JP2016130366A - Thin film deposition apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin film deposition apparatus capable of preventing a vapor-deposited material from being unnecessarily supplied to a space inside a chamber and reusing a vapor-deposited material collected by a source collection part.SOLUTION: A thin film deposition apparatus includes: a chamber which has an inside space formed and also has an opening part, where a substrate as an object of vapor deposition is to be arranged, formed in one region of a shield film forming an upper surface; a source supply part which provides a vapor deposition source toward the shield film while moving in the inside space of the chamber; and a source collection part which is arranged at least on one side of the opening part and between the source supply part and shield film to collect the vapor deposition source jetted toward the shield film.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a thin film deposition apparatus. More specifically, the present invention relates to a thin film deposition apparatus that can prevent the deposition material from being unnecessarily supplied to the internal space of the chamber and can reuse the deposition material collected by the source collection unit.

  In general, an organic light emitting device (OLED) can be driven at a lower voltage than a conventional liquid crystal display (LCD), and can be thinned, wide viewing angle, quick response speed, etc. The drawbacks pointed out as problems in the LCD can be solved.

  The organic electroluminescent element includes a passive matrix type organic electroluminescent element (Passive Matrix OLED) having no switching element for each pixel and an active matrix type organic electroluminescent element used by forming a switching element using a thin film transistor for each pixel ( Active Matrix OLED). Among these, the structure of the active matrix organic electroluminescent device is such that an organic light emitting part is formed on a substrate, the organic light emitting part is encapsulated, and the organic light emitting part made of an organic substance comes into contact with oxygen and moisture. Prevents oxidation or deterioration.

  In the conventional encapsulation method, the organic light emitting part is sealed with a cap made of metal or glass. However, such a method not only makes it difficult to reduce the thickness, but also has a problem that it is difficult to implement a curved display by using metal or glass. Recently, a method for forming a protective film in which a polymer layer and an inorganic layer are repeatedly laminated on the surface of an organic light emitting unit has been proposed. In such a method, the inorganic substance and the monomer (Monomer) are vapor-deposited in multiple layers, and are cured by ultraviolet (UV) so that the monomer is converted into a polymer.

  A conventional monomer vapor deposition apparatus for forming such a protective film vaporizes the monomer from a container containing a liquid monomer, stores it in a vapor deposition unit having an internal space for a certain period of time, and then in a gaseous state on the substrate. Inject the monomer. When the monomer is deposited on the substrate with a certain thickness, the substrate is cured and the monomer is changed to a polymer.

  In the monomer deposition process as described above, a part of the monomer vapor is deposited on the substrate, and the remaining monomer vapor moves to the periphery of the substrate and is deposited on members around the substrate. Meanwhile, the substrate is transferred in one direction by the transfer unit, and the monomer vapor can be deposited on one surface of the substrate while the substrate is transferred in one direction. Here, the monomer vapor not deposited on the substrate is deposited on the transfer unit. Such a monomer may cause the operation of the transfer unit to become unstable or damage the transfer unit. In such a case, the operation of the monomer deposition apparatus is stopped and the monomer deposited on the transfer unit is removed. Further, when it is difficult to remove the monomer, the transfer unit is replaced. During such maintenance work, there is a problem that productivity is reduced by stopping the process. Moreover, there is a problem that the maintenance cost increases and the manufacturing cost increases as the replacement period of not only the transfer unit but also the members around the substrate becomes shorter.

  Moreover, the above vapor deposition method has a problem that vapor deposition efficiency is low. In this case, the vapor deposition efficiency means the ratio of the vapor deposition material actually deposited on the substrate among the vapor deposition materials vaporized from the vapor deposition source, and the vapor deposition efficiency is about 32%. Furthermore, in the conventional vapor deposition method using FMM, about 68% of the vapor deposition material that has not been used for vapor deposition is deposited in an undesired region inside the thin film vapor deposition apparatus, so that it cannot be reused easily. There is.

  Accordingly, an object of the present invention is to solve such a conventional problem, and can prevent the deposition material from being unnecessarily supplied to the internal space of the chamber, and also to collect the source. An object of the present invention is to provide a thin film deposition apparatus capable of reusing the deposition material collected by the section.

  Further, the vapor deposition material discharged from the source supply unit is diffused into an unnecessary space of the chamber by collecting the vapor deposition material discharged from the source supply unit while the trap moves with the source supply unit. An object of the present invention is to provide a thin film deposition apparatus that can prevent this.

