JP2016078023A - Laser processing device, manufacturing device for light-emitting device, and method for manufacturing light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing device which can suppress adhesion of processed powder to a light-emitting device.SOLUTION: A manufacturing device 200 for a light-emitting device 10 is equipped with: an irradiation part 210 which processes a light-emitting device 10 by irradiation of laser beam 230; a suction part 40 which sucks processed powder generated by said processing; and an attraction part 50 which performs electrostatic attraction of the processed powder sucked by the suction part by electrical charging. The attraction part 50 has a cylindrical shape which forms an opening 51 for passing laser beam 230, and an area of the opening 51 at an end on the light-emitting device 10 side of the attraction part 50 is smaller than an area of the opening 51 at an end on the irradiation part 210 side of attraction part 50.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a laser processing apparatus, a light emitting device manufacturing apparatus, and a light emitting device manufacturing method.

  As a light emitting device (light emitting device) that emits white light, a light emitting device in which a blue LED chip is sealed with a translucent resin containing a phosphor is known.

  Such a light-emitting device has a problem that variations in the performance of the blue LED chip and variations in the chromaticity of white light due to the amount of the phosphor occur.

  In order to solve such a problem, Patent Document 1 discloses a technique for adjusting the chromaticity of the emission color of a light emitting device by removing a fluorescent layer containing a phosphor by laser light irradiation.

JP 2002-344029 A

  In adjusting the chromaticity of the light emitting device as described above, there is a problem that a deviation occurs in the amount of adjustment of chromaticity due to the processing powder generated during laser irradiation adhering to the light emitting device.

  Then, this invention provides the laser processing apparatus etc. which can suppress adhesion of the processing powder to a workpiece.

  A laser processing apparatus according to an aspect of the present invention includes an irradiation unit that processes an object by irradiating a laser beam, a suction unit that sucks processing powder generated by the processing, and a charging unit that charges the suction unit. A suction portion that electrostatically attracts the processed powder to be sucked, and the suction portion has a cylindrical shape that forms an opening through which the laser beam passes, and the opening at the end portion on the object side of the suction portion. The area is smaller than the area of the opening at the end of the suction part on the irradiation part side.

  A light-emitting device manufacturing apparatus according to one embodiment of the present invention is a light-emitting device manufacturing apparatus, which is formed by covering at least part of a light-emitting element with a light-transmitting resin containing a phosphor. The light emitting device manufacturing apparatus includes: an irradiation unit that processes the translucent resin by irradiating a laser beam; a suction unit that sucks processing powder generated by the processing; and the suction unit that is charged. An adsorption part that electrostatically adsorbs the processing powder attracted to the cylinder, and the adsorption part has a cylindrical shape that forms an opening through which the laser beam passes, and the opening at the end of the adsorption part on the light emitting device side Is smaller than the area of the opening at the end of the suction part on the irradiation part side.

  A method for manufacturing a light-emitting device according to one embodiment of the present invention is a method for manufacturing a light-emitting device using an adsorption portion, and the light-emitting device includes at least a part of a light-emitting element made of a light-transmitting resin containing a phosphor. The manufacturing method of the light-emitting device is formed by being covered, and the light-transmitting resin is processed by irradiating a laser beam, the processing powder generated by the processing is sucked, and the sucked processing powder is absorbed by the suction The adsorption part is electrostatically adsorbed by charging the part, and the adsorption part has a cylindrical shape that forms an opening through which the laser beam passes, and the area of the opening at the end of the adsorption part on the light emitting device side is the adsorption part It is smaller than the area of the opening at the end of the portion on the irradiation part side.

  The laser processing apparatus or the like according to one embodiment of the present invention can suppress the adhesion of the processing powder to the processing object.

FIG. 1 is an external perspective view of the light emitting device. 2 is a cross-sectional view taken along line AA in FIG. 3 is a cross-sectional view taken along line BB in FIG. FIG. 4 is a diagram schematically showing the light emitting device manufacturing apparatus according to the first embodiment. FIG. 5 is an external perspective view of the irradiation unit. FIG. 6 is an external perspective view of the suction portion. FIG. 7 is a flowchart showing a method for manufacturing the light emitting device according to the first embodiment. FIG. 8 is a cross-sectional view for explaining laser processing for the light emitting device. FIG. 9 is a cross-sectional view showing the structure of the suction portion provided with the receiving portion. FIG. 10 is a cross-sectional view illustrating the structure of the suction portion having a curved inner wall. FIG. 11 is a cross-sectional view showing the structure of the suction portion having a convex portion on the inner wall. FIG. 12 is a cross-sectional view showing the structure of a suction portion whose inner wall has a stepped shape. FIG. 13 is a schematic diagram illustrating an example in which the suction unit performs suction from the side of the suction unit. FIG. 14 is an external perspective view of a rectangular tube-shaped adsorption portion.

