KR101971813B1 - Temperature control apparatus, lithographic apparatus and article manufacturing method - Google Patents
Temperature control apparatus, lithographic apparatus and article manufacturing method Download PDFInfo
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- KR101971813B1 KR101971813B1 KR1020177022001A KR20177022001A KR101971813B1 KR 101971813 B1 KR101971813 B1 KR 101971813B1 KR 1020177022001 A KR1020177022001 A KR 1020177022001A KR 20177022001 A KR20177022001 A KR 20177022001A KR 101971813 B1 KR101971813 B1 KR 101971813B1
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- space
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- control
- difference
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
- G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
- G05D23/1932—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces
- G05D23/1934—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces each space being provided with one sensor acting on one or more control means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Remote Sensing (AREA)
- Automation & Control Theory (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Control Of Temperature (AREA)
Abstract
The present invention provides a temperature control apparatus for controlling a temperature of a first space and a second space, the temperature control apparatus comprising: a first control unit configured to control a temperature of a first space; A first container disposed in the first space, a second container disposed in the first space, a second container disposed in the first space, a second container disposed in the second space, Wherein the second control unit includes a detection unit including a sensor configured to detect a pressure difference between the first space and the second space, wherein the second control unit uses the conversion value obtained by converting the detected pressure difference into a temperature difference between the first space and the second space, Temperature is controlled.
Description
The present invention relates to a temperature control apparatus, a lithographic apparatus, and a method of manufacturing an article.
A lithographic apparatus used for manufacturing a semiconductor device or the like needs to accurately control the temperature of the internal space of the lithographic apparatus as a fine pattern is formed on the substrate. The lithographic apparatus may be provided with a control unit for controlling the temperature of the internal space based on, for example, an output from a temperature sensor (resistance body) whose resistance value varies with temperature.
The lithographic apparatus may be used, for example, to provide a temperature sensor in a plurality of portions (a plurality of spaces) of an inner space, and individually control the temperature of each portion by using a control unit based on an output from a temperature sensor provided in each portion . However, due to the individual differences and the aging changes of the temperature sensors provided in the plurality of portions, the errors generated at the output from each temperature sensor are sometimes of different sizes. In this case, if the temperature of each part is controlled based on the output from the corresponding temperature sensor, the temperature difference between the plurality of parts is deviated from the target temperature difference. This can make it difficult to accurately control the temperature in the interior space of the lithographic apparatus.
The present invention provides an advantageous technique for accurately controlling the temperature difference between a plurality of spaces.
According to one aspect of the present invention, there is provided a temperature control apparatus for controlling a temperature of a first space and a second space, the temperature control apparatus comprising: a first control unit configured to control a temperature of a first space; A second control unit configured to control a temperature of the second space; A first container disposed in the first space and having an internal pressure varying with the temperature of the first space, a second container disposed in the second space and having an internal pressure varying with the temperature of the second space, And a sensor connected to the interior of the first container and the interior of the second container and configured to detect a pressure difference between the first container and the second container, By using the conversion value obtained by converting the pressure difference detected by the detection unit to a temperature difference between the first space and the second space so as to set the temperature difference between the first space and the second space to the target temperature difference, Thereby controlling the temperature of the second space.
Other features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
1 is a schematic view showing a configuration of a temperature control device according to the first embodiment.
FIG. 2A is a graph showing an example of a change in error generated in each of the two temperature sensors with passage of time. FIG.
FIG. 2B is a graph showing an example of a change in the error generated in each of the two temperature sensors with the lapse of time. FIG.
3 is a view showing an example of the arrangement of the detection unit.
4A is a diagram showing an example of the arrangement of the differential pressure sensor.
4B is a diagram showing an example of the arrangement of the differential pressure sensor.
5 is a view showing an arrangement example of a detection unit having a heat insulating material.
6 is a block diagram showing a control block of the temperature control device according to the first embodiment.
