JP2016099762A - Non-contact type IC card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact type IC card that uses a woody sheet for a surface of the IC card to protect an antenna and the like from moisture, and can prevent deterioration of the antenna and the like.SOLUTION: An IC chip recess 21a and an antenna recess 21b are provided in a woody sheet 21 on a bottom face side, and after a moisture curable type hot melt adhesive 31 is coated, an antenna 12 and an IC chip 11 are sequentially housed in the recesses 21a and 21b and bonded therein, and then, a woody sheet 22 of a top face side having a moisture curable hot melt adhesive 32 coated is superimposed on the antenna and IC chip to be integrally laminated. The antenna and IC chip are wrapped with the moisture curable hot melt adhesives 31 and 32, and thus, can be protected from water transmitting the woody sheets 21 and 22.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a non-contact IC card, and more particularly to a wood-tone non-contact IC card.

  The non-contact type IC card is a card that incorporates an IC chip and a communication antenna, and transmits and receives signals to and from an external device through the antenna through electromagnetic waves. (See Patent Document 1).

  By the way, natural wood has a unique appearance and texture, and also has an excellent feel, so there is a strong demand for various products using this natural wood. Therefore, for example, a magnetic card having a natural wood veneer bonded to the surface is known (see Patent Document 2). Since this magnetic card uses a veneer of natural wood on the surface, it exhibits its unique feel, is easy to adjust to the hand, and has an excellent appearance.

  However, natural wood is rich in hygroscopicity and permeates moisture, so when it is used as the surface sheet of a non-contact IC card, moisture reaches the communication antenna, and the antenna and the antenna and IC chip There is a problem in that the connecting portion is corroded and the function of the non-contact type IC card is impaired.

JP 2011-89593 A Japanese Utility Model Publication No. 01-91582

  Therefore, an object of the present invention is to provide a non-contact type IC card using a wood sheet on the surface, which can prevent the antenna and the like from being deteriorated by preventing the antenna and the like from moisture. Is.

That is, the invention described in claim 1 is a non-contact IC card that incorporates an IC chip and an antenna, and transmits and receives signals to and from an external device using electromagnetic waves, and an IC card that has a wooden sheet on at least one surface. ,
A non-contact type IC card, wherein the IC chip and the antenna are covered with a water-resistant material.

  Next, the invention described in claim 2 is characterized in that an IC inlet is configured by arranging an IC chip and an antenna on a base sheet, and the IC inlet is covered with the water resistant material. The non-contact type IC card according to claim 1.

  The invention according to claim 3 is the non-contact type IC card according to claim 1 or 2, wherein the water-resistant material is made of a hot-melt adhesive.

  The invention according to claim 4 is the non-contact type IC card according to claim 3, wherein the hot melt adhesive is a moisture curable hot melt adhesive.

  The invention according to claim 5 is characterized in that the wood sheet is provided with a recess for accommodating one or both of an IC chip and an antenna. This is a non-contact type IC card.

  The invention according to claim 6 is the non-contact type IC card according to any one of claims 1 to 5, wherein the wood sheet is exposed on the surface.

  The invention according to claim 7 is the non-contact type IC card according to any one of claims 1 to 6, wherein the wood sheet is laminated on both the upper surface and the lower surface.

  The invention according to claim 8 is the non-contact type IC card according to any one of claims 1 to 7, wherein the wood sheet is made of a single plate.

  The invention described in claim 9 is the non-contact type IC card according to any one of claims 1 to 8, wherein the wood sheet is varnished.

  The IC card of the present invention includes an IC chip and an antenna, and the IC chip and the antenna are covered with a water-resistant material even though a wooden sheet is laminated. The antenna, or the connection portion thereof, is protected from moisture that has penetrated through the wood sheet. For this reason, it becomes possible to prevent deterioration of the antenna and its connecting portion.

  When a moisture curable hot melt adhesive is used as the water resistant material, the moisture that permeates through the wood sheet is captured by the adhesive, and therefore does not reach the antenna or the IC chip. . In addition, the adhesive that has trapped moisture reacts with the moisture and cures in a network, and the network structure prevents the moisture from permeating. That is, when a moisture-curable hot-melt adhesive is used as the water-resistant material, a water-resistant network structure is generated with an increase in the invading moisture, and the water resistance is enhanced. In addition, even if the wood sheet changes in size over time and distortion occurs between the upper and lower wood sheets, the hot-melt adhesive is flexible. The strain can be relaxed with the agent, and the deformation of the IC card can be prevented. Since this adhesive is a hot melt adhesive, the wood sheet can be laminated by melting the adhesive.

