JP2016096037A - Heating head, heater using the same, and heating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact type heating head which is increased in utilization efficiency of energy by effectively utilizing the generated heat even when non-contact heating is necessary while efficiently generating heat using a heating head, and also to provide a heater using the heating head, and a processing device.SOLUTION: On one face of a rectangular head substrate 1 having a planar shape, a band-like heat element 2 is formed in the longitudinal direction and a pair of electrode terminals 4 connected to the heat element 2 is formed. Then, on the surface of the heat element 2, a heat radiation layer 5 is provided in which irregularities 5a are formed on an exposed face with a material having emissivity of 0.8 or more.SELECTED DRAWING: Figure 1

Description

  The present invention is based on preheating, recording, erasing, transferring or retransferring to a medium, fixing of toner, heating of a continuous belt-like medium such as papers, films, cloths, non-woven fabrics, tapes (adhesives, adhesives). Has a belt-like heating resistor to heat the medium in a non-contact manner for bonding, deformation processing, overcoat, document laminating, sheet bonding, imprint processing (uneven heat processing such as plastic) The present invention relates to a heating head, a heating apparatus using the same, and a heating method. More specifically, the present invention relates to a heating head suitable for heating a medium by thermal radiation in a non-contact manner before and after heat processing, and a heating apparatus and a heating method using the same.

  In recent years, for the purpose of resource saving, energy saving, speed-up, high quality processing, space saving, etc. by reducing the size and weight of the device, for example, on the surface of a ceramic substrate, etc., for card recording / erasing, transfer / retransfer By using a heating head in which a heating resistor is formed in a belt shape, the heating resistor is energized to increase the temperature, and the medium is pressed against the heated ceramic substrate or heated with a platen while being transported. Has been done. However, when performing transfer / retransfer, drying and fixing the printed matter by an ink jet printer or the like at high speed, if the medium has low hygroscopicity, or the carrier liquid remains with the toner on the printing surface, There may be a case where the toner is not completely obtained. In such a case, if it is attempted to dry by pressure heating, a transferred or printed image flows (deteriorates), resulting in an image defect. For this reason, heating without contact is performed.

  For example, Patent Document 1 discloses an apparatus that includes a first nip 70, a non-contact heating device 80, and a second nip 90 as shown in FIG. 8, and fixes printed media in this order. Has been. The first nip 70 is configured so that the fixing roller 71 can move up and down. When the medium 60 is not hygroscopic and the carrier liquid remains, as shown in FIG. The non-contact heating device 80 is not heated by being pressed between the fixing roller 71 and the pressure roller 72, just by being lifted up and moving on the pressure roller 72 of the first nip. Have been to proceed. Then, the second nip 90 is heated by radiant heat by the non-contact heating device 80 and is heated while being pressed by the fixing roller 91 and the pressure roller 92 to be completely fixed. In this non-contact heating device 80, far infrared heaters 81 are arranged on both the upper and lower surfaces of the medium 60, but no detailed structure is disclosed.

JP2013-120330A

  As described above, when heating with the infrared heater 81, a large heater device is generally used, which is very wasteful and inefficient from the viewpoint of heat utilization. That is, when using radiant heat, the emissivity and transmittance differ depending on the radiating object and the absorbing material, and nothing is taken into account regarding the effective use of the radiated heat. In addition, as shown in FIG. 8, in the structure in which the medium 60 is transported by the transport belt 82, the radiant heat is almost interrupted by the transport belt 82, resulting in extremely poor thermal efficiency and equalizing the upper and lower heating. It is very difficult to do. However, in view of today's energy situation, there is a demand for efficient heating while avoiding unnecessary power consumption.

  Conventional heating heads for recording and erasing cards, for example, are small, compact, and have excellent heat utilization efficiency using a heating resistor with a length that matches the width of the medium such as the card. Heating is performed by directly contacting the heat generating portion using a heating head, and the heat generated can be used effectively, which is excellent in terms of effective use of energy. However, such a type of heating head that performs non-contact heating has not been put to practical use. On the other hand, if heating is performed using a large-scale device such as an infrared lamp heater, useless heat dissipation is greatly increased, which is not preferable in a situation where effective use of today's energy is screamed.

  The present invention has been made in view of such a situation. Even when it is necessary to perform non-contact heating while efficiently generating heat using a conventional heating head type heating device, the radiation efficiency is increased. It is an object of the present invention to provide a non-contact type heating head with improved energy utilization efficiency, a heating device using the heating head, and a heating method.

