JP2016095504A5 - - Google Patents

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Publication number
JP2016095504A5
JP2016095504A5 JP2015211796A JP2015211796A JP2016095504A5 JP 2016095504 A5 JP2016095504 A5 JP 2016095504A5 JP 2015211796 A JP2015211796 A JP 2015211796A JP 2015211796 A JP2015211796 A JP 2015211796A JP 2016095504 A5 JP2016095504 A5 JP 2016095504A5
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JP
Japan
Prior art keywords
layer
oxymetal
carrier substrate
precursor material
substrate
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Application number
JP2015211796A
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English (en)
Japanese (ja)
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JP6199941B2 (ja
JP2016095504A (ja
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Publication of JP2016095504A publication Critical patent/JP2016095504A/ja
Publication of JP2016095504A5 publication Critical patent/JP2016095504A5/ja
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Publication of JP6199941B2 publication Critical patent/JP6199941B2/ja
Expired - Fee Related legal-status Critical Current
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JP2015211796A 2014-11-12 2015-10-28 ディスプレイデバイスの製造 Expired - Fee Related JP6199941B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462078938P 2014-11-12 2014-11-12
US62/078,938 2014-11-12

Publications (3)

Publication Number Publication Date
JP2016095504A JP2016095504A (ja) 2016-05-26
JP2016095504A5 true JP2016095504A5 (https=) 2017-06-15
JP6199941B2 JP6199941B2 (ja) 2017-09-20

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ID=54849085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015211796A Expired - Fee Related JP6199941B2 (ja) 2014-11-12 2015-10-28 ディスプレイデバイスの製造

Country Status (6)

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US (1) US9515272B2 (https=)
EP (1) EP3020849B1 (https=)
JP (1) JP6199941B2 (https=)
KR (1) KR101759155B1 (https=)
CN (1) CN105591038B (https=)
TW (1) TWI572078B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104979262B (zh) * 2015-05-14 2020-09-22 浙江中纳晶微电子科技有限公司 一种晶圆分离的方法
KR102554183B1 (ko) 2016-07-29 2023-07-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법, 표시 장치, 표시 모듈, 및 전자 기기
TW201808628A (zh) * 2016-08-09 2018-03-16 半導體能源研究所股份有限公司 半導體裝置的製造方法
CN106098939A (zh) * 2016-08-26 2016-11-09 武汉华星光电技术有限公司 激光无损剥离柔性基板的方法
US10923350B2 (en) * 2016-08-31 2021-02-16 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
CN106356472A (zh) * 2016-10-18 2017-01-25 武汉华星光电技术有限公司 Oled器件制作方法及oled器件
JP6907032B2 (ja) * 2017-06-06 2021-07-21 株式会社ジャパンディスプレイ 表示装置及びその製造方法
US10693070B2 (en) 2017-08-08 2020-06-23 Sharp Kabushiki Kaisha Manufacturing method for electroluminescence device
CN109686854B (zh) * 2017-10-19 2024-07-02 京东方科技集团股份有限公司 封装结构及封装方法、电子装置及封装薄膜回收方法
CN109216589B (zh) * 2018-09-19 2021-07-09 深圳市化讯半导体材料有限公司 一种柔性器件的制备方法及应用

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965679A (en) 1996-09-10 1999-10-12 The Dow Chemical Company Polyphenylene oligomers and polymers
US6303270B1 (en) 1999-03-01 2001-10-16 The Curators Of The University Of Missouri Highly plasma etch-resistant photoresist composition containing a photosensitive polymeric titania precursor
JP4472238B2 (ja) * 2001-08-10 2010-06-02 株式会社半導体エネルギー研究所 剥離方法および半導体装置の作製方法
TW554398B (en) * 2001-08-10 2003-09-21 Semiconductor Energy Lab Method of peeling off and method of manufacturing semiconductor device
US6740469B2 (en) 2002-06-25 2004-05-25 Brewer Science Inc. Developer-soluble metal alkoxide coatings for microelectronic applications
US7364832B2 (en) 2003-06-11 2008-04-29 Brewer Science Inc. Wet developable hard mask in conjunction with thin photoresist for micro photolithography
JP4912146B2 (ja) 2004-12-01 2012-04-11 三洋電機株式会社 有機金属ポリマー材料
US7414313B2 (en) 2004-12-22 2008-08-19 Eastman Kodak Company Polymeric conductor donor and transfer method
JP5276792B2 (ja) * 2006-03-03 2013-08-28 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8222116B2 (en) * 2006-03-03 2012-07-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR20080001744A (ko) 2006-06-30 2008-01-04 엘지.필립스 엘시디 주식회사 점착반송기판 및 이를 이용한 플렉서블 표시장치 제조방법
KR100735339B1 (ko) 2006-12-29 2007-07-04 삼성전기주식회사 박막 캐패시터 내장형 배선 기판의 제조방법
US20090298211A1 (en) 2008-05-28 2009-12-03 Tae-Woong Kim Method for manufacturing flexible display
KR101040175B1 (ko) * 2008-12-11 2011-06-16 한국전자통신연구원 연성 기판 및 그의 제조 방법
TWI505410B (zh) * 2008-12-30 2015-10-21 財團法人工業技術研究院 應用於軟性電子元件之基板結構及其製造方法
KR20100111117A (ko) 2009-04-06 2010-10-14 삼성전기주식회사 박막소자의 제조방법 및 이로부터 제조된 박막소자
WO2010125011A2 (de) 2009-04-28 2010-11-04 Basf Se Verfahren zur herstellung von halbleitenden schichten
JP5611811B2 (ja) * 2009-12-31 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． バリア・フィルム複合体及びこれを含む表示装置
US9281207B2 (en) 2011-02-28 2016-03-08 Inpria Corporation Solution processible hardmasks for high resolution lithography
US9093397B2 (en) * 2011-07-06 2015-07-28 Panasonic Corporation Flexible device manufacturing method and flexible device
JP2013135181A (ja) * 2011-12-27 2013-07-08 Panasonic Corp フレキシブルデバイスの製造方法
TWI492373B (zh) * 2012-08-09 2015-07-11 友達光電股份有限公司 可撓式顯示模組的製作方法
US8795774B2 (en) 2012-09-23 2014-08-05 Rohm And Haas Electronic Materials Llc Hardmask
US10086584B2 (en) * 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US9136123B2 (en) * 2013-01-19 2015-09-15 Rohm And Haas Electronic Materials Llc Hardmask surface treatment
KR102309244B1 (ko) * 2013-02-20 2021-10-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
TWI515852B (zh) * 2013-05-01 2016-01-01 友達光電股份有限公司 主動元件基板與其之製作方法
US20150024522A1 (en) 2013-07-22 2015-01-22 Rohm And Haas Electronic Materials Llc Organometal materials and process
US8927439B1 (en) 2013-07-22 2015-01-06 Rohm And Haas Electronic Materials Llc Organoaluminum materials for forming aluminum oxide layer from coating composition that contains organic solvent

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