JP2016128370A - Laminated glass and pattern sheet for laminated glass - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for suppressing air bubbles from remaining in laminated glass for arranging a heating wire in window glass as a defroster device used for window glass.SOLUTION: There is provided laminated glass 10 which comprises a pair of glass plates 11 and 12 and a conductive pattern member 40 between the pair of glass plates 11 and 12, in which the conductive pattern member 40 includes a conductive thin wire 41 arranged in a pattern form and is arranged between the glass plate 11 of the pair of glass plates 11 and 12 and the conductive pattern member 40 and further includes a bonding layer 21 which directly contacts with the glass plate 11 and the conductive thin wire to bond the conductive pattern member 40 to the glass plate 11 and the conductive thin wire 41 is formed so that the wire width becomes narrower as approaching the glass plate 11 positioned on the side of the bonding layer 21 in contact with the conductive thin wire 41.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a laminated glass and a patterned sheet for laminated glass.

  2. Description of the Related Art Conventionally, as a defroster (defrosting or defogging) device used for a window glass such as a front window or a rear window of a vehicle, an apparatus in which a heating wire made of tungsten or the like is arranged on the window glass is known. In such a defroster device, a heating wire arranged on the window glass is energized, and the window glass is heated by resistance heating to remove fogging of the window glass, or snow and ice attached to the window glass are removed. It can be melted to ensure the sight of the occupant.

  The heating wire as described above is conventionally formed by various methods using various materials. For example, Patent Document 1 discloses forming a heating wire by exposing, developing and fixing a silver salt photosensitive layer on a substrate. Moreover, in this patent document 1, a metal foil is laminated | stacked on a base material, a heating wire is formed by etching this metal foil, or a heating wire is printed by printing the paste containing a metal particle on a base material. It is also disclosed to form. Furthermore, it is also disclosed that a heating wire is printed on a substrate by a screen printing plate or the like.

JP 2010-3667 A

  In the defroster apparatus as described above, a laminated glass is manufactured by sandwiching a bonding layer and a heating wire between a pair of glass plates and heating and pressurizing, and the defroster apparatus may be configured from the laminated glass. When manufacturing such a laminated glass using the heating wire disclosed in Patent Document 1, the heating wire is arranged between a pair of glass plates in a state of being integrated with a sheet-like base material, and thereafter , Heated and pressurized. In detail, a glass plate, a joining layer, a base material, a heating wire integral with this, a joining layer, and a glass plate are superimposed in this order, and are heated and pressurized. In the laminated glass plate thus manufactured, one bonding layer of the two bonding layers is in direct contact with the glass plate and the base material to bond the glass plate and the base material, and the other bonding is performed. The layer is in direct contact with the heating wire and the glass plate to join the heating wire and the glass plate.

  By the way, the heating wire disclosed in Patent Document 1 is formed so as to protrude along the normal direction of the sheet surface of the sheet-like substrate, and the side wall thereof is the normal direction of the sheet surface of the substrate. It extends along. Moreover, the side wall of such a heating wire may become an overhang shape for some reason in the formation process. The overhang shape is a shape in which the side wall of the heating wire is inclined and extended toward the outside in the direction along the sheet surface of the substrate as it is separated from the substrate along the normal direction of the sheet surface of the substrate. Say. Such an overhang shape is particularly likely to occur when a heating wire is formed by etching or printing a paste containing metal particles.

  However, when the side wall of the heating wire has a shape extending along the normal direction of the sheet surface of the base material or an overhanging shape as described above, the heating and pressurizing steps during the production of the laminated glass are performed. When the heat ray and the bonding layer come into contact with each other, there is a problem that the bonding layer is difficult to enter the base side of the heating wire, and bubbles are likely to remain around the side wall of the heating wire. Such bubbles can deteriorate the appearance quality of the laminated glass and cause glare. Therefore, in the production of laminated glass, a countermeasure for preventing such bubbles from remaining is desired.

  The present invention has been made in consideration of the above points, and an object of the present invention is to prevent bubbles from remaining in a laminated glass.

  The present invention is a laminated glass comprising a pair of glass plates and a conductive pattern member disposed between the pair of glass plates, wherein the conductive pattern member includes conductive thin wires arranged in a pattern. The conductive pattern member is disposed between at least one of the pair of glass plates and the conductive pattern member, and is in direct contact with the glass plate and the conductive thin wire. It is provided with a bonding layer that is bonded to a glass plate, and the conductive thin wire is formed such that its line width becomes narrower as it approaches the glass plate located on the bonding layer side in contact with the conductive thin wire. Laminated glass.

  In the laminated glass, the thin conductive wire may be formed from a metal film patterned by etching.

  In the laminated glass, the conductive thin wire may have a trapezoidal cross-sectional shape in a direction orthogonal to the extending direction of the conductive thin wire.

  Further, in the laminated glass, the trapezoidal cross-sectional shape of the conductive thin wire is such that an angle formed by a line segment extending from an end of the lower base to an end of the upper base and a direction extending along the lower base is 40 degrees or more. It may be 85 degrees or less.

Moreover, in the laminated glass, the conductive thin wire may have a dark color layer in a portion facing the glass plate side located on the bonding layer side in contact with the conductive thin wire.
In this case, the dark color layer may be made of chromium oxide.

  Moreover, this invention is a pattern sheet | seat for laminated glasses which has the electroconductive pattern member arrange | positioned between a pair of glass plates, Comprising: It has a sheet-like base material which has a pair of opposing surface, A pair of said base material The conductive pattern member is provided on at least one of the opposing surfaces of the substrate, and the conductive pattern member includes conductive thin wires arranged in a pattern, and the conductive thin wires are formed on the base material. It is a pattern sheet for laminated glass formed so that the line width becomes narrower as it is spaced outward from the substrate along the normal direction to the sheet surface.

