JPH0220684A - Laser scriber - Google Patents
Laser scriberInfo
- Publication number
- JPH0220684A JPH0220684A JP63170641A JP17064188A JPH0220684A JP H0220684 A JPH0220684 A JP H0220684A JP 63170641 A JP63170641 A JP 63170641A JP 17064188 A JP17064188 A JP 17064188A JP H0220684 A JPH0220684 A JP H0220684A
- Authority
- JP
- Japan
- Prior art keywords
- suction chamber
- nozzle
- worked
- chamber
- scattered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000694 effects Effects 0.000 claims abstract description 7
- 230000005684 electric field Effects 0.000 claims abstract description 4
- 238000007664 blowing Methods 0.000 abstract 2
- 230000001678 irradiating effect Effects 0.000 abstract 2
- 230000003245 working effect Effects 0.000 abstract 1
- 238000003754 machining Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はレーザを用いてスクライブ加工をするレーザス
クライバの飛散物除去に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to the removal of flying debris from a laser scriber that performs scribing using a laser.
従来、レーザを用いてアルミナセラミックなどの溝堀り
加工いわゆるスクライブ加工をする装置が知られている
。2. Description of the Related Art Conventionally, there has been known an apparatus that performs grooving, so-called scribing, on alumina ceramics or the like using a laser.
このような装置は、多くの場合加工効果増進のため、加
工時集光点に集光ビームに沿い気体を集束して吹きつげ
ることが行われている。このため加工による蒸発あるい
は溶融物が周辺に飛散しこれが対象加工物上に固着した
り、加工部集辺を汚染するなどの欠点があった。In many cases, such devices focus and blow gas along a condensed beam at a condensing point during machining in order to improve the machining effect. For this reason, there are drawbacks such as evaporation or molten material caused by processing scattering around and sticking to the target workpiece or contaminating the processing area.
飛散物を捕捉するため真空引きした吸引チャンバの考え
かたは従来からある。しかし、これでは不十分なので、
本発明ではワークに高電界をかけ静電的にチャージした
飛散物を逆極性の吸引チャンバ方向に引きつける効果と
並用して捕捉効果を一層高くするようにしたレーザスク
ライバである。The concept of evacuated suction chambers to capture flying debris is conventional. However, this is not enough, so
The present invention is a laser scriber in which a high electric field is applied to a workpiece to attract electrostatically charged flying objects toward a suction chamber of opposite polarity, thereby further enhancing the trapping effect.
本発明は集光点付近に吸引チャンバを設は真空にして飛
散物を吸引すると同時に、対象加工物と吸引チャンバと
の間に高電圧を印加して静電的にも吸引効果を促進しよ
うとするものである。In the present invention, a suction chamber is installed near the light convergence point to create a vacuum to suction the scattered objects, and at the same time, a high voltage is applied between the target workpiece and the suction chamber to promote the suction effect electrostatically. It is something to do.
次に本発明の実施例を図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.
1は図示しないレーザより出射され導入されたレーザ光
、2はその集光レンズ、3はレンズ2の保持具で、機密
性のあるもの、4は加圧された気体を集光点31に導く
円錐状の加圧チャンバ、5はチャンバ4の外壁をも一部
として構成される飛散物の吸引チャンバ、6は50本体
部分と導電体で構成される吸引チャンバ先端部7との間
を電気的に絶縁する絶縁部材、8は対象加工物9を載置
して移動させる移動手段、10は加工物9に高電圧を印
加するための電極、11は電極10と移動手段8との間
を絶縁する絶縁部材、12は7と10との間に高電圧を
印加するための高電圧源とその配線、21は図示しない
加圧源により加圧された気体、22は図示しない真空源
により吸引される気体、23は4の先端部を通過して9
に吹付けられる気体21の散乱流、24は加工により生
じた飛散物である。1 is a laser beam emitted and introduced from a laser (not shown), 2 is a condensing lens thereof, 3 is a holder for the lens 2 which is airtight, and 4 is a pressurized gas guided to a condensing point 31 A conical pressurizing chamber, 5 is a suction chamber for flying debris that also includes the outer wall of the chamber 4, and 6 is an electrical connection between the main body part 50 and the suction chamber tip 7 made of a conductor. 8 is a moving means for placing and moving the target workpiece 9; 10 is an electrode for applying a high voltage to the workpiece 9; 11 is an insulating member between the electrode 10 and the moving means 8; 12 is a high voltage source and its wiring for applying a high voltage between 7 and 10, 21 is a gas pressurized by a pressure source (not shown), and 22 is a gas sucked by a vacuum source (not shown). gas, 23 passes through the tip of 4 and 9
A scattered flow of gas 21 is blown onto the surface, and 24 are scattered objects generated by processing.