  According to the present invention, the present invention has an internal space formed therein, a chamber having an opening in which a deposition target substrate is disposed in a region of a blocking film that forms an upper surface, and a movement within the internal space of the chamber. However, a source supply unit that provides a deposition source toward the blocking film and a source supply unit that is disposed between the source supply unit and the blocking film on at least one side of the opening and sprayed toward the blocking film. This is achieved by a thin film deposition apparatus including a source collector for collecting a deposition source.

  Here, the source collecting unit has an inlet formed on a surface facing the source supply unit, and a trap disposed above the source supply unit, and a drive for reciprocating the trap in a direction aligned with the source supply unit. It is preferable that the unit and one end are connected to the inlet of the trap and the other end is connected to the outside of the chamber to include a discharge unit for discharging a deposition source collected in the trap.

  The driving unit has one end rotatably connected to the chamber and the other end connected to the trap. The driving link reciprocally moves the trap in a direction aligned with the source supply unit, and the driving link. It preferably includes a drive motor that provides the drive force.

  The trap is preferably guided to reciprocate by a linear guide installed on the inner wall surface of the chamber in a direction aligned with the movement direction of the source supply unit.

  In addition, the discharge part is pivotally connected to the chamber at one end and connected to the trap at the other end, and is formed in the longitudinal direction inside the connection link. It is preferable to include a discharge passage connecting the external space.

  According to the present invention, there is provided a thin film deposition apparatus capable of preventing the deposition material from being unnecessarily supplied to the internal space of the chamber and reusing the deposition material collected by the source collection unit. Is done.

  Further, the vapor deposition material discharged from the source supply unit is diffused into an unnecessary space of the chamber by collecting the vapor deposition material discharged from the source supply unit while the trap moves with the source supply unit. A thin film deposition apparatus capable of preventing this is provided.

It is a perspective view of the thin film vapor deposition apparatus of this invention. It is a perspective view which shows the effect | action of the thin film vapor deposition apparatus of this invention. It is a perspective view which shows the effect | action of the thin film vapor deposition apparatus of this invention. It is a front sectional view showing the operation of the thin film deposition apparatus of the present invention. It is a front sectional view showing the operation of the thin film deposition apparatus of the present invention. It is a front sectional view showing the operation of the thin film deposition apparatus of the present invention. It is a sectional side view which shows the structure of the source collection part of the thin film vapor deposition apparatus of this invention.

  Prior to the description, in various embodiments, components having the same configuration will be described in the first embodiment by using the same reference numerals, and in other embodiments, the same as the first embodiment. Different configurations will be described.

  Hereinafter, a thin film deposition apparatus according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  1 is a perspective view of the thin film deposition apparatus of the present invention, and FIGS. 2 and 3 are perspective views showing the operation of the thin film deposition apparatus of the present invention.

  The thin film deposition apparatus of the present invention as described above includes a chamber 110, a source supply unit 120 that moves inside the chamber 110, and a source collection unit 130 that moves with the source supply unit 120 in a partial region inside the chamber 110. Consists of.

  The chamber 110 forms an internal space 111, and an opening 113 in which a deposition target substrate is disposed is formed in a region of the blocking film 112 that forms the upper surface of the chamber 110.

  The source supply unit 120 provides a deposition source toward the blocking layer 112 while moving in the internal space 111 of the chamber 110.

  On the other hand, the source supply unit 120 reciprocates from the state of being disposed on one side of the internal space 111 of the chamber 110 to the other side, whereby the region corresponding to the opening 113 in the moving section of the source supply unit 120. The source provided from the source supply unit 120 is deposited on the substrate, and the source is set to be uniformly provided for uniform deposition of the thin film even in the region where the opening 113 is not formed. The source supply unit 120 includes a container for storing a deposition material, a heating member that heats the deposition material, and a nozzle that provides the deposition material heated by the heating member to the deposition target side. Can do.

  Here, in the moving section of the source supply unit 120, the area where the opening 113 is formed is the deposition section (A1), and the area from the initial position of the source supply unit 120 to the opening 113 is the blocking section (A2). ).

  In addition, a rail 121 for guiding the movement of the source supply unit 120 is provided on the floor surface in contact with the internal space 111 of the chamber 110, and the source supply unit 120 is reciprocated on the rail 121 by a driving unit (not shown). Can be configured to.

