CN203587951U - Heat dissipation device of digital micromirror device - Google Patents
Heat dissipation device of digital micromirror device Download PDFInfo
- Publication number
- CN203587951U CN203587951U CN201320700631.5U CN201320700631U CN203587951U CN 203587951 U CN203587951 U CN 203587951U CN 201320700631 U CN201320700631 U CN 201320700631U CN 203587951 U CN203587951 U CN 203587951U
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- heat
- radiating
- chilling plate
- heat pipe
- semiconductor chilling
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation device of a digital micromirror device. A semiconductor refrigeration sheet powered by a direct current power supply serves as a heat dissipation refrigeration sheet. The semiconductor refrigeration sheet is composed of two ceramic sheets which are connected with each other in series. N-type and Y-type semiconductor materials are arranged between the two ceramic sheets. Contacts, of which the currents flow from the N-type elements to the P-type elements, absorb heat to become cool terminals; and contacts, of which the currents flow from the P-type elements to the N-type elements, release heat to become hot terminals. By adopting the above technical scheme, the semiconductor refrigeration sheet powered by the direct current power supply serves as the heat dissipation refrigeration sheet, so that the heat dissipation device is capable of cooling the digital micromirror device well, the stability of the digital micromirror device is ensured, and the adaption capability of the whole machine to external environment is improved.
Description
Technical field
The utility model is related to a kind of data micro mirror heat abstractor.
Background technology
DLP projector is also referred to as data projector, i.e. data light and handled, and its core component is DMD, i.e. data micro-mirror device, and other parts also have bulb, light path and camera lens etc..
DMD operation principles：When light is after prism resolves into R, G, B three primary colors, project dmd chip, it is made up of on dmd chip many small eyeglasses, each eyeglass can be rotated freely and positioned by electric charge between -10 ° and+10 °, signal input acts on dmd chip after treatment, so as to control the deflection of eyeglass, incident ray arrives projection lens projection imaging after the reflection of DMD eyeglasses.
DMD is as the pith in light path, along with temperature is very big on its Performance And Reliability influence, so DMD radiatings are exactly critically important work.
Utility model content
The purpose of this utility model is to provide a kind of preferable data micro mirror heat abstractor, too big on Performance And Reliability influence to overcome the DMD temperature of prior art too high.
The technical scheme that the utility model solution above-mentioned technical problem is taken is as follows：
A kind of data micro mirror heat abstractor, radiating cooling piece is used as using the semiconductor chilling plate powered by dc source, the potsherd that the semiconductor chilling plate is connected by two panels is constituted, there is the semi-conducting material of N-type and p-type in the middle of it, the joint that electric current flows to p-type element by N-type element absorbs heat and as cold end, the joint for flowing to N-type element by p-type element discharges heat and turns into hot junction.
It is preferred that structure be that the semiconductor chilling plate is covered on the data micro-mirror device, and the cold end of the semiconductor chilling plate with first radiating heat pipe be connected.
It is preferred that structure be provided with fan it to be blowed radiating in the side of the described first radiating heat pipe.
It is preferred that structure be, the hot junction of the semiconductor chilling plate with second radiating heat pipe be connected, it is described two radiating heat pipe heats be directly emitted among air.
It is preferred that structure be, the data micro-mirror device and first radiating heat pipe between be provided with heat-conducting silicone grease.
It is preferred that structure be, the semiconductor chilling plate and first radiating heat pipe and second radiating heat pipe between be provided with heat-conducting silicone grease.
The utility model is taken after such scheme, because using the semiconductor chilling plate powered by dc source, as radiating cooling piece, it can be good at giving DMD coolings, it is ensured that DMD reliability, improves the adaptability of whole machine environment to external world.
Other features and advantages of the utility model will be illustrated in the following description, also, partly be become apparent from specification, or be understood by implementing the utility model.The purpose of this utility model and other advantages can be realized and obtained by specifically noted structure in the specification, claims and accompanying drawing write.
Brief description of the drawings
The utility model is described in detail below in conjunction with the accompanying drawings, to cause above-mentioned advantage of the present utility model definitely.