このような構成において、まず対象加工物9はX−Yテ
ーブルなどの移動手段8により所望の軌跡で移動させら
れ、集光点31において集光照射された1により加工さ
れていく。この際、加工効果促進のため円筒状の加工チ
ャンバ4により加圧気体21が集束して吹付けられ散乱
流23となる。In such a configuration, the target workpiece 9 is first moved along a desired trajectory by the moving means 8 such as an X-Y table, and is processed by the 1 irradiated with condensed light at the condensing point 31 . At this time, pressurized gas 21 is focused and blown into a scattered flow 23 by the cylindrical processing chamber 4 in order to promote the processing effect.
一方集光点31に接近して配置された吸引チャンバ5の
内部は真空源により常に吸引され気体流22となる。加
工により生じた飛散物24は散乱流23により散乱させ
られるが、吸引チャンバ5の先端部7に円筒状の加圧チ
ャンバ4と同軸状に設けられた穴を通じ吸引捕捉される
。しかし、このとき散乱流23の影響により、飛散物の
相当量は捕捉されず外部に散逸する。一方電極10を介
して高電圧源12により吸引チャンバの先端部6に対し
逆に印加され帯電された対象加工物9からの飛散物24
は同じく帯電され、したがって、これは吸引チャンバの
先端部7の穴へ向かって吸弓され捕捉率は向上する。On the other hand, the interior of the suction chamber 5 disposed close to the condensing point 31 is constantly suctioned by a vacuum source to form a gas flow 22 . Scattered objects 24 generated by processing are scattered by the scattering flow 23, and are suctioned and captured through a hole provided in the tip 7 of the suction chamber 5 coaxially with the cylindrical pressurizing chamber 4. However, at this time, due to the influence of the scattering flow 23, a considerable amount of the scattered objects are not captured and are scattered to the outside. On the other hand, the flying object 24 from the target workpiece 9 is electrically charged by being reversely applied to the tip 6 of the suction chamber by the high voltage source 12 via the electrode 10.
is also charged, and therefore it is sucked towards the hole in the tip 7 of the suction chamber, improving the capture rate.
以上説明したように本発明は、従来の吸引チャンバと高
電圧による静電吸引とを並用することにより飛散物捕捉
効果の大きいレーザスクライバを提供することができる
。As explained above, the present invention can provide a laser scriber that is highly effective at capturing flying objects by using both a conventional suction chamber and electrostatic suction using high voltage.
第1図は本発明の実施例を示す断面図である。
1・・・・・・レーザ光、2・・・・・・集光レンズ、
3・・団・2の保持具、4・・・・・・加圧チャンバ、
5・・・・・・吸引チャンバ、6・・・・・・絶縁部材
、7・・・・・・吸引チャンバ先端部、8・・・・・・
移動手段、9・・・・・・対象加工物、10・・・・・
・電極、11・・・・・・絶縁部材、12・・・・・・
高電圧電源とその配線、21・・・・・・加圧された気
体、22・・印・吸引される気体、23・・・・・・散
乱流、24・・・・・・飛散物、31・・・・・・集光
点。
代理人 弁理士 内 原 晋FIG. 1 is a sectional view showing an embodiment of the present invention. 1... Laser light, 2... Condensing lens,
3... Group 2 holder, 4... Pressure chamber,
5... Suction chamber, 6... Insulating member, 7... Suction chamber tip, 8...
