JP5052572B2 - Heating head, heating apparatus and heating method using the same - Google Patents

Description

  The present invention relates to erasing and writing of a record on a heat-sensitive rewritable medium, transfer and retransfer to a medium, toner fixing, adhesion by heating, fusing, deformation processing, overcoat, document laminating, sheet adhesion, The present invention relates to a heating head having a belt-like heating resistor for heating a medium to perform imprint processing (uneven heat processing such as plastic), and a heating apparatus and a heating method using the heating head. More specifically, the heating head can be heated while protecting its surface without directly pressing the heating resistor, and even when the heating width varies depending on the type of medium, a heating head capable of heating uniformly and a heating using the same The present invention relates to an apparatus and a heating method.

  In recent years, for example, reversible coloring and decoloring by heating on a film, sheet, card or other support made of synthetic resin such as paper, non-woven fabric, woven fabric, vinyl chloride, polyethylene terephthalate, metal, glass, etc. A reversible thermosensitive recording medium (rewritable card / rewritable sheet) provided with a recording section composed of a reversible thermosensitive recording layer has been widely used.

  As a heating head for heating such a medium or the like, one having a structure as shown in FIG. 7 is known (see, for example, Patent Document 1). In FIG. 7, a glass layer (glaze layer) (not shown) is provided on one surface of a head substrate 51 made of alumina or the like, a strip-shaped heating resistor 52 is formed thereon, and electrodes 53 are provided at both ends thereof. Is formed. The electrode 53 is led out to the back surface of the head substrate 51 by wiring or the like and is connected to a wiring substrate (not shown) provided on the back surface side of the head substrate 51 so as to apply a voltage. As a result, a voltage is applied to both ends of the heating resistor 52 via the pair of electrodes 53, the current flows, the heating resistor 52 generates heat, and the temperature of the heating resistor 52 is controlled by the amount of current. it can. The head substrate 51 is held by being bonded to a base 54 made of, for example, aluminum by an adhesive 55. In the example shown in FIG. 7, a recess 56 is formed in a part of the base on the lower side of the heating resistor 52, so that heat escape from the head substrate 51 to the base 54 is suppressed. Erasing as described above can be performed by passing a recording medium such as a card while pressing the heating resistor 52 with a roll (not shown).

  In such a heating head, for example, as shown in FIG. 8, an object to be heated such as a recording medium 61 is carried on the upper surface of the heating resistor 52 and is heated by being pressed by a rubber roll 62 or the like, thereby writing a record. Or erase.

  On the other hand, when performing fixing or the like, it is necessary to heat from the upper and lower surfaces, for example, a hot roll fixing device using a heat roll provided with a heater lamp made of a halogen lamp or the like as a fixing roll at the center of the roll The fixing roll and a heating roll having a heater lamp inside are connected by a belt, and the belt heated by the heating roll is rotated to the fixing roll side so that the fixing belt coming on the surface of the fixing roll and the heater having a heater inside are connected. A heat belt fixing device that heats a medium while being pressed with a pressure roll is known (see, for example, Non-Patent Document 1).

JP 2004-268256 A

Electrophotography (Edited by The Imaging Society of Japan, Tokyo Denki University Press 2008, 83-88)

  As described above, the heating resistor is heated while being energized, the recording medium is passed over it, and the recording medium is pressed against the heating resistor with a rubber roll or the like, thereby erasing the recording applied to the recording medium. And so on. In this case, a protective layer made of glass or the like is provided on the surface of the heating resistor 52 for the purpose of preventing wear or preventing a short circuit due to adhesion of foreign matter. Therefore, there is a problem that the glass or the like is easily broken and is worn out and the resistance value of the heating resistor 52 is easily changed. A pair of electrodes 53 are provided at both ends of the heating resistor 52. In order to allow the medium to pass through the surface of the heating resistor 52, wiring connected to a wiring board or the like is provided on the surface of the electrode 53. Etc. cannot be directly connected, and a wiring film that reaches the back surface of the head substrate 51 via the side surface of the head substrate 51 must be formed and connected to the wiring substrate on the back surface side of the head substrate 51. Therefore, there is a problem that the manufacturing process becomes complicated. Further, even if the heating resistor 52 is directly heated, if the medium is continuously carried in, the heat resistance of the heating resistor 52 itself is small, so that the temperature decreases, and conversely, the medium is carried in for a long time. If not, the temperature tends to rise and there is a problem that uniform heating is difficult.

  In order to solve such a problem, the applicant of the present application does not contact the medium with the surface of the head substrate on which the heating resistor is provided, and the surface opposite to the surface on which the heating resistor is provided, or the heating resistor is provided. A heating head having a side surface adjacent to the provided surface as a pressure-contact surface with the medium is invented and disclosed in Japanese Patent Application No. 2009-57087. However, with such a structure, alumina usually used as a head substrate has high hardness and large surface protrusions are removed in advance, but there is no surface smoothness. For example, lapping or polishing is applied to the surface. Without finishing, the frictional force of diamond-like carbon or the like is small, and even if a film made of a hard material is formed, the surface cannot be completely smoothed. For this reason, the surface of a medium such as a card or a card obtained by waxing the surface of plastic or cardboard is easily damaged. On the other hand, when such a surface treatment is carried out, there are problems that the number of manufacturing steps increases and the cost increases.

  Furthermore, if a heat source that increases the overall temperature of the heating roll by inserting a heater lamp as in the above-described heat roll fixing device or heat belt fixing device is used, the power consumption by the heater lamp is large and the heat source is wasted. In addition to the increase, there are problems that it takes time for the surface temperature of the heating roll to reach a predetermined temperature and that it is very difficult to keep the temperature of the surface of the heating roll constant.

  The present invention has been made to solve such a problem, and has a structure in which the heating resistor is not directly pressed to improve its durability, and the medium in contact with the heating head is not damaged. An object is to provide a specific structure of a heating head, and a heating apparatus and a heating method using the heating head.

  Another object of the present invention is to use wasteful power consumption by heating the surface of the heating roll using a heating head having a structure that does not damage the medium according to the present invention even when the medium is heated using the heating roll. Is to provide a heating device and a heating method excellent in energy saving characteristics.

  A heating head according to the present invention includes a pair of plate-like head substrates, at least one belt-like heating resistor provided on one surface of the head substrate, and a pair of electrodes provided so that a voltage can be applied to both ends of the heating resistor. A surface having an electrode, a wiring substrate electrically connected to the pair of electrodes, and a base to which the head substrate is attached, and a surface on which the heating resistor of the head substrate is not provided is pressed against the medium The head substrate is fixed to the base so as to be exposed to the outer surface, and a spacer is provided to be interposed between the surface pressed against the head substrate and the medium when the medium is heated. The spacer is not fixed to the pressure contact surface of the head substrate, and is fixed to the wiring substrate or the base only at one end of the spacer.

