TWI715854B - Heat dissipating device of light valve and projector - Google Patents

Abstract

In an embodiment of the present invention, a heat dissipating device of light valve and projector are disclosed. In the embodiment, a heat conducting component is disposed at the light receiving surface of the light transmitting component in the light valve module. The heat conducting component is used to conduct heat to another heat sink different from the heat sink on the back surface of the light valve, thereby allowing the light-transmitting element to dissipate heat in the vicinity, reducing the limitation of the design of the mechanism

Description

Light valve heat dissipation device and projector

The present invention relates to a light valve heat dissipation device and a projector, in particular to a light valve heat dissipation device and a projector with better light valve surface temperature relief capabilities.

In the field of projection, a spatial light modulator is an element that can convert illuminating light into image light. Among them, a light valve is a kind of spatial light modulator. In projectors, the more common types of light valves include liquid crystal panels (LCD), digital micro lens devices (DMD), or liquid crystal on silicon panels (LCOS). In order to protect the active matrix including a plurality of actuating elements in which the illuminating light can be converted into image light, the aforementioned various light valves often use light-transmitting elements such as glass as a protective cover to cover the surface thereof.

Since the light-transmitting element is arranged between each actuating element and the light source, the light-transmitting element will absorb part of the heat energy of the light when the light of the light source passes through, and the actuating element will also generate waste heat when it is activated. Proper heat dissipation may affect the normal operation of the actuating elements in the light valve, and reduce the reliability of the light valve.

The "prior art" paragraph is only used to help understand the content of the present invention. Therefore, the content disclosed in the "prior art" paragraph may include some conventional technologies that do not constitute the common knowledge in the technical field. The content disclosed in the "prior art" paragraph does not represent the content or the problem to be solved by one or more embodiments of the present invention, and has been known or recognized by those with ordinary knowledge in the technical field before the application of the present invention.

An example of the present invention provides a light valve heat dissipation device. A heat-conducting element or a heat-conducting element is arranged on the surface of the light-transmitting element of the light valve in the light-receiving direction to take away the heat to achieve the effect of improving the reliability of the light valve.

An example of the present invention relates to a light valve heat dissipation device, which includes a light valve, a first heat dissipation element, a second heat dissipation element, and a heat conduction element. The first heat dissipation element is connected to a narrow part of the upper surface of the light transmission element via the heat conduction element. On the side, the narrow side of the upper surface of the light-transmitting element is located among the edges of the light-transmitting element, which is closest to the side of the active matrix; and the second heat-dissipating element is connected to the light valve and is independent of the first heat-dissipating element ; The first heat-dissipating element is an independently arranged element relative to the second heat-dissipating element. In this way, in addition to the second heat dissipating element connected to the back of the light valve, which can dissipate heat to the light valve, the light valve can also conduct heat to another heat dissipating element through the first heat conducting element connected to the transparent element on the front side. The design of connecting the front and back sides of the light valve module to different heat-dissipating components allows the light-transmitting components to dissipate heat nearby, reducing the restriction on mechanism design. Moreover, the design of connecting the front and back of the light valve to the independent heat dissipation element can also prevent the heat energy of the hotter end of the light-transmitting element from being transferred to the colder end of the light-transmitting element, thereby reducing the heat dissipation effect at the cold end.

The different viewpoints in an example of the present invention are related to a light valve heat dissipation device, which includes a light valve, a first heat sink, a second heat sink, and a heat conducting element. The light valve includes a substrate and a light-transmitting element. The light-transmitting element is arranged on the substrate; the first heat sink is thermally coupled to the substrate; the heat-conducting element is substantially made of metal, and one end of the heat-conducting element is thermally coupled to the second heat sink , The other end of the heat-conducting element is thermally coupled to the light-receiving surface of the light-transmitting element. The first heat sink is an independent element relative to the second heat sink. In this way, in addition to the heat sink connected to the back of the light valve, it can also conduct heat to another heat sink through the metal heat-conducting element connected to the light-transmitting element on the front side for sufficient heat dissipation. . It should be noted that the first heat sink is an independent element relative to the second heat sink. In this way, in addition to the heat sink connected to the back of the light valve, it can also conduct heat to another heat sink through the heat-conducting element connected to the light-transmitting element on the front side for sufficient heat dissipation. The design of connecting the front and back sides of the light valve module to different heat sinks allows the light-transmitting elements to dissipate heat nearby, reducing the restriction of mechanism design. Furthermore, the design of connecting the front and back of the light valve to the independent heat sink is also possible The heat energy of the hot end of the light-transmitting element is prevented from being transferred to the colder end of the light-transmitting element, so as to reduce the heat dissipation effect at the cold end.

