JP2016082273A - Electronic apparatus - Google Patents
Electronic apparatus Download PDFInfo
- Publication number
- JP2016082273A JP2016082273A JP2014208503A JP2014208503A JP2016082273A JP 2016082273 A JP2016082273 A JP 2016082273A JP 2014208503 A JP2014208503 A JP 2014208503A JP 2014208503 A JP2014208503 A JP 2014208503A JP 2016082273 A JP2016082273 A JP 2016082273A
- Authority
- JP
- Japan
- Prior art keywords
- elastic member
- high thermal
- heat
- main body
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Studio Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本発明は、熱源を持つ本体部と、本体部に対して開閉可能な可動部で構成される電子機器の放熱構造に関する。 The present invention relates to a heat dissipation structure for an electronic device including a main body having a heat source and a movable part that can be opened and closed with respect to the main body.
従来の電子機器の放熱構造は、開閉可能なヒンジ部を持つ表示部と、熱源を持つ本体で構成された電子機器の場合、熱源を持つ本体の外装面から放熱することが一般的である。その中でも表示部を閉じた際に表示部と近接する本体外装面近傍に熱源を配置し、表示部を閉じた際に表示部と近接する本体外装面から放熱することで本体のユーザー把持部を熱くすることなく、本体の効率的な放熱を可能とした製品などがある(非特許文献1参照)。 In a conventional electronic device heat dissipation structure, in the case of an electronic device composed of a display unit having a hinge portion that can be opened and closed and a main body having a heat source, heat is generally radiated from the exterior surface of the main body having the heat source. Among them, when the display unit is closed, a heat source is arranged in the vicinity of the main unit exterior surface close to the display unit, and when the display unit is closed, heat is dissipated from the main unit exterior surface adjacent to the display unit to There are products that enable efficient heat dissipation of the main body without heating (see Non-Patent Document 1).
ここで、上記の非特許文献1の本体内部の放熱構造を図2を用いて説明する。まず上記した、表示部を閉じた際に表示部と近接する本体外装面21の内側一面に熱を広げて放熱効率を高めるための放熱板金22(銅板やアルミ板等)を配置する。また熱源24と放熱板金22の間に熱源24からの熱を放熱板金22に伝える高熱伝導弾性部材23(熱伝導ゴム等)を配置する。 Here, the heat dissipation structure inside the main body of Non-Patent Document 1 will be described with reference to FIG. First, a heat dissipating metal plate 22 (a copper plate, an aluminum plate, or the like) is disposed on the inner surface of the main body exterior surface 21 adjacent to the display unit when the display unit is closed to increase heat dissipation efficiency. Further, a highly heat conductive elastic member 23 (heat conductive rubber or the like) that transfers heat from the heat source 24 to the heat radiating metal plate 22 is disposed between the heat source 24 and the heat radiating metal plate 22.
上記の構成により、熱源24の熱が高熱伝導弾性部材23を介して放熱板22に伝わり、放熱板22一面に広がるため、本体外装面21一面に熱が広がり、外気と熱交換することで放熱する構造となる。 With the above configuration, the heat of the heat source 24 is transmitted to the heat radiating plate 22 via the high thermal conductive elastic member 23 and spreads over the entire surface of the heat radiating plate 22. It becomes the structure to do.
しかしながら、上記の製品ではビューファインダーを使用する場合などで表示部を閉じたまま使用することがある。その際、表示部を閉じたままでは外装面21からの放熱効率が低下する問題があった。 However, the above products may be used with the display unit closed when using a viewfinder. At that time, there is a problem that the heat radiation efficiency from the exterior surface 21 is lowered if the display unit is closed.
上記の問題に対し解決可能な手段の一つとして、本体の熱を開閉可能なヒンジ部を通して表示部に伝熱し、表示部から放熱する提案がなされている(特許文献1参照)。 As one of the means that can solve the above problem, there has been proposed a method in which heat of the main body is transferred to the display unit through a hinge unit that can be opened and closed and radiated from the display unit (see Patent Document 1).
