor paste, and to remove (remove) from the pressed ceramic green sheet It can be.

In FIG. 2, the curved portion 114 of the side conductor 107 is shown, but a curved portion (not shown) similar to the side conductor 107 is provided on the inner side surface of the recess 104 even in a portion where the side conductor 107 is not provided. It may be done. The curved portion on the inner side surface of the recess 104 may form, for example, an exposed surface (curved surface) continuous with the side conductor 107. In this case, it is possible to further facilitate the insertion of the pressing jig into the ceramic green sheet and the separation from the pressed ceramic green sheet.

As described above, the electronic device according to the embodiment includes the electronic component storage package having the above-described configuration and the electronic component 110 accommodated in the recess 104. As a result, since the second connecting conductor 106 has a large cross-sectional area in the embedded portion 108, the connection area between the side conductor 107 and the second connecting conductor 106 in the embedded portion 108 is larger than that in the related art. Therefore, the conductivity and the like at the connection portion between the second connection conductor 106 and the side conductor 107 can be increased. Therefore, the electronic component 110
Is electrically connected to the external connection conductor 109 via the first connection conductor 105, the side conductor 107, the second connection conductor 106, and the like, so that an electronic device with excellent external connection reliability of the electronic component 110 can be realized.

The electronic component 110 housed in the recess 104 is an electronic component 110 such as an IC, a light emitting element, a piezoelectric element, or a crystal vibrating element. If the electronic component 110 is an IC, for example, as shown in FIG. (Not shown) and the first connecting conductor 105 are connected by a wire 111, and as shown in FIG. 3, the electrode (not shown) of the electronic component 110 and the second connecting conductor 106 are connected by a bump 113 such as solder. It is a connected structure.

Further, as shown in FIG. 3B, the electronic component 110 is directly connected to the second connecting conductor 106 by the bump 113.
The top surface of the second connection conductor 106 and the bottom surface of the recess 104 are positioned on the same plane, that is, the second connection conductor 106 is embedded in the recess 104. Also good. As a result, the flatness of the bottom surface portion of the recess 104 including the second connection conductor 106 is further improved to improve the accommodation of the electronic component 110 in the recess 104, and the second connection conductor 106 is peeled from the recess 104. Is suppressed more effectively. In addition, it is possible to realize an electronic device that is excellent in mounting reliability of the electronic component 110.

In the present embodiment, an IC is taken as an example of the electronic component 110, and its mounting has been described in detail. However, if the electronic component 110 is a light emitting element (not shown) such as an LED, the inside of the recess 104 A metal layer (which may be coated with various plating layers) and other conductor layers are formed over a wide area from the side surface to the bottom surface, and a light emitting element is electrically and mechanically connected to this conductor layer. May be. At this time, since the embedded portion 108 and the protruding portion 112 are also formed in the metal layer that becomes the reflective film, the side conductor 107 (here, the reflective layer is meant) even if there is an influence of heat (thermal stress) by the light emitting element. ) Or the second connecting conductor 106 (which means a wiring conductor here) is more effectively suppressed from peeling from the recess 104.

For example, as shown in FIGS. 4A to 4F, a method for manufacturing an electronic component storage package includes a step of producing a ceramic green sheet 201 in which a plurality of wiring board regions 207 are arranged, The first metal paste 202 is printed on the upper surface of each of the plurality of wiring board regions 207 around the wiring board region 207, and the second metal paste 203 having one end in contact with the inner periphery of the first metal paste 202 is applied. A step of forming a through-conductor paste 204 penetrating at least part of the thickness direction of the ceramic green sheet 201 at a connection portion between the first metal paste 202 and the second metal paste 203; In each of the wiring board regions 207, the ceramic green sheet 201 is pressed against the inside of the first metal paste 202, and the ceramic green sheet 201 Some of the viewing direction, and includes a step of pressing the second metal paste 203 side portion of the second metal paste 203 and the via conductor paste 204 on the lower side.

Since such a manufacturing method is employed, when the concave portion 104, the second connection conductor 106 on the bottom surface thereof, and the side conductor 107 on the inner side surface thereof are formed by pressing, the second connection conductor 106 and the side conductor 107 are It is possible to secure a sufficient cross-sectional area to be connected to each other and to increase the reliability of electrical connection between them. That is, the electronic component storage package having the above-described configuration can be easily manufactured.