  According to this invention, it can suppress that a bubble remains in a laminated glass.

FIG. 1 is a diagram for explaining an embodiment according to the present invention, and is a perspective view schematically showing a vehicle provided with a laminated glass. In particular, FIG. 1 schematically shows an automobile with laminated glass as an example of a vehicle. FIG. 2 is a view of the laminated glass as viewed from the normal direction of the plate surface. FIG. 3 is a cross-sectional view of the laminated glass of FIG. FIG. 4 is a view showing a state before lamination of each member constituting the laminated glass of FIG. FIG. 5 is a plan view showing an example of a conductive pattern member. FIG. 6 is a cross-sectional view corresponding to the line AA in FIG. 5 and showing the cross-sectional shape of the conductive thin wire. FIG. 7 is an enlarged view of the cross-sectional shape of the thin conductive wire shown in FIG. FIG. 8 is a diagram for explaining an example of a method for producing laminated glass. FIG. 9 is a diagram for explaining an example of a method for producing laminated glass. FIG. 10 is a diagram for explaining an example of a method for producing laminated glass. FIG. 11 is a diagram for explaining an example of a method for producing laminated glass. FIG. 12 is a diagram for explaining an example of a method for producing laminated glass. FIG. 13 is a diagram for explaining an example of a method for producing laminated glass. FIG. 14 is a diagram for explaining an example of a method for producing laminated glass. FIG. 15 is a diagram for explaining an example of a method for manufacturing a laminated glass. FIG. 16 is a diagram for explaining an example of a method for producing laminated glass. FIG. 17 is a diagram for explaining an example of a method for manufacturing a laminated glass. FIG. 18 is a view showing a modification of the laminated glass of one embodiment according to the present invention. FIG. 19 is a view showing another modification of the laminated glass of one embodiment according to the present invention.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual product.

  In the present specification, the terms “plate”, “sheet”, and “film” are not distinguished from each other only based on the difference in names. For example, “sheet” is a concept that includes a member that can be called a plate or a film. Therefore, a “pattern sheet” is a member called “pattern plate (substrate)” or “pattern film”. It cannot be distinguished only by differences.

In addition, “sheet surface (plate surface, film surface)” means a target sheet-like member (plate-like) when the target sheet-like (plate-like, film-like) member is viewed as a whole and globally. It refers to the surface that coincides with the plane direction of the member or film-like member.
Further, in this specification, “joining” includes not only “main joining” that completes joining but also so-called “temporary joining” for temporarily fixing before “main joining”.

  Furthermore, as used in this specification, the shape and geometric conditions and the degree thereof are specified. For example, terms such as “parallel”, “orthogonal”, “identical”, length and angle values, etc. Without being bound by meaning, it should be interpreted including the extent to which similar functions can be expected.

  1-17 is a figure for demonstrating one Embodiment by this invention. Among these, FIG. 1 is a diagram schematically showing an automobile equipped with a laminated glass, FIG. 2 is a diagram of the laminated glass viewed from the normal direction of the plate surface, and FIG. 3 is a diagram of FIG. FIG. 4 is a cross-sectional view of the glass, and FIG. 4 is a diagram showing a state before lamination of each member constituting the laminated glass of FIG. In addition, the laminated glass in this Embodiment may be called a heat generating plate.

  As shown in FIG. 1, an automobile 1 as an example of a vehicle has window glasses such as a front window, a rear window, and a side window. Here, an example in which the front window 5 is composed of a laminated glass 10 is illustrated. The automobile 1 has a power source 7 such as a battery.

FIG. 2 shows the laminated glass 10 viewed from the normal direction of the plate surface. Moreover, the cross-sectional view corresponding to the III-III line of the laminated glass 10 of FIG. 2 is shown in FIG. In the example shown in FIG. 3, the laminated glass 10 includes a first glass plate 11, a first bonding layer 21, a pattern sheet (conductive pattern sheet) 30, a second bonding layer 22, and a second glass plate 12 in this order. Are stacked. The pattern sheet 30 includes a base material 31 and a conductive pattern member 40 provided on the base material 31. The conductive pattern member 40 includes conductive thin wires 41 arranged in a pattern.
Although details will be described later, in the present embodiment, the conductive thin wires 41 are arranged in a mesh pattern as shown in FIG.

  Further, as shown in FIG. 2, the laminated glass 10 includes a wiring portion 15 for energizing the conductive pattern member 40, and a connection portion 16 that connects the conductive pattern member 40 and the wiring portion 15. Have. In the illustrated example, the conductive pattern member 40 is energized from the power source 7 such as a battery through the wiring portion 15 and the connection portion 16, and the conductive pattern member 40 is heated by resistance heating. The heat generated in the conductive pattern member 40 is transmitted to the glass plates 11 and 12, and the glass plates 11 and 12 are warmed. Thereby, the cloudiness by the dew condensation adhering to the glass plates 11 and 12 can be removed. Moreover, when snow and ice adhere to the glass plates 11 and 12, this snow and ice can be melted. Therefore, a passenger | crew's visual field is ensured favorable.

  In order to produce this laminated glass 10, as shown in FIG. 4, the curved first glass plate 11, the first bonding layer 21, the pattern sheet 30, the second bonding layer 22, and the curved second glass plate 12 are The curved first glass plate 11, the pattern sheet 30, and the curved second glass plate 12 are bonded together by the bonding layers 21 and 22 by sequentially overlapping, heating and pressing.