The different viewpoints in an example of the present invention are related to a projection optical machine, which includes a light source, a digital micro lens device, a heat sink, a heat conducting element, and a lens. The digital micro lens device is arranged downstream of the light path of the light source. The digital micro lens device includes a substrate, a micro lens matrix and a light-transmitting element. The microlens matrix is arranged on the upper surface of the substrate; the light-transmitting element covers the microlens matrix; the light-transmitting element is provided with a light-receiving surface, a first side wall and a second side wall, the first side wall is closer to the micro lens matrix than the second side wall The first end of the heat-conducting element is only thermally coupled to the light-transmitting element via the light-receiving surface between the microlens matrix and the first side wall, and the second end is thermally coupled to the heat sink. Thereby, a heat-conducting element is provided on the light-receiving surface of the light-transmitting element on the digital micro-lens device, which can effectively remove the heat energy from the surface and ensure the reliability of the digital micro-lens device.

1: Optical engine

10: Light valve module

12: Light valve

121: substrate

122: Active Matrix

123: light transmitting element

1231: top

1231A: Light receiving surface

1232: bottom

124: Lens Hood

124A: Transmitting part

125: Barrier

14: Heat sink

16: heat sink

18: Thermal element

19: Electrical connector

20: light source

22: Light-emitting element

24: Light-emitting element

30: Combining light element group

31: lens

32: lens

33: Wedge-shaped combined light module

34: fly eye lens

35: lens

36: Total internal reflection 鏡

40: Imaging lens group

42: lens

44: lens

46: aperture diaphragm

48: lens

50: Chassis

51: protruding

2: power supply

3: Motherboard

4: Controller

A: Projector

CA: effective light area

D1: Projection direction

G: Confined space

IS: Reduced side

OS: zoom side

PL: Projection beam

P1~P4: intermediate point

W1~W4: side wall

WN: narrow side

FIG. 1 shows a schematic diagram of a projector in a specific embodiment of the invention.

FIG. 2 depicts a schematic diagram of an optical engine in a specific embodiment of the present invention.

FIG. 3 illustrates a schematic diagram of an imaging lens group in a specific embodiment of the present invention.

FIG. 4A shows a schematic diagram of a light valve module in a specific embodiment of the present invention.

FIG. 4B shows a schematic diagram of a light valve in a top view in an embodiment of the present invention.

FIG. 4C shows a schematic cross-sectional view of a light valve taken along the line A-A in FIG. 4B in a specific embodiment of the present invention.

FIG. 4D shows a schematic cross-sectional view of a light valve module taken along the A-A section of FIG. 4B in a specific embodiment of the present invention.

FIG. 5A shows a schematic diagram of a light valve and a heat dissipation element in another embodiment of the present invention from a top angle.

FIG. 5B is a schematic diagram of a light valve and a heat dissipation element in another specific embodiment of the present invention taken along the B-B section of FIG. 5A.

The foregoing and other technical content, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, for example: up, down, left, right, front, or back, etc., are used for directional terms to illustrate but not to limit the present invention. In the drawings, unless otherwise specified, the size of some components may be exaggerated rather than drawn on actual scale.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of a projector in a specific embodiment of the present invention. As can be seen from the figure, in this example, the projector A includes an optical engine 1, a power supply 2, a motherboard 3, and a controller 4. The description of each component in this example is as follows.

The controller 4 can be a microcontroller (MCU), various control chips or a central processing unit (CPU); in this example, the controller 4 is a central processing unit.

The main board 3 can be used to connect various components and allow each connected component to exchange or transmit energy (electricity, heat, etc.) or signals. The aforementioned components are, for example, the power supply, the controller, and the optical engine 1 and other components. In this example, the motherboard is a circuit board.

The power supply 2 can be an energy storage battery capable of outputting DC power or a transformer with AC and DC conversion functions. In this example, the power supply is a transformer that can convert AC power to DC power.

The optical engine 1 may be a device capable of outputting corresponding images according to control signals. In this example, the optical engine 1 is a projection light machine.

In this example, the optical engine 1, the power supply 2, the motherboard 3, the controller 4 and other components are all arranged inside the casing (not shown). The user can project an image to a screen by an external controller and control the projector A.

Please refer to FIG. 2. FIG. 2 illustrates a schematic diagram of an optical engine in a specific embodiment of the present invention. In this example, the optical engine 1 can include at least four main parts: a light source 20, a light combining element group 30, a light valve module 10, and an imaging lens group 40, and any of the foregoing can be selectively provided In the chassis 50 of the optical machine.

In this example, the light source 20 is used to generate illuminating light, and the light-emitting elements 22 and 24 in the light source 20 can emit light of different colors. Lights of different colors can be input to the light combining element group 30, and combined by the light combining element group 30, then input to the light valve module 10, and the light valve module 10 converts the illuminating light into image light with image data for projection The light beam PL and the projection light beam PL are then adjusted and output through the imaging lens group 40. The light travels from the upstream of the light path to the downstream of the light path, that is, the imaging lens 40 is downstream of the light path of the light valve module 10, and the light valve module 10 is downstream of the light path of the light combining element group 30, and so on, and vice versa.

