JP2016122777A5 - - Google Patents

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Publication number
JP2016122777A5
JP2016122777A5 JP2014262862A JP2014262862A JP2016122777A5 JP 2016122777 A5 JP2016122777 A5 JP 2016122777A5 JP 2014262862 A JP2014262862 A JP 2014262862A JP 2014262862 A JP2014262862 A JP 2014262862A JP 2016122777 A5 JP2016122777 A5 JP 2016122777A5
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Japan
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holding unit
unit
fixing member
support device
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JP2014262862A
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Japanese (ja)
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JP2016122777A (ja
JP6485687B2 (ja
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JP2014262862A 2014-12-25 2014-12-25 保持装置、物体支持装置及び露光装置、並びにデバイス製造方法 Active JP6485687B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014262862A JP6485687B2 (ja) 2014-12-25 2014-12-25 保持装置、物体支持装置及び露光装置、並びにデバイス製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014262862A JP6485687B2 (ja) 2014-12-25 2014-12-25 保持装置、物体支持装置及び露光装置、並びにデバイス製造方法

Publications (3)

Publication Number Publication Date
JP2016122777A JP2016122777A (ja) 2016-07-07
JP2016122777A5 true JP2016122777A5 (cg-RX-API-DMAC10.html) 2018-01-18
JP6485687B2 JP6485687B2 (ja) 2019-03-20

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ID=56329172

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JP2014262862A Active JP6485687B2 (ja) 2014-12-25 2014-12-25 保持装置、物体支持装置及び露光装置、並びにデバイス製造方法

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JP (1) JP6485687B2 (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7051455B2 (ja) * 2018-01-16 2022-04-11 キオクシア株式会社 パターン形成装置および半導体装置の製造方法
JP7110005B2 (ja) * 2018-06-20 2022-08-01 キヤノン株式会社 基板回転装置、基板回転方法、リソグラフィ装置、および物品製造方法
KR102822419B1 (ko) * 2020-12-08 2025-06-18 에스케이하이닉스 주식회사 반도체 제조 장치, 이를 이용하는 캐리어 위치 판독 방법 및 반도체 다이의 부착 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HK1216357A1 (en) * 2012-11-30 2016-11-04 Nikon Corporation Transfer system, exposure apparatus, transfer method, exposure method, device manufacturing method, and suction apparatus

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