JP2016133927A5 - - Google Patents
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- JP2016133927A5 JP2016133927A5 JP2015007191A JP2015007191A JP2016133927A5 JP 2016133927 A5 JP2016133927 A5 JP 2016133927A5 JP 2015007191 A JP2015007191 A JP 2015007191A JP 2015007191 A JP2015007191 A JP 2015007191A JP 2016133927 A5 JP2016133927 A5 JP 2016133927A5
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- JP
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- Prior art keywords
- space
- temperature
- container
- control device
- temperature control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001514 detection method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims 4
- 239000007788 liquid Substances 0.000 claims 3
- 239000012530 fluid Substances 0.000 claims 2
- 238000009835 boiling Methods 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000638 solvent extraction Methods 0.000 claims 1
Description
上記目的を達成するために、本発明の一側面としての温度制御装置は、第1空間および第2空間の温度を制御する温度制御装置であって、前記第1空間の温度を制御する第1制御部と、前記第2空間の温度を制御する第2制御部と、前記第1空間に配置され且つ前記第1空間の温度に応じて内部の圧力が変化する第1容器と、前記第2空間に配置され且つ前記第2空間の温度に応じて内部の圧力が変化する第2容器と、前記第1容器の内部と前記第2容器の内部とに接続されてそれらの圧力差を検出するセンサとを有する検出部と、を含み、前記第2制御部は、前記第1空間と前記第2空間との温度差が目標温度差になるように、前記検出部により検出された前記圧力差に基づいて前記第2空間の温度を制御する、ことを特徴とする。 In order to achieve the above object, a temperature control device according to one aspect of the present invention is a temperature control device that controls the temperature of a first space and a second space, and is a first device that controls the temperature of the first space. A control unit; a second control unit that controls the temperature of the second space; a first container that is disposed in the first space and has an internal pressure that changes according to the temperature of the first space; A second container that is disposed in the space and whose internal pressure changes according to the temperature of the second space, and is connected to the inside of the first container and the inside of the second container to detect the pressure difference between them. The pressure difference detected by the detection unit such that a temperature difference between the first space and the second space becomes a target temperature difference. The temperature of the second space is controlled based on the above.
Claims (14)
前記第1空間の温度を制御する第1制御部と、
前記第2空間の温度を制御する第2制御部と、
前記第1空間に配置され且つ前記第1空間の温度に応じて内部の圧力が変化する第1容器と、前記第2空間に配置され且つ前記第2空間の温度に応じて内部の圧力が変化する第2容器と、前記第1容器の内部と前記第2容器の内部とに接続されてそれらの圧力差を検出するセンサとを有する検出部と、
を含み、
前記第2制御部は、前記第1空間と前記第2空間との温度差が目標温度差になるように、前記検出部により検出された前記圧力差に基づいて前記第2空間の温度を制御する、ことを特徴とする温度制御装置。 A temperature control device for controlling the temperature of the first space and the second space,
A first controller for controlling the temperature of the first space;
A second control unit for controlling the temperature of the second space;
A first container disposed in the first space and having an internal pressure that varies in accordance with the temperature of the first space, and an internal pressure that is disposed in the second space and varies in accordance with the temperature of the second space. A detection unit having a second container to be connected, and a sensor connected to the inside of the first container and the inside of the second container to detect a pressure difference between them,
Including
The second control unit controls the temperature of the second space based on the pressure difference detected by the detection unit so that a temperature difference between the first space and the second space becomes a target temperature difference. A temperature control device characterized by that.
前記第2制御部は、前記温度センサの出力と前記第2空間の目標温度との偏差を前記換算値により補正することで得られた値に基づいて前記第2空間の温度を制御する、ことを特徴とする請求項2に記載の温度制御装置。 A temperature sensor for measuring the temperature of the second space;
The second control unit controls the temperature of the second space based a deviation between the target temperature and output the second space of the previous SL temperature sensor to a value obtained by correcting by the converted value, The temperature control device according to claim 2 .