In this example, the nature and quantity of the light source 20 will be adjusted according to the type of the light valve module 10 and the structure of the light combining element group 30. Generally speaking, the light source 20 includes multiple light-emitting elements 22 and 24. Each light-emitting element 22, 24 may be a visible light emitting diode chip including a plurality of different wavelength ranges. However, the light-emitting elements 22 and 24 are not limited to this, and may also include non-visible light chips or laser chips with wavelength conversion materials or other light sources 20 used in the projection field. For example, in this example, a dual-channel light combining architecture is used. More specifically, the light source 20 includes a first light-emitting element 22 and a second light-emitting element 24. The first light emitting element 22 can output red light and blue light, and the second light emitting element 24 can output green light. The first light-emitting element 22 and the second light-emitting element 24 may include one or more than one package. In this example, the first light emitting element 22 includes a blue light emitting diode (LED) module and a red light emitting diode module. The red light emitting diode module is a blue light emitting diode with a red light phosphor arranged on its surface. After the blue light enters the red light phosphor, the blue light excites the phosphor and outputs red light. And another On the one hand, the second light emitting element 24 can output green light, and it includes a green light emitting diode (LED). In addition, the red light package may include a combination of a blue LED, a yellow phosphor, and a filter. When the aforementioned structure is adopted, the blue LED will enter the yellow phosphor and excite a yellow light, and the filter will filter out Wavelengths other than red light are used to output red light. In this example, the first light emitting element 22 includes a blue LED package and a red LED package. The second light-emitting element 24 includes a green light-emitting diode package. Incidentally, the light source 20 can also be dual-channel and the aforementioned three colors of red, green and blue will then be combined through the light combining element group 30 to form an illuminating light and deliver it to the light valve module 10. The aforementioned convergence can be understood as making the rays of light travel along a substantially same path, and the rays of light may travel at the same time or time-sharing.

In this example, the light combining element group 30 is used to converge each light beam onto at least a single optical path. Usually include lenses, mirrors, various shapes of beam splitters (such as sheet or X-shaped), polar beam splitters, filters, homogenizing parts (such as homogenizing rod ROD, fly eye lens FLYEYE, etc.), wedge type The light-transmitting member or any one of the color wheel and the fluorescent wheel or a combination thereof. The aforementioned so-called lens, for example, refers to the one with a non-infinite radius of curvature of either the light-incident surface or the light-emitting surface, which is a curved surface. In this example, the light combining element group 30 includes two lenses 31 and 32 with positive refractive power on each side opposite to the two light-emitting elements 22 according to the order of light incidence; then the light will sequentially pass through the wedge-shaped combining light Module 33, fly-eye lens 34, a positive lens 35, TIR PRISM 36, and finally enter the light valve module 10; and the illumination light will be converted after entering the light valve module 10 A projection light PL including an image data is formed. The projection light PL enters the imaging lens group or the projection lens 40 through the aforementioned total reflection beam 36.

The case 50 may be a box body composed of a plurality of plates made of various materials, and a space is defined inside for accommodating various components therein. The case 50 can be sealed or ventilated. The chassis 50 can optionally be made of metal in whole or in part. In this example, at least part of the chassis 50 is made of metal material and is a sealed hollow box, and includes a chassis.

In this example, the light valve heat dissipation device, also known as the light valve module 10, is designed with reference to FIGS. 4A to 4C. 4A to 4C are respectively a schematic diagram of the light valve module in use in an embodiment of the present invention, a schematic diagram viewed from above, and a schematic diagram taken along the A-A section of 4B. As can be seen from the figure, the light valve module 10 includes a light valve 12, a first heat sink 14 (Heat sink), a second heat sink 16, a heat conducting element 18 and an electrical connector 19 (Connector).

The light valve 12 is used to convert illuminating light into image light and is a kind of spatial light modulation device. The light valve 12 can be any of a liquid crystal display (LCD), a digital micro lens device (hereinafter referred to as DMD), a liquid crystal on silicon panel (LCOS) and other components. In this example, the light valve 12 is a DMD. Please refer to FIG. 4B. It can be seen from the figure that, when simplified, the light valve 12 in this example includes a substrate 121, an active array 122, and a light-transmitting element 123.

The substrate 121 can be used to carry the active matrix 122. According to different types of the light valve 12, the substrate 121 can be made of metals with better heat conductivity such as copper and aluminum, or made of silicon or other materials such as plastic. . In this example, the substrate 121 is a printed circuit board (PCB) made of plastic. The substrate 121 includes an upper (front) surface facing the light-receiving direction and an opposite lower (back) surface; the lower surface is provided with a circuit connector to allow electrical energy to pass through, and the upper surface and the lower surface allow electrical energy to pass through.