Specifically, when the second metal paste 203 and the through-conductor paste 204 are pressed, a part of each paste is pressed to the lower surface side and the outer peripheral side of the ceramic green sheet 201 to be embedded deeper in the curved shape. . For this reason, the embedded portion 108 of the second connection conductor 106 is easily and reliably formed by a part of the second metal paste 203.

In this case, the possibility of the taper of the side conductor 107 is reduced, and the second connecting conductor 106 is also prevented from peeling from the upper surface of the recess 104 due to the anchor effect by the portion where each paste is embedded. The Therefore, an electronic component storage package having excellent reliability can be manufactured. Even in the case of the single-layer ceramic green sheet 201, the wiring board region 207 in which a plurality of recesses 104 are formed can be manufactured. It can be manufactured efficiently.

An example of this manufacturing method will be specifically described with reference to FIGS. In the example of FIG. 4, a manufacturing method in the form of a so-called multi-cavity substrate is shown in which a plurality of regions each serving as an insulating substrate 101 are arranged on a mother substrate (no reference).

First, as shown in FIG. 4A, a ceramic green sheet 201 is prepared in order to constitute the insulating substrate 101. Next, as shown in FIG. 4B, a first metal paste 202 that forms a pattern formed around the wiring substrate region 207 on the upper surface of each of the plurality of wiring substrate regions 207 of the ceramic green sheet 201, A second metal paste 203 having one end in contact with the inner periphery of one metal paste 202 is applied. Further, a through conductor paste 204 that penetrates at least a part of the ceramic green sheet 201 in the thickness direction is provided at a connection portion between the first metal paste 202 and the second metal paste 203. The through conductor paste 204 can be provided by, for example, providing a through hole in the ceramic green sheet 201 in advance and filling the through hole with a metal paste similar to the first metal paste 202 or the like. In this case, the first and second metal pastes 202 and 203 may be applied first, and then the through conductor paste 204 may be provided, or the reverse order (the first order in which the through conductor paste 204 is provided) may be used. FIG. 4 (b)
FIG. 2 shows a main part including two wiring substrate regions 207 in the ceramic green sheet aggregate in which a large number of wiring substrate regions 207 are formed as described above.

The through-conductor paste 204 is made of a metallized layer such as tungsten, molybdenum, manganese, copper, or silver. A through hole (not shown) is formed at a predetermined position where the through conductor of the ceramic green sheet 201 is formed, and this through hole is filled with a through conductor paste 204 by a suction method or the like.

The first metal paste 202, the second metal paste 203, and the metal paste to be the external connection conductor 109 are made of a metallized layer such as tungsten, molybdenum, manganese, copper, or silver. Each metal paste that becomes such a metallized layer is printed on the ceramic green sheet 201 in a predetermined pattern. Here, the first metal paste 202 and the second metal paste 203
As long as the through-conductor paste 204 is formed between them, the first metal paste 202 and the second metal paste 203 may be formed continuously. In addition, the width and length of the first metal paste 202 and the second metal paste 203 may be changed as necessary.

Next, as shown in FIG. 4C, in each of the plurality of wiring board regions 207, pressurization is performed so that the ceramic green sheet 201 can be pressed against the inside of the frame-shaped first metal paste 202. The jig 205 is positioned on the ceramic green sheet 201.

Then, as shown in FIG. 4D, the ceramic green sheet 201 is pressed into the inner side of the frame-shaped first metal paste 202 in each of the plurality of wiring board regions 207. At this time, a part of the ceramic green sheet 201 in the thickness direction is pressed downward to be processed into a concave shape. Further, the second metal paste 203 and the through-conductor paste 204 on the second metal paste 203 side are pushed into the lower side (inside the concave portion of the ceramic green sheet 201).