The 1st example of the IC card based on this invention is shown, Fig.1 (a) is the cross-sectional explanatory drawing, FIG.1 (b)-(e) is cross-sectional explanatory drawing which shows a manufacturing process. The 2nd example of the IC card based on this invention is shown, Fig.2 (a) is the cross-sectional explanatory drawing, FIG.2 (b)-(e) is cross-sectional explanatory drawing which shows a manufacturing process. The 3rd example of the IC card based on this invention is shown, Fig.3 (a) is the cross-sectional explanatory drawing, FIG.3 (b)-(e) is cross-sectional explanatory drawing which shows a manufacturing process.

  The IC card of the present invention is a non-contact IC card that incorporates an IC chip and an antenna, and exchanges signals with external devices using electromagnetic waves. This IC card has a wooden sheet laminated on the outer surface to enhance its design and feel, and cover both the IC chip and the antenna with a water-resistant material, thereby connecting the IC chip, the antenna and the connection thereof. The part is protected from external moisture. The IC card may be one in which the wood sheet is laminated on both upper and lower surfaces, or one in which the wood sheet is laminated on one of the upper and lower surfaces.

  When the above wooden sheets are laminated on both the upper and lower surfaces, these wooden sheets are generally hard materials. Therefore, in order to prevent damage to the IC chip and the antenna sandwiched between the upper and lower wooden sheets, a recess is formed in one of the wooden sheets. It is desirable to provide the IC chip and the antenna in the recess. The recess can be provided by excavation.

  Further, when the wood sheet is laminated on one side, it is desirable that another sheet is laminated on the opposite side. For example, an IC card can be obtained by laminating a wood sheet on the upper surface and a resin sheet on the lower surface. Further, a wood sheet may be laminated on the lower surface, and a resin sheet may be laminated on the upper surface.

  It is desirable to use a board made of natural wood as the wood sheet. For example, natural wood veneer. Moreover, although it may be a plywood, it is desirable to use a single plate from the viewpoint of its high-class feeling and strength. The thickness is desirably such that the total thickness of the upper surface side wood sheet and the lower surface side wood sheet becomes 760 to 800 μm. The material of the wood sheet may be arbitrary, and examples thereof include birch, cypress, cedar, walnut, and cherry. The wood sheet may be engraved or surface protected varnished.

  Both the IC chip and the antenna and the wood sheet can be laminated using an adhesive. When the adhesive has water resistance, the adhesive can be used as the water resistant material. If the adhesive is not water resistant, it is necessary to prepare another water resistant material and cover the IC chip and the antenna with this water resistant material.

  An example of the water resistant adhesive is a hot melt adhesive. Among them, the moisture curable hot melt adhesive is excellent in water resistance, and the moisture curable hot melt adhesive captures moisture that permeates through the wood sheet and reacts with the moisture. It is possible to prevent the antenna or the metal wire or solder of the connecting portion from being corroded by intrusion moisture. Further, since a network-like water-resistant structure is generated by the reaction between the intruding moisture and the adhesive, the network-like structure can prevent moisture from passing through even after the adhesive loses its reaction ability. Further, even when strain occurs over time between the upper and lower wood sheets, the moisture-curable hot-melt adhesive can relieve the strain and prevent deformation of the IC card. As such a moisture curable hot melt adhesive, a urethane moisture curable hot melt adhesive can be preferably exemplified. Urethane moisture-curable hot-melt adhesives have an isocyanate group, and this isocyanate group reacts with intruding moisture to form a network-like water-resistant structure. Urethane moisture-curing hot melt adhesives are known, and are commercially available, for example, from Hitachi Chemical Co., Ltd. or Sanyo Chemical Co., Ltd.

  In addition, as the above water-resistant material, water-resistant latex or varnish can be used.

  Next, the IC chip may be used as it is, or may be used in the form of an IC module configured by embedding the IC chip with a resin. As the IC module, an IC module in which a reinforcing plate is provided on the back surface of the IC chip and these IC chip and the reinforcing plate are embedded integrally can be used.

  In addition, for example, a coil antenna obtained by winding a metal wire into a coil shape can be used as it is. A copper wire can be suitably used as the metal wire. Moreover, it is also possible to use a coil antenna obtained by winding a metal wire coated with a resin and processing it into a coil shape.

  It is also possible to use an IC inlet in which these IC chip and antenna are integrated. The IC inlet can be formed by using a base sheet, forming an antenna on the base sheet, and joining IC chip electrodes to both ends of the antenna. Of course, an IC module can be used instead of the IC chip. In addition, the method of forming an antenna on a base material sheet is well-known. For example, after laminating a metal foil on a substrate sheet, the metal foil can be patterned to form an antenna. Copper foil can be used as the metal foil. Moreover, an antenna can also be formed on a base material sheet by adhering to a base material sheet while winding a metal wire or a metal wire coated with a resin. Further, the antenna and the IC chip can be joined by, for example, solder.