  The heating head according to the present invention is connected to the heating resistor and the head-like heating substrate formed in a longitudinal direction on one surface of the head substrate, and the heating substrate for flowing a current. And a heat radiation layer that is deposited on the surface of the heating resistor, is made of a material having an emissivity of 0.8 or more, and has an exposed surface that is uneven. In addition, it is preferable that the unevenness of the exposed surface of the heat radiation layer is a slightly rough surface, and further, the unevenness is formed in a dotted shape or a curved surface, so that the area for radiating heat is increased.

  Here, the heat radiation layer means a film excellent in infrared radiation necessary for heat transfer, and is not intended to release heat by heat conduction. That is, a material with as high an emissivity as possible is preferable, and it is preferable to form a surface structure that improves the emissivity. Specifically, the emissivity is a value shown by comparing the complete black body as 1.0, and graphite (graphite) is 1.0 at the maximum. Metal oxides, glass, and quartz also have high emissivity, but many small metals are not preferable. More specifically, the emissivity of black alumite is preferably 0.95. Black paint or black glass can also be used with an emissivity of about 0.85, but a material containing a large amount of pigment having a high emissivity is preferable. Further, it is preferable that the surface has irregularities and has a large surface area. In the example shown in FIG. 1, irregularities such as regular surfaces, pyramids, and curved surfaces are formed, but the surface thereof is further roughened, and may be random irregularities instead of such regular irregularities. Further, a shape having a large surface area even on the same substrate is particularly preferable. Moreover, although it is not related to the state of the surface, the amount of radiant heat is proportional to the 3rd to 4th power of the absolute temperature of the surface, so that a higher surface temperature is preferable. Furthermore, the closer to the medium, the more efficiently it can be heated. Furthermore, in an example of the wavelength that can be easily converted into heat, it is preferable that the wavelength is in the range of 1 to 15 μm, and that it is near infrared, middle infrared, and far infrared.

  Note that the medium to be heated partially transmits and does not generate heat, but it only needs to be reflected by the counter plate after transmission, so a material shape with good emissivity and good reflection is preferable. Since infrared rays are electromagnetic waves, they are also involved in transmission and absorption heat generation by the wavelength, material, and gas existing between the radiation layer surface and the medium.

  As described above, it is preferable that the heat radiation layer is formed of glass mixed with graphite, black alumite, or black pigment. In addition, there are some things that may not be black. Special coatings used for stoves and the like have been developed and evolved in various ways.

  A temperature measuring resistor is provided on the head substrate on which the heat generating resistor is provided, the temperature of the medium is estimated based on the temperature measured by the temperature measuring resistor, and the power supplied to the heat generating resistor is It is preferable that a control means for adjusting is further provided. It is important to control the temperature of the medium, not the temperature of the head surface, and it is necessary to set the distance to the medium and control the measurement.

  The heating apparatus according to the present invention includes at least one heating head arranged so that the medium is conveyed in a direction perpendicular to the longitudinal direction of the head substrate of the heating head, and the heat radiation layer side of the at least one heating head. It has at least 1 set of a driving roller which conveys the said medium so that a medium may oppose directly, and the coating container which coat | covers the said heating head and the said driving roller, The said heating head is any one of Claims 1-3. The heating head described in item 1 is used. The conveyance of the medium may be continuous or intermittent. In addition, as a medium, the continuous long thing on a card | curd, the thing in which a carrier is used, etc. are included.

  A structure in which at least one heating head is further provided so that the heat radiation layer side faces the medium across the medium facing the heating head, and the medium is conveyed between the two heating heads. It is preferable that

  The at least one set of driving rollers is provided below the heating head in the vertical direction, at least one feeding roller is provided vertically above the heating head, and the medium is pulled by the driving roller. Thus, the belt is conveyed between the medium and the heating head so as to be heated by passing in front of the heating head while the medium is conveyed in the vertical direction. Since there is no need, it is preferable from a viewpoint that it can heat efficiently. That is, placing on the belt conveyor is disadvantageous when performing double-sided processing, and if the belt conveyor is eliminated, a case where the belt hangs down is also assumed.

  By providing a processing portion for performing at least one first processing among recording, transfer, coating, coating, and film adhesion on the feed roller side of the heating head, the fixing is completely performed in the processed state. Even a processed product which has not been processed can be dried and fixed as it is, which is very convenient.

