JP2016087780A5 - - Google Patents

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Publication number
JP2016087780A5
JP2016087780A5 JP2015168088A JP2015168088A JP2016087780A5 JP 2016087780 A5 JP2016087780 A5 JP 2016087780A5 JP 2015168088 A JP2015168088 A JP 2015168088A JP 2015168088 A JP2015168088 A JP 2015168088A JP 2016087780 A5 JP2016087780 A5 JP 2016087780A5
Authority
JP
Japan
Prior art keywords
polishing
temperature sensor
polishing pad
pad
eddy current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015168088A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016087780A (ja
Filing date
Publication date
Application filed filed Critical
Priority to SG10201801305PA priority Critical patent/SG10201801305PA/en
Priority to US14/925,063 priority patent/US20160121452A1/en
Priority to SG10201508881RA priority patent/SG10201508881RA/en
Publication of JP2016087780A publication Critical patent/JP2016087780A/ja
Publication of JP2016087780A5 publication Critical patent/JP2016087780A5/ja
Pending legal-status Critical Current

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JP2015168088A 2014-10-31 2015-08-27 研磨装置および研磨方法 Pending JP2016087780A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG10201801305PA SG10201801305PA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method
US14/925,063 US20160121452A1 (en) 2014-10-31 2015-10-28 Polishing apparatus and polishing method
SG10201508881RA SG10201508881RA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014223293 2014-10-31
JP2014223293 2014-10-31

Publications (2)

Publication Number Publication Date
JP2016087780A JP2016087780A (ja) 2016-05-23
JP2016087780A5 true JP2016087780A5 (https=) 2018-09-13

Family

ID=56015959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015168088A Pending JP2016087780A (ja) 2014-10-31 2015-08-27 研磨装置および研磨方法

Country Status (2)

Country Link
JP (1) JP2016087780A (https=)
SG (2) SG10201508881RA (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017064899A (ja) * 2015-10-01 2017-04-06 株式会社荏原製作所 研磨装置
JP6779633B2 (ja) * 2016-02-23 2020-11-04 株式会社荏原製作所 研磨装置
KR102547156B1 (ko) 2016-10-21 2023-06-26 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
US11199605B2 (en) * 2017-01-13 2021-12-14 Applied Materials, Inc. Resistivity-based adjustment of measurements from in-situ monitoring
JP2024019825A (ja) * 2022-08-01 2024-02-14 株式会社荏原製作所 研磨装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001041828A (ja) * 1999-07-27 2001-02-16 Tokyo Gas Co Ltd 温度測定装置及びそれを利用した測定方法
TWI273947B (en) * 2002-02-06 2007-02-21 Applied Materials Inc Method and apparatus of eddy current monitoring for chemical mechanical polishing
JP2004014999A (ja) * 2002-06-11 2004-01-15 Hitachi Chem Co Ltd Ｃｍｐ研磨装置及び研磨方法
KR100506942B1 (ko) * 2003-09-03 2005-08-05 삼성전자주식회사 화학적 기계적 연마장치
JP4451111B2 (ja) * 2003-10-20 2010-04-14 株式会社荏原製作所 渦電流センサ
JP2009125825A (ja) * 2007-11-20 2009-06-11 Ebara Corp 電解複合研磨方法及び電解複合研磨装置
US8523429B2 (en) * 2009-10-19 2013-09-03 Tsi Technologies Llc Eddy current thermometer

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