JP2016087780A5 - - Google Patents
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- Publication number
- JP2016087780A5 JP2016087780A5 JP2015168088A JP2015168088A JP2016087780A5 JP 2016087780 A5 JP2016087780 A5 JP 2016087780A5 JP 2015168088 A JP2015168088 A JP 2015168088A JP 2015168088 A JP2015168088 A JP 2015168088A JP 2016087780 A5 JP2016087780 A5 JP 2016087780A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- temperature sensor
- polishing pad
- pad
- eddy current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 65
- 239000000758 substrate Substances 0.000 claims description 12
- 229910000859 α-Fe Inorganic materials 0.000 claims 3
- 239000007788 liquid Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG10201801305PA SG10201801305PA (en) | 2014-10-31 | 2015-10-28 | Polishing Apparatus And Polishing Method |
| SG10201508881RA SG10201508881RA (en) | 2014-10-31 | 2015-10-28 | Polishing Apparatus And Polishing Method |
| US14/925,063 US20160121452A1 (en) | 2014-10-31 | 2015-10-28 | Polishing apparatus and polishing method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014223293 | 2014-10-31 | ||
| JP2014223293 | 2014-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016087780A JP2016087780A (ja) | 2016-05-23 |
| JP2016087780A5 true JP2016087780A5 (cg-RX-API-DMAC7.html) | 2018-09-13 |
Family
ID=56015959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015168088A Pending JP2016087780A (ja) | 2014-10-31 | 2015-08-27 | 研磨装置および研磨方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2016087780A (cg-RX-API-DMAC7.html) |
| SG (2) | SG10201508881RA (cg-RX-API-DMAC7.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017064899A (ja) * | 2015-10-01 | 2017-04-06 | 株式会社荏原製作所 | 研磨装置 |
| JP6779633B2 (ja) * | 2016-02-23 | 2020-11-04 | 株式会社荏原製作所 | 研磨装置 |
| US10391610B2 (en) * | 2016-10-21 | 2019-08-27 | Applied Materials, Inc. | Core configuration for in-situ electromagnetic induction monitoring system |
| KR102489419B1 (ko) | 2017-01-13 | 2023-01-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 인-시튜 모니터링으로부터의 측정들의 비저항 기반 조정 |
| JP2024019825A (ja) * | 2022-08-01 | 2024-02-14 | 株式会社荏原製作所 | 研磨装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001041828A (ja) * | 1999-07-27 | 2001-02-16 | Tokyo Gas Co Ltd | 温度測定装置及びそれを利用した測定方法 |
| JP2005517290A (ja) * | 2002-02-06 | 2005-06-09 | アプライド マテリアルズ インコーポレイテッド | 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置 |
| JP2004014999A (ja) * | 2002-06-11 | 2004-01-15 | Hitachi Chem Co Ltd | Ｃｍｐ研磨装置及び研磨方法 |
| KR100506942B1 (ko) * | 2003-09-03 | 2005-08-05 | 삼성전자주식회사 | 화학적 기계적 연마장치 |
| JP4451111B2 (ja) * | 2003-10-20 | 2010-04-14 | 株式会社荏原製作所 | 渦電流センサ |
| JP2009125825A (ja) * | 2007-11-20 | 2009-06-11 | Ebara Corp | 電解複合研磨方法及び電解複合研磨装置 |
| US8523429B2 (en) * | 2009-10-19 | 2013-09-03 | Tsi Technologies Llc | Eddy current thermometer |
-
2015
- 2015-08-27 JP JP2015168088A patent/JP2016087780A/ja active Pending
- 2015-10-28 SG SG10201508881RA patent/SG10201508881RA/en unknown
- 2015-10-28 SG SG10201801305PA patent/SG10201801305PA/en unknown