The active matrix 122 is used to convert the illumination light into image light. The nature of the active matrix 122 is different according to the type of the light valve 12. For example, when the light valve 12 is an LCD, DMD, or LCOS, the active matrix 122 mainly includes liquid crystal, a movable micro mirror, and liquid crystal, respectively. In this example, the light valve 12 is a reflective light valve. More specifically, the light valve 12 is a digital micromirror device (DMD), and the active matrix 122 includes a reflective light valve. The micro-lens matrix of the mirror, each micro-mirror can swing correspondingly according to the control signal.

The light-transmitting element 123 is used to protect the active matrix 122, and the light-transmitting element 123 can be made of plastic, glass or various materials that allow light to pass through. In this example, the light-transmitting element 123 can be divided into two parts, a bottom part 1232 and a top part 1231, and the bottom part 1232 and the top part 1231 can be mutually bonded by bonding means such as glue. Fixed or one piece formed. In this example, the bottom 1232 is a hollow rectangular ring-shaped material block, and the top 1231 is a flat material block. In this example, the light-transmitting element 123 is made of glass. The light-transmitting property of the light-transmitting element 123 is to allow the illumination beam from the light source to pass through to reach the active matrix 122, and to allow the image light output by the active matrix 122 to reach the lens through the light-transmitting element 123. The top 1231 of the light-transmitting element 123, facing the upper surface of the light incident direction of the illuminating beam, is called the light receiving surface 1231A.

In this example, the active matrix 122 is disposed on the front surface of the substrate 121 in the light receiving direction, and the bottom 1232 of the light-transmitting element 123 surrounds the periphery of the active matrix 122 and accommodates the active matrix 122 in the accommodation space, and the top The plate-shaped glass block of 1231 is arranged above the bottom 1232 to cover the aforementioned active matrix 122. Here, the bottom 1232, the top 1231 and the substrate 121 of the light-transmitting element 123 jointly define an airtight closed space G, and the active matrix 122 is disposed therein to prevent foreign objects such as dust and the like from contacting the active matrix 122. According to the different types of the light valve 12, the light-transmitting element 123 can optionally be provided with a gap between the active matrix 122 and the light-transmitting element 123. In this example, the light valve 12 is a DMD, and a gap is provided between the active matrix 122 and the light-transmitting element 123 to allow the microlenses in the DMD to swing.

In addition, the position of the active matrix 122 on the upper surface of the substrate 121 may be different according to the specifications of the DMD. For example, the active matrix 122 can be located at the center of the top 1231 relative to the light-transmitting element 123, or the active matrix 122 is offset on one side of the light-transmitting element 123, as depicted in FIG. 4C, which is an example. . When the distance between a first edge of the top 1231 of the light-transmitting element 123 and the other edges of the active matrix 122 is small, the aforementioned first edge is called the narrow side WN.

In another aspect of this example, the top 1231 of the light-transmitting element 123 is rectangular, and the sidewalls W1 to W4 of the top 1231 of the light-transmitting element 123 are rectangular. In this example, the several edges of the upper surface 1231A of the light-transmitting element 123 and the active matrix 122 are measured along the substrate 121, and the distances are not completely equal. The narrow side WN of the upper surface 1231A of the light-transmitting element 123 is located among the edges of the light-transmitting element, closest to the edge of the active matrix.

In another viewpoint of this example, the midpoints of the four sidewalls W1 to W4 of the top 1231 of the light-transmitting element 123 are P1 to P4, respectively. In this example, P1 to P4 are respectively located approximately at the centroid of each side edge plane of the top 1231 of the light-transmitting element 123. The shortest linear distance between the aforementioned centroids and the active matrix 122 measured on the surface of the substrate 121 is the smallest, the sidewall with the smallest distance is the edge of the upper surface 1231A of the light-transmitting element 123, Its narrow side. That is, when the side wall W2 is closer to the active matrix 122 than the side walls W1, W3, and W4, the side connecting the side wall W2 and the upper surface 1231A is the narrow side WN. In another example, when the minimum distance between the centroids of the two or more edge surfaces of the light-transmitting element 123 and the active matrix 122 is the same after deducting the reasonable working tolerance, the edges on the upper surface 1231A are all They can be called narrow-side WN respectively. That is, when the narrow side WN can be divided into different distances, take the smallest distance; if there are multiple sides with the minimum distance of the active matrix 122 substantially the same, the narrow side WN can refer to any one of the smallest distances. As depicted in FIGS. 5A and 5B, in this example, the distance between the active matrix 122 and the sidewalls W1 to W3 is substantially the same, so one of the two sides can be called a narrow side.

The heat sink 14 (or the first heat sink) is a kind of heat dissipation element. The heat sink 14 can refer to, for example, a heat sink fin group, a heat pipe, a heat equalizing plate, a TEC, a metal plate or a fluid container, etc., which have heat storage or heat dissipation. Functional components, modules or devices. In this example, the heat sink 14 is a heat dissipation fin group.

