JP5831013B2 - LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE - Google Patents

Description

  The present invention relates to a method for manufacturing a light-emitting device that can be used in lighting fixtures such as LED bulbs and spotlights, and a light-emitting device.

  In general, a light-emitting device using a light-emitting element is known to be small, power efficient, and emit bright colors. Since the light-emitting element according to this light-emitting device is a semiconductor element, the light-emitting element is characterized by not only less fear of ball breakage but also excellent initial drive characteristics and resistance to repeated vibration and on / off lighting. Because of such excellent characteristics, light emitting devices using light emitting elements such as light emitting diodes (LEDs) and laser diodes (LDs) are used as various light sources.

  A light-emitting device mainly includes a light-emitting element, a base material having a conductive wiring in which the light-emitting element is arranged and electrically connected to the light-emitting element, and a seal that covers the light-emitting element to protect it from dust, moisture, external force, and the like. And a stop member. When the sealing member contains a phosphor, the light emitting device can emit mixed color light of light from the light emitting element and light whose wavelength is converted by the phosphor. For example, by combining a blue light emitting element and a yellow phosphor such as YAG (Yttrium Aluminum Garnet), white light in which these light emissions are mixed can be obtained. In addition, for example, white light with improved color rendering can be obtained by combining a blue light emitting element, a yellow phosphor, and a red phosphor and mixing these light emissions.

  Conventionally, in a white LED in which a plurality of blue LEDs are mounted in a matrix at predetermined intervals and sealed with a yellow phosphor-containing sealing member, color unevenness generated on the light emitting surface of the white LED due to individual differences is reduced. A method has been proposed (see Patent Document 1). In the method described in Patent Document 1, the color unevenness of the white LED is measured in advance, and the light emitting surface of the white LED is divided into a white light region and a yellowish region. And by forming a dent with a laser beam on the light emitting surface of the sealing member in the yellowish area, the emission of light from the vicinity of the dent including the dent is inhibited, and the same as in the area where the dent is not formed Control is performed so that light is emitted in shades of light.

JP 2006-303303 A

  When a light-emitting device using a light-emitting element is mass-produced, variations in color tone occur due to individual differences of the light-emitting devices. Specifically, conventionally, light emitting devices are classified by color temperature such as warm white (Warm White) or white (White), and each product is further classified by areas finely divided in the XY chromaticity diagram. Each area shows a chromaticity rank. Then, in order to achieve a desired chromaticity rank, the type, size, number, etc. of the light-emitting element are determined, and the type, amount, combination, etc. of the phosphor are appropriately adjusted, and a light-emitting device is manufactured in large quantities, and the color tone is adjusted. We measure and sort good / bad and ship good products. That is, in the light-emitting devices that are mass-produced, those that are determined as defective without being in the desired chromaticity rank are included at a certain ratio. Since a light emitting device determined to have a poor color tone cannot be shipped as a product, a technique for improving the color tone yield is desired.

  The method described in Patent Document 1 is to reduce color unevenness on the light exit surface of a white LED, and does not improve the color tone of a light emitting device that is determined to be defective without having a desired color tone rank. Absent. Further, in this method, since a recess is formed with a laser beam on the light emitting surface of the sealing member in the yellowish region, when the sealing member is formed of resin, oxygen, outside air, etc. penetrate and the light emitting element There is also a possibility that the lifetime is reduced and the reliability is lowered.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing a light emitting device and a light emitting device that can improve the color yield without changing the shape of the sealing resin.

In order to solve the above problems, a method for manufacturing a light emitting device according to the present invention is a method for manufacturing a light emitting device having at least one light emitting element and a sealing resin that covers the light emitting element and contains a phosphor. there are, by discoloring the sealing resin around a portion of the phosphor viewed including the steps of forming a dark portion, by exciting the phosphor, and forming the dark portion.