  Hereinafter, a light emitting device manufacturing apparatus and a light emitting device manufacturing method according to embodiments will be described with reference to the drawings. It should be noted that each of the embodiments described below shows a comprehensive or specific example. The numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements, steps, order of steps, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily shown strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, and the overlapping description may be abbreviate | omitted or simplified.

(Embodiment 1)
In Embodiment 1, a light emitting device manufacturing apparatus (manufacturing method) will be described as an example of the laser processing apparatus of the present invention.

[Configuration of light emitting device]
First, a light-emitting device that is an object of laser processing in the manufacturing apparatus according to Embodiment 1 will be described. FIG. 1 is an external perspective view of the light emitting device. FIG. 2 is a cross-sectional view of the light emitting device of FIG. 1 cut along line AA. FIG. 3 is a cross-sectional view of the light emitting device of FIG. 1 cut along the line BB.

  As shown in FIGS. 1 to 3, the light emitting device 10 includes a substrate 20, a light emitting element array 115 including a plurality of LED chips 110, and a color conversion unit 120. The light emitting device 10 also includes wiring 155 provided on the substrate 20 and bonding wires 160 that electrically connect the plurality of LED chips 110.

  The light emitting device 10 is a COB (Chip On Board) type light emitting module in which the LED chip 110 is directly mounted on the substrate 20 used for, for example, a downlight.

  The substrate 20 is, for example, a metal base substrate or a ceramic substrate. The substrate 20 may be a resin substrate having a resin as a base material.

  As the ceramic substrate, an alumina substrate made of aluminum oxide (alumina), an aluminum nitride substrate made of aluminum nitride, or the like is employed. As the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate, or the like having an insulating film formed on the surface is employed. As the resin substrate, for example, a glass epoxy substrate made of glass fiber and epoxy resin is employed.

  As the substrate 20, for example, a substrate having a high light reflectance (for example, a light reflectance of 90% or more) may be employed. By adopting a substrate having a high light reflectance as the substrate 20, the light emitted from the LED chip 110 can be reflected on the surface of the substrate 20. As a result, the light extraction efficiency of the light emitting device 10 is improved. An example of such a substrate is a white ceramic substrate based on alumina.

  On the other hand, a translucent substrate having a high light transmittance may be adopted as the substrate 20. By adopting a translucent substrate as the substrate 20, the light emitted from the LED chip 110 is transmitted through the inside of the substrate 20 and is emitted from the surface (back surface) on which the LED chip 110 is not mounted. Examples of such a substrate include a transparent ceramic substrate made of polycrystalline alumina or aluminum nitride, a transparent glass substrate made of glass, a crystal substrate made of crystal, a sapphire substrate made of sapphire, or a transparent resin substrate made of a transparent resin material. Illustrated.

  The LED chip 110 is an example of a light emitting element, and is a bare chip that emits monochromatic visible light. The LED chip 110 is directly mounted on the substrate 20. For example, the LED chip 110 is die-bonded and mounted on the substrate 20 by a die attach material (die-bonding material), but may be flip-chip mounted. A p-side electrode and an n-side electrode (not shown in FIGS. 1 to 3) for supplying current are formed on the upper surface of the LED chip 110. For example, a blue LED chip that emits blue light can be used as the LED chip 110. As the blue LED chip, for example, a gallium nitride based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.

  The light emitting element array 115 is a light emitting element array including a plurality of LED chips 110 arranged in a predetermined direction (X direction) on the substrate 20. In the example of FIG. 1, six light emitting element rows 115 are provided. The LED chips 110 included in each light emitting element array 115 are mounted so that their positions in the Y direction are aligned.

  In one light emitting element row 115, the cathode electrode of one LED chip 110 is connected to the anode electrode of the LED chip 110 adjacent to the LED chip 110 by a bonding wire 160. That is, in one light emitting element row 115, a plurality of LED chips 110 are connected in series by the chip to chip by the bonding wires 160.

  The LED chip 110 located at the end of each light emitting element array 115 is connected to a wiring 155 provided on the substrate 20 by a bonding wire 160. The wiring 155 is supplied with power for causing each light emitting element array 115 to emit light.

  The color conversion unit 120 is an example of a translucent resin containing a phosphor, and collectively seals the light emitting element arrays 115 in a line shape along a predetermined direction (X direction). The color conversion unit 120 is a translucent resin including a phosphor 130 that is a light wavelength conversion material, and converts the wavelength of the light from the LED chip 110 and seals the LED chip 110 to protect the LED chip 110. To do. The color conversion unit 120 is provided above the LED chip 110 (+ Z direction in the drawing). In addition, the upper side of the LED chip 110 is, in other words, the light emitting side of the LED chip 110 (the direction in which the LED chip 110 mainly emits light). Specifically, the translucent resin constituting the color conversion unit 120 is a dimethyl silicone resin, a phenyl silicone resin, a silsesquioxane resin, an epoxy resin, a fluororesin, an acrylic resin, a polycarbonate resin, or the like.