  According to the heating method of the present invention, the heating head according to any one of claims 1 to 3 is arranged so that the longitudinal direction of the heating head is parallel to the horizontal plane, and the medium is moved downward from above in the vertical direction. While being conveyed, the non-contact heating is performed by bringing the heating head close to the heat radiation layer, and the heat emitted from the heating head is retained by covering the periphery of the heating head, and the medium It is used for residual heat.

  By performing at least one first processing of recording, transfer, coating, coating, and film adhesion on the medium, and then transporting the medium, by drying the medium by non-contact heating of the heating head, From media processing to drying can be performed in a lump. After the non-contact heating, at least one second process of recording, transferring, coating, coating, and film bonding can be further performed on the medium.

  According to the heating head of the present invention, a heat radiation layer having an emissivity of 0.8 or more is provided on the surface of the heating resistor of the heating head, and an uneven surface is formed on the surface of the heat radiation layer. The medium generated can be heated by very efficiently radiating the heat generated by the small-sized heating head. Therefore, heat generation to radiation can be performed very efficiently, energy resources can be used very effectively, and a heating head that is friendly to the global environment can be obtained. In addition, in the case of moisture or solvent such as ink jet, in addition to the temperature rise, vaporization heat for evaporation is required, which is the fourth heat transfer amount. However, as will be described later, according to the heating device of the present invention, since the heating head is covered with the coating container, the temperature in the coating container is increased, and the vaporization heat can be supplied effectively.

  Further, according to the heating device of the present invention, since the coating container that covers the periphery of the heating head and the driving roller that conveys the medium is provided, the radiated heat can be held in the coating container. it can. Therefore, even if the medium is not transported to the front of the heating head, the temperature of the medium can be increased only by being carried into the coating container, and can be used for preheating the medium. As a result, the medium can be further efficiently heated. In addition, the gas used for preheating contains solvents and organic compounds in addition to moisture, and it is necessary to exhaust it with appropriate contamination prevention treatment. However, it is easy to prevent contamination by exhausting from the coated container. Can do.

  Further, at least one set of drive rollers is provided on the downstream side in the vertical direction, that is, in a direction perpendicular to the horizontal plane, and the medium is conveyed in the vertical direction, thereby conveying the medium in the vertical direction. be able to. As a result, it is not necessary to convey the medium by a belt conveyor or the like, and even when heating from both sides of the medium, the medium can be directly heated by the heating head. In addition, the distance between both surfaces and the heating head can be made equal, and both surfaces can be heated uniformly. As a result, heating by radiation can be performed very efficiently.

It is the plane explanatory view and the section explanatory view showing one embodiment of the heating head of the present invention. It is a section explanatory view showing one embodiment of the heating device of the present invention. It is a circuit diagram which shows an example of the operation circuit of the heating head shown by FIG. It is explanatory drawing which shows the example in which the transcription | transfer process part was provided in the front | former stage of the heating apparatus shown by FIG. It is a figure which shows the example of the other rear part provided in the front | former stage of the heating apparatus shown by FIG. It is a figure which shows the modification of the heating apparatus shown by FIG. It is explanatory drawing of the principle which measures temperature using the resistor for temperature measurement. It is explanatory drawing which shows an example of the conventional fixing device.

  Next, the heating head, the heating device, and the heating method of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory plan view showing an embodiment of a heating head according to the present invention, an explanatory plan view with the heat radiation layer 5 removed, and an explanatory sectional view perpendicular to the longitudinal direction. A strip-shaped heating resistor 2 is formed along the longitudinal direction on one surface of the head substrate 1 having a rectangular planar shape, and a pair of electrode terminals 4 connected to the heating resistor 2 is formed. A heat radiating plate 5 is provided on the surface of the heating resistor 2 and is made of a material having an emissivity of 0.8 or more and has an uneven surface 5a formed on the exposed surface.

  In the example shown in FIG. 1, an example in which one heating resistor 2 is provided is shown, but the number of heating resistors 2 is not limited. In the example shown in FIG. 1, a temperature measuring resistor 3 is provided beside the heating resistor 2 as shown in FIG. This temperature measuring resistor 3 is not for the purpose of heat generation but for measuring the temperature of the head substrate 1 using a resistor having a large temperature coefficient and estimating the temperature of the medium. Therefore, it is unnecessary if the temperature of the medium or the like is measured by other methods. Further, the heating resistor 2 and the temperature measuring resistor 3 are not directly provided on the head substrate 1 but via a heat insulating layer 6 called a grace layer made of an insulating layer having a high thermal resistance such as a glass layer. Is provided. This is to prevent the heat generated by the heating resistor 2 from escaping as much as possible to the head substrate 1 side. Further, the back surface side of the head substrate 1 is connected to the base 8 via a heat insulating layer 7 made of, for example, porous ceramics, heat-resistant resin substrates having low thermal conductivity, and the base 8 is fixed to the holder 9. . As will be described later with reference to FIG. 2, the back side of the holder 9 is also covered with a heat-insulating coating container 34 from, for example, aluminum to form a space 33 so that heat is not dissipated as much as possible.

