JPS62187591A - Recovery device for vaporizing and scattering matter by laser beam machining - Google Patents
Recovery device for vaporizing and scattering matter by laser beam machiningInfo
- Publication number
- JPS62187591A JPS62187591A JP61031045A JP3104586A JPS62187591A JP S62187591 A JPS62187591 A JP S62187591A JP 61031045 A JP61031045 A JP 61031045A JP 3104586 A JP3104586 A JP 3104586A JP S62187591 A JPS62187591 A JP S62187591A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- vaporizing
- laser beam
- laser
- gaseous body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011084 recovery Methods 0.000 title claims description 3
- 230000008016 vaporization Effects 0.000 title abstract 4
- 238000003754 machining Methods 0.000 title abstract 2
- 230000005068 transpiration Effects 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
- B23Q11/006—Devices for removing chips by sucking and blowing simultaneously
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はレーザ加工蒸散物の回収装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a recovery device for laser processing transpiration.
炭酸ガスレーザ、YAGレーザ又はアルゴンレーザ等の
高出力レーザ光を用いて、物体の表面加工、切断或いは
人体治療のための人体表面組織の蒸散や切開等が近年盛
んに行なわれるようになった。この場合、ミラーやファ
イバを用いてレーザ光を導き、その光を最終的にレンズ
によって集光し、被照射物にレーザを照射する。BACKGROUND ART In recent years, high-power laser beams such as carbon dioxide lasers, YAG lasers, or argon lasers have been increasingly used to process and cut the surface of objects, or to evaporate and incise tissue on the surface of the human body for human body treatment. In this case, a mirror or a fiber is used to guide the laser beam, the light is finally focused by a lens, and the object to be irradiated is irradiated with the laser beam.
この場合、レンズは被照射物から通常数龍〜数ωの位置
にあるため、加工時に噴出する被照射物の蒸散物がレン
ズに付着しこれを汚すことがしばしばあった。これを避
けるために、第2図に示すように、レンズ11の近傍に
気体噴射ノズル12を設置し、レーザ13の照射中はノ
ズル12から気体を被照射物14に向けて吹き付け、こ
れによって蒸散物を吹き飛ばす方法がとられていた。In this case, since the lens is usually located at a distance of several to several ω from the object to be irradiated, the evaporated matter of the object to be irradiated ejected during processing often adheres to the lens and stains it. In order to avoid this, a gas injection nozzle 12 is installed near the lens 11 as shown in FIG. The method used was to blow things up.
しかしながら、上記の方法では、蒸散物の飛散方向を充
分に制御できず、被照射物の表面形状によっては蒸散物
がかえってレンズ表面に付着することになる問題があっ
た。レンズ表面に蒸散物が付着すると、照射レーザのパ
ワーが低下するとともに、場合゛によってはレンズ表面
が強力なレーザによって損傷を受けることもあった。However, in the above method, the scattering direction of the evaporated matter cannot be sufficiently controlled, and depending on the surface shape of the object to be irradiated, the evaporated matter may instead adhere to the lens surface. When evaporated matter adheres to the lens surface, the power of the irradiating laser decreases, and in some cases, the lens surface may be damaged by the powerful laser.
また、レーザ照射を行なう環境によっては、蒸散物が空
中に放出されることが許されない場合もあり、このよう
な環境ではレーザ加工が行なえないこともあった。Furthermore, depending on the environment in which laser irradiation is performed, it may not be possible for evaporated substances to be released into the air, and laser processing may not be possible in such environments.
そこで、この発明は蒸散物の制御を確実に行なうことに
より、上記の問題点を解決することを目的とする。Therefore, it is an object of the present invention to solve the above problems by reliably controlling transpiration.
上記の問題点を解決するために、この発明は第1図に示
すように、レーザ照射装置の先端集光レンズ1の前方に
、レーザ2の通路を挾んで気体噴射用ノズル3と、気体
吸引用ノズル4を対向配置したものである。In order to solve the above-mentioned problems, the present invention, as shown in FIG. The nozzles 4 are arranged opposite to each other.
これらのノズル3.4は、パイプ5.6の先端に設けら
れ、空気又は適当なガスを一方のノズル3から噴出し、
他方のノズル4から吸引することにより、ノズル3.4
間に気体の層流を発生させる。レーザ2はその層流を突
き抜けて被照射物7に照射される。These nozzles 3.4 are provided at the tip of the pipe 5.6, and air or a suitable gas is ejected from one nozzle 3.