  The phosphor 130 is a yellow phosphor that emits yellow fluorescence when excited by light emitted from the LED chip 110. When the LED chip 110 is a blue LED chip, the phosphor 130 is a YAG (yttrium, aluminum, garnet) yellow phosphor. The phosphor 130 may be an orthosilicate phosphor or an oxynitride phosphor. The phosphors 130 are basically spherical and are included in the color conversion unit 120.

  The phosphor is generally excited by light having a shorter wavelength than the light emitted by the phosphor. Therefore, the light emitted from the phosphor 130 is light having a longer wavelength than the emitted light from the LED chip 110. Specifically, the phosphor 130 emits yellow fluorescence having a wavelength longer than 450 nm.

  Thus, the phosphor 130 is excited by the blue light of the LED chip 110 and emits yellow fluorescence. Thus, white light having a spectral distribution in a relatively wide wavelength range (for example, about 400 nm to 680 nm) is emitted from the light emitting device 10 (color conversion unit 120) by the excited yellow fluorescence and blue light.

  The chromaticity of white light of the light emitting device 10 is determined by the ratio between the amount of blue light emitted from the LED chip 110 and the amount of yellow fluorescent light emitted from the phosphor 130. Therefore, in the light emitting device 10, the problem is that the chromaticity of white light varies due to the variation in performance of the blue LED chip and the amount of phosphor.

  In order to reduce such variation, chromaticity adjustment is performed in the manufacture of the light emitting device 10. In the chromaticity adjustment, a part of the color conversion unit 120 is removed by laser processing for the purpose of reducing the amount of yellow fluorescent light emitted from the phosphor.

[Configuration of manufacturing equipment]
Next, a manufacturing apparatus (manufacturing method) of the light emitting device 10 will be described. FIG. 4 is a diagram schematically showing a manufacturing apparatus for the light emitting device 10.

  4, the manufacturing apparatus 200 includes an irradiation unit 210, a chromaticity measurement unit 220, a stage 240, a control unit 250, a display device 260, an input device 270, an adjustment unit 280, and a camera. 222, a suction unit 40, a suction unit 50, an arm 60, and a power source 70. The irradiation unit 210 includes a laser oscillator 210a and an optical system 210b, and the adjustment unit 280 includes a first mechanism 280a and a second mechanism 280b.

  In FIG. 4, the light emitting device 10 before processing is also illustrated. In FIG. 4, the suction unit 50 and the light emitting device 10 are shown in cross section. Further, the light emitting device 10 is schematically illustrated, and actually, the entire light emitting device 10 described with reference to FIG. 1 is disposed on the stage 240.

  The irradiation unit 210 processes the object by irradiation with the laser beam 230. In the first embodiment, the object is the light emitting device 10 (color conversion unit 120), and the irradiation unit 210 removes a part of the color conversion unit 120 by irradiating the color conversion unit 120 with the laser light 230, The chromaticity of light emitted from the light emitting device 10 is adjusted. More specifically, the irradiation unit 210 irradiates the light emitting device 10 with the laser light emitted from the laser oscillator 210a via the optical system 210b, and removes a part of the color conversion unit 120.

  The irradiation unit 210 (laser oscillator 210a) is, for example, a CO2 laser (CO2 laser device) or a UV laser (UV laser device). The irradiation unit 210 may be another laser as long as the color conversion unit 120 can be removed.

  The optical system 210b is a combination of a condensing lens for condensing laser light and a scanning optical system such as a polygon mirror, and as shown in FIG. 5, a position facing the stage 240 on which the light emitting device 10 is installed. Is arranged.

  FIG. 5 is an external perspective view of the irradiation unit 210. As shown in FIG. 5, the irradiation unit 210 irradiates the light emitting device 10 placed on the stage 240 with laser light 230.

  The controller 250 controls the timing at which the laser oscillator 210a emits laser light, the intensity (energy) and wavelength of the laser light emitted by the laser oscillator 210a, and the like.

  The adjustment unit 280 adjusts the relative positional relationship between the irradiation position of the laser beam 230 and the light emitting device 10 by adjusting the relative positional relationship between the laser oscillator 210 a, the optical system 210 b, and the light emitting device 10.

  In the first embodiment, the adjustment unit 280 drives the optical system 210b with the first mechanism 280a while the position of the laser oscillator 210a is fixed, so that the irradiation position of the laser beam 230 and the light emitting device 10 are relative to each other. Adjust the positional relationship.