しかしながら、上記の特許文献1では、介在する部品が多く、かつ熱伝導の経路が長く細いため放熱効率良くなかった。 However, in the above-mentioned Patent Document 1, there are many intervening parts, and the heat conduction path is long and thin, so the heat dissipation efficiency is not good.
本発明の目的は、介在する部品が少なく、かつ熱伝導の経路が短い放熱効率の良い電子機器を提供することにある。 An object of the present invention is to provide an electronic device with good heat dissipation efficiency with few intervening components and a short heat conduction path.
本発明は、把持部を含む本体部11と可動部12、前記本体部11に対して前記可動部12を少なくとも開閉可能に接続するヒンジ部13と、前記本体11内部に熱源112を有し、前記可動部12を閉めた際に、前記可動部12の近傍に熱源112を配置した電子機器において、
前記熱源112と熱的に接続されている高熱伝導弾性部材111を前記本体部11内に有し、前記高熱伝導弾性部材111は前記可動部12の閉時のみに可動部12と当接する配置とし、
前記可動部12は少なくとも前記高熱伝導弾性部材111と当接する個所121が高熱伝導部であることを特徴とする。
The present invention has a main body part 11 including a gripping part, a movable part 12, a hinge part 13 that connects the movable part 12 to the main body part 11 so as to be openable and closable, and a heat source 112 inside the main body 11, In the electronic device in which the heat source 112 is disposed in the vicinity of the movable part 12 when the movable part 12 is closed,
The main body 11 has a high thermal conductivity elastic member 111 thermally connected to the heat source 112, and the high thermal conductivity elastic member 111 is disposed so as to contact the movable portion 12 only when the movable portion 12 is closed. ,
The movable portion 12 is characterized in that at least a portion 121 in contact with the high thermal conductivity elastic member 111 is a high thermal conductivity portion.
本発明によれば、介在する部品が少なく、かつ熱伝導の経路が短く、放熱効率の良い電子機器の提供を実現できる。 ADVANTAGE OF THE INVENTION According to this invention, provision of the electronic device with few intervening parts, a short heat conduction path | route, and favorable heat dissipation efficiency is realizable.
以下、本発明を実施するための形態を図面に基づいて説明する。 Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
<第1の実施形態>
図1は本実施形態における電子機器の構成要素の説明である。本実施形態は、把持部を含む本体部11と可動部12(例えば表示部等)、前記本体部11と可動部12を少なくとも開閉可能に接続する付勢式ヒンジ部13、外部充電端子部14、バッテリ部15、ビューファインダー16、高熱伝導弾性部材111(放熱ゴムや熱伝導シリコンスポンジ等)、前記本体部11内部に熱源112、熱源の中の高発熱源1121(電源回路ブロック等)、開口部1131を持つ外観カバー113、熱源112の熱を広げる放熱板114、可動部12の一部であり前記高熱伝導弾性部材111との当接個所121、高熱伝導部材(高熱伝導モールドや金属など)のトップカバー122、電気回路基板123、LCDユニット124、高熱伝導部材のボトムカバー125、前記トップカバー122とボトムカバーを接続するビス126を有する電子機器である。
<First Embodiment>
FIG. 1 is a diagram illustrating components of an electronic device according to this embodiment. In the present embodiment, a main body portion 11 including a gripping portion and a movable portion 12 (for example, a display portion), a biasing hinge portion 13 that connects the main body portion 11 and the movable portion 12 so as to be openable and closable, and an external charging terminal portion 14. , Battery unit 15, viewfinder 16, high thermal conductive elastic member 111 (heat radiation rubber, thermal conductive silicon sponge, etc.), heat source 112 inside the main unit 11, high heat source 1121 (power circuit block etc.) in the heat source, opening An external cover 113 having a portion 1131; a heat radiating plate 114 that spreads heat from the heat source 112; a part 121 of the movable portion 12 that is in contact with the high thermal conductive elastic member 111; a high thermal conductive member (high thermal conductive mold, metal, etc.) Top cover 122, electric circuit board 123, LCD unit 124, bottom cover 125 of a high thermal conductivity member, top cover 122 and bottom cover An electronic device having a screw 126 to be connected.