  The source collection unit 130 is disposed between the source supply unit 120 and the blocking film 112 on at least one side of the opening 113, and the opening 113 is not formed on the inner surface of the blocking film 112. The vapor deposition source sprayed in the cutoff section (A2) is collected. The source collecting unit 130 includes an inlet 131 a formed on a surface facing the source supply unit 120, a trap 131 disposed on the upper side of the source supply unit 120, and a source supply unit on the inner wall surface of the chamber 110. A linear guide 133 that is installed in a direction aligned with the moving direction of 120 and guides the movement of the trap 131; a drive unit 132 that reciprocates the trap 131 in a direction aligned with the source supply unit 120; The trap 131 is connected to the inlet 131a, and the other end is connected to the outside of the chamber 110 and includes a discharge unit 134 for discharging the deposition source collected in the trap 131.

  Here, one end of the driving unit 132 is rotatably connected to the chamber 110, and the other end is rotatably connected to one end of the trap 131, so that the trap 131 is aligned with the source supply unit 120. The driving link 132a is provided with at least one joint that reciprocates in a direction, and includes a driving motor 132b that provides a rotational driving force to one end of the driving link 132a so that the driving link 132a is folded. The

  The discharge part 134 has one end part rotatably connected to the chamber 110 and the other end part connected to the other end part of the trap 131 so as to be connected to at least one joint 134a. The connecting link 134a includes a discharge passage 134b that is formed in the longitudinal direction and connects the trap 131 and the outer space of the chamber 110. Meanwhile, although not shown in the drawing, a separate collecting device for collecting the deposition material may be provided at the other end of the discharge passage 134b located outside the chamber 110.

  From here, operation | movement of 1st Embodiment of the thin film vapor deposition apparatus mentioned above is demonstrated.

  Among the accompanying drawings, FIGS. 4 to 6 are front sectional views showing the operation of the thin film deposition of the thin film deposition apparatus of the present invention, and FIG. 7 shows the configuration of the source collecting unit 130 of the thin film deposition apparatus of the present invention. It is a sectional side view.

  As shown in FIGS. 4 and 2, the source supply unit 120 is disposed so as to be movable in the horizontal direction along the rail 121 on the side where the opening 113 is not formed in the internal space 111 of the chamber 110. The trap 131 of the collecting unit 130 is arranged on the upper side of the source supply unit 120 so as to be movable along the linear guide 133 in the direction along with the source supply unit 120.

  Here, the source supply unit 120 reciprocates in the section including the blocking section (A2) and the deposition section (A1) in the internal space 111 of the chamber 110, and the source collector 130 is opened in the internal space 111 of the chamber 110. It moves with the source supply part 120 in the interruption | blocking area (A2) in which 113 is not formed.

  The source supply unit 120 provides a deposition material from the blocking section (A2) to the deposition target side in order to form a thin film having a uniform thickness on the substrate disposed on the opening 113 in the deposition section (A1). At this time, the source collecting unit 130 collects and collects the deposition material provided from the source supply unit 120 toward the inner surface of the blocking film 112 in the blocking section (A2), so that the deposition material is unnecessary. It is possible to prevent vapor deposition or diffusion within the chamber 110.

  That is, as shown in FIG. 5 and FIG. 3, in a state where the source supply unit 120 has started providing the vapor deposition material, the position shown in FIG. 5 from the position shown in FIG. The trap 131 of the source collection unit 130 disposed on the upper side of the source supply unit 120 moves together with the source supply unit 120 while moving from the source supply unit 120 toward the deposition section (A1). The substance is inhaled and discharged out of the chamber 110.

  That is, the source supply unit 120 is moved in the horizontal direction on the rail 121 by the driving means of the source supply unit 120 (not shown), and the drive link 132a of the source collection unit 130 is rotated by the drive motor 132b. When the trap 131 is pushed in the direction of the arrow “A”, the trap 131 guided by the linear guide 133 moves in the direction along with the source supply unit 120 and sucks the vapor deposition material discharged from the source supply unit 120. .