The heat sink 16 (or second heat sink) is a kind of heat dissipation element. The heat sink 16 can refer to, for example, heat dissipation fins, heat pipes, soaking plates, TECs, metal plates or fluid containers, etc., which have heat storage or heat dissipation functions. Components, modules or devices. In this example, the heat sink 16 is the surface of the chassis part of the chassis 50 of the light engine 1, and the surface of this part is made of metal. In this example, the first heat sink 14 and the second heat sink 16 are separate components rather than different parts of a single component.

The heat-conducting element 18 is a kind of connector. The connector can be directly or indirectly connected to two objects for the transmission of energy (kinetic energy, heat, electricity or waves, etc.), such as various wires, heat-conducting elements, or various, such as fixed parts, transmission parts, and connecting parts , Control parts and other parts are examples. The heat-conducting element 18 can transfer the heat energy from one place to another by means of heat conduction or/and convection.

The heat-conducting element 18 can be classified into active heat-conducting elements and passive heat-conducting elements according to different energy consumption. Active heat-conducting elements can consume energy (such as electrical energy) when heat is conducted, such as refrigerating chips, fans, fans, etc., for example. Passive heat-conducting components refer to components, modules, or devices that can transmit thermal energy without consuming electrical energy, such as heat dissipation fins or heat pipes.

In addition, the heat-conducting element 18 may include any one or a combination of elements such as a heat-conducting sheet, a heat-conducting glue, a metal foil (for example, aluminum or copper foil), a metal block, a heat pipe, and a soaking plate. The thermally conductive element is an element, device or module made at least partially of metal (for example, copper, iron, aluminum, etc.) or non-metal (for example, high molecular weight materials, graphene, etc.).

In this example, the heat-conducting element 18 is an opaque, flexible and flexible copper foil patch. The copper foil patch is essentially made of metal, but its surface part can be provided with a protective glue layer or Adhesive layer. In another example, the heat-conducting element 18 can also be a refrigeration chip or a heat pipe, both of which are substantially made of metal.

The electrical connector 19 may refer to, for example, a circuit board, an electric wire, a connecting wire, and other components having a power transmission function. In this example, the electrical connector 19 is a flat connector with a connection pad (PAD) on the surface.

In this example, the active matrix 122 is arranged on the upper surface of the substrate 121 relative to the light receiving direction; at the same time, the light-transmitting element 123 covers the active matrix 122; at the same time, the lower surface of the substrate 121 opposite to the light receiving direction is connected There is a heat sink 14. In addition, the heat sink 16 is thermally coupled to the upper surface of the light valve 12 at one side relative to the light receiving direction by the heat conducting element 18. More specifically, the heat sink 14 is connected or thermally coupled to the surface of the substrate 121 of the light valve 12 relative to the active matrix 122 of the light valve 12 by, for example, a thermally conductive paste. At the same time, the electrical connector 19 is provided between the heat sink 14 and the substrate 121 of the light valve 12 to provide electrical energy to the light valve and exchange or transmit signals with it. Furthermore, when two components, such as the heat sink 14 and the substrate 121, have thermal energy transmission between them, they can be called thermally coupled. The aforementioned connection can refer to a connection without a medium in the middle, but in direct contact; or There are indirect connections between other media or components. That is, the connection between the heat sink 14 and the substrate 121 is not limited to direct contact. In this way, the first heat sink 14 can take heat away from the light valve 12.

On the other hand, the heat sink 16 is connected to the other side of the light valve 12 with respect to the heat sink 14. More specifically, the heat sink 16 uses the heat-conducting element 18 connected to the outermost light-receiving surface of the light-transmitting element 123 in the light valve 12 to take away the heat energy of the light-transmitting element 123 of the light valve 12. From another point of view, one end of the heat-conducting element 18 is connected to the top 1231 of the light-transmitting element 123 of the light valve 12 on the light-receiving surface 1231A near its narrow side WN; and the other end is thermally coupled to the heat sink 16 . In other words, the heat-conducting element 18 covers a part of the light-receiving surface 1231A. In this example, the covering surface of the heat-conducting element 18 does not affect the amount of light received by the active matrix 122 in principle. That is, if the light-receiving area of the active matrix 122 is the effective light area CA, and the other part is the invalid light area, the light path before the illuminating light beam reaches the effective light area will not be covered by the heat conducting element 18. That is, the heat-conducting element 18 is arranged on the optical path of the illuminating beam to the ineffective light area. From another point of view, one end of the heat-conducting element 18 is thermally coupled to the light-transmitting element 123 only through the light-receiving surface 1231A between the active matrix 122 and the sidewall W2 closest to the active matrix 122.