  Hereinafter, each layer of the laminated glass 10 will be described.

  First, the glass plates 11 and 12 will be described. In particular, when the glass plates 11 and 12 are used for a front window, it is preferable to use a glass plate having a high visible light transmittance so as not to obstruct the passenger's field of view. Examples of the material of the glass plates 11 and 12 include soda lime glass and blue plate glass. The glass plates 11 and 12 preferably have a transmittance in the visible light region of 90% or more. Here, the visible light transmittance of the glass plates 11 and 12 is measured within a measurement wavelength range of 380 nm to 780 nm using a spectrophotometer (“UV-3100PC” manufactured by Shimadzu Corporation, JISK0115 compliant product). Of the transmittance at each wavelength. The visible light transmittance may be lowered by coloring a part or the whole of the glass plates 11 and 12. In this case, it is possible to block direct sunlight and to make it difficult to visually recognize the inside of the vehicle from outside the vehicle.

  Moreover, it is preferable that the glass plates 11 and 12 have a thickness of 1 mm or more and 5 mm or less. With such a thickness, the glass plates 11 and 12 excellent in strength and optical characteristics can be obtained.

  Next, the bonding layers 21 and 22 will be described. The first bonding layer 21 is disposed between the first glass plate 11 and the pattern sheet 30 and bonds the first glass plate 11 and the pattern sheet 30 to each other. More specifically, in this example, as shown in FIGS. 3 and 4, the first bonding layer 21 is disposed between the first glass plate 11 and the conductive pattern member 40 of the pattern sheet 30. The 1st glass plate 11 and the electrically conductive thin wire | line 41 are directly contacted, and the electroconductive pattern member 40 is joined to the 1st glass plate 11 via the electrically conductive thin wire | line 41 which contacted. Strictly speaking, the first bonding layer 21 is in direct contact with the first glass plate 11, the conductive thin wire 41, and the surface 31a of the base material 31, and is electrically conductive through the contacted conductive thin wire 41 and the surface 31a. The pattern member 40 is bonded to the first glass plate 11.

  In addition, the second bonding layer 22 is disposed between the second glass plate 12 and the pattern sheet 30 and bonds the second glass plate 12 and the pattern sheet 30 to each other. More specifically, in this example, the second bonding layer 22 is disposed between the second glass plate 12 and the substrate 31 of the pattern sheet 30, and directly on the second glass plate 12 and the substrate 31. The base material 31 and the second glass plate 12 are joined together.

  As the bonding layers 21 and 22, layers made of materials having various adhesiveness or tackiness can be used. The bonding layers 21 and 22 preferably have a high visible light transmittance. As a typical joining layer, the layer which consists of polyvinyl butyral (PVB) can be illustrated. The thicknesses of the bonding layers 21 and 22 are preferably 0.15 mm or more and 1 mm or less, respectively.

  The laminated glass 10 is not limited to the illustrated example, and may be provided with other functional layers expected to exhibit a specific function. Moreover, you may make it one functional layer exhibit two or more functions, for example, the glass plates 11 and 12 of the laminated glass 10, the joining layers 21 and 22, and the base material 31 of the pattern sheet 30 mentioned later You may make it provide a function to at least one. Examples of functions that can be imparted to the laminated glass 10 include antireflection (AR) function, hard coat (HC) function having scratch resistance, infrared shielding (reflection) function, ultraviolet shielding (reflection) function, and polarization function. An antifouling function and the like can be exemplified.

  Next, the pattern sheet 30 will be described. As shown in FIG.2 and FIG.3, the pattern sheet 30 of this Embodiment is the sheet-like base material 31 which has a pair of opposing surface 31a, 31b, and a pair of opposing surface 31a, 31b of the base material 31. The conductive pattern member 40 provided on the surface 31a, the wiring part 15 for energizing the conductive pattern member 40, and the connection part 16 for connecting the conductive pattern member 40 and the wiring part 15 to each other. Have. The pattern sheet 30 has substantially the same plane dimensions as the glass plates 11 and 12, and may be disposed over the entire laminated glass 10, or disposed only on a part of the laminated glass 10 such as a front portion of a driver's seat. May be.

  The base material 31 functions as a base material that supports the conductive pattern member 40. The base material 31 is a transparent and electrically insulating substrate that generally transmits a wavelength in the visible light wavelength band (380 nm to 780 nm), and includes a thermoplastic resin.

  The thermoplastic resin contained as the main component in the base material 31 may be any resin as long as it is a thermoplastic resin that transmits visible light. For example, an acrylic resin such as polymethyl methacrylate, a polyolefin resin such as polypropylene, and polyethylene terephthalate. And polyester resins such as polyethylene naphthalate, cellulose resins such as triacetyl cellulose (cellulose triacetate), polyvinyl chloride, polystyrene, polycarbonate resins, AS resins, and the like. In particular, acrylic resin and polyethylene terephthalate are preferable because they are excellent in optical properties and good in moldability.

  Moreover, it is preferable that the base material 31 has a thickness of 0.02 mm or more and 0.20 mm or less in consideration of light transmittance, appropriate supportability of the conductive pattern member 40, and the like.

  FIG. 5 is a plan view showing an example of an arrangement pattern of the conductive pattern member 40. The conductive pattern member 40 is energized from the power source 7 such as a battery through the wiring portion 15 and the connection portion 16 and generates heat by resistance heating. And when this heat is transmitted to the glass plates 11 and 12, the glass plates 11 and 12 are warmed.

