JP2016092111A - 制御回路基板およびロボット制御装置 - Google Patents
制御回路基板およびロボット制御装置 Download PDFInfo
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- JP2016092111A JP2016092111A JP2014222881A JP2014222881A JP2016092111A JP 2016092111 A JP2016092111 A JP 2016092111A JP 2014222881 A JP2014222881 A JP 2014222881A JP 2014222881 A JP2014222881 A JP 2014222881A JP 2016092111 A JP2016092111 A JP 2016092111A
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- edge
- control circuit
- circuit board
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- pins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10212—Programmable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10704—Pin grid array [PGA]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Numerical Control (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
2 ロボット制御装置
3 ロボット
4 基板部材
5 表面側素子(CPLD)
6 裏面側素子(CPLD)
7 表面側素子のピン
8 裏面側素子のピン
9 第一縁部
10 第二縁部
11 第三縁部
12 第四縁部
13 パターン
A1〜A5 素子間通信入力ピン
B1〜B5 素子間通信出力ピン
I1〜I5 外部信号入力ピン
O1〜O5 外部信号出力ピン
Claims (7)
- ロボット制御装置に組み込まれる制御回路基板であって、
基板部材と、
前記基板部材の各面にそれぞれ設けられた第1の素子および第2の素子と、を備え、
前記第1の素子および前記第2の素子は、それぞれ、互いに対向する第一縁部および第三縁部と、互いに対向する第二縁部および第四縁部と、を有し、
前記第一縁部には複数の信号入力ピンが設けられ、前記第三縁部には複数の信号出力ピンが設けられ、前記第二縁部には複数の素子間通信入力ピンが設けられ、前記第四縁部には複数の素子間通信出力ピンが設けられ、
共通の信号が前記第1の素子および前記第2の素子に入力されると共に、前記第1の素子と前記第2の素子との間で通信が行なわれるように構成されている、制御回路基板。 - 前記複数の素子間通信入力ピンおよび前記複数の素子間通信出力ピンのピン機能に関する配置が、前記第1の素子と前記第2の素子とで共通している、請求項1記載の制御回路基板。
- 前記複数の信号入力ピンおよび前記複数の信号出力ピンのピン機能に関する配置が、前記第1の素子と前記第2の素子とで共通している、請求項1または2に記載の制御回路基板。
- 前記複数の信号入力ピンおよび前記複数の信号出力ピンのピン機能に関する配置が、前記第1の素子と前記第2の素子とで反転している、請求項1または2に記載の制御回路基板。
- 前記第1の素子の前記第一縁部乃至第四縁部と前記第2の素子の前記第一縁部乃至第四縁部とが、前記基板部材を挟んで対向して配置されている、請求項1乃至4のいずれか一項に記載の制御回路基板。
- 前記第1の素子および前記第2の素子が、それぞれ、プログラマブル論理デバイスである、請求項1乃至5のいずれか一項に記載の制御回路基板。
- ロボットの動作を制御するためのロボット制御装置であって、
請求項1乃至6のいずれか一項に記載の制御回路基板が組み込まれたロボット制御装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014222881A JP6545447B2 (ja) | 2014-10-31 | 2014-10-31 | 制御回路基板およびロボット制御装置 |
KR1020177014761A KR102112390B1 (ko) | 2014-10-31 | 2015-10-29 | 제어 회로 기판 및 로봇 제어 장치 |
US15/523,472 US10251275B2 (en) | 2014-10-31 | 2015-10-29 | Control circuit board and robot control device |
CN201580059285.9A CN107107341B (zh) | 2014-10-31 | 2015-10-29 | 控制电路衬底及机器人控制装置 |
PCT/JP2015/080627 WO2016068264A1 (ja) | 2014-10-31 | 2015-10-29 | 制御回路基板およびロボット制御装置 |
EP15855357.8A EP3213884B1 (en) | 2014-10-31 | 2015-10-29 | Control circuit board and robot control device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014222881A JP6545447B2 (ja) | 2014-10-31 | 2014-10-31 | 制御回路基板およびロボット制御装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016092111A true JP2016092111A (ja) | 2016-05-23 |
JP6545447B2 JP6545447B2 (ja) | 2019-07-17 |
Family
ID=55857599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014222881A Active JP6545447B2 (ja) | 2014-10-31 | 2014-10-31 | 制御回路基板およびロボット制御装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10251275B2 (ja) |