  Specifically, as shown in FIG. 7, the trap 131 of the source collection unit 130 is aligned with the source supply unit 120 by a linear guide 133 installed on the blocking film 112 that forms the upper surface of the chamber 110. The foldable drive link 132a, which is installed so as to move to the side and connects one side of the trap 131 and the drive motor 132b, is folded while rotating along the drive direction of the drive motor 132b. Accordingly, the trap 131 reciprocates along the linear guide 133 on the upper side of the source supply unit 120 along the drive direction of the drive motor 132b. Therefore, the trap 131 is controlled by the drive motor 132b. It can be moved together with the source supply unit 120 on the upper side.

  In addition, the other side of the trap 131 is provided with a discharge part 134 configured by a folding connection link 134a in which a discharge passage 134b is formed, and the vapor deposition material sucked into the inlet 131a of the trap 131 is provided. Discharge outside the chamber 110.

  As described above, in the blocking section (A2) where vapor deposition is not performed on the substrate, the trap 131 of the source collection unit 130 moves together with the source supply unit 120, and the vapor deposition material discharged from the source supply unit 120 is collected. Therefore, it is possible to prevent the deposition material from being unnecessarily discharged into the chamber 110. In addition, after the chamber 110 is changed to normal pressure, the deposition material accumulated in the chamber 110 can be removed, and the maintenance / repair process of changing to the vacuum again can be minimized, thereby improving the equipment productivity. be able to.

  Further, the vapor deposition material discharged from the source supply unit 120 is unnecessary in the chamber 110 by configuring the trap 131 to move along with the source supply unit 120 and collect the vapor deposition material discharged from the source supply unit 120. Can be prevented from diffusing into a large space.

  On the other hand, as shown in FIG. 6, the source supply unit 120 supplies the vapor deposition material toward the opening 113 while passing through the vapor deposition zone (A1) after passing through the blocking zone (A2). The deposition material is deposited on the substrate disposed on the upper side of 113, and the source collection unit 130 stops at the end of the blocking section (A 2) before reaching the opening 113.

  On the other hand, although not shown in the drawing, when the source supply unit 120 enters the blocking section (A2) in the process of moving in the opposite direction, the trap 131 of the source collection unit 130 moves together with the source supply unit 120, and the source supply unit The deposition material discharged from 120 is collected, and the deposition material is prevented from being unnecessarily discharged into the chamber 110 in the process of moving the source supply unit 120 to the initial position.

  The scope of the right of the present invention is not limited to the above-described embodiments, and can be embodied in various forms within the scope of the appended claims. Without departing from the gist of the present invention claimed in the scope of claims, any person having ordinary knowledge in the technical field to which the invention pertains can describe various claims that can be modified. Considered to be within range.

110: Chamber
111: Internal space 112: Barrier film
113: Opening part 120: Source supply part
121: Rail 130: Source collection unit
131: Trap 131a: Suction port
132: Drive unit 132a: Drive link
132b: Drive motor 133: Linear guide
134: discharge part 134a: connection link
134b: Discharge passage A1: Deposition section
A2: Blocking section

Claims (5)

A chamber in which an internal space is formed and an opening in which a deposition target substrate is disposed is formed in a region of a blocking film that forms an upper surface;
A source supply unit that provides a deposition source toward the barrier film while moving in an internal space of the chamber; and
A thin film deposition apparatus including a source collection unit that is disposed between the source supply unit and the blocking film on at least one side of the opening and collects a deposition source sprayed toward the blocking film.   The source collection unit has an inlet formed on a surface facing the source supply unit, a trap disposed on the upper side of the source supply unit, and a drive unit that reciprocates the trap in a direction aligned with the source supply unit, The thin film deposition apparatus according to claim 1, wherein one end is connected to an inlet of the trap, and the other end is connected to the outside of the chamber, and includes a discharge unit that discharges a deposition source collected in the trap.   The driving unit has one end rotatably connected to the chamber, the other end connected to the trap, and a driving link that reciprocates the trap in a direction aligned with the source supply unit, and a driving force applied to the driving link. The thin film deposition apparatus according to claim 2, further comprising a driving motor that provides   The thin film deposition apparatus according to claim 3, wherein the trap is guided to reciprocate by a linear guide installed on an inner wall surface of the chamber in a direction aligned with a moving direction of the source supply unit.   The discharge part is pivotally connected to the chamber at one end and connected to the trap at the other end. The discharge part is formed in the length direction inside the connection link, so that an external space between the trap and the chamber is formed. The thin film deposition apparatus according to claim 2, comprising a discharge passage connecting the two.

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