  The conductive pattern member 40 shown in FIG. 5 is a member composed of conductive fine wires 41 arranged in a mesh pattern that defines a large number of openings 43, and is also a member called a conductive mesh. The conductive pattern member 40 includes a plurality of thin conductive wires 41 extending between two branch points 42 and defining an opening 43. That is, the conductive pattern member 40 is configured as a collection of a large number of thin conductive wires 41 that form branch points 42 at both ends. In particular, in the illustrated example, at the branch point 42, the three conductive thin wires 41 are connected at an equal angle, so that many honeycomb-shaped (hexagonal) openings 43 surrounded by the six conductive thin wires 41 are formed. It is defined.

  In the illustrated example, the conductive pattern member 40 has conductive thin wires 41 arranged in a mesh pattern in which honeycomb-shaped openings 43 of the same shape are regularly defined. 40 is not limited to such a mesh pattern, but a mesh pattern (lattice pattern) in which openings 43 having the same shape such as triangles and rectangles are regularly defined, and irregularly shaped openings 43 are regularly defined. The conductive fine wires 41 may be arranged in various mesh patterns such as a mesh pattern or a mesh pattern in which irregularly shaped openings 43 are irregularly defined, such as a Voronoi mesh. The conductive pattern member 40 may have a line and space pattern formed by a plurality of conductive thin wires 41 arranged in one direction.

  Examples of the material for forming the conductive pattern member 40 include gold, silver, copper, platinum, aluminum, chromium, molybdenum, nickel, titanium, palladium, indium, tungsten, and alloys thereof. The above can be illustrated. Further, the conductive pattern member 40 is formed of a metal film in which the conductive thin wires 41 are patterned by etching. The conductive pattern member 40 may include a thin line connecting adjacent conductive thin lines 41, that is, a connection line.

  FIG. 6 is a cross-sectional view corresponding to the line AA in FIG. 5 and showing a cross-sectional shape of the conductive thin wire 41. In FIG. 6, a cross-sectional shape of the thin conductive wire 41 in the direction orthogonal to the extending direction of the thin conductive wire 41 (hereinafter simply referred to as “cross-sectional shape” or “cross-section”) is shown. On the base material 31 (surface 31a), conductive fine wires 41 forming the conductive pattern member 40 are formed. In the illustrated example, the conductive thin wire 41 has a surface 41a on the base material 31 side, a surface 41b on the opposite side of the base material 31, and side surfaces 41c and 41d. In the illustrated example, the surface 41 a on the base 31 side and the surface 41 b on the opposite side of the base 31 are parallel. The side surface 41 c is a tapered surface that approaches the side surface 41 d as the distance from the substrate 31 increases along the normal direction of the sheet surface of the pattern sheet 30. Further, the side surface 41 d also has a tapered surface that approaches the side surface 41 c as the distance from the substrate 31 increases along the normal direction of the sheet surface of the pattern sheet 30. That is, the conductive thin wire 41 has a trapezoidal cross section as a whole in a cross-sectional view orthogonal to the extending direction.

  More specifically, the thin conductive wire 41 is formed so that its line width becomes narrower as it is spaced outward from the base material 31, that is, the surface 31 a, along the direction normal to the sheet surface of the base material 31. As shown in FIG. 3, in the state where the pattern sheet 30 is incorporated in the laminated glass 10, the conductive thin wire 41 is the first glass located on the first bonding layer 21 side in contact with the conductive thin wire 41. It is formed so that its line width becomes narrower as it approaches the plate 11.

  Here, FIG. 7 is an enlarged view of the cross-sectional shape of the thin conductive wire 41 shown in FIG. 7A, in the trapezoidal cross-sectional shape of the thin conductive wire 41, a line segment that forms the side wall of the thin conductive wire 41 extending from the end of the lower base (surface 41a) to the end of the upper base (surface 41b). Is an angle α with the direction extending along the lower base. This angle α is preferably any angle of 40 degrees to 85 degrees. When the angle α is less than 40 degrees, unless the line width of the conductive thin wire 41 is increased, it is difficult to obtain suitable heat generation during energization, and the visibility of the laminated glass 10 is impaired due to the widening of the conductive thin wire 41. There is a risk that. Therefore, the angle α is preferably 40 degrees or more.

  FIG. 7A shows an example of a trapezoidal shape in which the cross-sectional shape of the conductive thin wire 41 is arranged, but as shown in FIG. For example, the side surfaces 41c and 41d may be configured with curves. In the present invention, such a shape is also included in the trapezoidal concept. Also in this case, as shown in FIG. 7B, in the trapezoidal cross-sectional shape of the conductive thin wire 41, the angle α is from the end of the lower base (surface 41a) to the end of the upper base (surface 41b). It is defined by the angle between the extending line segment and the direction extending along the lower base. This angle α is also preferably not less than 40 degrees and not more than 85 degrees. In addition, in this Embodiment, although the cross-sectional shape of the conductive thin wire 41 is trapezoid, if the conductive thin wire 41 is formed so that the line | wire width may become narrow as the 1st glass plate 11 is approached. For example, it may be multistage.

  When the thin conductive wire 41 is formed so that its line width becomes narrower as it approaches the first glass plate 11 located on the first bonding layer 21 side in contact with the conductive thin wire 41, When the plates 11 and 12, the bonding layers 21 and 22, and the pattern sheet 30 are stacked, the bonding layer 21 easily enters the base side of the conductive thin wire 41. As a result, bubbles are suppressed from remaining around the side walls (surfaces 41c and 42d) of the conductive thin wire 41.