7A is a diagram showing an example of the arrangement of the detection unit.
7B is a diagram showing an example of the arrangement of the detection unit.
8A is a diagram showing an example of the arrangement of the detection unit.
8B is a diagram showing an example of the arrangement of the detection unit.
9 is a block diagram showing a control block additionally having a function of correcting the output from the detection unit.
10 is a block diagram showing a control block of the temperature control device according to the third embodiment.
11 is a view showing an example of the arrangement of a temperature control device using three control systems.
12 is a block diagram showing a control block of a temperature measuring apparatus for measuring the temperature of a plurality of spaces.
13 is a schematic view showing an exposure apparatus.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same reference numerals denote the same members throughout the drawings, and a repeated explanation thereof is not given.
1st Example
The
The
The
The
As shown in Fig. 1, the
The arrangement of the
Next, the detailed mechanism of the
... (One)
According to equation (1), the vapor pressure P is uniquely determined by the type and temperature of the liquid 14. That is, the internal pressure of the
The configuration of the
5, the
Temperature control
The temperature control in the
In the
In addition, the second control in the unit (1b), the second control unit in terms of a group of (7b) (7b 4) has a first space to a pressure difference (P 21) detected by the detection unit (10) (6a) and the 2 space (6b). For example, when Novec 7000 TM, which is hydrofluoroether (hereinafter referred to as HFE), is used as the liquid 14, the equation (2) can be obtained by using the equation (1) P) and the temperature T of the
... (2)
... (3)
Conversion group (7b 4) is a first container (11a) by adding the pressure difference (P 21), a second container (11b) in terms of value (P 2 ') on the vapor pressure of the interior is detected by the
... (4)
... (5)
The output from the
As described above, the
Second Example
A temperature control apparatus according to a second embodiment of the present invention will be described. The temperature control device according to the second embodiment differs from the
The
Fig. 9 is a block diagram showing a control block obtained by adding a function of correcting the output from the
Third Example
A temperature control apparatus according to a third embodiment of the present invention will be described. The first embodiment is a case in which the target temperature difference between the
10 is a block diagram showing a control block of the temperature control apparatus according to the third embodiment. Referring to Fig. 10, the target temperature SP1 of the
A second control unit (7b) includes a first calculator for calculating a first container (11a) pressure of the internal from the output from the first temperature sensor (5a) by using the equation (1) (7b 6) and (1 And a
Fourth Example
The
The
In addition, the
By constituting the
Of the temperature measuring device Example
An embodiment of a temperature measuring apparatus for measuring the temperature of a plurality of spaces will be described below with reference to Fig. 12 is a block diagram showing a control block of a temperature measuring apparatus for measuring the temperature of a plurality of spaces. The present embodiment will exemplify the case of measuring the temperatures of the first and second spaces.
The temperature measuring apparatus includes a
A control unit (7) is formula (1) a first converter (7b 6) and formula (1) by calculating a pressure value inside the first container (11a) from the output from the first temperature sensor (5a) using the And a
Lithography Device Example
A case where one of the
FIG. 13 is a schematic view showing the
The
Of the article manufacturing method Example
The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing an article such as a semiconductor device or a micro device having a fine structure. The present method for manufacturing an article according to the present embodiment includes the steps of forming a pattern on a substrate using the lithographic apparatus (exposure apparatus) (exposing a substrate) and processing a substrate on which a pattern is formed in a previous step , ≪ / RTI > development). The manufacturing method further includes other known steps (oxidation, deposition, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method according to this embodiment is superior to the conventional method in at least one of the article performance, quality, productivity, and production cost.