  That is, the heating head 10 of this embodiment is formed for non-contact heating, and is characterized in that the heat radiation layer 5 is formed on the surface of the heating resistor 2. As described above, the heat radiation layer 5 is coated with a material that easily radiates heat, rather than dissipating heat by heat conduction. Therefore, a material having a high emissivity of electromagnetic waves that move heat is used as the material. The emissivity is generally 0 to 1.0 (graphite: graphite). Metals have a low emissivity, and black oxide systems have a high emissivity. Glass and quartz also have high emissivity. From the viewpoint of emissivity, graphite (1.0), black alumite, glass, rubber, etc. (0.9), black lacquer (0.9), black paint (0.85), epoxy glass, paper phenol, Of polytetrafluoroethylene glass (0.8), a material that has high heat resistance and hardly changes in quality can be used. Furthermore, the surface of the heat radiation layer 5 is preferably formed in an uneven surface or a curved surface (wave shape) and has a large surface area. In the example shown in FIG. 1, an example in which regular irregularities are formed in the longitudinal direction and the vertical direction thereof is shown, but there is no need to make regular irregularities in this way. However, for example, the unevenness as shown in FIG. 1 has a width of about 10 to 50 μm and a depth of about 10 to 50 μm, but may be formed by pressing a mesh of that degree, Further, it may be formed on a rough surface having a depth of about 10 μm. It is preferable that the unevenness and the curved surface are formed in a dot shape because the surface area can be doubled.

Specifically, it is mainly composed of a mixture of ruthenium oxide (RuO ₂ ) and alumina (Al ₂ O ₃ ) similar to the heating resistor 2 (In the heating resistor 2, Ag is further mixed to adjust the resistance value. The paste is applied by printing or the like and sintered. Therefore, by pressing the aforementioned mesh or the like before being completely cured, irregularities are formed on the surface, and a desired rough surface can be formed.

Furthermore, it is known that the amount of thermal radiation of an object is proportional to (emissivity) × (the fourth power of the absolute temperature of the object surface (K ⁴ )). Therefore, it is preferable to increase the surface temperature of the heat radiation layer 5 in order to increase the amount of heat radiation. From this point of view, it is preferable that the heat generated in the heating resistor 2 is concentrated in the heat radiation layer 5 without escaping as much as possible. Accordingly, as described above, the heat insulating layer 6 is formed between the heating resistor 2 and the head substrate 1 so that the heat generated in the heating resistor 2 is not transmitted to the head substrate 1 side as much as possible. . Further, the heat insulating layer 7 as described above is also interposed between the head substrate 1 and the base 8, thereby preventing the heat quantity of the heating resistor 2 from escaping to the base 8 side.

  The head substrate 1 is made of, for example, a substantially rectangular plate having a length of about 60 mm, a width of about 8 mm, and a thickness of about 0.6 mm. If the head substrate 1 is connected vertically and horizontally, a heating device having a desired size can be obtained. However, the size of the head substrate 1 is not limited, and for example, the width can be increased to increase the number of heating resistors 2. Further, even when a plurality of head substrates 1 are connected, they can be connected not only in the longitudinal direction but also in the vertical direction, and an arbitrary three-dimensional space can be manufactured.

The heating resistor 2 is formed, for example, by selecting a powder such as Ag + Pd + RuO ₂ + Pt + metal oxide + glass, applying it in a paste form, and baking it. The sheet resistance of the resistance film formed by firing is 100 mΩ / Sq to 100 kΩ / Sq (depending on the amount of solid insulating powder), and the resistance value and temperature coefficient can be changed depending on the ratio of the two. Further, the material used as the conductor (electrode 4) varies depending on the operating temperature due to the connection of the terminals. The more Ag, the lower the resistance.