  In FIG. 6, Wmax indicates the line width along the sheet surface of the substrate 31 at the base of the conductive thin wire 41, and the line width of the widest portion of the conductive thin wire 41 (hereinafter referred to as the maximum width). Is shown. In the present embodiment, the maximum width Wmax of the thin conductive wire 41 is 1 μm or more and 20 μm or less. The maximum width Wmax is preferably 2 μm or more and 20 μm or less, and more preferably 2 μm or more and 15 μm or less. For this reason, the electroconductive pattern member 40 is grasped | ascertained transparently as a whole, and transparency is very favorable. Further, the height (thickness) H of the conductive thin wire 41, that is, the height (thickness) H along the normal direction to the sheet surface of the base material 31 is preferably 1 μm or more and 20 μm or less, preferably 1 μm. More preferably, the thickness is 12 μm or less. According to the conductive thin wire 41 having such a height dimension, the conductive pattern member 40 can be effectively invisible because it is sufficiently thinned in combination with the line width Wmax.

  In FIG. 6, the symbol P indicates the pitch of the adjacent openings 43 (distance between the centers of the adjacent openings 43) in the honeycomb pattern when the conductive pattern member 40 has a honeycomb pattern. The pitch P is preferably 0.3 mm or more and 2 mm or less. The pitch P may be not less than 0.3 mm and not more than 7.0 mm. Further, when the conductive pattern member 40 has a lattice pattern, the pitch of adjacent rectangular openings in the lattice pattern is preferably 0.3 mm or more and 2 mm or less. In this case as well, the pitch may be not less than 0.3 mm and not more than 7.0 mm. Moreover, when the electroconductive pattern member 40 has a line and space pattern, it is preferable that the pitch which is the distance between the adjacent electroconductive fine wires 41 is 0.3 mm or more and 2 mm or less. In this case as well, the pitch may be not less than 0.3 mm and not more than 7.0 mm.

  In the illustrated example, the conductive thin wire 41 includes a first dark color layer 46 provided on the substrate 31, a conductive metal layer 45 provided on the first dark color layer 46, and a conductive metal layer. The second dark color layer 47 provided on the upper surface 45 is included. In other words, the surface of the conductive metal layer 45 on the base 31 side is covered with the first dark color layer 46, and the surface of the conductive metal layer 45 on the side opposite to the base 31 and The second dark color layer 47 covers both side surfaces.

  The conductive metal layer 45 made of a metal material exhibits a relatively high reflectance. When the light is reflected by the conductive metal layer 45 forming the conductive thin wire 41 of the conductive pattern member 40, the reflected light is visually recognized, which may obstruct the occupant's field of view. Further, when the conductive metal layer 45 is visually recognized from the outside, the designability may be deteriorated. Therefore, the dark color layers 46 and 47 are disposed on at least a part of the surface of the conductive metal layer 45. The dark color layers 46 and 47 may be layers having a visible light reflectance lower than that of the conductive metal layer 45, and are dark color layers such as black. The dark color layers 46 and 47 make it difficult for the conductive metal layer 45 to be visually recognized, so that the occupant's field of view can be favorably secured. Moreover, the fall of the designability when seen from the outside can be prevented. Such dark color layers 46 and 47 may be omitted.

  Next, with reference to FIGS. 8-17, an example of the manufacturing method of the laminated glass 10 is demonstrated. 8-17 is sectional drawing which shows an example of the manufacturing method of the laminated glass 10 in order, Among these, FIGS. 8-16 is a figure explaining manufacture of the pattern sheet 30 in detail. FIG. 17 shows a state in which the laminated glass 10 is manufactured by sandwiching the pattern sheet 30 between the glass plates 11 and 12 after the pattern sheet 30 is manufactured.

  When manufacturing the pattern sheet 30, first, as shown in FIG. 8, a metal foil 350 having a pair of opposed surfaces 350a and 350b is prepared. The metal foil 350 forms the conductive metal layer 45 of the conductive thin wire 41. As the metal foil 350, for example, a foil of gold, silver, copper, platinum, aluminum, chromium, molybdenum, nickel, titanium, palladium, indium, tungsten, or an alloy thereof can be used. Further, the thickness of the metal foil 350 can be set to 1 μm or more and 60 μm or less.

  Next, as illustrated in FIG. 9, in the illustrated example, a dark color film 360 that forms the first dark color layer 46 of the conductive thin wire 41 is formed on the surface 350 b of the metal foil 350. In this example, the dark color film 360 is made of chromium oxide. Here, when the dark color film 360 formed on the metal foil 350 is chromium oxide, the dark color film 360 can be formed by, for example, a sputtering method, a vacuum evaporation method, or the like, or sodium chlorite and water. It can also be formed by treatment with an aqueous solution of sodium oxide and trisodium phosphate. Further, for example, a part of the material forming the metal foil 350 is subjected to a darkening process (blackening process), and the dark film 360 made of a metal oxide or a metal sulfide is formed from a part of the metal foil 350. You can also. Further, the dark color film 360 may be formed of, for example, copper nitride, copper oxide, nickel nitride, or the like.

  Next, as shown in FIG. 10, the base material 31 is prepared and arranged so that the surface 31 a of the base material 31 and the surface 350 b on which the dark color film 360 of the metal foil 350 is formed face each other. Then, as shown in FIG. 11, the metal foil 350 is laminated | stacked on the surface 31a of the base material 31 through an contact bonding layer. As the base material 31, for example, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polystyrene, cyclic polyolefin or the like having a thickness of 0.02 mm to 0.20 mm can be used.