By suctioning from the other nozzle 4, nozzle 3.4
A laminar flow of gas is generated between the two. The laser 2 penetrates through the laminar flow and irradiates the object 7 to be irradiated.
上記の装置によってレーザ加工を行なうと、被照射物か
ら発生する蒸散物は、気体の層流に捕捉され、その流れ
に従って吸引側のノズル4に吸い込まれる。When laser processing is performed using the above-mentioned apparatus, the evaporated matter generated from the irradiated object is captured by the laminar flow of gas, and is sucked into the nozzle 4 on the suction side according to the flow.
なお、気体の層流の位置、即ちノズル3.4の高さは、
蒸散物の飛散状況によって設定されるが、通常は被照射
物7に極めて接近した位置に設定される。Note that the position of the laminar flow of gas, that is, the height of the nozzle 3.4, is
Although it is set depending on the scattering situation of the evaporated matter, it is usually set at a position extremely close to the object 7 to be irradiated.
この発明は以上のように、蒸散物を気体の流れによって
捕捉するものであるから、蒸散物の飛散を避けることが
できる。したがって、蒸散物がレンズに付着することが
防止されるとともに、レンズの頻繁なりリーニングを行
なう必要がなく、使い易いレーザ加工装置となる。As described above, since the present invention traps transpired substances by the gas flow, it is possible to avoid scattering of transpired substances. Therefore, transpiration is prevented from adhering to the lens, and there is no need for frequent cleaning of the lens, resulting in an easy-to-use laser processing apparatus.
また、空中に蒸散物が飛散することがないため、クリー
ンな環境においてもレーザ加工、レーザ治療等を行なう
ことができる。Further, since no evaporated substances are scattered in the air, laser processing, laser treatment, etc. can be performed even in a clean environment.
第1図は実施例の概略正面図、第2図は従来例の概略正
面図である。
1・・・・・・集光レンズ、2・・・・・・レーザ、3
.4・・・・・・ノズル、7・・・・・・被照射物。FIG. 1 is a schematic front view of the embodiment, and FIG. 2 is a schematic front view of the conventional example. 1...Condensing lens, 2...Laser, 3
.. 4... Nozzle, 7... irradiated object.
Claims (1)
通路を挾んで気体噴射用ノズルと気体吸引用ノズルを対
向配置してなるレーザ加工蒸散物の回収装置。A laser processing transpiration recovery device comprising a gas injection nozzle and a gas suction nozzle placed opposite to each other in front of the tip condensing lens of a laser irradiation device with a laser path in between.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61031045A JPS62187591A (en) | 1986-02-13 | 1986-02-13 | Recovery device for vaporizing and scattering matter by laser beam machining |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61031045A JPS62187591A (en) | 1986-02-13 | 1986-02-13 | Recovery device for vaporizing and scattering matter by laser beam machining |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62187591A true JPS62187591A (en) | 1987-08-15 |
Family
ID=12320509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61031045A Pending JPS62187591A (en) | 1986-02-13 | 1986-02-13 | Recovery device for vaporizing and scattering matter by laser beam machining |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62187591A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3822097A1 (en) * | 1988-06-30 | 1990-01-04 | Messer Griesheim Gmbh | Method of deflecting particles moved in the direction of the optical system of a laser nozzle |
EP0856421A1 (en) * | 1997-01-30 | 1998-08-05 | DS4 S.r.l. | Method for the machining of buttons and other similar round objects by laser, operating radially in a hemisphere, device therefor, and products produced thereby |
JP2008252117A (en) * | 1999-11-05 | 2008-10-16 | Asml Netherlands Bv | Lithographic device |
US7605345B2 (en) * | 2002-03-14 | 2009-10-20 | Hitachi Zosen Corporation | Method and device for prevention of adhesion of dirt and contamination on optical parts in laser beam machine |
WO2015128293A1 (en) * | 2014-02-27 | 2015-09-03 | Trumpf Laser- Und Systemtechnik Gmbh | Laser machining head having a cross-jet nozzle close to the workpiece |
CN106312823A (en) * | 2016-08-29 | 2017-01-11 | 苏州市诚品精密机械有限公司 | Grinding machine with dust removal function |
US20190143443A1 (en) * | 2017-11-13 | 2019-05-16 | General Electric Company | Mobile large scale additive manufacturing using foil-based build materials |
