JP2016087780A5

JP2016087780A5 -

Info

Publication number: JP2016087780A5
Application number: JP2015168088A
Authority: JP
Filing date: 2015-08-27
Publication date: 2018-09-13

Description

上述した目的を達成するために、本発明の一参考例は、基板が研磨される研磨面を有する研磨パッドと、前記研磨パッドを支持する研磨テーブルと、前記研磨テーブルを回転させるテーブルモータと、前記基板の表面を前記研磨パッドの前記研磨面に押し付ける研磨ヘッドと、前記研磨パッドの前記研磨面に研磨液を供給する研磨液供給ノズルと、前記研磨テーブルに配置された温度センサとを備え、前記温度センサは、前記研磨テーブルが一回転するたびに前記基板の表面を横切る位置に配置されていることを特徴とする研磨装置である。 In order to achieve the above-described object, one reference example of the present invention includes a polishing pad having a polishing surface on which a substrate is polished, a polishing table that supports the polishing pad, a table motor that rotates the polishing table, A polishing head for pressing the surface of the substrate against the polishing surface of the polishing pad, a polishing liquid supply nozzle for supplying a polishing liquid to the polishing surface of the polishing pad, and a temperature sensor disposed on the polishing table, The temperature sensor is a polishing apparatus which is disposed at a position crossing the surface of the substrate every time the polishing table rotates once.

上記参考例の好ましい態様は、前記温度センサは、前記研磨パッドの下に配置され、前記研磨パッドの下面の温度を測定することを特徴とする。
上記参考例の好ましい態様は、前記研磨パッドは、その下面に凹部を有しており、前記温度センサの先端は、前記凹部内に位置していることを特徴とする。
上記参考例の好ましい態様は、前記研磨パッドは、通孔を有しており、前記温度センサの先端は、前記通孔内に位置しており、前記温度センサは前記通孔内に存在する前記研磨液の温度を測定することを特徴とする。 In a preferred aspect of the reference example, the temperature sensor is disposed under the polishing pad and measures the temperature of the lower surface of the polishing pad.
In a preferred aspect of the above reference example, the polishing pad has a recess on the lower surface thereof, and the tip of the temperature sensor is located in the recess.
In a preferred aspect of the above reference example, the polishing pad has a through hole, a tip of the temperature sensor is located in the through hole, and the temperature sensor exists in the through hole. The temperature of the polishing liquid is measured.

上記参考例の好ましい態様は、前記温度センサの出力値に基づいて前記基板の研磨終点を決定する研磨動作制御部をさらに備えたことを特徴とする。
上記参考例の好ましい態様は、前記温度センサは、熱電対であることを特徴とする。
上記参考例の好ましい態様は、前記温度センサは、渦電流センサと、導電材からなるセンサターゲットとの組み合わせであることを特徴とする。 In a preferred aspect of the reference example , a polishing operation control unit that determines a polishing end point of the substrate based on an output value of the temperature sensor is further provided.
In a preferred aspect of the above reference example, the temperature sensor is a thermocouple.
In a preferred aspect of the above reference example, the temperature sensor is a combination of an eddy current sensor and a sensor target made of a conductive material.

本発明の一態様は、研磨面と底面とを有し、前記研磨面から前記底面まで延びる通孔が形成された研磨パッドと、前記研磨パッドを支持する研磨テーブルと、基板の表面を前記研磨パッドの前記研磨面に押し付ける研磨ヘッドと、前記研磨テーブルに取り付けられた渦電流センサと、前記研磨パッドの前記通孔内に配置されたセンサターゲットとを備え、前記渦電流センサの先端は、前記研磨パッドの前記通孔内に位置していることを特徴とする研磨装置である。 One embodiment of the present invention includes a polishing pad having a polishing surface and a bottom surface, and having a through-hole extending from the polishing surface to the bottom surface, a polishing table that supports the polishing pad, and a surface of a substrate that is polished A polishing head that presses against the polishing surface of the pad; an eddy current sensor attached to the polishing table; and a sensor target disposed in the through hole of the polishing pad, the tip of the eddy current sensor being The polishing apparatus is located in the through hole of the polishing pad.

本発明の一参考例は、研磨面を有する研磨パッドを支持する研磨テーブルを回転させ、前記研磨パッドの上面から構成される前記研磨面に研磨液を供給しながら、基板の表面を前記研磨パッドの前記研磨面に押し付け、前記研磨テーブルの回転に伴って、前記研磨テーブルに配置された温度センサを前記基板の表面を横切るように移動させながら、前記温度センサの出力値を取得することを特徴とする研磨方法である。 One exemplary embodiment of the present invention, a polishing table for supporting a polishing pad having a polishing surface is rotated while supplying a polishing liquid to the polishing surface composed of the upper surface of the polishing pad, the polishing pad surface of the substrate The temperature sensor is pressed against the polishing surface, and the output value of the temperature sensor is acquired while moving the temperature sensor arranged on the polishing table across the surface of the substrate as the polishing table rotates. This is a polishing method.

上記参考例の好ましい態様は、前記研磨テーブルの回転に伴って、前記温度センサを前記基板の表面を横切るように移動させながら、前記研磨パッドの下面の温度を前記温度センサにより測定することを特徴とする。
上記参考例の好ましい態様は、前記研磨テーブルの回転に伴って、前記温度センサを前記基板の表面を横切るように移動させながら、前記基板と前記温度センサとの間に存在する前記研磨液の温度を前記温度センサにより測定することを特徴とする。
上記参考例の好ましい態様は、前記温度センサの出力値に基づいて前記基板の研磨終点を決定することを特徴とする。 In a preferred aspect of the above reference example, the temperature sensor measures the temperature of the lower surface of the polishing pad while moving the temperature sensor across the surface of the substrate as the polishing table rotates. And
A preferred aspect of the above reference example is that the temperature of the polishing liquid existing between the substrate and the temperature sensor while moving the temperature sensor across the surface of the substrate as the polishing table rotates. Is measured by the temperature sensor.
In a preferred aspect of the above reference example , the polishing end point of the substrate is determined based on the output value of the temperature sensor.

Claims

A polishing pad having a polishing surface and a bottom surface, and having a through-hole extending from the polishing surface to the bottom surface;
A polishing table that supports the polishing pad;
A polishing head for pressing the surface of the substrate against the polishing surface of the polishing pad;
An eddy current sensor attached to the polishing table;
A sensor target disposed in the through hole of the polishing pad,
The tip of the eddy current sensor is located in the through hole of the polishing pad.

The polishing apparatus according to claim 1 , wherein a relative position between the sensor target and the eddy current sensor is fixed.

The polishing apparatus according to claim 1 , further comprising a ferrite disposed in the through hole of the polishing pad.

The polishing apparatus according to claim 3 , wherein the ferrite is aligned with the eddy current sensor.

The polishing apparatus according to claim 3 , wherein the ferrite is not in contact with the eddy current sensor and the sensor target.