  One heating resistor 2 has, for example, a thickness of about 20 μm, a length that is linear, and the length of the head substrate 1 that is the same as the length of the head substrate 1. The electrode 4 is connected to the bent portion. Such a structure is convenient for connecting a plurality of head substrates. However, it is also possible to employ a structure in which the end of the head substrate 1 is connected to the electrode 4 on the side surface or the back surface side through the side surface. The heat radiation area is the entire surface of the head substrate 1, and the width is 8 mm and the length is 60 mm. As described above, the size can be freely selected by connecting different head substrates 1 both vertically and horizontally. The resistance value is about 8Ω for 200 ° C., and the resistance temperature coefficient is about 1500 ppm / ° C. (the resistance value changes by 15% when the temperature changes by 100 ° C.). However, it can be changed according to the operating temperature. The heat generation characteristics of the heat generating resistor 2 are not limited to this, and can be freely set. However, it is preferable that the temperature coefficient of resistance of the heat generating resistor 2 is positively high, and a material of 1000 to 3500 ppm / ° C. is used in particular. It is preferable to detect and control the temperature of the heating resistor 2 described later.

  The fact that the temperature coefficient of resistance is positively large means that the resistance value increases greatly when the temperature rises. Therefore, it is easy to detect the actual heat generation temperature due to deviation from the reference resistance value by measuring the resistance value in the heated state. It is easy to correct the deviation from the desired heat generation temperature by adjusting the applied voltage or adjusting the duty of the applied pulse. Also, since the temperature coefficient of resistance is positive, if the temperature rises too much, the resistance value increases, the current value decreases, and the amount of heat generated by the resistance decreases, so the temperature becomes saturated sooner, This is because it is excellent in temperature stability and can prevent overheating due to thermal runaway. In addition, the width of the heating resistor 2 is not limited to the above-described example, and may be set according to the application and may be arranged in parallel.

  Further, electrodes 4 made of a good conductor such as a silver / palladium alloy or Ag—Pt alloy with a reduced palladium ratio are printed on both ends of the heating resistor 2. The electrode 4 is connected to a wiring board that also serves as the holder 9, and has a structure in which a power source is connected via an external connection terminal provided on the wiring board and the heating resistor 2 is energized.

  The temperature measuring resistor 3 may be formed of the same material as that of the heating resistor 2, but it is preferable that the absolute value (%) of the temperature coefficient is as large as possible. This temperature measuring resistor 3 does not generate heat, but detects the temperature of the head substrate 1 to estimate the temperature of the medium. For example, the temperature measuring resistor 3 has a width of about 0.5 mm and a length of about 45 mm and is about 56Ω. Thus, the applied voltage is kept low so that the temperature measuring resistor 3 itself does not generate heat, and, for example, about 5 V is applied. That is, since the temperature measuring resistor 3 is provided in a thin layer on the head substrate 1, both temperatures are almost the same. By measuring the temperature of the temperature measuring resistor 3, the surface of the head substrate 1 is measured. Can be estimated. Although the temperature detecting means will be described later, the temperature of the temperature measuring resistor 3 is detected by detecting the voltage change at both ends of the temperature measuring resistor 3, so that the larger the temperature coefficient, the smaller the measurement error. be able to. In this case, the temperature coefficient may be positive or negative.

  The temperature measuring resistor 3 is not limited to the same material as the heat generating resistor 2 and is formed by printing or the like depending on the application. However, when the accuracy of the measurement temperature is required, it is possible to change the mixing ratio of Ag and Pd or use a completely different material having a large temperature coefficient. In non-contact heating, the substrate temperature is not important, and the temperature of the medium 30 (see FIG. 2) that is moved by heating is measured to determine the temperature of the heat radiation surface and the distance between the medium 30 and the heating head 10. Become. In the example shown in FIG. 1B, one electrode of the temperature measuring resistor 3 is shared with the electrode 4 at one end of the heat generating resistor 2, and the electrode 4 is formed in three terminals by both. Has been. Of course, the electrode 4 for the heating resistor 2 can be formed separately.

  The heat generating resistor 2 and the temperature measuring resistor 3 are generally not directly provided on the head substrate 1, and as described above, as shown in FIG. The layer (grace layer) 6 is provided by about 2 to 3 layers by screen printing or the like, on which the resistor material is provided by screen printing or the like, and the heat radiation layer 5 is further provided on the surface. Wear resistance is not required because of non-contact heating.

  In FIG. 1C, the thickness of the heat radiation layer 5 is about 20 μm, and also serves as an overcoat for each resistor having a thickness of about 10 to 20 μm.