  In this specification, the medium is a film, sheet, card, or plate made of paper (including cardboard), nonwoven fabric, woven fabric, synthetic resin such as vinyl chloride or polyethylene terephthalate, metal, glass, or the like. A reversible thermosensitive recording medium (rewritable card / rewritable) provided with a recording portion comprising a reversible thermosensitive recording layer that can reversibly repeat coloring and decoloring by heating on a support made of such a material. Sheet), recording paper used for transfer, retransfer, toner fixing, etc., base film, and the above materials that perform adhesion, fusion, deformation processing, overcoat, undercoat, laminating, imprinting, etc. by heating . The surface in pressure contact with the medium means a surface that appears on the outer surface side of the heating head and faces the space so that the medium such as a recording medium can be passed while increasing the temperature of the medium.

  If the spacer is formed of any one of a copper plate, a stainless steel plate, and a phosphor bronze plate, since the heat conduction is good, the temperature of the heating head is quickly transferred to the medium, and the contact surface with the medium is usually applied to the head substrate. Since the surface can be made much smoother than the alumina used, the frictional force with the medium is reduced, and the desired range of the medium can be continuously heated while smoothly feeding without damaging the medium. . Therefore, even if the medium is transported at a high speed, the risk of damaging the medium is very small. In addition, since the medium is not so hard, the spacer is hardly worn out, but even if the spacer is damaged by wear, the spacer is not attached to the pressure contact surface of the head substrate. Only the spacer can be easily replaced. However, it is also possible to form a structure such as Cr plating, DLC (Diamond Like Carbon), CrN or the like on the contact surface of the spacer with the medium to obtain smoothness while making the surface firm.

  In the heating device of the present invention, a belt-like heating resistor is formed on one surface of a plate-shaped head substrate, a surface other than the one surface of the head substrate is used as a pressure contact surface with the medium, and the pressure contact surface is opposed to the medium. The heating device comprises a heating head for heating the medium and a roll provided to face the pressure contact surface of the heating head, and heats the medium while conveying the medium between the roll and the heating head. Thus, one end of the spacer is fixed to a portion other than the head substrate of the heating head or a casing around the heating head so that a spacer is interposed between the heating head and the medium.

Other forms of heating device of the present invention, and one heating roller, is opposed to the heating body or pressure roll including other heating roll, between the heating body or pressure roll and heating roll A heating device that heats the medium while conveying the medium while being pressed, wherein the heating roll is heated upstream of a portion of the roll that is pressed against the medium, and the surface of the roll is heated by a heating head. The heating head is formed in a structure in which a belt-like heating resistor is formed on one surface of a plate-shaped head substrate, and a surface other than the one surface of the head substrate is used as a pressure contact surface. only one end of the spacer so spacer made of a metal plate is interposed is not fixed to the housing of the peripheral portion or the heating head other than the head substrate of the heating head between the said contact face and the roll .

  Here, the heating roll means a roll capable of increasing the temperature of at least the surface of the roll and increasing the temperature of the medium in contact with the roll by the heat. Further, the upstream side of the roll means a side of a portion where the roll comes into contact with the medium next by the rotation of the roll when the roll rotates to convey the medium.

Another embodiment of the heating device of the present invention is a heating device that fixes two toners transferred to the medium while the two rolls are opposed to each other and the medium is pressed and conveyed between the two rolls. Each of the two rolls is formed so that the surface of the roll is heated by a heating head upstream from the portion to be in pressure contact with the medium, and the heating head is strip-shaped on one surface of a plate-like head substrate. The heating resistor is formed, and a surface other than the one surface of the head substrate is formed as a pressure contact surface, and a spacer made of a metal plate is interposed between the pressure contact surface of the heating head and the roll. Thus, only one end of the spacer is fixed to a portion other than the head substrate of the heating head or a casing around the heating head.

According to the heating method of the present invention, at least one belt-like heating resistor is provided on at least one surface of a plate-like head substrate, and the heating head is formed by attaching the head substrate to a base, and appears on the outer surface side of the heating head. And, one end of the heating head other than the head substrate or a casing around the heating head is fixed to one surface of the head substrate, which is a surface where the heating resistor is not provided . The medium is heated by press-contacting the medium with a spacer made of a metal plate interposed therebetween.

Another method of the heating method according to the present invention is a heating method in which at least one of the two rolls having a heating roll is opposed to each other, and the medium is heated while being conveyed while being pressed between the two rolls. , the heating by the heating roll, upstream from the portion to be the medium pressure contact of the roll, by interposing a spacer made of a metal plate have the row by heating by the heating head surface of the roll, said heating head Is provided by providing at least one belt-like heating resistor on at least one surface of the plate-like head substrate, and attaching the head substrate to a base, and appears on the outer surface side of the heating head, and the heating resistor is provided. One surface of the head substrate, which is an unfinished surface, is pressed against the roll via the spacer, and only one end of the spacer is heated to the heating surface. Wherein the row Ukoto by fixing the housing of the peripheral portion or the heating head other than the head substrate mode.

  According to the heating head according to the present invention, the surface of the heating resistor is directly pressed by the roll, and the medium does not pass through the surface, so that the protective film such as glass provided on the surface of the heating resistor is broken. There is no risk that the heating resistor itself is damaged, and an extremely stable heating characteristic can be maintained over a long period of time. On the other hand, the alumina substrate usually used for the head substrate has a Vickers hardness Hv of about 1000, which is very hard and is very hard and has some surface polished to remove large protrusions. According to the present invention, since the spacer is provided so that the spacer is interposed between the head substrate and the medium, the spacer is a metal having excellent thermal conductivity and excellent smoothness. By using a plate or the like, the medium can be smoothly conveyed while the heat of the heating head is reliably transmitted to the medium, and the medium is not damaged. As the spacer, a metal plate such as a copper plate, a stainless steel plate, or a phosphor bronze plate can be used. For example, the surface roughness can be smoothed to about 0.01 to 0.5 μm, and the medium can be conveyed at high speed. Even so, the medium is hardly damaged.