As a pressurizing method, for example, a hydrostatic pressurizing method can be employed. The ceramic green sheet 201 on which the pressurizing jig 205 is positioned is wrapped with the pressurizing sheet 206 together with the pressurizing jig 205 and evacuated, and then the ceramic green sheet 201 is applied by hydrostatic pressure in a liquid in a sealed container. The pressure jig 205 is pressed in the pressure sheet 206. Although not shown, a plurality of stoppers for determining the bottom dead center may be provided around and at the center of at least one of the upper and lower pressure jigs 205. Thereby, the thickness of the ceramic green sheet 201 after pressurization can be made constant. In the hydrostatic pressurization, a liquid such as oil or water can be used as a pressurizing medium.

In addition, in the hydrostatic pressure, the ceramic green sheet 201 and each metal paste are heated by heating at a temperature equal to or higher than the glass transition temperature of the thermoplastic resin in accordance with the temperature characteristics of the thermoplastic resin contained in the ceramic green sheet 201. A plurality of recesses 104 are formed in the ceramic green sheet 201 by pressurizing with hydrostatic pressure. What is necessary is just to perform the temperature at the time of pressurization in the pressure range of 10-50 Mpa, for example in the temperature range of about 40-120 degreeC. As a result, pressure is uniformly applied to the entire surface of the ceramic green sheet 201, and pressure is also uniformly applied to the respective recesses 104. Therefore, the flatness in the recesses 104 is improved, and the dimensional accuracy is good in each wiring board region 207. The ceramic green sheet 201 can be manufactured. The pressurizing step is not limited to hydrostatic pressurization, and other methods such as hydraulic pressurization may be used.

What has been subjected to such a pressing step is a ceramic green sheet 201 in which a recess 104 as shown in FIG. 4E is formed. As shown in the figure, a second metal paste 203 to be the second connection conductor 106 is formed as an embedded portion 108 embedded in the upper surface portion of the recess 104. Further, the embedded portion 108 is deeper than the other portions at the connection portion between the second metal paste 203 and the through conductor paste 204. In addition, in the connection portion between the through-conductor paste 204 and the second metal paste 203, a protruding portion 112 is formed that is embedded in the inner side surface portion of the recess 104 larger than the other portions.

Such an embedded portion 108 is formed in a process in which a part of the ceramic green sheet 201 in the thickness direction, the second metal paste 203 and the portion of the through conductor paste 204 on the second metal paste 203 side are pushed downward. . That is, when pressing about 1/2 of the ceramic green sheet 201 and the through conductor paste 204, the pressure applied by the pressurizing jig 205 moves the through conductor paste 204 toward the lower surface of the recess 104. 108 is formed. Note that when the through-conductor paste 204 is pushed in, the embedded portion 108 is formed and a part of the through-conductor paste 204 spreads around the second connection conductor 106 of the recess 104. Thus, the diameter of the through-conductor paste 204 may be designed to be smaller than the width of the second connection conductor 106. Further, the pressing dimension in the lower surface direction to be pressed is about 1 / th of the thickness of the ceramic green sheet 201 before pressing.
It is not limited to 2 and may be changed in consideration of the size of the electronic component 110 to be accommodated.

Similarly, the projecting portion 112 is formed in a process in which a part of the ceramic green sheet 201 in the thickness direction, the second metal paste 203 and the portion of the through-conductor paste 204 on the second metal paste 203 side are pushed downward. The Here, when processing is performed in which the curved portion 114 is formed, the protruding portion 112 can be formed more effectively. That is, at the time of such pressurization, not only the pressure by the pressurizing jig 205 moves the through conductor paste 204 in the lower surface direction of the concave portion 104 but also in the horizontal direction of the concave portion 104 (the back side of the side surface of the concave portion 104). Thus, the protrusion 112 can be formed more effectively. Then, it is possible to facilitate insertion of the pressing jig 205 into the ceramic green sheet 201 when pressing the ceramic green sheet 201 and each metal paste, and peeling from the ceramic green sheet 201 after pressing. Note that a release agent may be applied to the pressing jig 205 or a surface treatment may be applied as necessary so that it can be easily peeled off.

The ceramic green sheet 201 formed with the plurality of recesses 104 formed in this way is, for example, when the ceramic material to be used is alumina and the metal paste is made of tungsten, and is about 1600 ° C. in a reducing atmosphere. By baking at a temperature, a plurality of wiring board regions 207 are formed as an array. Then, after a plating layer such as nickel or gold is deposited on the exposed wiring conductor, by dividing such an assembly, a plurality of electronic component storage packages as shown in FIG. An insulating substrate 101 is manufactured.