EP (1) | EP3213884B1 (ja) |
JP (1) | JP6545447B2 (ja) |
KR (1) | KR102112390B1 (ja) |
CN (1) | CN107107341B (ja) |
WO (1) | WO2016068264A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6193694A (ja) * | 1984-10-15 | 1986-05-12 | 松下電器産業株式会社 | 集積回路装置 |
JPS633153U (ja) * | 1986-06-23 | 1988-01-11 | ||
JPH0278118A (ja) * | 1988-09-12 | 1990-03-19 | Nippon Telegr & Teleph Corp <Ntt> | スイッチモジュール |
JPH04262591A (ja) * | 1991-02-15 | 1992-09-17 | Nec Corp | 集積回路の実装方式 |
JP2000252418A (ja) * | 1999-02-26 | 2000-09-14 | Hitachi Ltd | メモリモジュールおよびその製造方法 |
JP2005235074A (ja) * | 2004-02-23 | 2005-09-02 | Fujitsu Ltd | Fpgaのソフトエラー補正方法 |
US20090250255A1 (en) * | 2008-04-02 | 2009-10-08 | Spansion Llc | Connections for electronic devices on double-sided circuit board |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7406573B2 (en) * | 2002-05-09 | 2008-07-29 | Src Computers, Inc. | Reconfigurable processor element utilizing both coarse and fine grained reconfigurable elements |
JP2004330346A (ja) | 2003-05-07 | 2004-11-25 | Yaskawa Electric Corp | ロボット制御装置 |
JP5803214B2 (ja) * | 2011-03-30 | 2015-11-04 | セイコーエプソン株式会社 | ロボットコントローラー |
JP6524631B2 (ja) * | 2014-09-30 | 2019-06-05 | セイコーエプソン株式会社 | ロボット、制御装置およびロボットシステム |
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2014
- 2014-10-31 JP JP2014222881A patent/JP6545447B2/ja active Active
-
2015
- 2015-10-29 KR KR1020177014761A patent/KR102112390B1/ko active IP Right Grant
- 2015-10-29 CN CN201580059285.9A patent/CN107107341B/zh active Active
- 2015-10-29 WO PCT/JP2015/080627 patent/WO2016068264A1/ja active Application Filing
- 2015-10-29 US US15/523,472 patent/US10251275B2/en active Active
- 2015-10-29 EP EP15855357.8A patent/EP3213884B1/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6193694A (ja) * | 1984-10-15 | 1986-05-12 | 松下電器産業株式会社 | 集積回路装置 |
JPS633153U (ja) * | 1986-06-23 | 1988-01-11 | ||
JPH0278118A (ja) * | 1988-09-12 | 1990-03-19 | Nippon Telegr & Teleph Corp <Ntt> | スイッチモジュール |
JPH04262591A (ja) * | 1991-02-15 | 1992-09-17 | Nec Corp | 集積回路の実装方式 |
JP2000252418A (ja) * | 1999-02-26 | 2000-09-14 | Hitachi Ltd | メモリモジュールおよびその製造方法 |
JP2005235074A (ja) * | 2004-02-23 | 2005-09-02 | Fujitsu Ltd | Fpgaのソフトエラー補正方法 |
US20090250255A1 (en) * | 2008-04-02 | 2009-10-08 | Spansion Llc | Connections for electronic devices on double-sided circuit board |
Also Published As
Publication number | Publication date |
---|---|
EP3213884A4 (en) | 2018-06-20 |
US20170318679A1 (en) | 2017-11-02 |
US10251275B2 (en) | 2019-04-02 |
CN107107341B (zh) | 2020-03-03 |
EP3213884A1 (en) | 2017-09-06 |
WO2016068264A1 (ja) | 2016-05-06 |
EP3213884B1 (en) | 2021-05-26 |
JP6545447B2 (ja) | 2019-07-17 |
KR20170078790A (ko) | 2017-07-07 |
KR102112390B1 (ko) | 2020-05-18 |
CN107107341A (zh) | 2017-08-29 |
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