US10828724B2 (en) | 2017-11-13 | 2020-11-10 | General Electric Company | Foil part vectorization for mobile large scale additive manufacturing using foil-based build materials |
US10828723B2 (en) | 2017-11-13 | 2020-11-10 | General Electric Company | Process monitoring for mobile large scale additive manufacturing using foil-based build materials |
-
1986
- 1986-02-13 JP JP61031045A patent/JPS62187591A/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3822097A1 (en) * | 1988-06-30 | 1990-01-04 | Messer Griesheim Gmbh | Method of deflecting particles moved in the direction of the optical system of a laser nozzle |
EP0856421A1 (en) * | 1997-01-30 | 1998-08-05 | DS4 S.r.l. | Method for the machining of buttons and other similar round objects by laser, operating radially in a hemisphere, device therefor, and products produced thereby |
JP2008252117A (en) * | 1999-11-05 | 2008-10-16 | Asml Netherlands Bv | Lithographic device |
US7605345B2 (en) * | 2002-03-14 | 2009-10-20 | Hitachi Zosen Corporation | Method and device for prevention of adhesion of dirt and contamination on optical parts in laser beam machine |
WO2015128293A1 (en) * | 2014-02-27 | 2015-09-03 | Trumpf Laser- Und Systemtechnik Gmbh | Laser machining head having a cross-jet nozzle close to the workpiece |
US10654129B2 (en) | 2014-02-27 | 2020-05-19 | Trumpf Laser- Und Systemtechnik Gmbh | Laser processing heads with a cross-jet nozzle |
CN106312823A (en) * | 2016-08-29 | 2017-01-11 | 苏州市诚品精密机械有限公司 | Grinding machine with dust removal function |
US20190143443A1 (en) * | 2017-11-13 | 2019-05-16 | General Electric Company | Mobile large scale additive manufacturing using foil-based build materials |
CN111344093A (en) * | 2017-11-13 | 2020-06-26 | 通用电气公司 | Mobile large scale additive manufacturing using foil-based build material |
US10828724B2 (en) | 2017-11-13 | 2020-11-10 | General Electric Company | Foil part vectorization for mobile large scale additive manufacturing using foil-based build materials |
US10828723B2 (en) | 2017-11-13 | 2020-11-10 | General Electric Company | Process monitoring for mobile large scale additive manufacturing using foil-based build materials |
US11364564B2 (en) * | 2017-11-13 | 2022-06-21 | General Electric Company | Mobile large scale additive manufacturing using foil-based build materials |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6647829B2 (en) | Laser processing equipment | |
KR102338625B1 (en) | Laser processing apparatus | |
JPS62187591A (en) | Recovery device for vaporizing and scattering matter by laser beam machining | |
US8642919B2 (en) | Laser processing nozzle | |
TW201509578A (en) | Laser processing device, laser processing method, and laser oscillation device | |
KR970005525B1 (en) | Laser torch | |
JPH09192870A (en) | Laser beam machining head, device, and method | |
KR102379215B1 (en) | Laser apparatus | |
JPH0299293A (en) | Laser machining head | |
JPH08192289A (en) | Laser beam machining device | |
JPH10309899A (en) | Laser treating apparatus and method for removing coat ing | |
JPH10305376A (en) | Laser processing apparatus and painting film removal method | |
JP2667769B2 (en) | Laser processing equipment | |
JPH06155066A (en) | Machining head device for laser beam welding equipment | |
KR101840669B1 (en) | Contactless particle suction device | |
ATE353732T1 (en) | METHOD AND DEVICE FOR LASER CUTTING | |
JPH11314190A (en) | Laser beam machining device and dust collecting method | |
JPH10225788A (en) | Method and torch for laser beam cutting | |
JPS62179888A (en) | Work nozzle for laser beam machine | |
JPH05123886A (en) | Laser beam machine | |
JPH06335791A (en) | Laser beam converging device | |
JPH0379116B2 (en) | ||
JPH05111780A (en) | Method and apparatus for cutting conductive pattern of printed board | |
JP6162014B2 (en) | Laser processing head | |
JPS6035736B2 (en) | Laser recording device |