Other Example
The embodiment (s) of the present invention (control unit) may include a storage medium (which may be referred to more fully as a 'non-transitory computer readable storage medium') for performing one or more of the above- (E.g., an application-specific integrated circuit (e.g., a computer-readable storage medium) that reads and / or executes computer-executable instructions (e.g., one or more programs) ASIC), and / or by reading and executing computer-executable instructions from a storage medium to perform, for example, the functions of one or more of the above-described embodiments (s) and / May be realized by a method executed by a computer of the system or apparatus by controlling one or more circuits to perform one or more functions of the embodiment (s) There is also. A computer may include one or more processors (e.g., a central processing unit (CPU), microprocessing unit (MPU)) and may include a separate computer or a separate processor network for reading and executing computer- can do. The computer-executable instructions may be provided to the computer, for example, from a network or storage medium. The storage medium may be, for example, a hard disk, a random access memory (RAM), a read only memory (ROM), a storage of a distributed computing system, an optical disk (e.g., a compact disk (CD), a digital versatile disk Blu-ray Disc (BD) (TM)), a flash memory device, a memory card, and the like.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims priority from Japanese Patent Application No. 2015-007191, filed January 16, 2015, the entirety of which is incorporated herein by reference.
Claims (14)
A first control unit configured to control a temperature of the first space;
A second control unit configured to control a temperature of the second space; And
A first container which is disposed in the first space and whose internal pressure changes in accordance with the temperature of the first space, a second container which is disposed in the second space and whose internal pressure changes in accordance with the temperature of the second space, And a sensor connected to the interior of the first container and the interior of the second container and configured to detect a pressure difference between the first container and the second container,
And the second control unit controls the temperature of the second space based on a pressure difference detected by the detection unit so as to set the temperature difference between the first space and the second space to a target temperature difference.
And the second control unit controls the temperature of the second space by using the conversion value obtained by converting the pressure difference detected by the detection unit into the temperature difference.
Further comprising a temperature sensor configured to measure a temperature of the second space,
The second control unit controls the temperature of the second space based on the value obtained by correcting the deviation between the output from the temperature sensor and the target temperature of the second space using the conversion value, Device.
Wherein the first container and the second container are configured such that the pressure difference becomes zero when the temperature difference between the first space and the second space is zero.
Wherein the first vessel has the same volume as the second vessel.
Wherein a volume of liquid smaller than an internal volume of each of the first container and the second container is sealed in the inside thereof.
Wherein the sensor of the detection unit comprises:
A first chamber communicating with the interior of the first vessel through a first pipe, a second chamber communicating with the interior of the second vessel through a second pipe, and a second chamber communicating with the first chamber and the second chamber Wherein the diaphragm comprises a diaphragm,
And the pressure difference is detected by measuring twist of the diaphragm.
Wherein the first pipe and the second pipe are covered with a heat insulating material.
Wherein each of the first pipe and the second pipe is filled with a liquid having a boiling point higher than that of the liquid enclosed in each of the first container and the second container.
Wherein the detection unit generates in the detection result of the pressure difference by making the inside of the first container communicate with the inside of the second container while the control is performed to make the temperature of the first space and the second space coincide with each other And a bypass piping configured to correct an error that is caused by the temperature difference.
And the first space communicates with the second space.
The first control unit controls the temperature of the first space by controlling the temperature of the fluid supplied to the first space based on the output from the first temperature sensor disposed in the first space,
Wherein the second control unit is configured to control the temperature of the second space based on the pressure difference so that the fluid supplied to the second space based on the output from the second temperature sensor disposed in the second space And the temperature of the second space is controlled by adjusting the temperature.
A unit configured to form a pattern on the substrate; And
And a temperature control device configured to control a temperature of the first space and the second space in communication with the space in which the unit is disposed,
The temperature control device includes:
A first control unit configured to control a temperature of the first space;
A second control unit configured to control a temperature of the second space; And
A first container which is disposed in the first space and whose internal pressure changes in accordance with the temperature of the first space, a second container which is disposed in the second space and whose internal pressure changes in accordance with the temperature of the second space, And a sensor connected to the interior of the first container and the interior of the second container and configured to detect a pressure difference between the first container and the second container,
Wherein the second control unit controls the temperature of the second space based on a pressure difference detected by the detection unit to set a temperature difference between the first space and the second space to a target temperature difference.