  In this way, the dark color portion is formed around some of the phosphors, thereby reducing the function of converting the wavelength of light. That is, the ratio of the light whose wavelength is converted by the phosphor is reduced in the mixed color light of the light from the light emitting element and the light whose wavelength is converted by the phosphor. Therefore, after the dark color portion is formed, the chromaticity of the light emitting device is shifted to the color emitted from the light emitting element. Therefore, the color tone of the light emitting device can be corrected to a color tone having a desired chromaticity rank.

Further, when the phosphor is excited as this, the excitation light of the phosphor is deteriorated around the resin, a dark portion is formed as a result. Here, the alteration of the resin includes, for example, oxidation and carbonization.

  Moreover, it is preferable that the manufacturing method of the light-emitting device which concerns on this invention excites the said fluorescent substance with a laser beam. Here, if the condensing position of the laser light that passes through the sealing resin is set inside the sealing resin, a recess is not formed on the surface of the sealing resin even when the light emitting device is irradiated with the laser light. Will not be reduced.

  Moreover, it is preferable that the manufacturing method of the light-emitting device which concerns on this invention forms the said dark color part in the peripheral part of the said light emitting element in planar view.

  By doing in this way, a dark color part is not formed in the circumference | surroundings of the one part fluorescent substance currently disperse | distributed above the light emitting element in sealing resin. In this way, by forming the dark color portion by avoiding the area above the light emitting element where the light emission intensity becomes maximum, the light extraction efficiency is not lowered above the light emitting element after the laser light irradiation. A decrease in light output can be suppressed, and a desired brightness can be maintained. In addition, the light emitting element easily absorbs laser light, and irradiating laser light above the light emitting element may increase the range and density of discoloration compared to the case where other parts are irradiated with laser, and it is difficult to control the degree of discoloration. However, according to the present invention, such a situation can be prevented in advance. Further, since the peripheral portion of the light emitting element is irradiated, damage to the light emitting element can be prevented even if the laser light reaches the depth of the light emitting element in the sealing resin.

  In general, when the light emitting device is of a type in which a light emitting element is mounted on the bottom surface of the concave portion of the package and sealed with a sealing resin, peripheral light is compared with light near the center on the light irradiation surface. It is known that a yellow ring that becomes yellowish is produced. Specifically, in the case where the light emitting device is, for example, a white LED using a blue light emitting element and a YAG phosphor, if the amount of the phosphor is different between the upper surface direction and the oblique direction or the side surface direction of the light emitting element, the wavelength of the blue light is increased. There is also a difference in the degree of conversion. In the case of a type in which the light emitting element is mounted on the bottom surface of the recess, the distance from the light emitting element to the recess side wall tends to be larger than the distance from the light emitting element to the recess opening, that is, the phosphor in the oblique direction or side surface direction of the light emitting element Is likely to be larger than the amount of the phosphor in the upper surface direction of the light emitting element. For this reason, a yellow ring in which the vicinity of the center is blue and the outer peripheral portion is yellow on the light irradiation surface is generated.

  Therefore, in the method for manufacturing a light emitting device according to the present invention, the light emitting device includes a package having a recess in which the light emitting element is placed on a bottom surface, and the dark color portion is formed in a region surrounding the light emitting element. preferable. By doing so, a dark color portion is formed around the phosphor disposed in, for example, a substantially donut-shaped region surrounding the light emitting element in the concave portion, so that the function of converting the wavelength of light is reduced. Therefore, it is possible to reduce the yellow ring light on the light irradiation surface.

  Further, in the method for manufacturing a light emitting device according to the present invention, the light emitting device has at least one wire sealed with the sealing resin, and the dark color portion is formed in a region excluding a top portion of the wire in a plan view. Is preferably formed.