Please refer to FIG. 4A. It can be seen from the figure that, in this example, the heat sink 16 is the surface of the chassis in the chassis 50 of the light engine 1, and the surface of the heat sink 16 may be perpendicular to the light incident direction. From another point of view, the connecting surface of the heat sink 16 and the heat conducting element 18 and the light receiving surface 1231A of the light transmitting element 123 are substantially perpendicular to each other. In addition, in this example, the heat conducting element 18 is substantially L-shaped. The design of using the heat-conducting element 18 to conduct the heat energy of the light valve to the inner surface of the cabinet 50 enables the heat energy to be effectively dissipated by the cabinet 50, reducing the accumulation of heat energy inside the cabinet, and thereby reducing the burden on the heat dissipation system of the projector. In addition, the design of connecting the front and back sides of the light valve module 10 to different heat sinks prevents the heat energy of the higher temperature side of the light valve module 10 from being conducted to a lower temperature, which affects the heat dissipation effect at the lower temperature. Furthermore, since the thermal conductivity of the heat-conducting element 18 decreases with the conduction distance due to the thermal resistance, the design of connecting the front and back sides of the light valve module 10 to different heat sinks allows the light-transmitting element 123 to dissipate heat nearby, reducing the design Time limit.

Please refer to FIG. 4D. FIG. 4D illustrates the design of the light valve module 10 in an example of the present invention during application. In application, the light valve module 10 can be additionally provided with a shield/cover 124 above the light-receiving surface 1231A of the light-transmitting element 123, and a light-shielding cover. The light shield 124 can be used to block the light in the ineffective area, reduce the light reaching the light-receiving surface 1231A, and help it cool down. The light-shielding cover 124 is a rectangular plastic or metal sheet, and at least corresponding to the active matrix 122 in the middle is a light-transmitting portion 124A. The light-transmitting portion 124A allows at least part of light to pass through. In this example, the light-shielding 124 is The part other than the light-transmitting portion 124A is substantially opaque, and can be used to block the ineffective light from the total reflection beam, thereby slowing down the temperature rise of the light-receiving surface of the light-transmitting element 123. In addition, the light-transmitting portion 124A may be provided with a through hole whose shape and position correspond to the outline of the active matrix 122; or, it may further include a light-transmissive glass or plastic sheet covering the aforementioned through hole. In this example, the aforementioned perforation is rectangular. The light-shielding cover 124 is substantially a metal sheet body, and the light-transmitting portion 124A is a through hole and does not include a light-transmitting sheet.

In application, the light shield 124 can be pressed on the light-receiving surface 1231A of the light-transmitting element 123 by a barrier member (SPACER) 125, that is, the heat conducting element 18 is clamped between the barrier member 125 and the light-transmitting element 123 . The barrier 125 may be a thermally conductive or non-conductive solid element, and its thermal conductivity may be less than 1, 0.7, 0.4, or 0.2 m·K. In this example, the barrier 125 is a rubber ring with poor thermal conductivity. For reference, the thermal conductivity of pure copper (at room temperature, the same below) is about 401W/m.K, while the thermal conductivity of thermal paste is about 1-10W/m.K. The barrier 125 in this example is made of soft rubber, and is about 0.13 W/m.K, and the thickness is about several millimeters (mm). In this example, the heat-conducting element 18 is pressed by the barrier 125 on the light-receiving surface 1231A of the light-transmitting element 123, and means such as glue or heat-conducting glue can be selectively omitted. On the other hand, the barrier 125 can be selectively connected to the light shield 124 by glue. In another example, a heat-conducting medium such as a heat-conducting paste can be selectively provided between the heat-conducting element 18 and the light-receiving surface 1231A. When the light-transmitting part 124A of the light-shielding cover 124 is provided with a transparent material, a dust-proof cavity can be formed between the light-shielding cover 124 and the light-transmitting element 123 by the arrangement of the barrier 125 to prevent dust particles from entering the light-transmitting element 123 Light-receiving surface. In this example, the barrier 125 is fixed to the heat-conducting element 18 by glue. Between the heat conducting element 18 and the barrier 125 and the light transmitting element 123 Direct contact without medium. In another example, the barrier 125 is in direct contact with the light-transmitting element 123 and the heat-conducting element 18 at the same time, that is, the heat-conducting element 18 and each element do not need to be a medium such as glue, and only the friction force generated by the pressure maintains it. relative position.

Please refer to FIG. 4D again. It can be seen from the figure that the light shield 124 can be embedded and supported in each protrusion 51 structure of the chassis portion of the chassis 50.

In this example, during installation and placement, first place the cavity on the surface of the light shield 124 in the corresponding protrusion 51, then place the barrier 125 on the other surface of the protrusion 51, and then place the barrier 125 on the other surface of the barrier. A heat-conducting element 18 is placed on the surface of 125, and the other end of the heat-conducting element 18 opposite to the light-transmitting element 123 is connected to the inner surface of the base of the chassis 50. Then, the light valve 12 is placed on the heat-conducting element 18, and the light-receiving surface 1231A of the light-transmitting element 123 of the light valve 12 is in direct contact with the barrier 125 and the heat-conducting element 18 at the same time. Subsequently, the connecting cable 19 is connected to the back of the light valve 12, and then the heat sink 14 is connected, and the assembly is basically completed.