Fig. 1 is the structural representation of the utility model data micro mirror heat abstractor；
Fig. 2 is the structural representation of the semiconductor chilling plate of the utility model data micro mirror heat abstractor；
Fig. 3 is the connection diagram between the DMD and the first heat pipe of the utility model data micro mirror heat abstractor；
Fig. 4 is the connection diagram between the semiconductor chilling plate and the first heat pipe and the second heat pipe of utility model data micro mirror heat abstractor.
Embodiment
The utility model is described in detail with reference to specific embodiment.
Specifically, the utility model is radiated using semiconductor chilling plate TEC to DMD, while being radiated to power panel, apparatus for lighting up.Machine is set to be used in 50-60 DEG C of environment（General projector can only work below 40 DEG C）.
Wherein, semiconductor chilling plate TEC operation principle：
The work operating of semiconductor chilling plate is to use DC current, determine to realize refrigeration on same cooling piece by changing the polarity of DC current or heat, as shown in Figure 2, it is a cooling piece, it is made up of two panels potsherd, there is the semi-conducting material of N-type and p-type in the middle of it, this semiconductor element is to be linked to constitute with cascade on circuit.
And when one piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to galvanic couple pair, connect in this circuit after DC current, the transfer with regard to energy can be produced.The joint that electric current flows to p-type element by N-type element absorbs heat, as cold end.The joint for flowing to N-type element by p-type element discharges heat, as hot junction.
Thus, TEC cooling pieces cold end and heat pipe in the case of energization（Cold end）It is connected, whole heat pipe temperature reduction, heat pipe（Cold end）DMD temperature is directly reduced, while using fan opposite heat tube（Cold end）Fin blowing, for cooling to power panel.TEC hot junction and heat pipe（Hot junction）It is connected, heat is directly emitted in air.
According to as above principle, as shown in Figure 1, the utility model data micro mirror heat abstractor, on casing 6, it is mainly used as radiating cooling piece using the semiconductor chilling plate powered by dc source, the potsherd 11 that the semiconductor chilling plate 1 is connected by two panels is constituted, and metallic conductor 12 is arranged respectively at bottom, and have the semi-conducting material of N-type and p-type in the middle of two metallic conductors 12, the joint that electric current flows to p-type element by N-type element absorbs heat and turns into cold end, the joint release heat of N-type element is flowed to by p-type element and turns into hot junction, and in a preferred embodiment, the dc source is located among power pack 5.
It is preferred that structure be that the semiconductor chilling plate is covered on the data micro-mirror device 2, and the cold end of the semiconductor chilling plate with first radiating heat pipe 4（Cold end）It is connected.
It is blowed radiating provided with fan 3 in the side of the described first radiating heat pipe.
In a further embodiment, the hot junction of the semiconductor chilling plate and the second radiating heat pipe 7（Hot junction）It is connected, the heat of the two radiatings heat pipe is directly emitted among air.
It is preferred that structure be, as shown in figure 3, the data micro-mirror device and first radiating heat pipe between be provided with heat-conducting silicone grease 8.
It is preferred that structure be, as shown in figure 4, the semiconductor chilling plate and first radiating heat pipe and second radiating heat pipe between be provided with heat-conducting silicone grease.
The utility model is taken after such scheme, because using the semiconductor chilling plate powered by dc source, as radiating cooling piece, it can be good at giving DMD coolings, it is ensured that DMD reliability, improves the adaptability of whole machine environment to external world.
Specifically, apparatus above has the beneficial effect that：
1st, TEC can be very good to cool to DMD, it is ensured that DMD reliability；
2nd, fan blows heat pipe（Cold end）Air temperature be less than ambient temperature, be conducive to power panel preferably to radiate；
3rd, the adaptability of whole machine environment to external world is improved, can be that projector uses in extraneous 50-60 DEG C of environment；
4th, it can apply in powerful machine, improve TEC power to ensure that DMD temperature is reached in specification.