  By doing in this way, a dark color part is not formed in the circumference | surroundings of the part nearest to the light-projection surface of sealing resin in a wire, ie, the one part fluorescent substance disperse | distributed to wire top vicinity. When irradiating the inside of the sealing resin with laser light to form a dark color part, if the laser light is irradiated in the vicinity of the wire, the range and density of discoloration increase compared to the case of irradiating other parts. It is difficult to control the degree of discoloration. This is considered because the wire easily absorbs laser light. Therefore, by separating the laser beam irradiation position from the wire, such a situation can be prevented in advance. In order to separate the laser beam irradiation position from the wire, it is effective to avoid the top of the wire. The reason is that if the wire top portion and the wire portion above the light emitting element are avoided, the other wire portions are located on the bottom surface side close to the lead electrode. For this reason, when the laser beam is focused inside the sealing resin to aim at a position above the lead electrode for the purpose of exciting the phosphor, the laser beam is not applied to the wire portion located on the bottom side near the lead electrode. It becomes difficult to be irradiated.

  In addition, there is a sufficient area surrounding the light emitting element mounting area on the bottom surface of the recess, such as a small light emitting device called a side view type that emits light in the lateral direction, and the shape of the opening of the recess is a thin rectangular slit. Even if it does not exist, it is possible to correct the color tone of the light emitting device by irradiating the sealing resin with laser light while avoiding the vicinity of the top of the wire.

  Further, in the method for manufacturing a light emitting device according to the present invention, at least one of the x and y values in the xy chromaticity value of the light emitting device is decreased and the decreased value is 0.001 or more and 0.004 or less. Preferably, the dark color portion is formed.

  As described above, by setting the decrease value of at least one of the x and y values in the xy chromaticity value to be 0.001 or more, the color tone can be reliably corrected. In addition, by setting the decrease value of at least one of x and y in the xy chromaticity value to 0.004 or less, the discoloration of the sealing resin can be made inconspicuous, and the appearance can be kept good, and the light output Can be suppressed.

The light-emitting device according to the present invention is a light-emitting device that includes at least one light-emitting element and a sealing resin that covers the light-emitting element and contains a phosphor. includes a dark portion around the phosphor, the dark part you characterized in that said sealing resin the Futomeju butter or carbonized and oxidized.

  According to such a configuration, the light emitting device is a mixed color light of the light converted from the wavelength of the fluorescent material except for the fluorescent material provided with a dark color portion in the sealing resin and the light from the light emitting element. By emitting the light, it is possible to emit light having the same tone rank as the light emitted from other light-emitting devices that are mass-produced to include the same amount of the same phosphor without the dark color portion.

  In the light emitting device according to the present invention, it is preferable that the dark color portion is disposed in a peripheral portion of the light emitting element in a plan view.

  Further, in the light emitting device according to the present invention, when the light emitting element mounted on the bottom surface of the concave portion provided in the package is sealed with the sealing resin, the dark color portion is It is preferable to arrange in a region surrounding the light emitting element.

According to the method for manufacturing a light emitting device according to the present invention, it is possible to improve the color tone yield without changing the shape of the sealing resin. In addition, a highly reliable light-emitting device can be manufactured. Moreover, the color tone of the light emitting device manufactured once can be corrected.
According to the light emitting device of the present invention, the color tone yield can be improved without impairing the reliability.