  A holder 9 is further provided on the back side of the base 8. The holder 9 is, for example, a printed wiring board, and can be used as a circuit board. That is, it can be used for connection between the electrode 4 for the heating resistor 2 and the electrode 4 of the temperature measuring resistor 3 and the external electrode terminal. A thermistor (not shown) may be provided on the back surface of the head substrate 1 for double overheat prevention. Furthermore, the temperature of the medium 30 to be heated, which will be described later, may be measured by a temperature sensor or the like.

  The heating apparatus of the present invention using this heating head 10 can be configured as shown schematically in FIG. That is, the heating head 10 is set so that the longitudinal direction of the heating head 10 is parallel to the horizontal plane, in other words, the width direction of the heating head 10 is perpendicular to the horizontal plane. The medium 30 is conveyed by the upstream feed roller 31 and the pair of downstream drive rollers 32 so that the medium 30 is conveyed in the vertical direction without contacting the surface side. In other words, the medium 30 is driven by the driving roller 32, and the feeding roller 31 is a roller having a pressure with “slip” for maintaining tension. In the example shown in FIG. 2, the pair of heating heads 10 are provided so as not to contact the medium 30 with the medium 30 interposed therebetween, and two heating heads 10 are provided in parallel in the vertical direction. . That is, the pair of heating heads 10 are arranged with the heat radiation layer 5 facing each other, and the medium 30 is conveyed so that the medium 30 passes directly between the heating heads 10 facing the heating head 10 therebetween. By arranging such a pair of heating heads 10 to face each other, both the front and back surfaces of the medium 30 are heated to the same temperature, so that the heating can be performed efficiently and uniformly. However, as will be described later with reference to FIG. 6, a simple heating plate may be arranged on one side, or heating on one side may be provided only on one side. In the example shown in FIG. 2, two heating heads 10 are also arranged in the vertical direction, but the number of the vertical arrangements is also free depending on the medium 30 to be heated, the conveyance speed of the medium 30, and the like. Can be set to

  Processing portions such as a thermal print head, an ink jet head, and a film coater are provided on the surface of the medium 30 along the roller 31 in FIG. 2 that does not come into contact with the roller 31, and can be dried without contact in the processed state. So convenient. For example, as shown in FIG. 4, when the medium 32 is sent out while printing with the heating element 41 of the thermal head 40, the ink is not completely dried, and the heating layer is heated as shown in FIG. It is automatically sent between the heads 10 to be dried, and further sandwiched between drive rollers to be completely baked. In FIG. 4, 42 is a drive unit, 43 is an ink ribbon, and 44 is a recovery roller for the ink ribbon 43. The feed roller 31 may be tensioned by a spring to prevent the medium 30 from sagging, or the direction may be bent at this portion. In that case, the covering container 34 is moved between 31 and the head 10. FIG. 4 shows an example in which the thermal print head 40 is attached. Instead of the thermal print head 40, other processing parts such as an ink jet head and a film coater described later can be attached.

  The number of heating heads 10 arranged in the vertical direction also varies depending on the number of heating resistors 2 of the heating head 10 in particular. That is, in the example shown in FIG. 1, one wide heating resistor 2 is provided, but if this number is small, the number of heating heads 1 increases, and if the number of heating resistors 2 is large. Alternatively, if the heating resistor 2 is wide, the number of heating heads 10 can be reduced. For example, the number of heating resistors 2 can be increased to 5 or more, and the number of heating heads 10 is appropriately selected depending on the type of medium and the conveyance speed.

  As described above, the upstream drive roller 31 is provided on the upper side in the vertical direction, the downstream drive roller 32 is disposed on the lower side, and the medium 30 is transported in the vertical direction. 30 is preferable because it hangs down under its own weight and is difficult to touch the heating head 10. Therefore, a belt conveyor for conveying the medium is not necessary, and the medium 30 can be efficiently heated from both sides. As a result, the medium can be transported without being brought into contact with the heating head while bringing the medium very close to the heat sink 5 of the heating head, and the heating efficiency can be further improved.

  Another feature of the heating apparatus shown in FIG. 2 is that the entire heating head 10 and the downstream drive roller 32 are covered with a coating container 34. Thus, since it covers with the covering container 34, the back surface side of the heating head 10 is also covered with the staying air 33 that hardly moves, and thus the temperature drop of the heating head 10 itself can be prevented. As a result, non-contact heating by radiant heat can be performed very efficiently only by heating the small heating resistor 2. Further, the heated air rises and uses residual heat.

