JP2016127116A5 - - Google Patents
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- Publication number
- JP2016127116A5 JP2016127116A5 JP2014266140A JP2014266140A JP2016127116A5 JP 2016127116 A5 JP2016127116 A5 JP 2016127116A5 JP 2014266140 A JP2014266140 A JP 2014266140A JP 2014266140 A JP2014266140 A JP 2014266140A JP 2016127116 A5 JP2016127116 A5 JP 2016127116A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive sheet
- ring frame
- pressure
- semiconductor chips
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014266140A JP6482866B2 (ja) | 2014-12-26 | 2014-12-26 | 半導体装置の製造方法 |
TW104143856A TWI695421B (zh) | 2014-12-26 | 2015-12-25 | 半導體裝置之製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014266140A JP6482866B2 (ja) | 2014-12-26 | 2014-12-26 | 半導体装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016127116A JP2016127116A (ja) | 2016-07-11 |
JP2016127116A5 true JP2016127116A5 (es) | 2017-11-24 |
JP6482866B2 JP6482866B2 (ja) | 2019-03-13 |
Family
ID=56359712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014266140A Active JP6482866B2 (ja) | 2014-12-26 | 2014-12-26 | 半導体装置の製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6482866B2 (es) |
TW (1) | TWI695421B (es) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7250468B2 (ja) | 2018-10-12 | 2023-04-03 | 三井化学株式会社 | 電子装置の製造方法および粘着性フィルム |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200033221A (ko) * | 2017-08-04 | 2020-03-27 | 린텍 가부시키가이샤 | 반도체 장치의 제조 방법 |
JP7093630B2 (ja) * | 2017-12-27 | 2022-06-30 | リンテック株式会社 | 離間装置および離間方法 |
CN111886673A (zh) * | 2018-03-07 | 2020-11-03 | 琳得科株式会社 | 扩片方法、半导体装置的制造方法、以及粘合片 |
JP2021034398A (ja) * | 2019-08-14 | 2021-03-01 | 株式会社ジャパンディスプレイ | 素子移載装置、素子移載方法 |
KR102351045B1 (ko) * | 2019-12-19 | 2022-01-14 | 한국기계연구원 | 마이크로 소자의 간격 조절 전사방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005243910A (ja) * | 2004-02-26 | 2005-09-08 | Lintec Corp | 半導体チップの製造方法 |
JP2006203079A (ja) * | 2005-01-21 | 2006-08-03 | Sharp Corp | 半導体装置および半導体装置の製造方法 |
JP5518502B2 (ja) * | 2009-01-27 | 2014-06-11 | シチズン電子株式会社 | 発光ダイオードの製造方法 |
WO2014002535A1 (ja) * | 2012-06-29 | 2014-01-03 | シャープ株式会社 | 半導体装置の製造方法 |
-
2014
- 2014-12-26 JP JP2014266140A patent/JP6482866B2/ja active Active
-
2015
- 2015-12-25 TW TW104143856A patent/TWI695421B/zh active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7250468B2 (ja) | 2018-10-12 | 2023-04-03 | 三井化学株式会社 | 電子装置の製造方法および粘着性フィルム |
JP7250468B6 (ja) | 2018-10-12 | 2023-04-25 | 三井化学株式会社 | 電子装置の製造方法および粘着性フィルム |
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