Transportation means, 9...Target workpiece, 10...
・Electrode, 11...Insulating member, 12...
High voltage power supply and its wiring, 21... Pressurized gas, 22... Marked/suctioned gas, 23... Scattered flow, 24... Flying objects, 31... Focus point. Agent Patent Attorney Susumu Uchihara
Claims (1)
物に気体を吹付ける前記集光レンズの出射側取付けられ
たノズルと、前記対象加工物を載置移動させるテーブル
とからなるレーザスクライバにおいて、前記ノズルの外
側に加工の飛散物を吸引させる吸引チャンバと、前記テ
ーブルと前記吸引チャンバとの間に電界を生じさせる手
段とを備えて前記飛散物の吸引効果を倍増させたことを
特徴とするレーザスクライバ。A laser scriber comprising a laser and a lens that focuses the output beam thereof, a nozzle attached to the output side of the condensing lens that blows gas onto the target workpiece, and a table on which the target workpiece is placed and moved, The present invention is characterized in that it includes a suction chamber for sucking flying debris from processing to the outside of the nozzle, and a means for generating an electric field between the table and the suction chamber, thereby doubling the suction effect of the flying debris. laser scriber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63170641A JPH0220684A (en) | 1988-07-08 | 1988-07-08 | Laser scriber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63170641A JPH0220684A (en) | 1988-07-08 | 1988-07-08 | Laser scriber |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0220684A true JPH0220684A (en) | 1990-01-24 |
Family
ID=15908642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63170641A Pending JPH0220684A (en) | 1988-07-08 | 1988-07-08 | Laser scriber |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0220684A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6576871B1 (en) * | 2000-04-03 | 2003-06-10 | Rexam Ab | Method and device for dust protection in a laser processing apparatus |
TWI400138B (en) * | 2010-11-18 | 2013-07-01 | Ind Tech Res Inst | Absorbing method and apparatus for rear side laser process |
JP2016078023A (en) * | 2014-10-09 | 2016-05-16 | パナソニックIpマネジメント株式会社 | Laser processing device, manufacturing device for light-emitting device, and method for manufacturing light-emitting device |
CN108723581A (en) * | 2018-06-15 | 2018-11-02 | 湖南大学 | A kind of binary vortices electric field-assisted ultrafast laser machining system and its processing method |
EP4124406A1 (en) * | 2021-07-29 | 2023-02-01 | Samsung SDI Co., Ltd. | Cutting device and method for cutting an electrode foil for a secondary battery cell |
-
1988
- 1988-07-08 JP JP63170641A patent/JPH0220684A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6576871B1 (en) * | 2000-04-03 | 2003-06-10 | Rexam Ab | Method and device for dust protection in a laser processing apparatus |
TWI400138B (en) * | 2010-11-18 | 2013-07-01 | Ind Tech Res Inst | Absorbing method and apparatus for rear side laser process |
JP2016078023A (en) * | 2014-10-09 | 2016-05-16 | パナソニックIpマネジメント株式会社 | Laser processing device, manufacturing device for light-emitting device, and method for manufacturing light-emitting device |
CN108723581A (en) * | 2018-06-15 | 2018-11-02 | 湖南大学 | A kind of binary vortices electric field-assisted ultrafast laser machining system and its processing method |
CN108723581B (en) * | 2018-06-15 | 2020-09-25 | 湖南大学 | Double-vortex electric field assisted ultrafast laser processing system and processing method thereof |
EP4124406A1 (en) * | 2021-07-29 | 2023-02-01 | Samsung SDI Co., Ltd. | Cutting device and method for cutting an electrode foil for a secondary battery cell |
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