SG10201905457YA - Method of identifying trajectory of eddy current sensor, method of calculating substrate polishing progress, method of stopping operation of substrate polishing apparatus, method of regularizing substrate polishing progress, program for executing the same, and non-transitory recording medium that records program - Google Patents

Method of identifying trajectory of eddy current sensor, method of calculating substrate polishing progress, method of stopping operation of substrate polishing apparatus, method of regularizing substrate polishing progress, program for executing the same, and non-transitory recording medium that records program

Info

Publication number
SG10201905457YA
SG10201905457YA SG10201905457YA SG10201905457YA SG10201905457YA SG 10201905457Y A SG10201905457Y A SG 10201905457YA SG 10201905457Y A SG10201905457Y A SG 10201905457YA SG 10201905457Y A SG10201905457Y A SG 10201905457YA SG 10201905457Y A SG10201905457Y A SG 10201905457YA
Authority
SG
Singapore
Prior art keywords
substrate polishing
program
progress
polishing progress
regularizing
Prior art date
Application number
SG10201905457YA
Inventor
Nakamura Akira
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201905457YA publication Critical patent/SG10201905457YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B24B49/05—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/08—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels controlled by information means, e.g. patterns, templets, punched tapes or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B24B53/14—Dressing tools equipped with rotary rollers or cutters; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
    • G01B7/105—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance for measuring thickness of coating
SG10201905457YA 2018-06-22 2019-06-14 Method of identifying trajectory of eddy current sensor, method of calculating substrate polishing progress, method of stopping operation of substrate polishing apparatus, method of regularizing substrate polishing progress, program for executing the same, and non-transitory recording medium that records program SG10201905457YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018119242A JP7083279B2 (en) 2018-06-22 2018-06-22 How to identify the trajectory of the eddy current sensor, how to calculate the progress of polishing the substrate, how to stop the operation of the substrate polishing device and how to equalize the progress of polishing the substrate, to execute these methods. The program and the non-transient recording medium on which the program is recorded

Publications (1)

Publication Number Publication Date
SG10201905457YA true SG10201905457YA (en) 2020-01-30

Family

ID=68968500

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201905457YA SG10201905457YA (en) 2018-06-22 2019-06-14 Method of identifying trajectory of eddy current sensor, method of calculating substrate polishing progress, method of stopping operation of substrate polishing apparatus, method of regularizing substrate polishing progress, program for executing the same, and non-transitory recording medium that records program

Country Status (6)

Country Link
US (1) US11376704B2 (en)
JP (1) JP7083279B2 (en)
KR (1) KR20200000346A (en)
CN (1) CN110625516B (en)
SG (1) SG10201905457YA (en)
TW (1) TWI807048B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7134033B2 (en) * 2018-09-06 2022-09-09 東京エレクトロン株式会社 Substrate state determination device, substrate processing device, model creation device, and substrate state determination method
JP2020131353A (en) * 2019-02-19 2020-08-31 パナソニックＩｐマネジメント株式会社 Polishing system, learning device, and learning method of learning device
DE102020105732A1 (en) * 2020-03-04 2021-09-09 Bayerische Motoren Werke Aktiengesellschaft Device for marking a component by applying readable identification information