  Furthermore, according to the heating head of the present invention, since the medium is not directly pressed against the surface of the heating resistor and heated, the life of the heating head can be further extended and the entire head substrate can be obtained. As a result, the heat capacity of the portion to be heated is increased and the temperature is stabilized. In addition, although there may be a gap between the spacer and the heating head, a spacer having a very good thermal conductivity and a thin one can be used. As a result, regardless of whether the medium is heated continuously or intermittently, it can be heated at a relatively stable temperature, that is, with little temperature unevenness. Furthermore, even if wiring is directly provided on the surface of the pair of electrodes provided at both ends of the heating resistor, there is no hindrance to the passage of the medium, and it is not necessary to form a wiring film around the heating head. Manufacturing becomes very easy. Furthermore, according to the heating head of the present invention, since there is no problem even if the surface of the heating resistor is uneven, when the temperature of the heating resistor is uneven, the coating film is partially formed on the surface of the heating resistor. The heating temperature of the entire heating resistor can be made uniform.

  Furthermore, according to the heating apparatus and heating method of the present invention in which the spacer is fixed so that the spacer is interposed between the heating head and the medium, the medium is not damaged even when the medium is conveyed at high speed. Can be heated at an accurate temperature. In this case, even when the heating head is not provided with a spacer, the same effect as that obtained by using the heating head described above can be obtained. Furthermore, according to the heating device and the heating method of the structure of heating using the heating roll obtained by heating the roll through the spacer with the heating head according to the present invention, by the heating head that is easy to strictly control the temperature, While heating the surface of the heating roll, the heated part is in contact with the medium immediately, so there is no need to heat the entire heating roll, and it is extremely heat efficient and exhibits an energy saving effect. Also, there is an effect that the temperature of the heating roll can be precisely controlled. Moreover, since the heating roll is not in direct contact with the alumina substrate of the heating head or the surface of the heating resistor, it is in contact through the spacer, so the durability of the heating head and roll is very high. A heating device that is high and reliable over a long period of time can be obtained.

It is plane explanatory drawing which removed the spacer which shows one Embodiment of the heating head of this invention, and AA cross-section explanatory drawing of the said plane explanatory drawing in the state in which the spacer was provided. It is a conceptual explanatory drawing of the heating apparatus which heats a medium using the heating head of FIG. It is explanatory drawing which shows the modification of the heating head shown by FIG. It is plane explanatory drawing which shows other embodiment of the heating head of this invention, its BB cross-section explanatory drawing, and explanatory drawing which shows the use condition. It is a schematic explanatory drawing which shows other embodiment of the heating apparatus of this invention. It is explanatory drawing of the circuit which measures the temperature of a head board | substrate using a heating resistor. It is explanatory drawing which shows the structural example of the conventional heating head. It is explanatory drawing in the case of heating a medium using the conventional heating head.

  Next, a heating head of the present invention, a heating apparatus using the same, and a heating method will be described with reference to the drawings. The heating head according to the present invention is formed as shown in FIG. 1A to FIG. 1B with a plane explanatory view in which the spacer of one embodiment is removed and an explanatory view including the spacer in the AA cross section. Yes.

  That is, at least one belt-like heating resistor 2 is provided on one surface of the plate-like head substrate 1, so that a voltage can be applied to a pair of electrode terminals 3 provided at both ends of the heating resistor 2. A wiring board 5 is provided so as to be connected, and the head board 1 is attached to the base 4. Then, the head substrate 1 is arranged so that the surface on which the heating resistor 2 is provided faces the base 4 side and the medium can be pressure-contacted on the other surface 1a side of the head substrate 1 (the other surface 1a becomes the pressure-contact surface). Is fixed to the base 4 via the heat insulating plate 6 and the wiring board 5. Further, when the medium is heated, the spacer 8 is provided so that the spacer 8 is interposed between the other surface 1a of the head substrate 1 and the medium, and the spacer 8 is not fixed to the other surface 1a of the head substrate 1. Thus, the heating head 10 is formed by being fixed to either the wiring substrate 5 or the base 4 only at one end thereof. As a result, as shown in a schematic diagram of the heating apparatus in FIG. 2, the medium 31 is pressed against the surface 1a to be pressed against the head substrate 1 via the spacer 8 and heated.

  The head substrate 1 varies depending on the size of the medium to be heated. For example, the head substrate 1 is a substantially rectangular plate having a length of about 40 to 350 mm, a width of about 5 to 25 mm, and a thickness of about 0.635 to 1.0 mm. Has a heat conductivity as good as possible, that is, has a heat conductivity of about 1 (for example, soda glass) to 200 W / (m · K), has heat resistance under heat generation temperature conditions during use, and has a heat generating resistor 2 For example, a ceramic surface such as alumina, aluminum nitride, or the like can be used. An insulating film may be formed on the surface of a metal plate such as stainless steel to a thickness of about 5 to 20 μm, for example, by printing and baking a thick film paste for insulation.

  In the present invention, the other surface 1a of the head substrate 1 (the surface opposite to the surface on which the heating resistor 2 is provided) is used as a pressure contact surface, and the spacer 8 is interposed on the surface that is in pressure contact with the medium. Even if an alumina substrate having a rough surface is used, the medium 31 (see FIG. 2) to be heated is conveyed while being in contact with the spacer 8 without being directly pressed against the alumina. This medium 31 is generally made of PET (polyethylene terephthalate) or paper coated with wax, and is conveyed while being pressed against hard and rough alumina (Vickers hardness Hv: about 1000). However, in the present invention, this problem is solved by the spacer 8.

  The spacer 8 is preferably excellent in thermal conductivity because it is necessary to quickly transmit the temperature on the other surface 1 a side of the heating head 1 to the surface of the spacer 8 to heat the medium 31. Further, since the medium 31 needs to be conveyed while being pressed, it is also preferable that the friction coefficient is small and the smoothness is excellent so that the medium 31 can move smoothly. A material satisfying such a material having excellent thermal conductivity and excellent smoothness (for example, a surface roughness of 0.01 to 0.5 μm) is preferable, for example, about 0.3 to 0.3 mm thick. Metals such as copper plate, stainless steel plate, phosphor bronze (Cu-Sn-P alloy: Sn is 3 to 9 wt%, P is 0.03 to 0.3 wt%, impurities are less than 0.5 wt%, and the remainder is Cu) A plate can be used. That is, the material of the spacer can be selected depending on the material of the medium. If the medium is soft, a soft and high thermal conductivity material such as a copper plate can be used, and if the medium is a hard material. A hard material such as a stainless steel plate can be used, and a material such as phosphor bronze can be used as an intermediate medium. These metal plates can obtain a plate-like body excellent in smoothness (flatness), and can easily obtain the above-mentioned surface roughness. On the other hand, since many of these metal plates are not hard, the surface may be damaged if they are used frequently. However, as will be described later, the spacer 8 is attached to the back surface of the head substrate 1. However, since it is fixed to the wiring board 5 or the like only at one end, it can be easily replaced if it is fixed with screws, for example.