Then, by forming the embedded portion 108 and the protruding portion 112, it is possible to manufacture an electronic component storage package having excellent connection reliability between the second connection conductor 106 and the side conductor 107. In addition, the possibility of tapering of the side conductor 107 is reduced, the second connecting conductor 106 is peeled off from the upper surface of the recess 104 due to the anchor effect by the embedded portion, and the side conductor 107 is removed from the side surface of the recess 104. Peeling is also effectively suppressed. This also makes it possible to manufacture an electronic component storage package with excellent reliability.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the example of the above-described embodiment, the shape of the insulating substrate 101 is a rectangular shape in which the length of the long side and the short side is different, but may be a square shape. Moreover, the arrangement position and the number of wires of the wiring conductor can be changed according to the use of the electronic component storage package. Further, although the shape of the recess 104 is the insulating substrate 101 with one bottom formed, it may be applied to the insulating substrate 101 with the stepped recess 104 with two or more bottoms formed in the thickness direction. Good. In addition, the cross-sectional shape in plan view of the through-conductor paste 204 to be the side conductor 107 is circular, but in order to ensure more reliable conductivity during pressurization, an elliptical shape or a long hole shape is necessary. Etc. may be changed.

101 ・ ・ ・ Insulating substrate
102 ... Base
103 ・ ・ ・ Frame part
104 ... concave
105 ... 1st connection conductor
106 ... Second connection conductor
107 ・ ・ ・ Side conductor
108 ... buried part
109 ・ ・ ・ External connection conductor
110 ・ ・ ・ Electronic parts
111 ・ ・ ・ Wire
112 ... Projection
113 ・ ・ ・ Bump
114 ・ ・ ・ Bent
201 ・ ・ ・ Ceramic green sheet
202 ... 1st metal paste
203 ・ ・ ・ Second metal paste
204 ・ ・ ・ Paste for through conductor
205 ... Pressure jig
206 ・ ・ ・ Pressure sheet
207 ・ ・ ・ Wiring board area

Claims (6)

An insulating substrate having a recess on the upper surface;
At least one first connection conductor provided on the upper surface so as to be in contact with an edge of the recess in plan view;
At least one second connection conductor provided on the bottom surface of the recess in contact with the inner side surface of the recess, and provided on the inner side surface of the recess from the lower end to the upper end of the inner side surface, and the first connection A side conductor connected to the conductor and the second connection conductor,
The second connection conductor is embedded in a bottom surface portion of the concave portion of the insulating substrate and has a buried portion connected to the side conductor;
The package for storing an electronic component, wherein the embedded portion is deeper than the other portion at a connection portion with the side conductor. The said side conductor has a protrusion part which is largely embedded in the inner side surface part of the said recessed part of the said insulated substrate in the connection part with the said embedding part of the said 2nd connection conductor rather than another part. The electronic component storage package according to 1. The plurality of second connection conductors are provided, and the top surfaces of the plurality of second connection conductors and the bottom surfaces of the recesses are located on the same plane. The electronic component storage package according to 2. The electronic component housing according to any one of claims 1 to 3, wherein the side conductor has an exposed surface having a curved portion at a lower end in a cross-sectional view in the thickness direction of the insulating substrate. For package. An electronic device comprising: the electronic component storage package according to claim 1; and an electronic component accommodated in the recess. Producing a ceramic green sheet in which a plurality of wiring board regions are arranged;
A first metal paste is applied to the upper surface of each of the plurality of wiring board regions of the ceramic green sheet and around the wiring board region, and a second metal paste having one end in contact with the inner periphery of the first metal paste A step of applying
Providing a through conductor paste penetrating at least part of the thickness direction of the ceramic green sheet at a connection portion between the first metal paste and the second metal paste; and each of the plurality of wiring board regions The ceramic green sheet is pressed against the inner side of the first metal paste, and the second part of the ceramic green sheet in the thickness direction, the second metal paste, and the through conductor paste Pushing the metal paste side part downward;
The manufacturing method of the package for electronic component accommodation characterized by including this.

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