図1aは一体化状態での可動部12の閉状態(この時、可動部12は閉方向に付勢されている)を表す図である。図1bは一体化状態での可動部12の開状態を表す図である。図1cは本体11内部の構成を表す図である。図1dは可動部12内部の構成を表す図である。図1eは図1dの可動部12の組み立て状態を表す図である。 FIG. 1A is a diagram illustrating a closed state of the movable portion 12 in the integrated state (at this time, the movable portion 12 is urged in the closing direction). FIG. 1B is a diagram illustrating an open state of the movable unit 12 in an integrated state. FIG. 1 c is a diagram illustrating the internal configuration of the main body 11. FIG. 1 d is a diagram illustrating the internal configuration of the movable unit 12. FIG. 1e is a diagram illustrating an assembled state of the movable portion 12 of FIG. 1d.
上記の構成において、図1cに示すように高熱伝導弾性部材111は、熱源112上に配置され、開口1131を持つ外観カバー113とで挟みこまれることで、熱源112と熱的に接続される。また、図1bに示すように開口を持つ外観カバー113の開口部1131から高熱伝導弾性部材111が一部外観に露出する。前記高熱伝導弾性部材111は、図1bに示すように前記可動部12の閉時(図1aのような場合)のみに可動部12と当接する配置とし、前記可動部12は少なくとも当接個所121が高熱伝導部材(金属もしくは高熱伝導モールド等)である。これにより、可動部12の閉時の場合にのみ、可動部12に本体内部の熱源112の熱が伝わり放熱される構成となる。そして介在する部品が少なく、かつ熱伝導の経路が短く、放熱効率の良い構成となる。 In the above configuration, as shown in FIG. 1c, the high thermal conductive elastic member 111 is disposed on the heat source 112 and is thermally connected to the heat source 112 by being sandwiched between the appearance cover 113 having the opening 1131. Further, as shown in FIG. 1B, the high thermal conductive elastic member 111 is partially exposed from the opening 1131 of the outer cover 113 having an opening. As shown in FIG. 1B, the high thermal conductive elastic member 111 is disposed so as to contact the movable portion 12 only when the movable portion 12 is closed (as shown in FIG. 1A), and the movable portion 12 is at least a contact portion 121. Is a high heat conductive member (metal or high heat conductive mold or the like). Thereby, only when the movable part 12 is closed, the heat of the heat source 112 inside the main body is transmitted to the movable part 12 and radiated. In addition, there are few intervening parts, the heat conduction path is short, and the heat radiation efficiency is good.
また上記の構成により、ユーザーが可動部12を開いて可動部12を把持する場合に、可動部12に熱が伝わらないので把持部が熱くなることはない。この場合の放熱は外観カバー113によって行われる。 Also, with the above configuration, when the user opens the movable part 12 and grips the movable part 12, heat is not transmitted to the movable part 12, so the grip part does not become hot. In this case, the heat radiation is performed by the appearance cover 113.
また図1eに示すように、当接個所121はトップカバー122とボトムカバー125を接続するビス126の近傍に配置する。また図1dに示すように、トップカバー122とボトムカバー125をネジ126で接合することでトップカバー122とボトムカバー125は短い経路で熱的な接続を持つ構成となる。 Further, as shown in FIG. 1e, the contact portion 121 is disposed in the vicinity of the screw 126 connecting the top cover 122 and the bottom cover 125. Also, as shown in FIG. 1d, the top cover 122 and the bottom cover 125 are joined by screws 126 so that the top cover 122 and the bottom cover 125 have a thermal connection with a short path.