Finally it should be noted that：It the foregoing is only preferred embodiment of the present utility model, it is not limited to the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for a person skilled in the art, it can still modify to the technical scheme described in foregoing embodiments, or carry out equivalent to which part technical characteristic.It is all it is of the present utility model spirit and principle within, any modifications, equivalent substitutions and improvements made etc. should be included within protection domain of the present utility model.
Claims (6)
1. a kind of data micro mirror heat abstractor, it is characterized in that, radiating cooling piece is used as using the semiconductor chilling plate powered by dc source, the potsherd that the semiconductor chilling plate is connected by two panels is constituted, there is the semi-conducting material of N-type and p-type in the middle of it, the joint that electric current flows to p-type element by N-type element absorbs heat and as cold end, the joint for flowing to N-type element by p-type element discharges heat and turns into hot junction.
2. data micro mirror heat abstractor according to claim 1, it is characterised in that the semiconductor chilling plate is covered on the data micro-mirror device, and the cold end of the semiconductor chilling plate is connected with the first radiating heat pipe.
3. data micro mirror heat abstractor according to claim 2, it is characterised in that and it is blowed radiating provided with fan in the side of the described first radiating heat pipe.
4. data micro mirror heat abstractor according to claim 1 or 2, it is characterised in that the hot junction of the semiconductor chilling plate is connected with the second radiating heat pipe, the heat of the two radiatings heat pipe is directly emitted among air.
5. data micro mirror heat abstractor according to claim 2, it is characterised in that be provided with heat-conducting silicone grease between the data micro-mirror device and the first radiating heat pipe.
6. data micro mirror heat abstractor according to claim 3, it is characterised in that be provided with heat-conducting silicone grease between the semiconductor chilling plate and the first radiating heat pipe and the second radiating heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320700631.5U CN203587951U (en) | 2013-11-07 | 2013-11-07 | Heat dissipation device of digital micromirror device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320700631.5U CN203587951U (en) | 2013-11-07 | 2013-11-07 | Heat dissipation device of digital micromirror device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203587951U true CN203587951U (en) | 2014-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320700631.5U Expired - Fee Related CN203587951U (en) | 2013-11-07 | 2013-11-07 | Heat dissipation device of digital micromirror device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203587951U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109669313A (en) * | 2018-10-29 | 2019-04-23 | 苏州佳世达光电有限公司 | Projector |
| CN112241097A (en) * | 2019-07-19 | 2021-01-19 | 无锡视美乐激光显示科技有限公司 | Projector heat dissipation system and control method thereof |
| CN112987463A (en) * | 2019-12-02 | 2021-06-18 | 青岛海信激光显示股份有限公司 | Optical machine and laser projection equipment |
| CN113382217A (en) * | 2020-02-25 | 2021-09-10 | 青岛海信激光显示股份有限公司 | Laser television |
-
2013
- 2013-11-07 CN CN201320700631.5U patent/CN203587951U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109669313A (en) * | 2018-10-29 | 2019-04-23 | 苏州佳世达光电有限公司 | Projector |
| CN112241097A (en) * | 2019-07-19 | 2021-01-19 | 无锡视美乐激光显示科技有限公司 | Projector heat dissipation system and control method thereof |
| CN112241097B (en) * | 2019-07-19 | 2022-04-05 | 无锡视美乐激光显示科技有限公司 | Projector heat dissipation system and control method thereof |
| CN112987463A (en) * | 2019-12-02 | 2021-06-18 | 青岛海信激光显示股份有限公司 | Optical machine and laser projection equipment |
| CN112987463B (en) * | 2019-12-02 | 2023-03-14 | 青岛海信激光显示股份有限公司 | Optical machine and laser projection equipment |
| CN113382217A (en) * | 2020-02-25 | 2021-09-10 | 青岛海信激光显示股份有限公司 | Laser television |
| CN113382217B (en) * | 2020-02-25 | 2024-04-26 | 青岛海信激光显示股份有限公司 | Laser television |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140507 Termination date: 20161107 |
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| CF01 | Termination of patent right due to non-payment of annual fee |