  In other words, the spacer 8 is shown in FIG. 1 as being in close contact with the back surface (other surface) of the heating head 1, but as one embodiment, only one end 8 a is attached to the wiring substrate 5 or the like with screws or adhesive. Even if there is a gap between the head substrate 1 and the other surface 1a of the head substrate 1, there is no problem because it is brought into close contact with the medium 31 when pressed. The reason why the other surface 1a and the spacer 8 are not joined is that the head substrate 1 itself rises to about 250 ° C., so that there is no adhesive that adheres while having heat conduction, and the material of the spacer 8 and the head substrate 1 Is firmly fixed with an adhesive or the like, since the linear expansion coefficients of the two materials are different, warping occurs, and the adhesive is cracked due to repeated operation and non-operation, and the head substrate 1 to the spacer 8 This is because heat conduction is reduced. Therefore, even if the temperature rises and the linear expansion coefficients of the head substrate 1 and the spacer 8 are different, both sides are free and the other surface of the heating head 1 is in contact with each other so that they are surely in contact with each other on a flat surface. It is fixed only at one end so that the spacer 8 always exists on the 1a side. When this heating head is used in a heating device, as shown in FIG. 2, the fixing of the one end 8a of the spacer 8 is upstream of the feeding of the medium 31, that is, the contact of the heating head 1 with the medium 31. It is necessary to attach so that it may become the insertion side of the medium 31 rather than a part. With such attachment, the spacer 8 is always in contact with the head substrate 1 even when the medium 31 is fed.

The heating resistor 2 is provided in a strip shape extending in the longitudinal direction so as to cover a part of the pair of electrodes 3. In the example shown in FIG. 1, four heating resistors 2 having the same length (same characteristics) are formed in parallel. However, the size of the heating head varies depending on the medium to be heated. The heating resistor 2 can be formed. In addition to the above, a heating resistor for measuring the substrate temperature can be provided, or one of the heating resistors 2 for heating described above can be used for measuring the substrate temperature, and heat can be generated at an arbitrary number. The length of the portion to be heated can be varied to vary the heating length (medium width). The heating resistor 2 is formed, for example, by applying and baking a paste such as Ag + Pd + glass or silver and glass. It is also possible to use a further added and RuO ₂ thereto. When composed of an Ag—Pd alloy formed by firing, a sheet resistance of 100 mΩ / Sq to 500 mΩ / Sq is obtained (depending on the blending, amount of solid insulating powder, printing thickness, firing conditions, etc.), the ratio of the two Thus, the resistance value and the temperature coefficient can be changed. For example, the sheet resistance is about 200 mΩ, the width is 5 mm, the length is 100 mm, the thickness is about 10 μm (total resistance is about 3.6Ω), and the resistance temperature coefficient is about 1500 ppm / ° C. (when the temperature changes by 100 ° C. The resistance value changes by 15%). The heating resistor 2 is printed and formed so as to overlap a pair of electrodes 3 provided at both ends of the head substrate 1 in the longitudinal direction.

  The sheet resistance of the heating resistor 2 is set according to the size of the medium to be heated, the processing speed of the medium (speed of erasing recording, that is, the speed of passing over the heating head), and the like. For example, when the head substrate 1 has a width × length × thickness of 7 mm × 104 mm × 0.8 mm in the above example and is made of alumina, the amount of heat required to raise the head substrate 1 by 1 ° C. is 1 In order to increase 150 ° C. at .76 J, 150 × 1.76 = 264 J is required. For example, if the resistance between both ends of the heating resistor 2 is 3.6Ω, a heat amount of 160 W is generated by applying a voltage of 24 V, so 264 J / 160 W = 1.65 seconds. The required amount of heat can be supplied. That is, it is necessary to wait about 1.65 seconds for the substrate temperature to rise to a predetermined temperature of about 170 ° C. at the time of start-up. Since it is an order of magnitude larger than only the thin heating resistor 2, the medium can be heated continuously with almost no temperature unevenness.

  For example, one or more heating resistors 2 are formed in parallel on substantially the entire surface of the head substrate 1 excluding a width of about 2 mm from the end of the head substrate 1. In the example shown in FIG. 1, four pieces having a width of about 3 mm are formed in parallel. In addition, a resistor for measuring the temperature of the head substrate can be provided in parallel with the heating resistor 2, and the temperature can be measured using the heating resistor 2. As shown in FIG. 1, the heating resistor 2 is formed over almost the entire length in the longitudinal direction of the head substrate 1, but one of the pair of electrodes 3 is formed in common with the plurality of heating resistors 2. It is also possible to form an electrode in the middle part. In particular, in the case of a heating resistor for temperature measurement, it is not necessary to provide it over the entire length of the head substrate 1, it can be provided only in the center portion, etc., or it is formed long in the longitudinal direction of the head substrate 1, A plurality of electrodes can be formed in the middle, and the partial temperature of the head substrate 1 can be measured. Such an intermediate electrode can be connected by bonding, crimping, high-temperature soldering or the like to an electric wire or a flexible cable.

  The heat generation characteristic of the heat generating resistor 2 is not limited to the above-described example and can be freely designed. However, as the temperature measuring resistor or the heat generating resistor 2 for measuring temperature, a resistor having a large resistance temperature coefficient is used. It is preferable to use a material, and it is particularly preferable to use a material of 1000 to 3500 ppm / ° C. to detect and control the temperature using a heating resistor 2 described later, or to prevent overheating due to thermal runaway. preferable. However, in the present invention, the medium is heated via the spacer 8 from the other surface 1a or side surface 1b (see FIG. 4) side of the head substrate 1 instead of the structure in which the heating resistor 2 is directly heated. This problem is unlikely to occur, and even a resistance material having a negative temperature coefficient can be used. If the material has a large temperature coefficient, it is easy to accurately measure the temperature of the head substrate 1 and control the temperature.

