JP2017527107A5 - - Google Patents

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Publication number
JP2017527107A5
JP2017527107A5 JP2017502835A JP2017502835A JP2017527107A5 JP 2017527107 A5 JP2017527107 A5 JP 2017527107A5 JP 2017502835 A JP2017502835 A JP 2017502835A JP 2017502835 A JP2017502835 A JP 2017502835A JP 2017527107 A5 JP2017527107 A5 JP 2017527107A5
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JP
Japan
Prior art keywords
polishing
pressure control
pad
substrate
control pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2017502835A
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Japanese (ja)
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JP2017527107A (en
JP6778176B2 (en
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Publication date
Priority claimed from US14/334,948 external-priority patent/US9662762B2/en
Application filed filed Critical
Priority claimed from PCT/US2015/040064 external-priority patent/WO2016010865A1/en
Publication of JP2017527107A publication Critical patent/JP2017527107A/en
Publication of JP2017527107A5 publication Critical patent/JP2017527107A5/ja
Application granted granted Critical
Publication of JP6778176B2 publication Critical patent/JP6778176B2/en
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Description

上記のように、精密制御研磨ヘッド２０２及び研磨パッド２０４は、研磨中、基板２１２に対して回転し得る。この結果、圧力制御パッド２２０もまた、基板２１２に対して回転する。圧力制御パッド２２０によって印加された局所的圧力による局所的研磨は、径方向の円周全体に沿って行われ得る。ある実施形態では、研磨ヘッド２０２及び研磨パッド２０４を回転する代わりに、モータ２０６が研磨パッドを振動させて、圧力制御パッド２２０に対応する箇所の基板表面２１４から材料を取り除く。その後、圧力制御パッド２２０は、異なる箇所から材料を取り除くため、その異なる箇所へと移動され得る。圧力制御パッドの箇所は、基板の所望の厚さプロファイルと実際の厚さプロファイルとに基づいて、あらかじめ決められていることができる。 As described above, the precision controlled polishing head 202 and polishing pad 204 can rotate relative to the substrate 212 during polishing. As a result, the pressure control pad 220 also rotates with respect to the substrate 212. Local polishing with local pressure applied by the pressure control pad 220 may be performed along the entire radial circumference. In some embodiments, instead of rotating the polishing head 202 and polishing pad 204, a motor 206 causes the polishing pad to vibrate to remove material from the substrate surface 214 at a location corresponding to the pressure control pad 220. Thereafter, the pressure control pad 220 can be moved to a different location to remove material from the different location. The location of the pressure control pad can be predetermined based on the desired thickness profile and the actual thickness profile of the substrate.

JP2017502835A 2014-07-18 2015-07-10 Adjusting the board thickness profile Active JP6778176B2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462026269P 2014-07-18 2014-07-18
US14/334,948 2014-07-18
US62/026,269 2014-07-18
US14/334,948 US9662762B2 (en) 2014-07-18 2014-07-18 Modifying substrate thickness profiles
PCT/US2015/040064 WO2016010865A1 (en) 2014-07-18 2015-07-10 Modifying substrate thickness profiles

Publications (3)

Publication Number Publication Date
JP2017527107A JP2017527107A (en) 2017-09-14
JP2017527107A5 true JP2017527107A5 (en) 2018-08-23
JP6778176B2 JP6778176B2 (en) 2020-10-28

Family

ID=55078939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017502835A Active JP6778176B2 (en) 2014-07-18 2015-07-10 Adjusting the board thickness profile

Country Status (5)

Country Link
JP (1) JP6778176B2 (en)
KR (1) KR102376928B1 (en)
CN (1) CN106463384B (en)
TW (1) TWI691379B (en)
WO (1) WO2016010865A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102666494B1 (en) * 2016-03-25 2024-05-17 어플라이드 머티어리얼스, 인코포레이티드 Polishing pad assemblies for local area polishing systems and polishing systems
JP7044774B2 (en) * 2016-10-10 2022-03-30 アプライド マテリアルズ インコーポレイテッド Real-time profile control for chemical mechanical polishing
SG10202111787PA (en) * 2016-10-18 2021-11-29 Ebara Corp Local polisher, method of a local polisher and program
KR102629679B1 (en) * 2018-11-09 2024-01-29 주식회사 케이씨텍 Carrier head of chemical mechanical apparatus and membrane used therein
TWI834195B (en) 2019-04-18 2024-03-01 美商應用材料股份有限公司 Computer readable storage medium of temperature-based in-situ edge assymetry correction during cmp
US11282755B2 (en) 2019-08-27 2022-03-22 Applied Materials, Inc. Asymmetry correction via oriented wafer loading
TWI797501B (en) 2019-11-22 2023-04-01 美商應用材料股份有限公司 Wafer edge asymmetry correction using groove in polishing pad
CN111975469A (en) * 2020-08-28 2020-11-24 上海华力微电子有限公司 Chemical mechanical polishing method and polishing system

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06333891A (en) * 1993-05-24 1994-12-02 Sony Corp Substrate polishing apparatus and substrate holding table
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US5558563A (en) * 1995-02-23 1996-09-24 International Business Machines Corporation Method and apparatus for uniform polishing of a substrate
US6267659B1 (en) * 2000-05-04 2001-07-31 International Business Machines Corporation Stacked polish pad
JP2002246346A (en) * 2001-02-14 2002-08-30 Hiroshima Nippon Denki Kk Chemical mechanical polishing equipment
US20020164926A1 (en) * 2001-05-07 2002-11-07 Simon Mark G. Retainer ring and method for polishing a workpiece
US6863771B2 (en) * 2001-07-25 2005-03-08 Micron Technology, Inc. Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
US6764387B1 (en) * 2003-03-07 2004-07-20 Applied Materials Inc. Control of a multi-chamber carrier head
US6913518B2 (en) * 2003-05-06 2005-07-05 Applied Materials, Inc. Profile control platen
TWI275451B (en) * 2005-01-11 2007-03-11 Asia Ic Mic Process Inc Measurement of thickness profile and elastic modulus profile of polishing pad
US7198548B1 (en) * 2005-09-30 2007-04-03 Applied Materials, Inc. Polishing apparatus and method with direct load platen
US8858300B2 (en) * 2010-02-09 2014-10-14 International Business Machines Corporation Applying different pressures through sub-pad to fixed abrasive CMP pad
JP2014501455A (en) * 2011-01-03 2014-01-20 アプライド マテリアルズ インコーポレイテッド Pressure controlled polishing platen
JP6282437B2 (en) * 2012-10-18 2018-02-21 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Damper for polishing pad conditioner
US20140141694A1 (en) * 2012-11-21 2014-05-22 Applied Materials, Inc. In-Sequence Spectrographic Sensor

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