  The first mechanism 280a has the laser beam 230 for the light emitting device 10 in the optical axis direction (Z-axis direction in FIG. 4) of the laser beam 230 and the direction (X-axis direction or Y-axis direction in FIG. 4) orthogonal to the optical axis direction. This is a mechanism for changing the relative position of the focal point.

  Specifically, the first mechanism 280a changes the focal position of the laser beam 230 in each of the X axis direction, the Y axis direction, and the Z axis direction by moving the condenser lens of the optical system 210b.

  In the first embodiment, the adjustment unit 280 further includes a second mechanism 280 b that changes the inclination of the optical axis of the laser beam 230 with respect to the light emitting device 10.

  The second mechanism 280b changes the inclination of the optical axis of the laser beam 230 with respect to the light emitting device 10 by driving the scanning optical system included in the optical system 210b to scan the laser beam. That is, since the second mechanism 280b can adjust the incident angle of the laser beam 230 with respect to the surface of the light emitting device 10, the irradiation unit 210 can irradiate the color conversion unit 120 with the laser beam 230 obliquely. it can.

  In the manufacturing apparatus 200, the adjustment unit 280 (the first mechanism 280a and the second mechanism 280b) can adjust the relative positional relationship between the irradiation position of the laser beam 230 and the light emitting device 10 on the order of μm. . Specifically, the adjustment unit 280 employs a mechanism capable of driving the optical system 210b with a very fine resolution and high accuracy.

  Note that the adjustment unit 280 may adjust the relative positional relationship between the irradiation position of the laser beam 230 and the light emitting device 10. For example, the adjustment unit 280 may move the laser oscillator 210 a or the stage 240.

  The display device 260 and the input device 270 are user interfaces provided in the manufacturing apparatus 200. The display device 260 displays an image captured by the camera 222, a measurement result of the chromaticity measurement unit 220, and the like. The input device 270 receives various inputs from the user.

  The chromaticity measuring unit 220 obtains a color image captured in a state where the light emitting device 10 emits light from the camera 222 which is a color camera that captures the light emitting device 10, and uses the color image to perform color conversion by image processing. The light color of the surface of the unit 120 is measured.

  At this time, the chromaticity measurement unit 220 does not obtain the light color of the surface of the color conversion unit 120 in a unified manner, but the acquired image so that local color unevenness in the color conversion unit 120 is also reflected. The light color is measured for each pixel.

  The “light color” in the first embodiment includes the chromaticity, color tone (brightness and saturation), color temperature, and the like of the emitted light. In the first embodiment, the chromaticity measurement unit 220 is an example. Assuming that the chromaticity of light emitted from the light emitting device 10 is measured.

  The chromaticity measuring unit 220 may be configured to take a representative value (average value or median value) for each set of a plurality of pixels and measure the light color for each set.

  The chromaticity measuring unit 220 may be a measuring device using a general-purpose spectroscope for measuring optical characteristics such as chromaticity or luminance.

  In this case, for example, the chromaticity measurement unit 220 measures the spectrum of light on the light emitting surface (light emitting side surface) of the light emitting device 10 to obtain the chromaticity. Note that the chromaticity measuring unit 220 may measure luminescence intensity or light distribution characteristics in addition to chromaticity (light spectrum of the light emitting device 10).

  The suction unit 40 is a suction device that sucks in air the processing powder generated by the laser processing of the irradiation unit 210. In the first embodiment, the suction unit 40 sucks the processing powder obliquely upward. The suction unit 40 sucks the processing powder 125 from at least the irradiation unit 210 side (Z-axis direction + side) with respect to the light emitting device 10. The suction unit 40 may be any device that can suck dust such as processed powder.

  The adsorption part 50 is a metal member having conductivity, such as aluminum or stainless steel. Hereinafter, the shape of the suction portion 50 will be described with reference to FIG. FIG. 6 is an external perspective view of the suction portion 50.

  The suction part 50 has a cylindrical shape that forms an opening 51 through which laser light passes. The area of the opening 51 at the end of the suction part 50 on the light emitting device 10 side is the opening at the end of the suction part 50 on the irradiation part 210 side. Less than 51 area. More specifically, the area of the opening 51 formed by the suction unit 50 decreases from the irradiation unit 210 side (Z-axis direction + side) toward the stage 240 side (Z-axis direction − side, light-emitting device 10 side). . In other words, the adsorption part 50 has a mortar shape (funnel shape) without a bottom.

  In addition, as will be described later, the suction portion 50 may be provided with a convex portion or the like, but in such a case as well, the area of the opening 51 formed by the suction portion 50 is excluding components such as the convex portion. It can be said that it becomes smaller from the irradiation unit 210 side toward the stage 240 side.