前記第2制御部は、前記第2空間に配置された第2温度センサの出力に基づいて、前記第2空間に供給される流体を温調することにより前記第2空間の温度を制御する、ことを特徴とする請求項1乃至11のうちいずれか1項に記載の温度制御装置。 The first control unit controls the temperature of the first space by adjusting the temperature of the fluid supplied to the first space based on the output of the first temperature sensor disposed in the first space,
The second control unit controls the temperature of the second space by adjusting the temperature of the fluid supplied to the second space based on the output of the second temperature sensor disposed in the second space. The temperature control apparatus according to any one of claims 1 to 11 , wherein
前記基板にパターンを形成するユニットと、
請求項1乃至12のうちいずれか1項に記載の温度制御装置と、
を含み、
前記温度制御装置は、前記ユニットが配置されている空間と連通している第1空間および第2空間の温度を制御する、ことを特徴とするリソグラフィ装置。 A lithographic apparatus for forming a pattern on a substrate,
A unit for forming a pattern on the substrate;
The temperature control device according to any one of claims 1 to 12 ,
Including
The lithographic apparatus, wherein the temperature control device controls temperatures of a first space and a second space communicating with a space in which the unit is disposed.
前記工程で前記パターンを形成された前記基板を加工する工程と、
を含むことを特徴とする物品の製造方法。 Forming a pattern on a substrate using the lithographic apparatus according to claim 13 ;
Processing the substrate on which the pattern is formed in the step;
A method for producing an article comprising:
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015007191A JP6415332B2 (en) | 2015-01-16 | 2015-01-16 | Temperature control apparatus, lithographic apparatus, and article manufacturing method |
PCT/JP2016/000078 WO2016114117A1 (en) | 2015-01-16 | 2016-01-08 | Temperature controlling apparatus, lithography apparatus, and method of manufacturing article |
KR1020177022001A KR101971813B1 (en) | 2015-01-16 | 2016-01-08 | Temperature control apparatus, lithographic apparatus and article manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015007191A JP6415332B2 (en) | 2015-01-16 | 2015-01-16 | Temperature control apparatus, lithographic apparatus, and article manufacturing method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016133927A JP2016133927A (en) | 2016-07-25 |
JP2016133927A5 true JP2016133927A5 (en) | 2018-04-19 |
JP6415332B2 JP6415332B2 (en) | 2018-10-31 |
Family
ID=56405669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015007191A Active JP6415332B2 (en) | 2015-01-16 | 2015-01-16 | Temperature control apparatus, lithographic apparatus, and article manufacturing method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6415332B2 (en) |
KR (1) | KR101971813B1 (en) |
WO (1) | WO2016114117A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6853704B2 (en) * | 2017-03-22 | 2021-03-31 | キヤノン株式会社 | Lithography equipment and manufacturing method of goods |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5949921U (en) * | 1982-09-24 | 1984-04-03 | 横河電機株式会社 | liquid level transmitter |
JPS60122845U (en) * | 1984-01-26 | 1985-08-19 | 横河電機株式会社 | Pressure/differential pressure transmitter with temperature compensation mechanism |
JP3776297B2 (en) * | 2000-07-12 | 2006-05-17 | 株式会社山武 | Control system |
JP3833479B2 (en) * | 2001-01-25 | 2006-10-11 | 株式会社山武 | Control device |
JP4364218B2 (en) * | 2006-06-07 | 2009-11-11 | 株式会社ナック | Leak inspection method and leak inspection apparatus |
JP5219906B2 (en) | 2009-04-07 | 2013-06-26 | キヤノン株式会社 | Temperature measuring apparatus, temperature measuring method, exposure apparatus, and device manufacturing method |
JP5912439B2 (en) * | 2011-11-15 | 2016-04-27 | 東京エレクトロン株式会社 | Temperature control system, semiconductor manufacturing apparatus, and temperature control method |
-
2015
- 2015-01-16 JP JP2015007191A patent/JP6415332B2/en active Active
-
2016
- 2016-01-08 WO PCT/JP2016/000078 patent/WO2016114117A1/en active Application Filing
- 2016-01-08 KR KR1020177022001A patent/KR101971813B1/en active IP Right Grant
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