  Next, as shown in FIG. 12, a resist layer 48 is provided on the metal foil 350. The resist layer 48 is a resin layer having photosensitivity to, for example, light in a specific wavelength range, for example, ultraviolet rays. This resin layer may be formed by sticking a resin film, or may be formed by coating a fluid resin. The specific photosensitive characteristics of the resist layer 48 are not particularly limited. For example, as the resist layer 48, a photocurable photosensitive material may be used, or a photodissolvable photosensitive material may be used.

  Thereafter, as shown in FIG. 13, the resist layer 48 is patterned to form (stack) a resist pattern 49. As a method of patterning the resist layer 48, various known methods can be employed. In this example, a resin layer having photosensitivity to light in a specific wavelength region, for example, ultraviolet rays, is used as the resist layer 48. Patterning is performed using a known photolithography technique. First, a mask in which a portion to be patterned is opened or a mask in which a portion to be patterned is shielded is disposed on the resist layer 48, and the resist layer 48 is irradiated with ultraviolet rays through this mask. Thereafter, a portion where the ultraviolet rays are shielded by the mask or a portion irradiated with the ultraviolet rays, that is, a portion where the resist pattern 49 is not formed is developed and removed with an aqueous solution such as water. Thereafter, the remaining resist layer 48 is baked at a predetermined temperature by curing, for example, heating, chrome hardening or the like. Thereby, the patterned resist pattern 49 can be formed.

  Next, as shown in FIG. 14, the metal foil 350 including the dark color film 360 is etched using the resist pattern 49 as a mask. By this etching, the metal foil 350 including the dark color film 360 is patterned into a pattern substantially the same as the resist pattern 49. As a result, the conductive metal layer 45 that forms a part of the thin conductive wire 41 is formed from the patterned metal foil 350. In addition, a first dark color layer 46 that forms a part of the thin conductive wire 41 is formed from the patterned dark color film 360. Here, the conductive metal layer 45 is formed so that the line width thereof becomes narrower as the distance from the base material 31, that is, the surface 31 a, increases outward along the normal direction to the sheet surface of the base material 31. The etching method is not particularly limited, and a known method can be employed. Known methods include, for example, wet etching using an etchant, plasma etching, and the like.

  Here, in the present embodiment, a predetermined operation is performed in order to form the conductive metal layer 45 in a desired shape that becomes narrower as the line width of the conductive metal layer 45 is separated from the surface 31a. As an example of the predetermined operation for forming such a desired shape, there is an operation for reducing the adhesion between the resist pattern 49 and the metal foil 350. One specific method for reducing the adhesion is to cure the resist layer 48 remaining after development in the formation process of the resist pattern 49 so that the resist pattern 49 is not completely dried. When baking is performed at a predetermined temperature, the baking may be performed at a temperature of about 80 degrees to 95 degrees lower than 100 degrees. In addition, as another example of the predetermined operation for forming the desired shape, wet etching is employed when the metal foil 350 including the dark color film 360 is etched using the resist pattern 49 as a mask, and wet etching is performed. Examples of the operation include setting the concentration of the etching solution used in the above to a predetermined concentration or more, setting the temperature of the etching solution to a predetermined temperature or more, and setting the etching time with the etching solution to a predetermined time or less. As still another example of the predetermined operation for forming the desired shape, there is an operation of lowering the UV intensity of the resin when an ultraviolet curable resin is used for the resist layer 48. it can.

  As described above, after the metal foil 350 including the dark color film 360 is etched, the resist pattern 49 is removed as shown in FIG.

  Next, as shown in FIG. 16, the second dark color layer 47 is formed on the surface 41 a and the side surfaces 41 c and 41 d of the conductive metal layer 45 opposite to the first dark color layer 46. For example, the second dark color layer 47 is subjected to a darkening process (blackening process) on a part of the material forming the conductive metal layer 45, and the metal oxide or metal sulfide is formed from a part of the conductive metal layer 45. A second dark color layer 47 made of a material can be formed. Further, the second dark color layer 47 may be provided on the surface of the conductive metal layer 45 by forming a dark color coating film or a plating layer of nickel or chromium. Alternatively, the second dark color layer 47 may be provided by roughening the surface of the conductive metal layer 45.

  The pattern sheet 30 is manufactured as described above. Thereafter, as shown in FIG. 17, the curved first glass plate 11, the first bonding layer 21, the pattern sheet 30, the second bonding layer 22, and the curved second glass plate 12 are superposed in this order, and heated and pressurized. Thus, the curved first glass plate 11, the pattern sheet 30, and the curved second glass plate 12 are bonded by the bonding layers 21 and 22. Thereby, the laminated glass 10 is manufactured.

  The laminated glass 10 in this Embodiment demonstrated above is equipped with a pair of glass plates 11 and 12, and the conductive pattern member 40 arrange | positioned between a pair of glass plates 11 and 12, A conductive pattern member Reference numeral 40 includes thin conductive wires 41 arranged in a pattern. Moreover, the laminated glass 10 is arrange | positioned between the 1st glass plate 11 and the electroconductive pattern member 40 of a pair of glass plates, and contacts the 1st glass plate 11 and the electroconductive thin wire 41 directly, A first bonding layer 21 for bonding the conductive pattern member 40 to the first glass plate 11 is provided. The thin conductive wire 41 is formed so that its line width becomes narrower as it approaches the first glass plate 11 located on the first bonding layer 21 side in contact with the conductive thin wire 41.

  According to such a laminated glass 10, when the glass plates 11, 12, the bonding layers 21, 22 and the pattern sheet 30 are laminated in the manufacturing process, the bonding layer 21 is on the base side of the conductive thin wire 41 particularly during heating. Easy to enter. As a result, it is possible to prevent bubbles from remaining around the side walls (surfaces 41c and 42d) of the conductive thin wire 41. Thereby, according to this Embodiment, while improving the external appearance quality of the laminated glass 10, it can suppress that a glare arises in the laminated glass 10. FIG.