BRIEF DESCRIPTION OF THE DRAWINGS It is an example of the light-emitting device handled with the manufacturing method of the light-emitting device which concerns on embodiment of this invention, Comprising: (a) is the top view which permeate | transmits the part seen from the main light emission surface side, and is shown typically (b). It is sectional drawing in the AA arrow of (a). It is a flowchart which shows the flow of the manufacturing method of the light-emitting device which concerns on embodiment of this invention. It is explanatory drawing of the manufacturing method of the light-emitting device which concerns on embodiment of this invention, Comprising: (a) is the top view which permeate | transmits the part seen from the main light emission surface side, and is shown typically (b). It is sectional drawing in the AA line arrow. It is explanatory drawing of the manufacturing method of the light-emitting device concerning embodiment of this invention, Comprising: (a) is sectional drawing which shows typically the focus of a laser beam, (b) is typical sealing resin before laser beam irradiation. (C) is sectional drawing which shows typically sealing resin after laser beam irradiation. It is a graph which shows the excitation spectrum of an example of the fluorescent substance used with the manufacturing method of the light-emitting device which concerns on embodiment of this invention. It is a graph which shows an example of the color tone before and behind laser beam irradiation of the light-emitting device shown in FIG. 2 is a graph showing the relationship between the laser light output irradiated to the light emitting device shown in FIG. 1 and the color tone, where (a) shows the x shift amount of the xy chromaticity value, and (b) shows the y shift amount of the xy chromaticity value. Show. It is explanatory drawing of the manufacturing method of the light-emitting device which concerns on embodiment of this invention, Comprising: (a) is a top view which shows typically the irradiation range of the laser beam of predetermined intensity, (b) shows the case where the irradiation range is increased. A plan view schematically showing, (c) is a plan view schematically showing the case where the laser intensity is increased. It is another example of the light-emitting device handled with the manufacturing method of the light-emitting device which concerns on embodiment of this invention, Comprising: (a) is a front view which permeate | transmits and shows typically, (b) is B of (a). It is sectional drawing in the -B line arrow. It is explanatory drawing of the manufacturing method of the light-emitting device which concerns on embodiment of this invention, Comprising: (a) is a front view which permeate | transmits and shows typically, (b) is a BB line arrow view of (a). FIG. It is a graph which shows an example of the color tone before and behind laser beam irradiation when the light-emitting device shown in FIG. 9 is manufactured on 1st experiment conditions. It is a graph which shows an example of the color tone before and behind laser beam irradiation when the light-emitting device shown in FIG. 9 is manufactured on 2nd experiment conditions. It is a graph which shows an example of the color tone before and behind laser beam irradiation when the light-emitting device shown in FIG. 9 is manufactured on 3rd experiment conditions. It is a block diagram which shows the 1st modification of the light-emitting device handled with the manufacturing method of the light-emitting device which concerns on embodiment of this invention, Comprising: (a) is a top view which permeate | transmits typically and shows (b). It is sectional drawing in the CC arrow of (a). It is a top view which permeate | transmits a part of 2nd modification of the light-emitting device handled with the manufacturing method of the light-emitting device which concerns on embodiment of this invention, and shows typically. It is a block diagram which shows the 3rd modification of the light-emitting device handled with the manufacturing method of the light-emitting device which concerns on embodiment of this invention, Comprising: (a) is a top view which permeate | transmits typically and shows (b). It is sectional drawing in the DD arrow of (a).

  Hereinafter, a method for manufacturing a light emitting device and a light emitting device according to an embodiment of the present invention will be described with reference to the drawings. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members in principle, and the detailed description will be omitted as appropriate.

  The method for manufacturing a light emitting device according to an embodiment of the present invention includes a step of forming a dark color portion by changing the color of the sealing resin around a part of the phosphors contained in the sealing resin of the light emitting device. For example, by exciting the phosphor, the color of the sealing resin around the phosphor can be changed. Further, for example, the phosphor can be excited by irradiating the inside of the sealing resin with laser light that passes through the sealing resin. Therefore, the manufacturing method of the light emitting device according to the embodiment of the present invention includes a step of irradiating a laser beam as a step of forming the dark color portion. The light emitting device that is the target of the laser light irradiation process is a light emitting device that has been determined to have poor color tone. As a premise, a large number of light emitting devices are manufactured in advance so as to obtain a desired chromaticity rank, and the color tone is measured and selected. As a result of the selection, a light emitting device that does not have a desired chromaticity rank is determined to be defective. In the method for manufacturing a light emitting device according to the present invention, it is preferable to obtain in advance a light emitting device whose color tone is determined to be poor. In addition, what is determined to be a non-defective product with a desired chromaticity rank need not be a target of the laser light irradiation process.