  The adsorption unit 50 is supported between the irradiation unit and the light emitting device 10 by the arm 60. When the suction unit 50 and the light emitting device 10 are viewed from above (when viewed from the Z-axis direction + side), all or part of the light emitting device 10 is visible through the opening 51 formed by the suction unit 50.

  The suction unit 50 is charged when the power supply 70 is turned on. At this time, the polarity that the adsorbing part 50 is charged is opposite to that of the processing powder, and differs depending on the processing object. The power supply 70 is turned on and off by the control unit 250, for example.

  The adsorption unit 50 is a characteristic configuration of the manufacturing apparatus 200, and effects obtained by the adsorption unit 50 will be described later.

[Method for Manufacturing Light Emitting Device]
Next, a method for manufacturing the light emitting device 10 using the manufacturing apparatus 200 will be described. FIG. 7 is a flowchart showing a method for manufacturing the light emitting device 10. FIG. 8 is a cross-sectional view for explaining laser processing for the light emitting device 10.

  First, the light emitting device 10 is generated (S10). Hereinafter, a method for generating the light emitting device will be described.

  First, a plurality of LED chips 110 are mounted on the substrate 20. At this time, the plurality of LED chips 110 form a plurality of light emitting element arrays 115, and in one light emitting element array 115, adjacent LED chips 110 are electrically connected to each other by bonding wires 160.

  Next, the liquid color conversion unit 120 including the phosphor 130 is applied to the light emitting element array 115, and the applied liquid color conversion unit 120 is cured.

  In addition, when performing chromaticity adjustment with respect to the already generated (off-the-shelf) light emitting device 10, step S10 is omitted.

  Subsequently, the generated light emitting device 10 is inspected for lighting in a state where the light emitting device 10 is energized to emit light (S20). Subsequently, the chromaticity measurement unit 220 measures the chromaticity of light emitted from the light emitting device 10 (color conversion unit 120) (S30). Then, it is determined whether or not the chromaticity measured by the chromaticity measuring unit 220 is within a predetermined range (S40).

  When the chromaticity measured by the chromaticity measuring unit 220 is within the predetermined range (Yes in S40), the chromaticity adjustment of the light emitting device 10 is finished. The predetermined range is, for example, a chromaticity inspection specification of the light emitting device 10 in the manufacturing process.

  When the chromaticity measured by the chromaticity measuring unit 220 is outside the predetermined range (No in S40), the irradiation unit 210 irradiates the color conversion unit 120 with the laser beam 230 from above (+ Z direction) (S50). Note that out of the predetermined range here means that the chromaticity is shifted to the yellow side, and when the chromaticity is shifted to the blue side, for example, addition of the liquid color conversion unit 120 Application is performed.

  At this time, the irradiation condition (intensity, etc.) of the laser beam 230 is determined based on the chromaticity measured by the chromaticity measuring unit 220. Note that a plurality of pieces of information on the irradiation conditions of the laser beam 230 are registered in advance in association with the measurement result of the chromaticity measuring unit 220, and are automatically determined based on the registered information.

  When the laser beam 230 is irradiated on a part of the color conversion unit 120, the processing powder 125 is scattered. The processing powder 125 is sucked by the suction unit 40 obliquely upward along the inner wall of the suction unit 50 (S60), and the suction unit 50 sucks the sucked processing powder 125 (S70).

  After the working powder 125 is adsorbed (S70) and the lighting inspection is performed (S20), the chromaticity measuring unit 220 measures the chromaticity of the light emitting device 10 after processing the laser beam 230 (S30). Thereafter, until the chromaticity measured by the chromaticity measuring unit 220 falls within a predetermined range, the irradiation of the laser beam 230 of the irradiation unit 210, the suction and adsorption of the processed powder 125, and the chromaticity of the chromaticity measurement unit 220 are performed. The measurement is repeated. The operations in steps S20 to S70 may be automatically performed by the control unit 250, or may be performed semi-automatically by the user.

  Note that the chromaticity measurement of the chromaticity measurement unit 220 and the irradiation of the laser beam 230 of the irradiation unit 210 may be performed in real time (simultaneously).

  Further, for example, while measuring at least one of chromaticity (light spectrum of the light emitting device 10), light emission intensity, and light distribution characteristics, the laser light 230 is irradiated to remove a part of the color conversion unit 120. May be.

  In this case, the camera 222 is disposed in the vicinity of the optical system 210b so that the light emitting device 10 can be imaged even during irradiation with the laser beam 230.

  Thus, the time required for processing of the light emitting device 10 can be shortened by performing the chromaticity measurement of the chromaticity measurement unit 220 and the irradiation of the laser beam 230 of the irradiation unit 210 in real time.