上記の構成により、高熱伝導弾性部材111から伝えられた熱が、当接個所121、高熱伝導部材のボトムカバー125、高熱伝導部材のトップカバー122へと順番に伝熱する。その際に当接個所121とトップカバー122とボトムカバーを接続するビス126を近傍に配置することで、伝熱の損失が最小で可動部12を閉じた際の主外観となる高熱伝導部材のトップカバー122へ伝わり、可動部12を閉じた際に熱源112の効率的な放熱が可能となる。 With the above configuration, the heat transferred from the high thermal conductive elastic member 111 is sequentially transferred to the contact portion 121, the bottom cover 125 of the high thermal conductive member, and the top cover 122 of the high thermal conductive member. At that time, the screw 126 connecting the contact portion 121, the top cover 122, and the bottom cover is disposed in the vicinity, so that the heat transfer loss is minimized and the high heat conduction member that becomes the main appearance when the movable portion 12 is closed is provided. When transmitted to the top cover 122 and the movable part 12 is closed, the heat source 112 can efficiently dissipate heat.
また図1bに示すように、当接個所121は、可動部12の他の面より一段高い面形状となり、高熱伝導弾性部材111は、本体部11の他の面より一段低い面に配置する。これにより、可動部12への放熱構造を保ったまま、ユーザーが高熱伝導弾性部材111に容易に触れることができなくなり、低温やけど等の可能性を低減できる。 Further, as shown in FIG. 1 b, the contact portion 121 has a surface shape that is one step higher than the other surface of the movable portion 12, and the high thermal conductive elastic member 111 is disposed on a surface that is one step lower than the other surface of the main body portion 11. As a result, the user cannot easily touch the high thermal conductive elastic member 111 while maintaining the heat dissipation structure to the movable portion 12, and the possibility of low temperature burns or the like can be reduced.
また図1aに示すように、バッテリ15や外部充電端子14は、前記高熱伝導弾性部材111近傍に配置する。これは高発熱源1121となる電源回路の近傍にバッテリ15や外部充電端子14を配置することが一般的であるため、バッテリ15や外部充電端子14は、前記高熱伝導弾性部材111近傍に配置することで、高発熱源1121から直接高熱伝導弾性部材111に伝熱でき、効率の良い放熱が可能となる。 Further, as shown in FIG. 1a, the battery 15 and the external charging terminal 14 are disposed in the vicinity of the high thermal conductive elastic member 111. In general, the battery 15 and the external charging terminal 14 are disposed in the vicinity of the power supply circuit serving as the high heat generation source 1121. Therefore, the battery 15 and the external charging terminal 14 are disposed in the vicinity of the high thermal conductive elastic member 111. Thus, heat can be directly transferred from the high heat generation source 1121 to the high thermal conductive elastic member 111, and efficient heat dissipation can be achieved.
また図1bに示すように、高熱伝導弾性部材111は、前記ヒンジ部13の近傍以外に配置する。これは、可動部12を閉めた際に可動部12の当接個所121と高熱伝導弾性部材111が当接し、衝撃を効率的に軽減できる。 Further, as shown in FIG. 1b, the high thermal conductive elastic member 111 is disposed outside the vicinity of the hinge portion 13. This is because when the movable portion 12 is closed, the contact portion 121 of the movable portion 12 and the high thermal conductive elastic member 111 come into contact with each other, and the impact can be efficiently reduced.
以上、本発明をその好適な実施形態に基づいて詳述してきたが、本発明はこれら特定の実施形態に限られるものではなく、この発明の要旨を逸脱しない範囲の様々な形態も本発明に含まれる。上述の実施形態の一部を適宜組み合わせてもよい。 Although the present invention has been described in detail based on preferred embodiments thereof, the present invention is not limited to these specific embodiments, and various forms within the scope of the present invention are also included in the present invention. included. A part of the above-described embodiments may be appropriately combined.