  In order to measure the temperature of the head substrate 1 using the heating resistor 2 or the temperature measurement resistor (since it is not intended for heating, a thin resistor film whose resistance value varies greatly depending on the temperature may be formed) For example, as shown in FIG. 6, if the heating resistor 22 and the reference resistor 23 are connected in series to both ends of the DC power source 21 and the voltage V across the reference resistor 23 is measured, the temperature detecting means 24 The temperature can be detected from the amount of change in the voltage and the temperature coefficient (determined by the material) of the heating resistor 22 that is known in advance. By controlling the voltage applied to both ends of the heating resistor 22 by the control means 25 according to the detected temperature, the temperature of the head substrate 1 can be maintained at a predetermined temperature. The temperature control of the heating resistor 22 by the control means 25 can be adjusted by applying a DC voltage and changing the applied voltage, or by driving the duty and changing the duty. The reference resistor 23 preferably has a small temperature coefficient. Further, the temperature measuring resistor or the heating resistor 22 used for temperature measurement is preferably as large as possible in absolute value (%) of the temperature coefficient (which may be positive or negative). Further, when used only for temperature measurement, for example, it is about 0.3 to 0.5 mm wide, and is attached to an appropriate position of the head substrate 1 (a portion in the vicinity of the portion where the medium is pressed and which does not interfere with the pressure contact). Preferably, the applied voltage of the resistor 22 for measuring the substrate temperature itself is kept low so as not to generate heat. Thereby, the temperature of the part which press-contacts the medium of the head substrate 1 can be estimated.

  The pair of electrodes 3 are, for example, a silver / palladium alloy or Ag that has a palladium ratio smaller than that of the material of the heating resistor 2 so as to be connected to the heating resistor 2 at both ends facing the longitudinal direction of the head substrate 1. It is formed by printing in the same manner as the heating resistor 2 with a good conductor such as a -Pt alloy. The pair of electrodes 3 is connected to the wiring of the wiring board 5 to be described later. However, in the present invention, the side on which the pair of electrodes 3 is provided faces the base 4 side, as will be described later. It is not necessary to provide connection wiring from the electrode 3 to the back side of the head substrate 1. Since the pair of electrodes 3 are not necessarily directly contacted with the surface on which the heating resistor 2 is provided, the unevenness of the surface is not a problem. It can also be formed, or as described above, it can be configured to be connected by direct bonding, pressure bonding, high-temperature soldering, or the like. Although not provided in the example shown in FIG. 1, when a substrate temperature measurement heating element is provided, the pair of electrodes can be formed in exactly the same manner.

  The base 4 is, for example, a metal plate such as an aluminum plate (thermal conductivity: 221 W / (m · K)), an iron plate (thermal conductivity: 83 W / (m · K)), or a ceramic such as aluminum nitride or aluminum oxide. And can be used to hold the head substrate 1. The base 4 is formed in a size corresponding to the head substrate 1 described above, and has a thickness of about 7 mm, for example.

  As described above, the wiring substrate 5 is connected to the pair of electrodes 3 so as to apply a voltage to the pair of electrodes 3 on the head substrate 1 and connected to a power source, and the temperature of the head substrate 1 described above. For example, it is formed of a printed circuit board or the like, but can also be formed of a flexible film as in an example described later. The wiring board 5 is also connected to a thermistor (not shown) separately provided on the head board 1 and may be managed as a double safety for preventing overheating of the head board 1. Furthermore, a temperature fuse or the like may be provided to cut off the voltage application to the pair of electrodes 3 when the temperature of the head substrate 1 rises too much.

  An adhesive 7 is attached to the wiring substrate 5 through the heat insulating plate 6 with the above-described head substrate 1 facing down on the one surface side of the base 4 (the one surface (front surface) on which the heating resistor 2 is provided is the base 4 side). It is attached by. The heat insulating plate 6, the wiring board 5, and the base 4 are also fixed by a heat-resistant adhesive (not shown) 7 (for example, silicone resin or epoxy resin), but these are fixed by screws or the like as will be described later. You can also. As this heat insulating plate 6, for example, the same material as the head substrate 1 and the same thickness can be used. However, for example, by forming a dam (bank) around and injecting the above heat-resistant adhesive with a dispenser or the like and curing it, the head substrate 1 can be easily fixed to the base 4 together with the formation of the heat insulating plate 6. it can. That is, the thermal conductivity of this silicone resin is about 0.15 W / (m · K), the thermal conductivity of alumina is 20 W / (m · K), and the thermal resistance of this heat-resistant adhesive is Since it is about 130 times, there is almost no heat escape. As a result, the temperature of the other surface 1a of the head substrate 1 (the upper surface in FIG. 1 and the contact surface with the spacer 8) also rises due to heat generated by energization of the heating resistor 2, and the spacer 8 is interposed on this surface. By pressing the medium with a rubber roll or the like, heating for writing or erasing the recording can be sufficiently performed.

  The example shown in FIG. 1 has a structure in which the heat insulating plate 6 is directly attached to the surface of the heating resistor 2 formed on the head substrate 1, but as described above, a heat resistant adhesive is used as the heat insulating plate 6. Even if it is used, the thermal conductivity is 0.15 W / (m · K), which is about 130 times that of the alumina substrate. However, in order to prevent the escape of heat, the surface of the heating resistor 2 is hollow. It is preferable to be in a state. An example is shown in FIG. That is, in FIG. 3 (a), the same parts as those in FIG. 1 (b) are denoted by the same reference numerals and description thereof is omitted, but in this example, the surface of the heating resistor 2 of the head substrate 1 and the heat insulating plate 6 It is obtained by joining the head substrate 1 and the heat insulating plate 6 via a columnar heat insulating spacer 6c so that a space is formed between them. In this case, the heat insulating spacer 6c can also be made of, for example, a silicone resin, an epoxy resin, or the like. By adopting this structure, the surface of the heating resistor 2 is not in direct contact with any part, faces the space, and transfers most of the heat to the head substrate 1 side.

  In each of the above examples, the head substrate 1, the heat insulating plate 6, the wiring substrate 5, and the base 4 are joined with a heat-resistant adhesive, but the head substrate 1, the wiring substrate 5, and the base 4 are made of ceramics. , Glass epoxy resin, aluminum plate, etc., which have different linear expansion coefficients, and there is a risk that the adhesive will crack or peel off due to the on / off cycle due to operation / non-operation of the heating head 10 is there. An example for solving such a problem is shown in FIG. 3B in the same diagram as FIG. In FIG. 3B, three heating resistors 2 are formed for convenience. That is, in FIG. 3B, the same parts as those in FIG. 1 are denoted by the same reference numerals and description thereof is omitted. In this example, the head substrate 1, the heat insulating plate 6, the wiring substrate 5, and the base 4 are provided. It is fixed with screws 90. The screws 90 are fixed at about 2 to 5 in accordance with the length of the head substrate 1 in the longitudinal direction. By adopting such a structure, since each plate-like body is not a structure in which the entire surface is adhered with an adhesive, even if there is a difference in linear expansion coefficient between the respective materials, peeling or cracking occurs. And the reliability is greatly improved.

