JP2016133927A5 - - Google Patents

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JP2016133927A5
JP2016133927A5 JP2015007191A JP2015007191A JP2016133927A5 JP 2016133927 A5 JP2016133927 A5 JP 2016133927A5 JP 2015007191 A JP2015007191 A JP 2015007191A JP 2015007191 A JP2015007191 A JP 2015007191A JP 2016133927 A5 JP2016133927 A5 JP 2016133927A5
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Prior art keywords
space
temperature
container
control device
temperature control
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JP2015007191A
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JP6415332B2 (en
JP2016133927A (en
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Priority claimed from JP2015007191A external-priority patent/JP6415332B2/en
Priority to PCT/JP2016/000078 priority patent/WO2016114117A1/en
Priority to KR1020177022001A priority patent/KR101971813B1/en
Publication of JP2016133927A publication Critical patent/JP2016133927A/en
Publication of JP2016133927A5 publication Critical patent/JP2016133927A5/ja
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上記目的を達成するために、本発明の一側面としての温度制御装置は、第1空間および第2空間の温度を制御する温度制御装置であって、前記第1空間の温度を制御する第1制御部と、前記第2空間の温度を制御する第2制御部と、前記第1空間に配置され且つ前記第1空間の温度に応じて内部の圧力が変化する第1容器と、前記第2空間に配置され且つ前記第2空間の温度に応じて内部の圧力が変化する第2容器と、前記第1容器の内部と前記第2容器の内部とに接続されてそれらの圧力差を検出するセンサとを有する検出部と、を含み、前記第2制御部は、前記第1空間と前記第2空間との温度差が目標温度差になるように、前記検出部により検出された前記圧力差に基づいて前記第2空間の温度を制御する、ことを特徴とする。 In order to achieve the above object, a temperature control device according to one aspect of the present invention is a temperature control device that controls the temperature of a first space and a second space, and is a first device that controls the temperature of the first space. A control unit; a second control unit that controls the temperature of the second space; a first container that is disposed in the first space and has an internal pressure that changes according to the temperature of the first space; A second container that is disposed in the space and whose internal pressure changes according to the temperature of the second space, and is connected to the inside of the first container and the inside of the second container to detect the pressure difference between them. The pressure difference detected by the detection unit such that a temperature difference between the first space and the second space becomes a target temperature difference. The temperature of the second space is controlled based on the above.

Claims (14)