In the above example, the light-receiving surface 1231A of the light-transmitting element 123 is only connected to a single heat-conducting element 18, but the present invention is not limited to this. If necessary, the light-receiving surface 1231A can be provided with multiple heat-conducting elements 18 at the same time to dissipate heat. In addition, each heat conducting element 18 may be connected to a separate heat sink, or connected to the same heat sink. Furthermore, please refer to FIG. 5A and FIG. 5B. FIG. 5A shows a schematic diagram of a light valve and a heat dissipation element in a top view in another specific embodiment of the present invention. FIG. 5B is a schematic diagram of a light valve and a heat dissipation element in another specific embodiment of the present invention taken along the B-B section of FIG. 5A. In this example, the light-receiving surface 1231A of the light-transmitting element 123 can be provided with a heat-conducting element 18 simultaneously covering and connected to a plurality of edges, such as those depicted in FIGS. 5A and 5B.

On the other hand, the imaging lens group 40 or the projection lens system at least includes a single lens with diopter and an aperture stop 46 (STOP). For example, please refer to FIG. 3, which illustrates a schematic diagram of an imaging lens group 40 in a specific embodiment of the present invention. As can be seen from the figure, in this example, the imaging lens group 40 must be set between the magnification side OS and the reduction side IS. And when the imaging lens set in this case When 40 is used as a projection lens, the magnification side refers to the side of the lens outputting the projection light beam PL, while the reduction side refers to the side of the lens relative to the light valve module 10.

As depicted in the figure, the imaging lens group 40 may include, arranged along the optical axis from the magnification side OS to the reduction side IS, a second lens 48, an aperture stop 46 (STOP, or aperture), a first lens 44 and The third lens 42. Furthermore, the aperture diaphragm 46 has to be independently arranged on the surface of the lens according to the design requirements, and the present invention does not impose any restrictions on it.

In this example, the refractive powers of the first lens 44, the second lens 48, and the third lens 42 are negative, positive, and negative, respectively. It is worth noting that, in this example, the aperture stop 46 is provided between the first lens 44 and the second lens 48, that is, the aperture stop 46 has only a single piece toward the light exit direction, the projection direction D1, or the exit direction. A lens with refractive power. When necessary, the aperture stop 46 has no lens toward the end of the projection direction D1.

For the detailed parameters of each component and its external components in the optical system of this example, please refer to Table 1 to Table 2 below.

Table 1 records the value of the optical parameters of each lens in the imaging lens group 40. The * in the surface number indicates that the surface is an aspherical surface; otherwise, it is a spherical surface. The surface number refers to the mirror The order of the surface of the optical elements arranged from the magnification side to the reduction side of the head. In addition, the unit of radius and thickness/spacing in Table 1 is millimeter (mm). It should be noted that when the above lenses are needed, practitioners can make appropriate adjustments to the top-opening design according to their needs, proportions or other parameters before using them. In the above table, the spacing of S9 0.36 refers to the spacing between the top 1231 surface of the light-transmitting element 123 and the surface of the active matrix 122 and the active matrix 122.

It can be seen from the foregoing table that, in this example, the projection lens system includes three lenses with diopters. Counting from the light exit 13 of the projection light PL, the second lens 48, the aperture stop 46, the first lens 44, and the third lens 42 in order. Both surfaces of the second lens 48 and the third lens 42 are aspherical lenses, respectively.

As for the design parameters of each aspheric surface in this example, it can be seen that Table 2 is as follows:

The corresponding calculation formula is Formula 1, as follows:

In the imaging lens group 40 of the previous example, the focal length is about 9.788 mm, the field angle of the imaging lens group 40 is about 4.86 degrees, and the telecentric angle of the imaging lens group 40 is about 1 degree. In addition, (|R6|+R7)/(|R6|-R7) is equal to 1.709, |FG1|/FL2 is equal to 9.172, R7/F is equal to 0.277, |FG1|/F is equal to 6.072, and D/F is equal to 2.424. Among them, R6 represents the radius of curvature of the surface of the third lens 42 facing the magnification side OS, R7 represents the radius of curvature of the concave surface of the third lens 42 facing the reduction side IS, FG1 represents the effective focal length of the second lens 48, and FL2 represents the The effective focal length of a lens 44. F represents the effective focal length of the imaging lens group, and FG2 represents the effective focal length of the first lens 44 and the third lens 42.

The above imaging lens assembly 40 is only an example, and other feasible lens assembly design solutions can be freely applied during application, which will not affect the operation of the light valve module in this case.