  In order to erase a record on a recording medium such as a rewritable card using the heating head 10 as an erasing head, a configuration as shown in a schematic diagram of an embodiment of a heating device according to the present invention is shown in FIG. Can do. That is, the rubber roll 32 is opposed to the other surface (pressure contact surface) 1 a of the heating head 10 via the spacer 8, and the heating resistor 2 is energized to supply the other surface 1 a side of the head substrate 1, that is, the spacer 8. Is increased to a predetermined temperature, and the medium 31 is sent between the spacer 8 and the rubber roll 32, so that the medium 31 is pressed by the rubber roll 32 and the heating head 10, and the temperature of the medium 31 increases. The recorded display can be erased. As described above, the temperature of the head substrate 1 is measured in advance by measuring the temperature on one surface side of the head substrate 1 with the heating resistor 2 or by providing a temperature measuring resistor, that is, on the other surface 1a side, that is, on the spacer. By associating with the temperature of 8, the temperature of the part in contact with the medium can be measured, or a temperature sensor such as a thermistor or a temperature measuring resistor as described above is provided in the vicinity of the part to be pressed. It can also be measured with the body attached.

  That is, the heating device according to the present invention has the same configuration as the conventional heating device shown in FIG. 8, but in the present invention, the medium 31 is not directly pressed onto the heating resistor 2 of the heating head 10. The back surface of the head substrate 1 opposite to the surface on which the heating resistor 2 is provided is the medium side, and contact with the medium 31 is performed by interposing a smooth spacer 8 without directly contacting the head substrate 1. It is characterized by being in contact with each other. The heating device shown in FIG. 2 uses the heating head 10 shown in FIG. 1 as it is. However, in the case of using such a heating device, the spacer can be used even if the spacer 8 is not attached to the heating head 10 itself. 8, as described above, contacts the other surface 1 a of the head substrate 1 of the heating head 10 to smoothly convey the medium 31, so that the surface of the head substrate 1 on which the heating resistor 2 is not provided is provided. As long as the heating head 10 can be exposed to the surface to heat the medium 31, the heating head 10 without a spacer may be used. The spacer 8 may be provided so as to be in contact with the pressure contact surface of the heating head 10 (the surface exposed for heating with the head substrate 1). This spacer can be attached to, for example, a housing (not shown) that fixes the heating head 10. In this case, since the spacer 8 is pulled along with the conveyance of the medium 31, the attachment side is shown at the position where the one end 8 a of the spacer 8 is fixed to the heating head 10 in FIG. 2. And the rubber roll 32 is fixed on the upstream side of the medium 31, that is, on the side where the medium 31 is not yet heated (when the medium 31 is fed from the right side as shown in FIG. It is necessary to fix it at one end thereof.

  According to the heating head and heating apparatus (heating method) of the present invention, as shown in FIG. 2, the spacer 8 is formed on the other surface 1a of the head substrate 1, that is, on the back surface opposite to the one surface on which the heating resistor 2 is provided. Therefore, the medium 31 can be moved while being in contact with the smooth surface of the spacer 8. Therefore, the medium 31 does not move while being pressed against the hard and rough surface of the head substrate 1, but can move while in contact with a smooth spacer, and is uniformly heated without being damaged. In addition, by forming a coating of Cr plating, DLC (Diamond Like Carbon), CrN or the like on the contact surface of the spacer 8 with the medium 31, the spacer 8 can be maintained while maintaining the smoothness of the contact surface. It is easy to prevent damage due to wear. Further, in FIG. 2, the rubber roll 32 is shown in the same configuration as a heating roll for heating described later, and a surface layer 32 a made of heat-resistant rubber such as silicone rubber or fluorine rubber is provided on the outer surface. An inner layer 32b made of a heat insulating rubber such as foamable silicone rubber or fluorine rubber is provided on the center side, and is fixed to the rotating shaft 32c. However, it is not limited to this example.

  Further, the medium is not directly heated by the heat generating resistor 2, and the medium 31 is connected to the medium 31 via the spacer 8 on the other surface 1 a different from the surface where the heat generating resistor 2 of the head substrate 1 is provided by heat conduction to the head substrate 1. Since the pressure contact is not required, uniformity of the temperature distribution of the heating resistor 2 is not required as in the prior art, but the surface of the heating resistor 2 is not necessarily passed through the medium 31 as in the prior art, so the surface needs to be flat. The temperature distribution by the heating resistor 2 is constant, and a coating for temperature dispersion with good heat conduction is applied to the surface of the heating resistor 2 or a part of the heating resistor 2 is shaved. The temperature distribution can also be adjusted.

  Furthermore, according to the present invention, the temperature on the back surface side of the heating resistor 2 is most likely to rise, and the entire head substrate 1 does not reach a uniform temperature, but the spacer 8 is made of a copper plate or the like as described above. Therefore, the heat conduction is very good, and the contact surface of the spacer 8 with the medium 31 is almost uniform over the entire surface. As a result, even at a position not pressed by the rubber roll 32, the temperature of the medium 31 can be increased when the spacer 8 is in contact with the spacer 8, so that the effect of preheating can be obtained. Thus, the temperature can be increased and recording or erasure on the medium 31 can be performed in a short time.

  As described above, according to the heating head 10 of the present invention, since the surface of the head substrate 1 on which the heating resistor 2 is provided is opposed to the base 4 side and attached to the base 4, the rubber roll 32 serves as a medium. The surface that presses 31 can be different from the surface provided with the heating resistor 2 of the head substrate 1 via the spacer 8. As a result, unevenness may be formed on the surface by applying a heat dispersion material to a portion where the temperature distribution of the heating resistor 2 is not constant, or by scraping off a part of the heating resistor. Since the thickness of the head substrate 1 is about 0.8 mm as described above, even if the surface opposite to the surface on which the heating resistor 2 is provided, the thermal conductivity (20 W / (m If K)), the temperature can be raised to the working temperature in about 1.65 seconds after the heating resistor 2 is energized. In addition, since the heat capacity is larger than that of the heating resistor 2, even if the passage speed of the medium 31 is high, a rapid temperature drop does not occur, and stable heating can be continued.

  In the above example, the surface of the head substrate 1 on which the heating resistor 2 is provided is fixed to the base 4 with the base side facing, but the head substrate 1 is not necessarily limited to the surface on which the heating resistor 2 is provided with the base 4 side. Even if it is not fixed to the base 4, for example, as shown in FIG. 4, even if the head substrate 1 is provided with the portion provided with the heat generating resistor 2 opposite to the base 4, the heat generating resistor 2 It is also possible to expose the side surface 1b adjacent to the portion provided with the exposed surface 1b and use the exposed surface 1b as a heating surface so that the spacer 8 is interposed between the heating surface and the medium 31. In this case, the side surface 1b is a side surface along the direction in which the belt-shaped heating resistor 2 extends.