  The IC card of the present invention has a difference between whether or not a wood sheet is laminated on both upper and lower surfaces or one surface, whether or not a water-resistant adhesive is used as an adhesive, or an IC inlet. Various structures and manufacturing processes can be adopted depending on whether or not to use these. Therefore, the present invention will be described below with specific examples. The first example is an example in which a water-resistant adhesive is used as an adhesive and no IC inlet is used (see FIG. 1). The second example is an example using a water-resistant adhesive and an IC inlet (see FIG. 2). Next, a third example is an example in which an adhesive having no water resistance is used as an adhesive and no IC inlet is used (see FIG. 3). In these descriptions, a sheet constituting the lower surface of the IC card is referred to as a “lower surface sheet”, and a sheet constituting the upper surface is referred to as an “upper surface sheet”.

(Description of First Embodiment)
In this example, as shown in the cross-sectional explanatory view of FIG. 1A, the IC chip 11 and the antenna 12 are both sandwiched between the lower surface sheet 21 and the upper surface sheet 31, and the whole is laminated and integrated. is there.

  Both the lower surface sheet 21 and the upper surface sheet 31 are wood sheets. To prevent damage to the IC chip 11 and the antenna 12 sandwiched between the upper and lower wood sheets, the IC chip 11 is disposed on the inner surface of the lower surface sheet 21. IC chip recess 21a for receiving the antenna 12 and antenna recess 21b for receiving the antenna 12 are provided.

  Both the IC chip 11 and the antenna 12 and the lower surface sheet 21 are bonded with a moisture-curable hot-melt adhesive 31 having water resistance. Further, both the IC chip 11 and the antenna 12 and the upper surface side sheet 22 are also bonded with a moisture-curable hot melt adhesive 32. As described above, the moisture-curable hot-melt adhesives 31 and 32 are respectively provided between the IC chip 11 and the antenna 12 and the lower surface sheet 21, both of the IC chip 11 and the antenna 12, and the upper surface sheet 22. In addition, both the IC chip 11 and the antenna 12 are wrapped with the adhesive 31 and the adhesive 32. For this reason, both the IC chip 11 and the antenna 12 are protected from moisture that has penetrated through the wooden lower surface sheet 21 and the upper surface sheet 22.

  This IC card can be manufactured as follows. That is, first, the moisture curable hot-melt adhesive 32 is applied to the top sheet 22 (see FIG. 1B). On the other hand, after excavating the wood sheet to provide the recesses 21a and 21b to form the lower surface sheet 21, a moisture-curing hot melt adhesive 31 is applied to the excavated surface (see FIG. 1C).

  Next, the coil antenna 12 wound into a coil shape by winding a metal wire is accommodated in the antenna recess 21b (see FIG. 1D). At this time, the antenna 12 is accommodated so that both ends of the antenna 12 are positioned in the IC chip recess 21a. Then, the IC chip 11 is accommodated in the IC chip recess 21a, and its electrodes are connected to both ends of the antenna 12 (see FIG. 1 (e)). The antenna 12 and the IC chip 11 can be connected by, for example, solder.

  Finally, the upper surface sheet 22 is stacked, and the whole is bonded and integrated, whereby the IC card of this example can be manufactured. After that, engraving and surface protection varnish can be applied to the surface of the lower surface sheet 21 and the upper surface sheet 22.

(Description of Second Embodiment)
In this example, as shown in the cross-sectional explanatory view of FIG. 2A, an IC inlet is used, and the IC inlet is sandwiched between a lower surface sheet 21 and an upper surface sheet 31, and the whole is laminated and integrated. It is. The IC inlet is obtained by forming the antenna 12 on the base sheet 13 and arranging the IC chip, and electrically connecting both ends of the antenna 12 and the electrodes of the IC chip 11. Each of the lower surface sheet 21 and the upper surface sheet 31 is a wood sheet, and an IC chip recess 21 a and an antenna recess 21 b are provided on the inner surface of the lower surface sheet 21.

  The IC inlet and the lower surface side sheet 21 are bonded with a moisture curable hot melt adhesive 31. Further, the IC inlet and the upper surface side sheet 22 are also bonded with a moisture-curable hot melt adhesive 32. As described above, the moisture-curable hot-melt adhesives 31 and 32 are interposed between the IC inlet and the lower surface sheet 21, and between the IC inlet and the upper surface sheet 22, respectively. Both the chip 11 and the antenna 12 are protected from moisture that has permeated through the wooden lower surface sheet 21 and the upper surface sheet 22.