第1空間および第2空間の温度を制御する温度制御装置であって、
前記第1空間の温度を制御する第1制御部と、
前記第2空間の温度を制御する第2制御部と、
前記第1空間に配置され且つ前記第1空間の温度に応じて内部の圧力が変化する第1容器と、前記第2空間に配置され且つ前記第2空間の温度に応じて内部の圧力が変化する第2容器と、前記第1容器の内部と前記第2容器の内部とに接続されてそれらの圧力差を検出するセンサとを有する検出部と、
を含み、
前記第2制御部は、前記第1空間と前記第2空間との温度差が目標温度差になるように、前記検出部により検出された前記圧力差に基づいて前記第2空間の温度を制御する、ことを特徴とする温度制御装置。
A temperature control device for controlling the temperature of the first space and the second space,
A first controller for controlling the temperature of the first space;
A second control unit for controlling the temperature of the second space;
A first container disposed in the first space and having an internal pressure that varies in accordance with the temperature of the first space, and an internal pressure that is disposed in the second space and varies in accordance with the temperature of the second space. A detection unit having a second container to be connected, and a sensor connected to the inside of the first container and the inside of the second container to detect a pressure difference between them,
Including
The second control unit controls the temperature of the second space based on the pressure difference detected by the detection unit so that a temperature difference between the first space and the second space becomes a target temperature difference. A temperature control device characterized by that.
前記第2制御部は、前記検出部により検出された前記圧力差を前記第1空間と前記第2空間との温度差に換算することで得られた換算値を用いて、前記第2空間の温度を制御する、ことを特徴とする請求項1に記載の温度制御装置。The second control unit uses a conversion value obtained by converting the pressure difference detected by the detection unit into a temperature difference between the first space and the second space, and uses the converted value of the second space. The temperature control apparatus according to claim 1, wherein the temperature is controlled. 前記第2空間の温度を計測する温度センサを更に含み、
前記第2制御部は、記温度センサの出力と前記第2空間の目標温度との偏差を前記換算値により補正することで得られた値に基づいて前記第2空間の温度を制御する、ことを特徴とする請求項に記載の温度制御装置。
A temperature sensor for measuring the temperature of the second space;
The second control unit controls the temperature of the second space based a deviation between the target temperature and output the second space of the previous SL temperature sensor to a value obtained by correcting by the converted value, The temperature control device according to claim 2 .
前記第1容器および前記第2容器は、前記第1空間と前記第2空間との温度差が零のときに前記圧力差が零になるように構成されている、ことを特徴とする請求項1乃至3のうちいずれか1項に記載の温度制御装置。 The first container and the second container are configured such that the pressure difference becomes zero when the temperature difference between the first space and the second space is zero. The temperature control apparatus according to any one of 1 to 3 . 前記第1容器および前記第2容器は互いに同じ容積を有する、ことを特徴とする請求項1乃至のうちいずれか1項に記載の温度制御装置。 Temperature control device according to any one of claims 1 to 4 wherein the first container and the second container has the same volume with each other, it is characterized. 前記第1容器および前記第2容器にはそれぞれ、内部の容積より少ない量の液体が封入されている、ことを特徴とする請求項1乃至のうちいずれか1項に記載の温度制御装置。 Temperature control device according to any one of claims 1 to 5, wherein said each of the first container and the second container, small amounts of liquid from the inside of the volume is filled, it. 前記検出部の前記センサは、前記第1容器の内部に第1配管を介して連通する第1室、前記第2容器の内部に第2配管を介して連通する第2室、および前記第1室と第2室とを仕切るダイアフラムを有し、当該ダイアフラムの歪みを計測することにより前記圧力差を検出する、ことを特徴とする請求項1乃至のうちいずれか1項に記載の温度制御装置。 The sensor of the detection unit includes a first chamber communicating with the inside of the first container via a first pipe, a second chamber communicating with the inside of the second container via a second pipe, and the first The temperature control according to any one of claims 1 to 6 , further comprising a diaphragm partitioning the chamber and the second chamber, and detecting the pressure difference by measuring distortion of the diaphragm. apparatus. 前記第1配管および前記第2配管は断熱材で覆われている、ことを特徴とする請求項に記載の温度制御装置。 The temperature control device according to claim 7 , wherein the first pipe and the second pipe are covered with a heat insulating material. 前記第1配管および前記第2配管には、前記第1容器および前記第2容器のそれぞれに封入された液体より沸点の高い液体が充填されている、ことを特徴とする請求項又はに記載の温度制御装置。 The said 1st piping and the said 2nd piping are filled with the liquid whose boiling point is higher than the liquid enclosed with each of the said 1st container and the said 2nd container, The Claim 7 or 8 characterized by the above-mentioned. The temperature control device described. 前記検出部は、前記第1空間と前記第2空間との温度を互いに同じになるように制御している間において、前記第1容器の内部および前記第2容器の内部を連通させて前記圧力差の検出結果に生じる誤差を補正するためのバイパス管を含む、ことを特徴とする請求項乃至のうちいずれか1項に記載の温度制御装置。 While the temperature of the first space and the second space is controlled to be equal to each other, the detection unit communicates the inside of the first container and the inside of the second container with the pressure. temperature control device according to any one of claims 7 to 9 including a bypass pipe for correcting errors caused in the detection result of the difference, it is characterized. 前記第1空間および前記第2空間は連通している、ことを特徴とする請求項1乃至のうちいずれか1項に記載の温度制御装置。 The temperature control device according to any one of claims 1 to 9 , wherein the first space and the second space communicate with each other. 前記第1制御部は、前記第1空間に配置された第1温度センサの出力に基づいて、前記第1空間に供給される流体を温調することにより前記第1空間の温度を制御し、
前記第2制御部は、前記第2空間に配置された第2温度センサの出力に基づいて、前記第2空間に供給される流体を温調することにより前記第2空間の温度を制御する、ことを特徴とする請求項1乃至11のうちいずれか1項に記載の温度制御装置。
The first control unit controls the temperature of the first space by adjusting the temperature of the fluid supplied to the first space based on the output of the first temperature sensor disposed in the first space,
The second control unit controls the temperature of the second space by adjusting the temperature of the fluid supplied to the second space based on the output of the second temperature sensor disposed in the second space. The temperature control apparatus according to any one of claims 1 to 11 , wherein
基板にパターンを形成するリソグラフィ装置であって、
前記基板にパターンを形成するユニットと、
請求項1乃至12のうちいずれか1項に記載の温度制御装置と、
を含み、
前記温度制御装置は、前記ユニットが配置されている空間と連通している第1空間および第2空間の温度を制御する、ことを特徴とするリソグラフィ装置。
A lithographic apparatus for forming a pattern on a substrate,
A unit for forming a pattern on the substrate;
The temperature control device according to any one of claims 1 to 12 ,
Including
The lithographic apparatus, wherein the temperature control device controls temperatures of a first space and a second space communicating with a space in which the unit is disposed.
請求項13に記載のリソグラフィ装置を用いて基板にパターンを形成する工程と、
前記工程で前記パターンを形成された前記基板を加工する工程と、
を含むことを特徴とする物品の製造方法。
Forming a pattern on a substrate using the lithographic apparatus according to claim 13 ;
Processing the substrate on which the pattern is formed in the step;
A method for producing an article comprising:
JP2015007191A 2015-01-16 2015-01-16 Temperature control apparatus, lithographic apparatus, and article manufacturing method Active JP6415332B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015007191A JP6415332B2 (en) 2015-01-16 2015-01-16 Temperature control apparatus, lithographic apparatus, and article manufacturing method
PCT/JP2016/000078 WO2016114117A1 (en) 2015-01-16 2016-01-08 Temperature controlling apparatus, lithography apparatus, and method of manufacturing article
KR1020177022001A KR101971813B1 (en) 2015-01-16 2016-01-08 Temperature control apparatus, lithographic apparatus and article manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015007191A JP6415332B2 (en) 2015-01-16 2015-01-16 Temperature control apparatus, lithographic apparatus, and article manufacturing method