Forming a pattern on a substrate using a lithographic apparatus; And
And processing the substrate on which the pattern is formed to manufacture an article,
The lithographic apparatus comprising:
A unit configured to form a pattern on the substrate; And
And a temperature control device configured to control a temperature of the first space and the second space in communication with the space in which the unit is disposed,
The temperature control device includes:
A first control unit configured to control a temperature of the first space;
A second control unit configured to control a temperature of the second space; And
A first container which is disposed in the first space and whose internal pressure changes in accordance with the temperature of the first space, a second container which is disposed in the second space and whose internal pressure changes in accordance with the temperature of the second space, And a sensor connected to the interior of the first container and the interior of the second container and configured to detect a pressure difference between the first container and the second container,
Wherein the second control unit controls the temperature of the second space based on a pressure difference detected by the detection unit so as to set a temperature difference between the first space and the second space to a target temperature difference.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015007191A JP6415332B2 (en) | 2015-01-16 | 2015-01-16 | Temperature control apparatus, lithographic apparatus, and article manufacturing method |
JPJP-P-2015-007191 | 2015-01-16 | ||
PCT/JP2016/000078 WO2016114117A1 (en) | 2015-01-16 | 2016-01-08 | Temperature controlling apparatus, lithography apparatus, and method of manufacturing article |
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KR20170103890A KR20170103890A (en) | 2017-09-13 |
KR101971813B1 true KR101971813B1 (en) | 2019-04-23 |
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KR1020177022001A KR101971813B1 (en) | 2015-01-16 | 2016-01-08 | Temperature control apparatus, lithographic apparatus and article manufacturing method |
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JP (1) | JP6415332B2 (en) |
KR (1) | KR101971813B1 (en) |
WO (1) | WO2016114117A1 (en) |
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JP6853704B2 (en) * | 2017-03-22 | 2021-03-31 | キヤノン株式会社 | Lithography equipment and manufacturing method of goods |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002023805A (en) | 2000-07-12 | 2002-01-25 | Yamatake Corp | Control system |
JP2002222001A (en) | 2001-01-25 | 2002-08-09 | Yamatake Corp | Controller |
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JPS5949921U (en) * | 1982-09-24 | 1984-04-03 | 横河電機株式会社 | liquid level transmitter |
JPS60122845U (en) * | 1984-01-26 | 1985-08-19 | 横河電機株式会社 | Pressure/differential pressure transmitter with temperature compensation mechanism |
JP4364218B2 (en) * | 2006-06-07 | 2009-11-11 | 株式会社ナック | Leak inspection method and leak inspection apparatus |
JP5219906B2 (en) | 2009-04-07 | 2013-06-26 | キヤノン株式会社 | Temperature measuring apparatus, temperature measuring method, exposure apparatus, and device manufacturing method |
JP5912439B2 (en) * | 2011-11-15 | 2016-04-27 | 東京エレクトロン株式会社 | Temperature control system, semiconductor manufacturing apparatus, and temperature control method |
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2015
- 2015-01-16 JP JP2015007191A patent/JP6415332B2/en active Active
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2016
- 2016-01-08 WO PCT/JP2016/000078 patent/WO2016114117A1/en active Application Filing
- 2016-01-08 KR KR1020177022001A patent/KR101971813B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002023805A (en) | 2000-07-12 | 2002-01-25 | Yamatake Corp | Control system |
JP2002222001A (en) | 2001-01-25 | 2002-08-09 | Yamatake Corp | Controller |
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Publication number | Publication date |
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JP6415332B2 (en) | 2018-10-31 |
KR20170103890A (en) | 2017-09-13 |
WO2016114117A1 (en) | 2016-07-21 |
JP2016133927A (en) | 2016-07-25 |
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