  A drive circuit for the heating head 10 shown in FIG. 1 is shown in FIG. That is, this drive circuit is driven by a direct current or alternating current power supply 29. As the power supply 29, a battery, a commercial power supply, or a commercial power supply 29 is adjusted by a transformer or the like to adjust the voltage and application time to adjust the applied power. The driving power is supplied to the electrode 4 (see FIG. 1) connected to the heating resistor 2 via the heater 27. As a result, the AC power supply can be used as it is, and the voltage supplied from the commercial AC power supply 29 is adjusted by the power adjustment unit 27 and adjusted to a desired temperature. As a result, no DC power supply is required, and no power supply cooling fan is required. However, a direct current power source using a battery can also be used. The temperature is measured by measuring the temperature by using the temperature measuring resistor 3 by measuring the current supplied from the constant current source 25 and the voltage V across the temperature measuring resistor 3. The power adjustment unit 27 can adjust the voltage and the like. The adjusting unit 27 is effective for making the temperature of each heating head uniform, particularly when the plurality of heating heads 10 are heated side by side.

  The principle of this temperature measurement will be described with reference to FIG. A regulating resistor 24 and a constant current device CCR (current controlled regulator) 25 are connected in series with the temperature measuring resistor 3 at both ends of the DC power supply 21, and the voltage V across the temperature measuring resistor 3 is measured. For example, by dividing the voltage by the constant current by the temperature detecting means 23, the resistance value of the temperature measuring resistor 3 at that time can be known, and the temperature measuring resistor 3 that is known in advance can be obtained. The temperature can be calculated from the temperature coefficient (determined by the material). The temperature of the head substrate 1 can be maintained at a predetermined temperature by controlling the voltage applied to both ends of the heating resistor 2 from the control means 26 according to the detected temperature. In the temperature control of the heating resistor 2 by the control means 26, the applied voltage may be a pulse, the duty of the pulse may be changed, or the voltage itself may be changed.

  As described above, the temperature measurement resistor is preferably as large as possible in absolute value (%) of the temperature coefficient (which may be positive or negative). When used only for temperature measurement, for example, it is preferably about 0.3 to 0.5 mm wide and attached to an appropriate position of the head substrate 1 (in the vicinity of the heating resistor 2). It is preferable to apply a DC voltage of about 5V because the applied voltage is kept low so as not to generate heat. Thereby, the temperature of the surface of the head substrate 1 can be estimated. However, for example, with the structure shown in FIG. 2, the temperature of the medium 30 can be directly measured between two heating heads 10 arranged in the vertical direction with a thermometer using a thermal infrared sensor such as a thermopile.

  The above-described processing portion shown in FIG. 4 is an example of a thermal print head, but various processing portions can be arranged instead. For example, FIG. 5A shows an example in which the toner is fixed by heat transfer with pressure. That is, while the medium 30 and the transfer film 45 are simultaneously advanced, the small roller 47 is heated and transferred by the heating head 48 while being pressed by the platen roller 46 and the small roller 47. This heating head is not a non-contact type heating head as shown in FIG. 1, but a heating head capable of performing contact heating by ordinary pressure contact. In the case of such a transfer, depending on the medium 30, there is a case where the fixing or curing is sent in an insufficient state, so that the image is disturbed by being sent to the heating device shown in FIG. 2 as it is. It can be dried without contact.

  In the example shown in FIG. 5B, the hot stamp 50 is moved up and down by the flat platen 49 and the hot stamp 50, and the hot stamp 50 is conveyed while the medium 30 and the ink ribbon 51 are conveyed. Is moved up and down, and images such as numbers are transferred when the hot stamp 50 is lowered. The surface of the flat platen 49 is formed of soft rubber, sponge, felt or the like, and the medium 30 is step-conveyed depending on the heating time of the hot stamp, but continuous conveyance is also possible. Also in this case, since fixing and curing may not be completed completely by the medium 30, it is effective to heat with a non-contact heating device, which is sent to the heating device described above.

  The example shown in FIG. 5C is an example in which fixing is performed by the hot stamp 50 as in FIG. 5B. Similarly, the toner 52 is fixed by heating with the flat platen 49 and the hot stamp 50. A toner 51 is fixed by moving a hot stamp 50 up and down on a medium 30 that has been transferred with static electricity 51. Also in this case, since fixing may be insufficient due to the medium 30, the medium 30 is further sent to a non-contact heating device and dried to be completely fixed. Also in this case, the medium 30 is step-conveyed.