Publications (3)

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JP2016133927A JP2016133927A (en) 2016-07-25
JP2016133927A5 true JP2016133927A5 (en) 2018-04-19
JP6415332B2 JP6415332B2 (en) 2018-10-31

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JP (1) JP6415332B2 (en)
KR (1) KR101971813B1 (en)
WO (1) WO2016114117A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6853704B2 (en) * 2017-03-22 2021-03-31 キヤノン株式会社 Lithography equipment and manufacturing method of goods

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* Cited by examiner, † Cited by third party
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JPS5949921U (en) * 1982-09-24 1984-04-03 横河電機株式会社 liquid level transmitter
JPS60122845U (en) * 1984-01-26 1985-08-19 横河電機株式会社 Pressure/differential pressure transmitter with temperature compensation mechanism
JP3776297B2 (en) * 2000-07-12 2006-05-17 株式会社山武 Control system
JP3833479B2 (en) * 2001-01-25 2006-10-11 株式会社山武 Control device
JP4364218B2 (en) * 2006-06-07 2009-11-11 株式会社ナック Leak inspection method and leak inspection apparatus
JP5219906B2 (en) 2009-04-07 2013-06-26 キヤノン株式会社 Temperature measuring apparatus, temperature measuring method, exposure apparatus, and device manufacturing method
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