[Effects]
The manufacturing apparatus 200 is characterized in that the suction unit 50 is provided. Hereinafter, the effect obtained by providing the adsorption | suction part 50 is demonstrated.

  The processing powder 125 generated by the laser processing includes white powder in which the molecular bond of the silicone resin of the color conversion unit 120 is cut to become SiO2. When such processed powder 125 adheres to the color conversion unit 120 of the light emitting device 10, the processed powder 125 functions as a reflector, and a problem that desired chromaticity cannot be obtained occurs.

  Further, the processing powder 125 generated by the laser processing includes a black powder in which the molecular bond of the silicone resin of the color conversion unit 120 is cut to form a C (carbon) component alone. When such processed powder 125 adheres to the color conversion unit 120 of the light emitting device 10, light is absorbed, which causes a problem of reduction in light emission efficiency.

  Since the processing powder 125 is charged, once it adheres to the color conversion unit 120, it is not easy to remove. Further, since the processed powder 125 has a large specific gravity due to the inclusion of SiO2, it is difficult to completely suck the processed powder 125 only by the suction by the suction unit 40.

  Therefore, in the manufacturing apparatus 200, the adsorption unit 50 is provided between the irradiation unit 210 and the light emitting device 10. Thereby, deposition and adhesion of the processing powder 125 on the color conversion unit 120 of the light emitting device 10 are reduced.

  Here, for example, a configuration in which a plate-like suction part provided with an opening through which the laser beam 230 passes is provided between the irradiation part 210 and the light emitting device 10 is conceivable. In such an adsorbing portion, the processing powder 125 adsorbed on the lower surface (the surface facing the light emitting device 10) may fall due to air pressure or the like and adhere to the color conversion portion 120.

  Therefore, in the manufacturing apparatus 200, the adsorption unit 50 has a cylindrical shape (cylinder shape) that forms the opening 51 through which the laser light 230 passes, and the area (diameter) of the opening 51 is larger than the end portion on the light emitting device 10 side. The end on the irradiation unit 210 side is smaller. Thereby, it can suppress that the adsorbed processing powder 125 falls, and can reduce the deposition and adhesion of the processing powder 125 to the color conversion unit 120.

  As described above, according to the cylindrical (cylindrical) adsorption portion 50 in which the area of the opening 51 decreases from the irradiation unit 210 side toward the light emitting device 10 side, a so-called nozzle effect is obtained. Specifically, the nozzle effect here is an effect in which the air flow rate by the suction of the suction unit 40 is increased on the light emitting device 10 side in the opening 51, and the ascending air current becomes stronger. That is, according to the suction part 50, the effect of increasing the suction force of the suction part 40 is also obtained.

[Modification]
In addition, the shape of an adsorption | suction part is not limited to the above shapes.

  For example, a receiving portion that receives the processing powder 125 that is about to fall from the suction portion may be provided at the end of the suction portion on the light emitting device 10 side. FIG. 9 is a cross-sectional view showing the structure of the suction portion provided with the receiving portion.

  The adsorbing part 50a shown in FIG. 9 has a shape in which the end surface of the adsorbing part 50 on the light emitting device 10 side is folded inward. The folded portion functions as a receiving portion 55, and the receiving portion 55 receives the processing powder 125 that is about to fall from the suction portion 50a, thereby further reducing the accumulation and adhesion of the processing powder 125 on the color conversion portion 120. can do.

  The receiving portion 55 is typically provided over the entire circumference of the end portion on the light emitting device 10 side, but may be provided on a part of the end portion on the light emitting device 10 side. Moreover, in the adsorption | suction part 50a, although the receiving part 55 is integrally formed with the main body of the adsorption | suction part 50a, the receiving part 55 may be formed by attaching another member to the main body of the adsorption | suction part 50a.

  Moreover, the inner wall (inner surface) of the adsorption portion may not be a plane. FIG. 10 is a cross-sectional view illustrating the structure of the suction portion having a curved inner wall.

  The adsorbing part 50b shown in FIG. 10 has a bowl shape with an open bottom, and the angle of the tangent plane of the inner wall with respect to the horizontal plane decreases from the irradiation part 210 side toward the light emitting device 10 side. That is, the tangential plane of the inner wall approaches the horizontal plane from the irradiation unit 210 side toward the light emitting device 10 side. Therefore, also by such an adsorption | suction part 50b, possibility that the processing powder 125 once adsorbed will fall from the adsorption | suction part 50b can be lowered | hung.

  Further, a convex portion may be provided on the inner wall of the suction portion 50. FIG. 11 is a cross-sectional view showing the structure of the suction portion having a convex portion on the inner wall.

