JP2008298749A5 - - Google Patents
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- Publication number
- JP2008298749A5 JP2008298749A5 JP2007148376A JP2007148376A JP2008298749A5 JP 2008298749 A5 JP2008298749 A5 JP 2008298749A5 JP 2007148376 A JP2007148376 A JP 2007148376A JP 2007148376 A JP2007148376 A JP 2007148376A JP 2008298749 A5 JP2008298749 A5 JP 2008298749A5
- Authority
- JP
- Japan
- Prior art keywords
- heating
- probe
- amount
- inspection object
- control means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000010438 heat treatment Methods 0.000 claims 12
- 239000000523 sample Substances 0.000 claims 12
- 238000007689 inspection Methods 0.000 claims 11
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 238000001514 detection method Methods 0.000 claims 2
- 238000005259 measurement Methods 0.000 claims 1
- 230000003287 optical Effects 0.000 claims 1
Claims (3)
上記プローブカード基板を加熱する手段、および上記加熱手段による加熱量を制御する加熱制御手段を備え、
上記プローブの先端の位置を、予め上記検査対象物が冷却されて収縮した位置に合わせて設定し、常温よりも低温での検査の際に、上記加熱制御手段によって上記発熱体による加熱量を制御することにより、上記プローブカード基板の熱変形量を制御し、上記プローブ先端の位置を調整することを特徴とする半導体検査装置。 A semiconductor inspection apparatus comprising a plurality of probes that contact an inspection object and a probe card substrate on which the probes are arranged ,
A means for heating the probe card substrate, and a heating control means for controlling the amount of heating by the heating means,
The position of the tip of the probe is set in advance according to the position where the inspection object is cooled and contracted, and the amount of heating by the heating element is controlled by the heating control means during inspection at a temperature lower than normal temperature. By doing so, the amount of thermal deformation of the probe card substrate is controlled, and the position of the probe tip is adjusted .
上記電流制御手段は、上記プローブカード基板の加熱量と熱変形量との関係、および上記加熱量と上記電流値との関係を基にして、位置補正を行うために必要な電流を上記発熱体に供給する機能を備えていることを特徴とする請求項２記載の半導体検査装置。 The position detection means sets a reference probe from the probes, detects the tip position of the reference probe using an optical measurement device, draws it on a two-dimensional coordinate, The position of the inspection object to be contacted by the probe is drawn on the two-dimensional coordinates, and the position of the inspection object actually contacted by the reference probe is detected and the two-dimensional By drawing on the coordinates of the above, with the function of calculating the positional deviation between the probe and the inspection object on the coordinates,
The current control means supplies the current required for position correction based on the relationship between the heating amount and the thermal deformation amount of the probe card substrate and the relationship between the heating amount and the current value to the heating element. 3. The semiconductor inspection apparatus according to claim 2, further comprising a function of supplying to the semiconductor inspection apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007148376A JP4981525B2 (en) | 2007-06-04 | 2007-06-04 | Semiconductor inspection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007148376A JP4981525B2 (en) | 2007-06-04 | 2007-06-04 | Semiconductor inspection equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008298749A JP2008298749A (en) | 2008-12-11 |
| JP2008298749A5 true JP2008298749A5 (en) | 2011-04-14 |
| JP4981525B2 JP4981525B2 (en) | 2012-07-25 |
Family
ID=40172384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007148376A Active JP4981525B2 (en) | 2007-06-04 | 2007-06-04 | Semiconductor inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4981525B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5258590B2 (en) * | 2009-01-16 | 2013-08-07 | 株式会社日本マイクロニクス | Integrated circuit testing equipment |
| JP5294954B2 (en) * | 2009-04-07 | 2013-09-18 | 株式会社日本マイクロニクス | Probe card manufacturing method |
| JP5235163B2 (en) | 2009-05-18 | 2013-07-10 | 株式会社日本マイクロニクス | Inspection device |
| US20140091826A1 (en) * | 2012-10-03 | 2014-04-03 | Corad Technology Inc. | Fine pitch interface for probe card |
| KR102077062B1 (en) | 2013-02-25 | 2020-02-13 | 삼성전자주식회사 | Probe card and apparatus for testing an object including the same |
| CN106269542B (en) * | 2015-06-11 | 2018-05-22 | 鸿劲科技股份有限公司 | Electronic component preheats pre-cooler and its implement of application |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05152389A (en) * | 1991-11-27 | 1993-06-18 | Mitsubishi Electric Corp | Probe card |
| JP3103959B2 (en) * | 1993-08-18 | 2000-10-30 | 東京エレクトロン株式会社 | Probe device |
| JPH11145215A (en) * | 1997-11-11 | 1999-05-28 | Mitsubishi Electric Corp | Tester for semiconductor and controlling method therefor |
| JP2000346875A (en) * | 1999-06-07 | 2000-12-15 | Advantest Corp | Probe card and ic testing device using it |
| JP2003215162A (en) * | 2002-01-17 | 2003-07-30 | Seiko Epson Corp | Probe card, and semi-conductor measuring instrument provided with the same |
-
2007
- 2007-06-04 JP JP2007148376A patent/JP4981525B2/en active Active
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