  That is, in the embodiment shown in FIG. 4, the head substrate 1 provided with the heating resistor 2 is provided on the base 4 via the first heat insulating plate 6a, and the second heat insulating is performed by the holding plate 9a and the screw 9b. It is attached to the base 4 with the plate 6b interposed therebetween. As shown in FIG. 4C, the heating head 10 is similarly used by pressing the rubber roll 32 through the spacer 8 while the medium 31 is passing over the side surface 1 b of the head substrate 1. The medium 31 can be heated while being smoothly conveyed using the smoothness of the above. The same parts as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted. 4 (a) and 4 (b), the spacer 8 is omitted. However, as shown in FIG. 4 (c), one end thereof may be fixed to the base 4 of the heating head 10 or the like. As described above, one end of the spacer 8 is fixed to a housing (not shown) that fixes the heating head 10 without being fixed to the heating head 10, and the space between the pressure contact surface of the heating head 10 and the medium 31 is fixed. The spacer 8 may be provided so as to be interposed therebetween. In the example shown in FIG. 4, the wiring substrate 5 is formed of a flexible film and is provided under the presser plate 9a. However, the structure shown in FIG.

  In the structure in which the side surface 1b of the head substrate 1 is a pressure contact surface, the heating resistor 2 is not provided on only one surface of the head substrate 1, but is also provided on the lower side of the head substrate 1 in FIG. It can also be provided. By adopting such a structure, the temperature of the head substrate 1 can be increased even if the heat generation amount of one heating resistor 2 is reduced, and stable heating can be performed.

  FIG. 5 is a schematic explanatory view showing another embodiment of the heating device according to the present invention. In this example, the heating roller 33 is a double-sided heating device using heating rolls 33 particularly suitable for fixing toner on both sides of the medium 31. In the present invention, the heating roll 33 is provided with a heater inside the roll, and the entire roll is mounted. It is not a structure for heating, but is characterized by a structure in which the temperature of only a part of the surface of the rubber roll 32 is increased and heated by the heat using the heating head 10 described above. Therefore, the heating apparatus shown in FIG. 5 is characterized by the configuration of the heating roll 33. The heating roll 33 is not provided on both sides of the medium 31 for double-sided heating, but only on one side of the medium 31 and on the other side. A single-sided heating device provided with a pressure roll that only pressurizes without heating may be used, or one surface may be heated by double-sided heating in which the heating roll 33 is provided on the other surface by the heating head 10 as described above. It may be a device.

  That is, as shown in FIG. 5, the heating roll 33 used in the heating apparatus of the present invention is composed of the rubber roll 32 and the heating head 10, and the rubber roll 32 is the same as the rubber roll described with reference to FIG. For example, a surface layer 32a made of heat-resistant rubber such as silicone rubber or fluorine rubber is provided on the outer surface, and an inner layer 32b made of heat-insulating rubber such as foamable silicone rubber or fluorine rubber is provided at the center thereof. And is fixed to the rotating shaft 32c. The surface layer 32a transmits the heat received from the heating head 10 to the medium 31, and keeps a temperature higher than the temperature for heating the medium 31 (usually 150 to 200 ° C.), and with the opposing rubber roll 32 or the heating head 10 It is necessary to withstand the pressure that is pressed between them, and elasticity is also required so as to ensure a contact length with the medium 31 that is called a nip. Therefore, as described above, rubber such as silicone rubber (adjusted to a desired hardness by adding a plasticizer) is used. In addition, the inner layer 32b keeps the heat received from the heating head 10 in the surface layer 32a as much as possible on the surface layer 32a and contributes to the heating of the medium 31. That is, foamable silicone rubber obtained by foaming silicone rubber, rubber partially mixed with a filler (filler), or the like can be used.

  As the heating head 10, the heating head 10 having the structure shown in FIGS. 1 and 4 can be used. That is, in the heating head having a structure in which the surface of the heating resistor 52 is heated in direct contact with the surface of the heating resistor 52 as shown in FIG. 8 as the conventional structure, the surface of the heating resistor 2 is in direct contact with the rubber roll 32. When the plurality of heat generating resistors 2 are formed, the contact surface with the rubber roll 62 becomes uneven, so that the extra heat generating resistor 52 is severely damaged. Can not be used. On the other hand, for example, when the heating head 10 having the structure shown in FIG. 1 has a structure without the spacer 8, when the rubber roll 32 and the heating head 10 are brought into direct contact without the spacer 8, the contact surface of the heating head 10 is Since the back surface of the head substrate 1 is flat, it contacts the rubber roll 32 uniformly. However, since the head substrate 1 is usually made of ceramics such as alumina and is generally hard and has a rough surface, the surface of the rubber roll 32 There is a problem of rubbing and damaging. However, as shown in FIG. 1, the spacer 8 is provided on the heating head 10, or is made of a metal plate having a smooth surface with a thickness of about 0.1 to 0.3 mm between the heating head 10 and the rubber roll 32. By interposing the spacer 8, there is no such problem, and the heat of the heating head 10 can be transferred to the rubber roll 32 with good durability, and a heating rubber roll (heating roll 33) can be obtained.

  When such a heating roll 33 is configured, the positional relationship between the rubber roll 32 and the heating head 10 is also important. That is, the rubber roll 32 is a mechanism that heats the medium 31 by supplying heat to the medium 31 that is rotated by the portion heated by the heat received from the heating head 10 and contacting the medium 31. The position needs to reach the contact point with the medium 31 as soon as possible by the rotation of the rubber roll 32. Therefore, the heating head 10 needs to be provided near the contact position of the rubber roll 32 with the medium 31 and on the upstream side thereof. Here, the upstream side means the side before reaching the contact position between the rubber roll 32 and the medium 31. That is, for example, in the case of the upper rubber roll 32 in FIG. 5, since the rubber roll 32 rotates to the right and the contact point with the medium 31 is the lower end, upstream means the right side of the lower end, and the lower rubber roll in FIG. In the case of 32, since the contact point with the medium 31 at the left rotation is the upper end, the upstream means the right side of the upper end. The fact that the heating head 10 should be as close as possible to the contact point between the rubber roll 32 and the medium 31 prevents heat dissipation due to radiation between the contact point with the medium 31 and the contact point with the heating head 10. It is clear from the point, and it is attached at a position as close as possible to the contact point with the medium 31 in consideration of a space for attaching the heating head 10. Note that the temperature drop due to heat dissipation between the contact point with the heating head 10 and the contact point with the medium 31 is almost constant if the distance is determined by each device, so the temperature drop is measured in advance. If the heating temperature by the heating head 10 is raised, no problem will occur.