  This IC card can be manufactured as follows. That is, first, the moisture curable hot-melt adhesive 32 is applied to the top sheet 22 (see FIG. 2B). On the other hand, after excavating the wood sheet to provide the recesses 21a and 21b to form the lower surface sheet 21, a moisture-curing hot melt adhesive 31 is applied to the excavated surface (see FIG. 2C). In addition to this, an IC inlet is prepared (see FIG. 2D).

  Then, the IC inlet is aligned and overlapped on the lower surface side sheet 21 (see FIG. 2E). That is, the IC chip 11 provided in the IC inlet is overlaid so that the IC chip 11 is positioned in the IC chip recess 21a and the antenna 12 is positioned in the antenna recess 21b.

  Finally, the upper surface sheet 22 is stacked, and the whole is bonded and integrated, whereby the IC card of this example can be manufactured. Further, thereafter, engraving and surface protection varnish can be applied to the surfaces of the lower surface side sheet 21 and the upper surface side sheet 22.

(Description of the third embodiment)
In this example, as shown in the cross-sectional explanatory view of FIG. 3A, the IC chip 11 and the antenna 12 are both sandwiched between the lower surface sheet 21 and the upper surface sheet 31, and the whole is laminated and integrated. is there. Both the lower surface sheet 21 and the upper surface sheet 31 are wood sheets, and an IC chip recess 21 a and an antenna recess 21 b are provided on the inner surface of the lower surface sheet 21.

  Both the IC chip 11 and the antenna 12 and the lower surface sheet 21 are bonded with a moisture-curable hot melt adhesive 31. On the other hand, the adhesive 32 that bonds the upper surface side sheet 22 is an adhesive having no water resistance. Therefore, both the IC chip 11 and the antenna 12 are covered with the water resistant material 4, and the upper surface side sheet 22 is laminated on the water resistant material 4 via the adhesive 32.

As described above, the water-resistant moisture-curable hot-melt adhesive 31 is interposed between the IC chip 11 and the antenna 12 and the lower surface sheet 21, while both the IC chip 11 and the antenna 12 are used. The water-resistant material 4 is interposed between the upper surface side sheet 22 and the upper surface side sheet 22. Moreover, both the IC chip 11 and the antenna 12 are wrapped with the adhesive 31 and the water-resistant material 4. For this reason, both the IC chip 11 and the antenna 12 are protected from moisture that has penetrated through the wooden lower surface sheet 21 and the upper surface sheet 22.

  This IC card can be manufactured as follows. That is, first, the moisture curable hot melt adhesive 32 is applied to the upper surface side sheet 22 (see FIG. 3B). On the other hand, after excavating the wood sheet to provide the recesses 21a and 21b to form the lower surface sheet 21, a moisture-curing hot melt adhesive 31 is applied to the excavated surface (see FIG. 3C).

  Next, the coil antenna 12 wound in a coil shape by winding a metal wire is accommodated in the antenna recess 21b, the IC chip 11 is accommodated in the IC chip recess 21a, and the electrodes of the IC chip 11 are connected to both ends of the antenna 12. (See FIG. 3D).

  And water-resistant latex or varnish is apply | coated so that these IC chip 11 and the antenna 12 may be covered, and the water-resistant material 4 is formed (refer FIG.3 (e)). Finally, the upper surface sheet 22 is stacked, and the whole is bonded and integrated, whereby the IC card of this example can be manufactured. Further, thereafter, engraving and surface protection varnish can be applied to the surfaces of the lower surface side sheet 21 and the upper surface side sheet 22.

11: IC chip 12: Antenna 13: Substrate sheet 21: Lower surface sheet 21a: Recess for IC chip 21b: Recess for antenna 22: Upper sheet 31, 32: Adhesive 4: Water resistant material

Claims (9)

In a non-contact IC card that incorporates an IC chip and an antenna and exchanges signals with an external device by electromagnetic waves, and at least one side of the IC card is made of a wood sheet,
A non-contact type IC card, wherein the IC chip and the antenna are covered with a water-resistant material.   2. The non-contact type IC according to claim 1, wherein an IC inlet is constituted by arranging an IC chip and an antenna on a base sheet, and the IC inlet is covered with the water resistant material. card.   3. The non-contact type IC card according to claim 1, wherein the water resistant material is made of a hot melt adhesive.   The non-contact type IC card according to claim 3, wherein the hot-melt adhesive is a moisture-curing hot-melt adhesive.   The non-contact type IC card according to any one of claims 1 to 4, wherein the wood sheet is provided with a recess for accommodating one or both of an IC chip and an antenna.   The non-contact type IC card according to claim 1, wherein the wood sheet is exposed on a surface.   The non-contact type IC card according to claim 1, wherein the wood sheet is laminated on both an upper surface and a lower surface.   The non-contact type IC card according to claim 1, wherein the wood sheet is made of a single plate.   The non-contact type IC card according to claim 1, wherein the wood sheet is varnished.

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