  Various modifications can be made to the above-described embodiment. Hereinafter, modified examples will be described with reference to the drawings as appropriate. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above embodiment are used for the parts that can be configured in the same manner as in the above embodiment. A duplicate description is omitted.

  First, in the modification shown in FIG. 18, the conductive pattern member 40 is provided on the surface of the first glass plate 11 facing the second glass plate 12 through a holding layer (not shown). The base material 31 as described in the form is not provided. The holding layer has a thickness of about 1 μm to 100 μm, and bonds the conductive pattern member 40 to the first glass plate 11 by a release layer (not shown) formed on the surface facing the first glass plate 11 side. ing. On the other hand, the third bonding layer 23 is disposed between the conductive pattern member 40 and the second glass plate 12, and the third bonding layer 23 is in direct contact with the second glass plate 12 and the conductive thin wire 41. The conductive pattern member 40 is joined to the second glass plate 12 through the contacted conductive thin wires 41. The thin conductive wire 41 is formed so that its line width becomes narrower as it approaches the second glass plate 12 located on the third bonding layer 23 side. Also in such a modification, the same effect as the above-mentioned embodiment is produced. In this example, when the conductive pattern member 40 is formed by patterning, there is a base material that supports the conductive pattern member 40 as described in the embodiment. However, the base material is peeled off when the conductive pattern member 40 is joined to the first glass plate 11. Thereby, the above-mentioned holding layer is exposed. The release layer formed on the holding layer may be an interface release type release layer, an interlayer release type release layer, a cohesive release type release layer, or the like.

  Next, in the modification shown in FIG. 19, the conductive pattern member 40 is provided on each of the surfaces 31 a and 31 b of the substrate 31 in the pattern sheet 30. A first bonding layer 21 is disposed between the first glass plate 11 and the conductive pattern member 40 provided on the surface 31a, and the first bonding layer 21 is provided on the first glass plate 11 and the surface 31a. The conductive pattern member 40 is directly in contact with the conductive thin wire 41 of the conductive pattern member 40, and the conductive pattern member 40 is joined to the first glass plate 11 through the contacted thin conductive wire 41. The thin conductive wire 41 is formed so that its line width decreases as it approaches the first glass plate 11 located on the first bonding layer 21 side in contact with the thin conductive wire 41.

  On the other hand, the second bonding layer 22 is disposed between the second glass plate 12 and the conductive pattern member 40 provided on the surface 31b, and the second bonding layer 22 is disposed on the second glass plate 12 and the surface 31b. The conductive pattern member 40 is directly in contact with the conductive thin wire 41 of the provided conductive pattern member 40, and the conductive pattern member 40 is bonded to the second glass plate 12 through the contacted conductive thin wire 41. The thin conductive wire 41 is formed so that its line width decreases as it approaches the second glass plate 12 located on the second bonding layer 22 side in contact with the conductive thin wire 41. Also in such a modification, the same effect as the above-mentioned embodiment is produced.

  It should be noted that various changes can be made to the above-described embodiments and modifications.

  For example, in the example shown in FIG. 6, the second dark color layer 47 is formed on the surface 41a and the side surfaces 41c and 41d opposite to the first dark color layer 46 of the conductive metal layer 45. However, the present invention is not limited to this. Alternatively, the second dark color layer 47 may be formed only on the surface 41 a of the conductive metal layer 45 opposite to the first dark color layer 46 or only on the side surfaces 41 c and 41 d of the conductive metal layer 45.

  In the case where the second dark color layer 47 is formed only on the surface 41a opposite to the first dark color layer 46 of the conductive metal layer 45, for example, after the step shown in FIG. The dark color layer 47 and the resist pattern 49 are sequentially provided, and then the second dark color layer 47, the conductive metal layer 45, and the first dark color layer 46 may be etched using the resist pattern 49 as a mask.

  In the case where the second dark color layer 47 is formed only on the side surfaces 41c and 41d of the conductive metal layer 45, for example, the second dark color layer without removing the resist pattern 49 after the step shown in FIG. 47 is formed, and then the resist pattern 49 is removed.

  Moreover, you may use the laminated glass 10 for the rear window of the motor vehicle 1, a side window, and a sunroof. Moreover, you may use for windows of vehicles other than a motor vehicle, such as a railway, an aircraft, a ship, and a spacecraft.

  Furthermore, the laminated glass 10 can also be used in places other than the vehicle, in particular, in places that divide the room from the outdoors, such as buildings, stores, and house windows.

  In addition, although the some modification with respect to embodiment mentioned above was demonstrated above, naturally, it is also possible to apply combining several modifications suitably.

  Hereinafter, the present invention will be described in more detail with reference to examples. In addition, this invention is not limited to this Example.

(Example)
The laminated glass 10 of Example was produced as follows. First, as the base material 31, a PET (polyethylene terephthalate) film (A4300 manufactured by Toyobo Co., Ltd.) having a thickness of 100 μm, a width of 82 cm, and a length of 100 m was prepared. A two-component mixed urethane ester adhesive was laminated on the substrate 31 with a gravure coater so that the dry thickness upon curing was 7 μm. Then, an electrolytic copper foil having a thickness of 10 μm, a width of 81 cm, and a length of 80 m is laminated as a metal foil 350 on the base material 31 via an adhesive, and this state is maintained for 4 days in an environment of 50 ° to perform electrolysis. A copper foil was fixed to the base material 31.