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6159073A (en) 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
TW541425B (en) * 2000-10-20 2003-07-11 Ebara Corp Frequency measuring device, polishing device using the same and eddy current sensor
US7175503B2 (en) * 2002-02-04 2007-02-13 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
WO2005043132A1 (en) * 2003-10-31 2005-05-12 Applied Materials, Inc. Polishing endpoint detection system and method using friction sensor
US20060166608A1 (en) * 2004-04-01 2006-07-27 Chalmers Scott A Spectral imaging of substrates
JP4790475B2 (en) 2006-04-05 2011-10-12 株式会社荏原製作所 Polishing apparatus, polishing method, and substrate film thickness measurement program
US8360817B2 (en) * 2009-04-01 2013-01-29 Ebara Corporation Polishing apparatus and polishing method
JP5730747B2 (en) * 2010-12-10 2015-06-10 株式会社荏原製作所 Eddy current sensor and polishing method and apparatus
TWI496661B (en) 2010-04-28 2015-08-21 Applied Materials Inc Automatic generation of reference spectra for optical monitoring
US20130065493A1 (en) * 2011-08-09 2013-03-14 Taro Takahashi Polishing monitoring method, polishing end point detection method, and polishing apparatus
JP6050571B2 (en) 2011-08-09 2016-12-21 株式会社荏原製作所 Polishing monitoring method and polishing apparatus
JP2013222856A (en) 2012-04-17 2013-10-28 Ebara Corp Polishing device and polishing method
US8992286B2 (en) 2013-02-26 2015-03-31 Applied Materials, Inc. Weighted regression of thickness maps from spectral data
TWI635929B (en) * 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 Polishing apparatus and polished-state monitoring method
JP6423600B2 (en) * 2014-03-12 2018-11-14 株式会社荏原製作所 Film thickness measuring device and polishing device
JP6595987B2 (en) * 2014-04-22 2019-10-23 株式会社荏原製作所 Polishing method
US9911664B2 (en) 2014-06-23 2018-03-06 Applied Materials, Inc. Substrate features for inductive monitoring of conductive trench depth
US9754846B2 (en) 2014-06-23 2017-09-05 Applied Materials, Inc. Inductive monitoring of conductive trench depth
JP6779633B2 (en) * 2016-02-23 2020-11-04 株式会社荏原製作所 Polishing equipment
TWI784719B (en) * 2016-08-26 2022-11-21 美商應用材料股份有限公司 Method of obtaining measurement representative of thickness of layer on substrate, and metrology system and computer program product
JP6357260B2 (en) * 2016-09-30 2018-07-11 株式会社荏原製作所 Polishing apparatus and polishing method

Also Published As

Publication number Publication date
TWI807048B (en) 2023-07-01
US11376704B2 (en) 2022-07-05
US20190389031A1 (en) 2019-12-26
CN110625516B (en) 2023-01-31
CN110625516A (en) 2019-12-31
KR20200000346A (en) 2020-01-02
JP2019217617A (en) 2019-12-26
JP7083279B2 (en) 2022-06-10
TW202017699A (en) 2020-05-16

Similar Documents

Publication Publication Date Title
SG10201706430PA (en) Non-transitory recording medium recording cyber-attack analysis supporting program, cyber-attack analysis supporting method, and cyber-attack analysis supporting apparatus
KR102377417B1 (en) Wafer processing apparatus recording medium and wafer conveying method
SG10201905457YA (en) Method of identifying trajectory of eddy current sensor, method of calculating substrate polishing progress, method of stopping operation of substrate polishing apparatus, method of regularizing substrate polishing progress, program for executing the same, and non-transitory recording medium that records program
KR102599023B9 (en) Apparatus method computer program and computer readable recording medium for guiding path and method thereof
SG11202004544YA (en) Method and apparatus for determining data exception
KR102599024B9 (en) Apparatus method computer program and computer readable recording medium for guiding path and method thereof
EP3241522A4 (en) Method for dental implant planning, apparatus for same, and recording medium having same recorded thereon
SG11201802143QA (en) Substrate treatment apparatus, method for manufacturing semiconductor device, and recording medium
SG11201705569PA (en) Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
SG11201701125SA (en) Image processing apparatus, image processing method, recording medium, and program
SG10201510145YA (en) Liquid processing method, liquid processing apparatus and recording medium
KR102377044B1 (en) Apparatus and method for evaluating walking safety risk and recording media recorded program realizing the same
EP3748533C0 (en) Method, apparatus, and storage medium for obtaining object information
EP3249601A4 (en) Information processing device, control method for same, control program, and recording medium
GB2571830B (en) Recording medium on which evaluating program is recorded, evaluating method, and information processing apparatus
EP3812747A4 (en) Defect identifying method, defect identifying device, defect identifying program, and recording medium
EP3185544A4 (en) Information processing apparatus, information recording medium, information processing method, and program
GB2530150B (en) Information processing apparatus for detecting object from image, method for controlling the apparatus, and storage medium
EP3477521A4 (en) Process control device, process control method, and recording medium having process control program recorded therein
KR102524492B9 (en) Apparatus method computer program and computer readable recording medium for guiding path and method thereof
KR102524495B9 (en) Apparatus method computer program and computer readable recording medium for guiding path and method thereof
EP3570246A4 (en) Information processing device, information processing method, and recording medium on which information processing program is recorded
EP3123709A4 (en) Image processing apparatus, method for controlling image processing apparatus, image pickup apparatus, method for controlling image pickup apparatus, and recording medium
EP3423976C0 (en) Method and apparatus for identifying and quantifying abnormality
EP3251769A4 (en) Method for estimating surface shape defect generating regions, method for estimating surface shape defect source regions, surface shape defect generating region estimating device, shape defect source region estimating device, program and recording media