  Further, in the example shown in FIG. 5D, what is printed by the ink jet printer 54 is sent to the above-described non-contact heating device. In the example shown in FIG. 5D, printing by the ink jet printer 54 is performed. In order to preheat the medium, the platen 46 and a normal heating head 48 can be heated in pressure contact with each other. In FIG. 5D, reference numeral 53 denotes a heater that heats and accelerates drying. However, depending on the material of the medium 30, drying may not be sufficient. Therefore, it is sent to the non-contact heating layer shown in FIG.

  Various processed parts can be formed as described above. However, the processed part is not limited to the above-described transfer or ink-jet printing, and non-contact heating is required in various cases such as recording, coating, coating, and film bonding. When processing is performed, it is very important that the processing and non-contact heating are performed continuously by disposing them before and after the feeding roller 31 shown in FIG. Furthermore, after performing the processing by the first processing portion, drying by non-contact heating can be performed, and then the processing as described above can be performed as the second processing. By repeating such a loop, heat processing can be performed very efficiently. As the heating device, the processing device as described above is arranged next to the drive roller 32 described above.

  FIG. 6 is an explanatory view showing a modification of the heating device shown in FIG. That is, in this example, the medium 30 is not heated by the non-contact heating head 10 from both surfaces, but one surface is heated by the hot plate 55. In general, a hot plate is not thermally efficient, but hardly needs to be heated, may be a temperature lower by about 5 to 10 ° C. than the heating temperature of the medium 30, and may be a thin layer, so that power consumption is almost zero. Because there is no, thermal efficiency is improved. Moreover, it is also preferable to use the hot plate 55 from the viewpoint of heat insulation in the coating container 34.

DESCRIPTION OF SYMBOLS 1 Head substrate 2 Heating resistor 3 Temperature measuring resistor 4 Electrode 5 Thermal radiation layer 6 Thermal insulation layer 7 Thermal insulation layer 8 Base 9 Holder 10 Non-contact type heating head 30 Medium 31 Feeding roller 32 Drive roller 33 Space 34 Coating container

Claims (10)

A head substrate having a rectangular planar shape, a belt-like heating resistor formed on one surface of the head substrate along the longitudinal direction, a pair of electrode terminals connected to the heating resistor and for passing a current; A heating head having a heat radiation layer deposited on the surface of the heating resistor, made of a material having an emissivity of 0.8 or more, and having an exposed surface formed with irregularities. The heating head according to claim 1, wherein the heat radiation layer is formed of graphite, black alumite, or black glass. A temperature measuring resistor is provided on the head substrate on which the heat generating resistor is provided, the temperature of the medium is estimated based on the temperature measured by the temperature measuring resistor, and the power supplied to the heat generating resistor is The heating head according to claim 1, further comprising control means for adjusting. At least one heating head arranged so that the medium is conveyed in a direction perpendicular to the longitudinal direction of the head substrate of the heating head, and the medium directly facing the heat radiation layer side of the at least one heating head. The heating head according to any one of claims 1 to 3, further comprising: at least one set of driving rollers that convey the medium; and a covering container that covers the heating head and the driving roller. Is a heating device. A structure in which at least one heating head is further provided so that the heat radiation layer side faces the medium across the medium facing the heating head, and the medium is conveyed between the two heating heads. The heating device according to claim 4. The at least one set of driving rollers is provided below the heating head in the vertical direction, at least one feeding roller is provided vertically above the heating head, and the medium is pulled by the driving roller. The heating apparatus according to claim 4 or 5, wherein the medium is heated by passing in front of the heating head while the medium is conveyed in a vertical direction. The 1st process part which performs at least 1 process among recording, transcription | transfer, application | coating, coating, and film adhesion is provided in the said feed roller side of the said heating head. Heating device. The heating head according to any one of claims 1 to 3, wherein the heating head is disposed so that a longitudinal direction of the heating head is parallel to a horizontal plane, and the medium is conveyed downward from above in the vertical direction, the heating head A heating method for performing non-contact heating by bringing the head close to the heat radiation layer and covering the periphery of the heating head to retain heat released from the heating head and use it for residual heat of the medium . 9. The medium is dried by non-contact heating of the heating head by transporting the medium after performing at least one first processing of recording, transfer, coating, coating, and film adhesion on the medium. The heating method as described. The heating method according to claim 9, wherein after the non-contact heating, the medium is further subjected to at least one second processing among recording, transfer, coating, coating, and film adhesion.

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