JP2016111366A - 平坦でない二次元及び三次元の面を電気的に接続する配線が印刷された伸縮性を有するシート - Google Patents
平坦でない二次元及び三次元の面を電気的に接続する配線が印刷された伸縮性を有するシート Download PDFInfo
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- JP2016111366A JP2016111366A JP2015235826A JP2015235826A JP2016111366A JP 2016111366 A JP2016111366 A JP 2016111366A JP 2015235826 A JP2015235826 A JP 2015235826A JP 2015235826 A JP2015235826 A JP 2015235826A JP 2016111366 A JP2016111366 A JP 2016111366A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
Abstract
Description
Claims (9)
- 平坦でない二次元又は三次元の面に導体を形成する方法であって、
物体の面の二点間に導体を形成するのに必要とされる導電材料の量を決定し、
その決定された量の導電材料を基板に成膜し、
前記物体の面の二点間に導体が形成されるように、前記導電材料が成膜された基板を前記物体に貼り付ける、方法。 - 請求項1に記載の方法において、前記導電材料は伸縮性を有する導電材料である、方法。
- 請求項1に記載の方法において、前記基板は伸縮性を有する基板である、方法。
- 請求項1に記載の方法において、前記基板の面上に導電材料を印刷するインクジェットプリンタによって、前記導電材料を前記基板に成膜する、方法。
- 請求項1に記載の方法において、前記基板内の貯留部の中に導電材料を成膜する埋め込み型三次元プリンタによって、前記導電材料を前記基板に成膜する、方法。
- 請求項1に記載の方法において、馬蹄形状のパターンで前記導電材料を前記基板に成膜する、方法。
- 請求項1に記載の方法において、ラミネート加工によって、前記導電材料が成膜された基板を前記物体に貼り付ける、方法。
- 請求項1に記載の方法において、前記物体は、前記二点間に、少なくとも一つの平坦でない面を有する、方法。
- 請求項8に記載の方法において、前記導体は、前記二点間に、前記少なくとも一つの平坦でない面に亘って形成される、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/558,357 | 2014-12-02 | ||
US14/558,357 US9398705B2 (en) | 2014-12-02 | 2014-12-02 | Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016111366A true JP2016111366A (ja) | 2016-06-20 |
JP6921475B2 JP6921475B2 (ja) | 2021-08-18 |
Family
ID=55967936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015235826A Active JP6921475B2 (ja) | 2014-12-02 | 2015-12-02 | 平坦でない二次元及び三次元の面に導体を形成する方法、及び平坦でない二次元及び三次元の面を電気的に接続するシステム |
Country Status (4)
Country | Link |
---|---|
US (2) | US9398705B2 (ja) |
JP (1) | JP6921475B2 (ja) |
CN (1) | CN105655757B (ja) |
DE (1) | DE102015120819A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111781799A (zh) * | 2020-07-13 | 2020-10-16 | 深圳市国铭达科技有限公司 | 一种3d结构件上的3d图形的加工方法 |
US20240098903A1 (en) * | 2022-09-15 | 2024-03-21 | Xtpl S.A. | Method for printing traces on a substrate and an additive manufacturing apparatus therefor |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02156694A (ja) * | 1988-12-09 | 1990-06-15 | Matsushita Electric Ind Co Ltd | 描画装置 |
JPH08279659A (ja) * | 1995-04-07 | 1996-10-22 | Shichizun Denshi:Kk | 立体基板及びその製造方法 |
US6020862A (en) * | 1998-04-09 | 2000-02-01 | Harris Corporation | Method for making non-planar radio frequency device and device produced thereby |
JP2007173226A (ja) * | 2005-11-28 | 2007-07-05 | Osaka Univ | ゴム材料およびゴム材料の製造方法 |
JP2012033674A (ja) * | 2010-07-30 | 2012-02-16 | Tokai Rubber Ind Ltd | 柔軟配線体 |
JP2013145842A (ja) * | 2012-01-16 | 2013-07-25 | Nippon Mektron Ltd | フレキシブル回路基板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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CH595664A5 (ja) * | 1975-11-17 | 1978-02-15 | Landis & Gyr Ag | |
US4869767A (en) * | 1985-05-03 | 1989-09-26 | Hallmark Cards, Incorporated | Process for placing single or multiple patterned layers of conductive material on a substrate |
US5264061A (en) * | 1992-10-22 | 1993-11-23 | Motorola, Inc. | Method of forming a three-dimensional printed circuit assembly |
US5413659A (en) * | 1993-09-30 | 1995-05-09 | Minnesota Mining And Manufacturing Company | Array of conductive pathways |
US7037382B2 (en) * | 1996-12-20 | 2006-05-02 | Z Corporation | Three-dimensional printer |
US6743982B2 (en) * | 2000-11-29 | 2004-06-01 | Xerox Corporation | Stretchable interconnects using stress gradient films |
JP4737942B2 (ja) * | 2004-03-24 | 2011-08-03 | Tdk株式会社 | 太陽電池の製造方法 |
US8217381B2 (en) * | 2004-06-04 | 2012-07-10 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
EP1840648A1 (en) * | 2006-03-31 | 2007-10-03 | Sony Deutschland Gmbh | A method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate |
KR101814683B1 (ko) * | 2006-09-06 | 2018-01-05 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 2차원 인장 가능하고 구부릴 수 있는 장치 |
GB0821927D0 (en) * | 2008-12-01 | 2009-01-07 | Ucl Business Plc | Article and method of surface treatment of an article |
-
2014
- 2014-12-02 US US14/558,357 patent/US9398705B2/en active Active
-
2015
- 2015-12-01 DE DE102015120819.9A patent/DE102015120819A1/de active Pending
- 2015-12-02 CN CN201510872807.9A patent/CN105655757B/zh active Active
- 2015-12-02 JP JP2015235826A patent/JP6921475B2/ja active Active
-
2016
- 2016-06-29 US US15/196,280 patent/US10244623B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02156694A (ja) * | 1988-12-09 | 1990-06-15 | Matsushita Electric Ind Co Ltd | 描画装置 |
JPH08279659A (ja) * | 1995-04-07 | 1996-10-22 | Shichizun Denshi:Kk | 立体基板及びその製造方法 |
US6020862A (en) * | 1998-04-09 | 2000-02-01 | Harris Corporation | Method for making non-planar radio frequency device and device produced thereby |
JP2007173226A (ja) * | 2005-11-28 | 2007-07-05 | Osaka Univ | ゴム材料およびゴム材料の製造方法 |
JP2012033674A (ja) * | 2010-07-30 | 2012-02-16 | Tokai Rubber Ind Ltd | 柔軟配線体 |
JP2013145842A (ja) * | 2012-01-16 | 2013-07-25 | Nippon Mektron Ltd | フレキシブル回路基板 |
Non-Patent Citations (1)
Title |
---|
MUTH ET AL.: "Embedded 3D Printing of Strain Sensors within Highly Stretchable Elastomers", ADVANCED MATERIALS, vol. 26 (36), JPN6019042185, 16 June 2014 (2014-06-16), pages 6307 - 6312, ISSN: 0004395024 * |
Also Published As
Publication number | Publication date |
---|---|
JP6921475B2 (ja) | 2021-08-18 |
CN105655757B (zh) | 2019-07-26 |
US20160157363A1 (en) | 2016-06-02 |
US10244623B2 (en) | 2019-03-26 |
US20160309584A1 (en) | 2016-10-20 |
CN105655757A (zh) | 2016-06-08 |
DE102015120819A1 (de) | 2016-06-02 |
US9398705B2 (en) | 2016-07-19 |
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