11 本体部、12 可動部、13 付勢式ヒンジ部、14 外部充電端子部、15 バッテリ部、16 ビューファインダー、111 高熱伝導弾性部材、112 熱源、113 開口部1131を持つ外観カバー、114 熱源112の熱を広げる放熱板、1121 熱源の中の高発熱源、1113 開口部 DESCRIPTION OF SYMBOLS 11 Main-body part, 12 Movable part, 13 Energizing-type hinge part, 14 External charge terminal part, 15 Battery part, 16 Viewfinder, 111 High heat conduction elastic member, 112 Heat source, 113 Appearance cover with opening 1131, 114 Heat source 112 Heat dissipation plate to spread the heat of heat, 1121 high heat source in heat source, 1113 opening
Claims (6)
前記熱源112と熱的に接続されている高熱伝導弾性部材111を前記本体部11内に有し、前記高熱伝導弾性部材111は前記可動部12の閉時のみに可動部12と当接する配置とし、
前記可動部12は少なくとも前記高熱伝導弾性部材111と当接する個所121が高熱伝導部であることを特徴とする電子機器。 A main body 11 and a movable part 12 including a gripping part, a hinge part 13 that connects the movable part 12 to the main body part 11 so as to be openable and closable, and a heat source 112 inside the main body 11. In the electronic device in which the heat source 112 is disposed in the vicinity of the movable portion 12 when the
The main body 11 has a high thermal conductivity elastic member 111 thermally connected to the heat source 112, and the high thermal conductivity elastic member 111 is disposed so as to contact the movable portion 12 only when the movable portion 12 is closed. ,
2. The electronic apparatus according to claim 1, wherein at least a portion 121 where the movable portion 12 contacts with the high thermal conductivity elastic member 111 is a high thermal conductivity portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014208503A JP2016082273A (en) | 2014-10-10 | 2014-10-10 | Electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014208503A JP2016082273A (en) | 2014-10-10 | 2014-10-10 | Electronic apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016082273A true JP2016082273A (en) | 2016-05-16 |
Family
ID=55956508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014208503A Pending JP2016082273A (en) | 2014-10-10 | 2014-10-10 | Electronic apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2016082273A (en) |
-
2014
- 2014-10-10 JP JP2014208503A patent/JP2016082273A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101572446B1 (en) | Battery Cell Aseembly and Method for Manufacturing the Battery Cell Assembly | |
TWI539892B (en) | Electronic device | |
JP2017515300A (en) | Heat dissipation assembly and electronic device | |
TW201527932A (en) | Mobile terminal | |
JP6397045B2 (en) | mobile computer | |
JP2016045399A (en) | Heat radiation structure and electronic apparatus | |
GB2580440A (en) | Housing and device | |
CN203587951U (en) | Heat dissipation device of digital micromirror device | |
TWM452436U (en) | Solid state relay | |
TWI475952B (en) | Heat dissipating module with enhanced heat dissipation efficiency and electronic device therewith | |
CN109618542B (en) | Mobile terminal with heat gathering and conducting function | |
JP2016082273A (en) | Electronic apparatus | |
JP2017017123A (en) | Housing structure and electronic equipment using the same | |
WO2013189316A1 (en) | Terminal device | |
JP2005534197A (en) | Heat dissipation method for mobile phone device | |
WO2020052030A1 (en) | Flexible electronic device | |
TWI264272B (en) | A battery module for electrical apparatus | |
JP2007265800A (en) | Charging cradle | |
JP3220696U (en) | Smartphone case | |
KR20120076309A (en) | A mobile phone cooler | |
JP2012047887A (en) | Portable electronic device | |
JP2012104549A (en) | Heat radiation structure and method of portable terminal device | |
TWI546652B (en) | Heat dissipation unit of handheld electronic device | |
CN216057971U (en) | Heat radiator | |
JP2006135559A (en) | Mobile electronic equipment |