  In the adsorption part 50c shown in FIG. 11, the processing powder 125 is caught by the convex part 52 provided in the inner wall. Moreover, in such a structure, since electric charge tends to concentrate on the uneven | corrugated | grooved part formed by the convex part 52, there exists an effect which improves an electrical attraction force. Therefore, according to the adsorption | suction part 50c, possibility that the processing powder 125 once adsorbed will fall from the adsorption | suction part 50c can be lowered | hung. In addition, although the convex part 52 is provided over the perimeter of the inner wall of the adsorption | suction part 50c, for example, you may be provided in a part of circumferential direction of the inner wall of the adsorption | suction part 50c.

  Further, the inner wall (inner surface) of the suction portion 50 may be stepped. FIG. 12 is a cross-sectional view showing the structure of a suction portion whose inner wall has a stepped shape.

  In the adsorption part 50d shown in FIG. 12, since the processing powder 125 can be received at the stage provided on the inner wall, the possibility that the once-adsorbed machining powder 125 falls from the adsorption part 50d can be reduced.

(Other embodiments)
The present invention is not limited to the above embodiment.

  The light emitting device 10 of the above embodiment is an example of a processing object. The laser processing apparatus of the present invention can be realized not only as the manufacturing apparatus 200 of the light emitting device 10 but also as a laser processing apparatus that processes an object to be processed other than the light emitting device 10.

  For example, the present invention can be applied to laser processing of a resin member such as a light guide plate. In this case, the irradiation unit 210 is a gas laser such as a CO2 laser and an excimer laser, but is preferably a CO2 laser. For example, the CO 2 laser irradiates laser light having a wavelength of 2 μm or more and 11 μm or less.

  The present invention can also be applied to laser processing of ceramic members. In this case, the irradiation unit 210 is a solid-state laser such as a YAG laser, a YVO4 laser, and a titanium sapphire laser, but is preferably a YAG laser. For example, the YAG laser irradiates laser light having a wavelength of 0.35 μm or more and 2 μm or less.

  In addition, the present invention can be applied to laser processing of a member in which charged processing powder scatters, such as a metal member.

  The present invention can also be applied to processing a light emitting device having an SMD (Surface Mount Device) structure. An SMD type light emitting device (light emitting element) includes, for example, a resin container having a recess, an LED chip mounted in the recess, and a sealing member (phosphor-containing resin) sealed in the recess. Prepare.

  Moreover, arrangement | positioning of the suction part 40 and the adsorption | suction part 50 in the said embodiment is an example, and the arrangement | positioning of the adsorption | suction part 40 and the adsorption | suction part 50 may be changed in the range which can implement | achieve the characteristic function of this invention. For example, as shown in FIG. 13, the suction part 40 may be disposed on the side of the suction part 50 e having the through-hole 56, and the work powder 125 may be sucked from the side. FIG. 13 is a cross-sectional view illustrating an example in which the suction unit 40 performs suction from the side of the suction unit 50e.

  As shown in FIG. 13, the suction part 50 e has the same shape as the suction part 50, but is provided with a through-hole 56 that penetrates in a direction intersecting the laser light irradiation direction (Z-axis direction). Is different from the suction part 50. And the suction part 40 is provided in the side of the adsorption | suction part 50e, and attracts the process powder 125 through the through-hole 56 from the outer wall side of the adsorption | suction part 50e.

  In such a configuration, since the machining powder 125 is sucked toward the adsorption unit 50e, the machining powder 125 can be efficiently adsorbed to the adsorption unit 50e. The direction of the through hole 56, the position where the through hole 56 is provided, and the method of forming the through hole 56 are not particularly limited.

  Further, in the above embodiment, the cylindrical suction part has been described. However, the shape of the suction part is such that the area of the opening is from the irradiation part 210 side to the light emitting device 10 side as in the suction part 50f shown in FIG. It may be a rectangular tube shape that decreases as it goes. FIG. 14 is an external perspective view of a rectangular tube-shaped suction part 50f.

  The shape of the opening of the suction part 50f shown in FIG. 14 is a rectangle, but the shape of the opening may be other polygons such as a pentagon.

  In the light emitting device 10 of the above embodiment, the plurality of LED chips 110 constituting one light emitting element row 115 are connected in series by Chip To Chip. However, the plurality of LED chips 110 are connected in series via the wiring by connecting the p-side electrode and the n-side electrode of each LED chip 110 to the wiring provided on the substrate 20 by the bonding wire 160. Also good.

  In the above embodiment, the phosphor 130 is described as being a yellow phosphor. However, in addition to the yellow phosphor, the color conversion unit 120 includes a green phosphor that emits green fluorescence or a red fluorescence that emits red fluorescence. Body may be included. The green phosphor and the red phosphor are mixed in the color conversion unit 120 for the purpose of enhancing the color rendering property of white light. The color conversion unit 120 includes a green phosphor and a red phosphor instead of the yellow phosphor, and emits white light from the light emitting device in combination with the blue light emitted from the LED chip 110. Also good.