In an example of the present invention, since a heat-conducting element is provided on the light receiving surface of the light-transmitting element in the light valve module, the surface temperature of the light-transmitting element can be effectively relieved. The use of the heat-conducting element to conduct the heat of the light-transmitting element to another heat sink that is different from the heat sink on the back of the light valve can prevent the heat energy of the higher-temperature side of the light valve module from being conducted to a lower temperature and causing adverse effects. Furthermore, since the thermal conductivity of the heat-conducting element will decrease with the conduction distance due to the thermal resistance, the design of connecting the front and back of the light valve module to different heat sinks allows the light-transmitting element to dissipate heat nearby, reducing the limitation of the mechanism design .

The above specific embodiments are for illustrative purposes only, and do not limit the present invention. Although the present invention has been disclosed in preferred embodiments as above, it is not intended to limit the present invention. Anyone familiar with the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall be subject to the scope of the attached patent application. In addition, any embodiment of the present invention or the scope of the patent application does not need to achieve all the objectives or advantages or features disclosed in the present invention. The abstract part and title are only used to assist in searching for patent documents, not to limit the scope of rights of the present invention.

10‧‧‧Light valve cooling device

12‧‧‧Light valve

14‧‧‧Heat sink

16‧‧‧Heat sink

18‧‧‧Thermal element

19‧‧‧Electrical connector

50‧‧‧Chassis

Claims (10)

A light valve heat dissipation device is arranged in a chassis, and includes: a light valve, including: an active matrix; and a light-transmitting element, which is arranged above the active matrix, and has several edges on the upper surface of the light-transmitting element, It is provided with a distance that is not completely equal to the active matrix; a heat-conducting element; a first heat-dissipating element connected to the light valve; and a second heat-dissipating element connected to a narrow part of the upper surface of the light-transmitting element On the side, the second heat dissipation element includes a part of the chassis, and the second heat dissipation element and the first heat dissipation element are separate elements; wherein, the narrow side of the upper surface of the light-transmitting element is located on the light-transmitting element Among the edges of the component, the one closest to the active matrix. The light valve heat dissipation device according to claim 1, wherein the first heat dissipation element is a first heat sink; the second heat dissipation element is a second heat sink, wherein the active matrix is provided on a substrate, and the light-transmitting element The upper surface is the other direction of the light-transmitting element relative to the substrate, and the upper surface is the light-receiving surface. A light valve heat dissipation device, arranged in a chassis, including: a light valve, including a substrate and a light-transmitting element, the light-transmitting element is arranged on the substrate; a first heat sink thermally coupled to the substrate; A second heat sink, including a part of the chassis; and a heat-conducting element, substantially made of metal. One end of the heat-conducting element is thermally coupled to the second heat sink, and the other end of the heat-conducting element is thermally coupled to the transparent The light-receiving surface of the light element; Wherein, the first heat sink is an independent element relative to the second heat sink. In the light valve heat dissipation device according to claim 2 or claim 3, the light-transmitting element and the substrate define an airtight enclosed space. The light valve heat dissipation device according to claim 4, further comprising a light-shielding cover disposed on the other side of the light-transmitting element relative to the substrate. The light valve heat dissipation device according to claim 5, further comprising a barrier, the light shield is connected to the heat conducting element via the barrier, and the thermal conductivity of the barrier is less than 1 W/m-k. According to the light valve heat dissipation device described in claim 6, the light-transmitting element is connected to the heat-conducting element and the barrier at the same time through the light-receiving surface. The light valve heat dissipation device according to claim 2 or claim 3, wherein the first heat sink includes a heat dissipation fin group. A projection optical machine includes: a cabinet; a light source arranged in the cabinet; a digital micro lens device arranged in the cabinet and located downstream of the light path of the light source, the digital micro lens device including: a substrate, An upper surface; a microlens matrix arranged on the upper surface; and a light-transmitting element covering the microlens matrix, the light-transmitting element having a light-receiving surface, a first side wall and a second side wall, the first side wall Closer to the microlens matrix than the second side wall; and A heat-conducting element is provided with a first end and a second end. The first end is thermally coupled to the light-transmitting element only through the light-receiving surface between the microlens matrix and the first side wall, and the second end is The chassis is thermally coupled; and a lens is arranged at the optical downstream of the digital micro lens device. The optical projection machine according to claim 9, further comprising: a light-shielding cover disposed on the other side of the light-transmitting element with respect to the substrate, the light-shielding cover being connected to the heat-conducting element via a barrier, and the barrier The thermal conductivity is less than 1W/mk; wherein, the light-transmitting element is in direct contact with the heat-conducting element through the light-receiving surface, the barrier is in direct contact with the heat-conducting element, and the heat-conducting element is sandwiched between the light shield and the substrate There is no glue between the heat-conducting element and the light-receiving surface, the light-transmitting element and the substrate define a closed space, the microlens matrix is arranged in the closed space, and the closed space is airtight.

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