  According to the heating device of the present invention shown in FIG. 5, only the portion necessary for heating the medium 31 of the heating roll 33 is heated and the temperature rising portion of the heating roll 33 is pressed against the medium 31 and heated. Therefore, it is not necessary to generate unnecessary heat, and the thermal efficiency is greatly improved, which makes the heating device suitable for recent energy saving devices. Moreover, since the heating head 10 is heated by the head substrate 1 heated by the temperature rise of the heating resistor 2, the temperature of the head substrate 1 can be accurately controlled directly by the temperature coefficient of the heating resistor 2. The medium 31 can be heated at a very accurate temperature. In addition, according to the present invention, the pressure contact surface of the heating head 10 with the rubber roll 32 is a flat surface on which the heating resistor 2 is not provided, and is in pressure contact with the rubber roll 32 via the spacer 8 having smoothness. Therefore, the rubber roll 32 is not worn without special surface treatment on the pressure contact surface of the head substrate 1 of the heating head 10.

  As shown in FIG. 5, the heating apparatus having a structure in which heating rolls are provided on both sides of the medium 31 is particularly suitable for use in fixing an electrophotographic printer. In other words, an electrophotographic printer is charged while rotating a photosensitive drum, and optical writing is performed using laser light or LED light to form an electrostatic latent image on the photosensitive drum. Develop and make visible image. Then, the toner is transferred from the photosensitive drum to the paper by electric force, and the toner transferred to the paper is fixed on the paper by heat or pressure to be output from the printer. In order to fix the toner transferred to the paper on the paper, a heating roll is provided on both sides of the medium 31 shown in FIG. The toner can be firmly fixed to the paper over time. In other words, roll heating can be performed at a uniform temperature from both sides with a small and simple configuration, and very stable fixing can be performed. In the case of color printing, color printing is performed by arranging the combination of the photosensitive drum and the fixing unit for black (K), cyan (C), magenta (M), and yellow (Y). You can also.

  The heating device shown in FIG. 2 or FIG. 5 described above shows only one heating portion. However, since two or more such heating devices are juxtaposed, the temperature rise can be repeated. The temperature rise at the location can be shortened, the medium feeding speed can be increased, and heating can be performed in a short time. However, power consumption increases.

  The heating head of the present invention is used for recording, erasing, heat transfer and retransfer of transfer film, re-transfer, toner fixing, adhesion by heating, fusing, deformation processing, documents, images, and other surfaces as materials, gas , To protect from light, or to create a clear image with a mirrored image surface, etc., lamination of documents, adhesion of sheets such as partial adhesion of thermosetting adhesive sheets, on the surface of plastic, etc. It can be used for imprint processing for forming irregularities by thermal processing.

DESCRIPTION OF SYMBOLS 1 Head board | substrate 2 Heating resistor 3 Electrode 4 Base 5 Wiring board 6 Heat insulation board 7 Heat insulation adhesive 8 Spacer 10 Heating head 31 Medium 32 Rubber roll 33 Heating roll

Claims (7)

A plate-shaped head substrate, at least one belt-shaped heating resistor provided on one surface of the head substrate, a pair of electrodes provided so that a voltage can be applied to both ends of the heating resistor, and the pair of electrodes a wiring board electrically connected with, and a base, wherein the head substrate is mounted, so that the surface where the heating resistors are not provided the head board is exposed to the outer surface as a surface to be pressed against the medium The head substrate is fixed to the base, and a spacer is provided between the medium and the surface to be pressed against the head substrate when the medium is heated. A heating head which is not fixed to a surface to be pressed against the head substrate, and is fixed to the wiring substrate or the base only by one end of the spacer.   The heating head according to claim 1, wherein the spacer is made of any one of a copper plate, a stainless steel plate, and a phosphor bronze plate.   A heating head in which a belt-like heating resistor is formed on one surface of a plate-shaped head substrate, a surface other than the one surface of the head substrate is a pressure contact surface with the medium, and the pressure contact surface is opposed to the medium to heat the medium And a heating device that heats the medium while conveying the medium between the roll and the heating head, the heating head and the heating head A heating apparatus in which one end of the spacer is fixed to a part other than the head substrate of the heating head or a casing around the heating head so that the spacer is interposed between the medium and the medium. And one heating roller, is opposed to the heating body or pressure roll including other heating rolls, the medium while conveying by pressure medium between the heating roll and the heating body or pressure roll A heating device for heating, wherein the heating roll is formed such that the surface of the roll is heated by a heating head upstream of a portion of the roll that is in pressure contact with the medium. A belt-like heating resistor is formed on one surface of the head-shaped head substrate, and a surface other than the one surface of the head substrate is formed as a pressure contact surface. Between the pressure contact surface of the heating head and the roll A heating apparatus in which only one end of the spacer is fixed to a portion other than the head substrate of the heating head or a casing around the heating head so that a spacer made of a metal plate is interposed. A heating device that fixes two toners transferred to the medium while the two rolls face each other and the medium is pressed and conveyed between the two rolls, each of the two rolls being pressed against the medium The surface of the roll is formed so as to be heated by a heating head upstream of the portion to be formed, and the heating head has a belt-like heating resistor formed on one surface of a plate-like head substrate, and the head substrate A surface other than the one surface is formed as a pressure contact surface, and only one end of the spacer is heated so that a spacer made of a metal plate is interposed between the pressure contact surface of the heating head and the roll. A heating device fixed to a portion of the head other than the head substrate or a casing around the heating head. At least one belt-like heating resistor is provided on at least one surface of the plate-like head substrate, a heating head is formed by attaching the head substrate to a base, and appears on the outer surface side of the heating head, and the heating resistor A spacer made of a metal plate having only one end fixed to a portion other than the head substrate of the heating head or a casing around the heating head is interposed on one surface of the head substrate, which is a surface on which the heating head is not provided. And heating the medium by bringing the medium into pressure contact with each other. A heating method in which at least one of two rolls each having a heating roll is opposed, and the medium is heated while being conveyed while being pressed between the two rolls, the heating by the heating roll, upstream from the portion to be medium pressure contact, by interposing a spacer made of a metal plate have the row by heating by the heating head surface of the roll, at least a heating head on at least one surface of a plate-shaped head substrate One head-shaped heating resistor is provided, and the head substrate is formed by attaching the head substrate to a base. The head substrate is formed on the outer surface side of the heating head and is a surface on which the heating resistor is not provided. One surface is pressed against the roll via the spacer, and only one end of the spacer is connected to a portion other than the head substrate of the heating head. The method of heating medium characterized rows Ukoto by fixing to the housing around the heating head.

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