  The LED chip 110 may be an LED chip that emits light other than blue light. For example, the LED chip 110 may be an LED chip that emits near ultraviolet rays. In this case, the color conversion unit 120 includes each color phosphor that emits light of three primary colors (red, green, and blue).

  The light emitting device 10 may use a light wavelength conversion material other than a phosphor. For example, the light wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, An optical wavelength conversion material made of a substance that emits light having a wavelength different from the absorbed light may be used. That is, the manufacturing apparatus and the manufacturing method of the present invention can also be applied to a light emitting device using a light wavelength conversion material other than a phosphor.

  Moreover, in the said embodiment, although LED chip 110 was used as a light emitting element, solid state light emitting elements, such as semiconductor light emitting elements, such as a semiconductor laser, organic EL (Electro Luminescence), or inorganic EL, were used as a light emitting element. May be.

  In the above-described embodiment, each component (for example, the control unit 250 and the chromaticity measurement unit 220) is configured by dedicated hardware or realized by executing a software program suitable for each component. May be. Each component may be realized by a program execution unit such as a CPU or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory.

  The light emitting device manufacturing apparatus (laser processing apparatus) and the light emitting device manufacturing method according to one or more embodiments have been described based on the embodiment, but the present invention is limited to this embodiment. It is not a thing. Unless it deviates from the gist of the present invention, various modifications conceived by those skilled in the art have been made in this embodiment, and forms constructed by combining components in different embodiments are also in one or more aspects. It may be included within the range.

DESCRIPTION OF SYMBOLS 10 Light-emitting device 20 Board | substrate 40 Suction part 50, 50a-50f Adsorption part 51 Opening 52 Convex part 55 Receiving part 56 Through-hole 110 LED chip (light emitting element)
120 color converter (translucent resin)
125 Processing powder 130 Phosphor 200 Manufacturing equipment (laser processing equipment)
210 Irradiation part

Claims (11)

An irradiation unit for processing an object by irradiating a laser beam;
A suction part for sucking processing powder generated by the processing;
An electrostatic chuck that electrostatically adsorbs the processing powder sucked into the suction section by charging,
The adsorbing portion has a cylindrical shape that forms an opening through which the laser light passes.
The area of the opening at the end of the suction portion on the object side is smaller than the area of the opening at the end of the suction portion on the irradiation portion side. The laser processing apparatus of Claim 1. The area of the said opening becomes small as it goes to the said object side from the said irradiation part side. The laser processing apparatus according to claim 1, wherein a receiving portion that receives a processing powder that is about to fall from the suction portion is provided at an end of the suction portion on the object side. The laser processing apparatus of any one of Claims 1-3 with which a convex part is provided in the inner wall of the said adsorption | suction part. The laser processing apparatus according to any one of claims 1 to 3, wherein an inner wall of the suction portion is stepped. The laser processing apparatus according to any one of claims 1 to 5, wherein the suction portion has a cylindrical shape or a rectangular tube shape. The suction part is provided with a through hole penetrating in a direction intersecting with the irradiation direction of the laser beam,
The laser processing apparatus according to any one of claims 1 to 6, wherein the suction unit sucks processing powder from the outer wall side of the suction unit through the through hole. The laser processing apparatus according to claim 1, wherein the irradiation unit is a gas laser and processes the object made of resin. The laser processing apparatus according to claim 1, wherein the irradiation unit is a solid-state laser and processes the ceramic object. A device for manufacturing a light emitting device,
The light emitting device is formed by covering at least a part of a light emitting element with a translucent resin containing a phosphor,
The light emitting device manufacturing apparatus comprises:
An irradiation unit that processes the translucent resin by irradiating a laser beam;
A suction part for sucking processing powder generated by the processing;
An electrostatic chuck that electrostatically adsorbs the processing powder sucked into the suction section by charging,
The adsorbing portion has a cylindrical shape that forms an opening through which the laser light passes.
The area of the opening at the end of the suction portion on the light emitting device side is smaller than the area of the opening at the end of the suction portion on the irradiation portion side. A method of manufacturing a light emitting device using an adsorption part,
The light emitting device is formed by covering at least a part of a light emitting element with a translucent resin containing a phosphor,
The method for manufacturing the light emitting device is as follows:
Processing the translucent resin by irradiating with laser light,
Aspirate the processing powder generated by the processing,
The work powder to be sucked is electrostatically adsorbed by charging the adsorption part,
The adsorbing portion has a cylindrical shape that forms an opening through which the laser light passes.
The method of manufacturing a light emitting device, wherein an area of the opening at an end portion of the suction portion on the light emitting device side is smaller than an area of the opening at an end portion of the suction portion on the irradiation portion side.

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