JP2016092118A - 熱伝導電磁波吸収シート - Google Patents
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- 239000002245 particle Substances 0.000 claims abstract description 59
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 40
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000003063 flame retardant Substances 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 claims description 22
- 239000000945 filler Substances 0.000 claims description 19
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 12
- 239000000347 magnesium hydroxide Substances 0.000 claims description 12
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 12
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 8
- -1 acrylate ester Chemical class 0.000 claims description 7
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 7
- 239000000194 fatty acid Substances 0.000 claims description 7
- 229930195729 fatty acid Natural products 0.000 claims description 7
- 150000004665 fatty acids Chemical class 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 7
- 230000000379 polymerizing effect Effects 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 230000035699 permeability Effects 0.000 abstract description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011574 phosphorus Substances 0.000 abstract description 5
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 5
- 238000004381 surface treatment Methods 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 8
- 238000004898 kneading Methods 0.000 description 7
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- 238000011156 evaluation Methods 0.000 description 3
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- 239000000463 material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000007561 laser diffraction method Methods 0.000 description 2
- 239000012762 magnetic filler Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
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- GKZPEYIPJQHPNC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GKZPEYIPJQHPNC-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
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- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 229910001035 Soft ferrite Inorganic materials 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
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- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
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- C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
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Abstract
【解決手段】平均粒径8μmのフェライトと80μmのフェライトとを9:13〜15:7の体積比で熱伝導電磁波吸収シート全体の55〜60vol%含有させ、かつ、表面処理された難燃剤を熱伝導電磁波吸収シート全体の8〜10vol%含有させる。
【選択図】なし
Description
次に、本発明の実施の形態を、具体的実施例を挙げて説明する。本願出願人は、アクリル酸エステルを含むモノマーを重合してなるポリマーに、金属磁性酸化物としてのフェライトと、難燃性フィラーとしての水酸化アルミニウム又は水酸化マグネシウムの少なくとも一方とを含有させた熱伝導材を作成し、シート状に成形して熱伝導電磁波吸収シートとした。
表1に示した実施例1〜4及び比較例1〜9の特性を表2に示す。なお表2において、生産性は次のように評価した。フィラーを基材に混練してシート化する作業が容易にできるものを○、シート化するのに多少の困難を伴うものを△とした。
[考察]
実施例1〜4は、いずれも、小粒径(平均粒径8μm)のフェライトと大粒径(平均粒径80μm)のフェライトとを9:13〜15:7の体積比で熱伝導電磁波吸収シート全体の約59vol%含有している。また、実施例1〜4は、いずれも、高級脂肪酸処理された水酸化マグネシウムを熱伝導電磁波吸収シート全体の3.45vol%含有し、チタネート処理された水酸化アルミニウムを熱伝導電磁波吸収シート全体の5.65vol%含有している。すなわち、難燃性フィラー(難燃剤)を、熱伝導電磁波吸収シート全体の約9vol%含有している。表2に示すように、これらの実施例では、10MHzにおいて10以上の良好な透磁率が得られた。また、これらの実施例では、1.3W/m・K以上の良好な熱伝導性が得られた。また、これらの実施例の熱伝導電磁波吸収シートは、アスカーC(ASKERC)硬度が40以下の柔軟性を有し、生産性も良好(○)であった。また、これらの実施例の熱伝導電磁波吸収シートは、難燃性がV−2相当であった。
なお、本発明は前記実施形態に何ら限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の形態で実施することができる。例えば、小粒径のフェライトの平均粒径は、1〜10μmの範囲で変更しても同様の実験結果が得られるものと考えられる。大粒径のフェライトの平均粒径は、50〜100μmの範囲で変更しても同様の実験結果が得られるものと考えられる。フェライト全体としての含有量は熱伝導電磁波吸収シート全体の55〜60vol%の範囲で変更しても同様の実験結果が得られるものと考えられる。さらに、金属磁性酸化物としてはフェライト以外のものを用いても同様の実験結果が得られるものと考えられる。
Claims (4)
- アクリル酸エステルを含むモノマーを重合してなるポリマーに金属磁性酸化物を含有させてシート状に成形した熱伝導電磁波吸収シートであって、
前記金属磁性酸化物として、平均粒径1〜10μmの金属磁性酸化物と平均粒径50〜100μmの金属磁性酸化物とを9:13〜15:7の体積比で熱伝導電磁波吸収シート全体の55〜60vol%含有し、かつ、表面処理された難燃性フィラーを熱伝導電磁波吸収シート全体の8〜10vol%含有したことを特徴とする熱伝導電磁波吸収シート。 - 前記平均粒径50〜100μmの金属磁性酸化物を、熱伝導電磁波吸収シート全体の24vol%以上含有したことを特徴とする請求項1に記載の熱伝導電磁波吸収シート。
- 前記金属磁性酸化物として、フェライトを含有したことを特徴とする請求項1又は2に記載の熱伝導電磁波吸収シート。
- 前記難燃性フィラーとして、高級脂肪酸処理された平均粒径0.5〜2μmの水酸化マグネシウムと、チタネート処理された平均粒径1〜10μmの水酸化アルミニウムとを含有したことを特徴とする請求項1〜3のいずれか1項に記載の熱伝導電磁波吸収シート。
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US14/928,030 US9868889B2 (en) | 2014-10-31 | 2015-10-30 | Thermal conductive electromagnetic wave absorbing sheet |
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Cited By (3)
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EP3595420A1 (en) | 2018-07-11 | 2020-01-15 | Kitagawa Industries Co., Ltd. | Thermally conductive composition |
EP3595004A1 (en) | 2018-07-11 | 2020-01-15 | Kitagawa Industries Co., Ltd. | Thermally conductive composition |
US10631397B1 (en) | 2018-10-25 | 2020-04-21 | Seiko Epson Corporation | Printed circuit board, electronic device and heat conduction sheet |
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CN108003818A (zh) * | 2017-12-14 | 2018-05-08 | 深圳市德镒盟电子有限公司 | 一种导热低卤阻燃压敏胶及其制备方法 |
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JP2006344805A (ja) * | 2005-06-09 | 2006-12-21 | Fujifilm Holdings Corp | 電磁波吸収体 |
JP2008297343A (ja) * | 2007-05-29 | 2008-12-11 | Kitagawa Ind Co Ltd | 難燃性材料 |
JP2010192550A (ja) * | 2009-02-17 | 2010-09-02 | Furukawa Electric Co Ltd:The | 電磁波遮蔽用組成物、電磁波遮蔽用組成物の成形体、電磁波遮蔽シート、電磁波遮蔽電線 |
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JP2006344805A (ja) * | 2005-06-09 | 2006-12-21 | Fujifilm Holdings Corp | 電磁波吸収体 |
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JP2010192550A (ja) * | 2009-02-17 | 2010-09-02 | Furukawa Electric Co Ltd:The | 電磁波遮蔽用組成物、電磁波遮蔽用組成物の成形体、電磁波遮蔽シート、電磁波遮蔽電線 |
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EP3595420A1 (en) | 2018-07-11 | 2020-01-15 | Kitagawa Industries Co., Ltd. | Thermally conductive composition |
EP3595004A1 (en) | 2018-07-11 | 2020-01-15 | Kitagawa Industries Co., Ltd. | Thermally conductive composition |
US10779450B2 (en) | 2018-07-11 | 2020-09-15 | Kitagawa Industries Co., Ltd. | Thermally conductive composition |
US10631397B1 (en) | 2018-10-25 | 2020-04-21 | Seiko Epson Corporation | Printed circuit board, electronic device and heat conduction sheet |
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US20160122610A1 (en) | 2016-05-05 |
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