  Then, casein was apply | coated and dried on the electrolytic copper foil (metal foil 350), and the resist layer 48 as a photosensitive resin layer was laminated | stacked. Then, a mesh pattern having a 3.0 mm pitch and a line width of 7 μm was exposed in a plurality of ranges defined by 100 cm × 80 cm in the resist layer 48 using a photomask on which the pattern was formed. In the exposure, ultraviolet contact exposure was intermittently performed. After the exposure, the portion where the resist pattern 49 was not formed was developed and removed with water, the remaining resist layer 48 was heated at 80 ° C. for 2 minutes, and then baked at a temperature of 85 degrees. Thereby, a resist pattern 49 was formed. The resist pattern 49 is formed in a mesh pattern having a pitch of 3.0 mm and a line width of 7 μm.

  Etching was performed by spraying a ferric chloride solution (Baume degree 42, temperature 30 degrees) onto the metal foil 350 from the resist pattern 49 side using the resist pattern 49 as a mask. And after wash | cleaning with water, the resist was peeled using the alkaline solution, and it wash | cleaned and dried after peeling. And the laminated body containing two or more pattern sheet 30 of the structure of the base material 31 which consists of PET / adhesive layer / conductive pattern member 40 (conductive mesh) which consists of copper was obtained. The conductive pattern member 40 in the pattern sheet 30 is formed in a range of 100 cm × 80 cm, and has conductive thin wires 41 arranged in a mesh pattern having a pitch of 3.0 mm and a line width of 7 μm in the range. Yes. The thin conductive wire 41 has a trapezoidal cross-sectional shape in a direction orthogonal to the extending direction of the conductive thin wire, and the trapezoidal cross-sectional shape of the conductive thin wire 41 is the end of the lower base (surface 41a). The angle α formed by the line extending from the portion to the end of the upper base (surface 41b) and the direction extending along the lower base, that is, the angle of the base angle, was 75 degrees.

  And the 100 cm x 80 cm pattern sheet 30 was cut out from the laminated body obtained as mentioned above. The pattern sheet 30 was sandwiched between bonding layers 21 and 22 made of a PVB adhesive sheet of the same size as the pattern sheet 30 and further sandwiched between 100 cm × 80 cm glass plates 11 and 12 and heated and pressurized (vacuum lamination). And the laminated glass 10 concerning an Example was obtained.

When the laminated glass 10 according to the example was visually confirmed, no bubbles were found.
Moreover, when a point light source 3 m ahead was observed through the laminated glass 10, no fine glare derived from bubbles was generated.

(Comparative example)
The laminated glass of the comparative example was manufactured by using the same material as in the example and performing the same process except that the baking temperature for forming the resist pattern was 100 degrees. In the laminated glass of the comparative example, the conductive thin wire had a rectangular cross-sectional shape in the direction orthogonal to the extending direction, and the base angle was approximately 90 degrees. When the laminated glass of the comparative example was visually confirmed, bubbles were found. Moreover, when a point light source 3 m ahead was observed through the laminated glass, fine glare derived from bubbles was generated.

DESCRIPTION OF SYMBOLS 1 Car 5 Front window 7 Power supply 10 Laminated glass 11 1st glass plate 12 2nd glass plate 15 Wiring part 16 Connection part 21 1st joining layer 22 2nd joining layer 23 3rd joining layer 30 Pattern sheet 31 Base material 31a, 31b Surface 40 Conductive pattern member 41 Conductive thin wire 41a Surface 41b Surface 41c, 41d Side surface 42 Branch point 43 Opening 45 Conductive metal layer 46 First dark color layer 47 Second dark color layer 48 Resist layer 49 Resist pattern 49 Metal foil 350a, 350b surface 360 dark color layer

Claims (7)

A laminated glass comprising a pair of glass plates and a conductive pattern member disposed between the pair of glass plates, wherein the conductive pattern member includes conductive thin wires arranged in a pattern,
The conductive pattern member is disposed between at least one of the pair of glass plates and the conductive pattern member, and is in direct contact with the glass plate and the conductive thin wire, so that the conductive pattern member is disposed on the glass plate. A bonding layer for bonding to
The laminated glass, wherein the thin conductive wire is formed so that its line width becomes narrower as it approaches the glass plate located on the side of the bonding layer in contact with the thin conductive wire.   The laminated glass according to claim 1, wherein the conductive thin wire is formed from a metal film patterned by etching.   The laminated glass according to claim 1 or 2, wherein the thin conductive wire has a trapezoidal cross-sectional shape in a direction orthogonal to the extending direction of the thin conductive wire.   The trapezoidal cross-sectional shape of the thin conductive wire is such that an angle between a line segment extending from an end of the lower base to an end of the upper base and a direction extending along the lower base is 40 degrees or more and 85 degrees or less. Item 4. The laminated glass according to item 3.   The conductive thin wire has a dark color layer in a portion facing the side opposite to the glass plate side located on the bonding layer side in contact with the conductive thin wire. Laminated glass as described.   The laminated glass according to claim 5, wherein the dark color layer is made of chromium oxide. A pattern sheet for laminated glass having a conductive pattern member disposed between a pair of glass plates,
Having a sheet-like substrate having a pair of opposed surfaces;
The conductive pattern member is provided on at least one of a pair of opposing surfaces of the base material,
The conductive pattern member includes conductive thin wires arranged in a pattern,
The said thin conductive wire is a pattern sheet | seat for laminated glasses formed so that the line | wire width may become narrow as it spaces apart from the said base material along the normal line direction with respect to the sheet | seat surface of the said base material.

Images