  Hereinafter, two different types of surface-mounted light-emitting devices will be described as examples of the light-emitting device to be handled. First, regarding the light emitting device of the first embodiment, the outline of the configuration of the light emitting device, the details of each configuration of the light emitting device, the overview of the manufacturing method of the light emitting device, the laser light irradiation process will be described, and then the same applies to the light emitting device of the second embodiment Explain in order.

(Light-emitting device of 1st form)
[Outline of configuration of light emitting device]
The light emitting device of the first form is the light emitting device 1 called a top view type shown in FIG. The light emitting device 1 is a light emitting device having a light emitting surface provided on the side opposite to the mounting surface of the light emitting device 1 and capable of irradiating light in a direction substantially perpendicular to the mounting surface of the light emitting device 1. For convenience of explanation, FIG. 1A shows the state in which the inside of the recess 40a is transmitted.

  The light emitting device 1 is a device that is used in, for example, a lighting fixture such as an LED bulb or a spotlight. As shown in FIG. 1, the light emitting device 1 mainly includes a light emitting element 10, lead frames 20 and 30, a base material 40, and a sealing resin 50.

  In the light emitting device 1, the side on which the light emitting element 10 is placed is called a main surface side, and the opposite side is called a back surface side. The main surface side is the light emitting surface side of the light emitting device 1, and the back surface side is the mounting surface side of the light emitting device 1. The lead frames 20 and 30 are electrically connected to the light emitting element 10. The base material 40 is comprised from thermosetting resins, such as an epoxy resin, for example. The substrate 40 and the lead frames 20 and 30 are integrally molded to constitute a package. In this package, a recess 40a for accommodating the light emitting element 10 is formed. The inner side wall 40b of the recess 40a is constituted by the base material 40 and forms an inclined surface. One surface of the lead frames 20 and 30 is exposed on the bottom surface portion 40c of the recess 40a, and a part of the base material 40 is between the lead frame 20 and the lead frame 30 in the bottom surface portion 40c of the recess 40a. Is arranged as. The sealing resin 50 contains the phosphor 70 at a predetermined ratio, and covers the light emitting element 10 accommodated in the recess 40 a of the base material 40. In addition, in FIG.1 (b), the fluorescent substance 70 is exaggerated and displayed.

  The light emitting device 1 includes three light emitting elements 10. Note that the number of the light emitting elements 10 is not particularly limited, and at least one is sufficient. The light emitting element 10 has a pair of positive and negative n electrodes (cathodes) 13 and p electrodes (anodes) 14 as shown in FIG. The n electrode 13 and the p electrode 14 are formed on the same surface (upper surface). In addition, the shape of the four corners of the upper surface of the base material 40 is asymmetric, and the side processed into a linear shape is a cathode mark 80 indicating the cathode side. A protection element 12 is provided on the lead frame 30. The protection element 12 protects the light emitting element 10 from element destruction and performance deterioration due to excessive voltage application.

[Details of each configuration of light emitting device]
Next, the detail of each structure of the light-emitting device 1 is demonstrated.

<Light emitting element>
The light emitting element 10 is a semiconductor element that emits light by applying a voltage. As shown in FIG. 1, a plurality of light emitting elements 10 are arranged in the recess 40 a of the base material 40. The light emitting element 10 is bonded to the lead frame 20 of the bottom surface portion 40c of the recess 40a by the bonding member 11 with the main light emitting surface facing upward. As a joining method, for example, a joining method using a resin or a solder paste as a joining member can be used.

Specifically, it is preferable to use a light-emitting diode as the light-emitting element 10, and a light-emitting element having an arbitrary wavelength can be selected according to the application. For example, as the light emitting element 10 of blue (light with a wavelength 430Nm～490nm), green (light with a wavelength 490Nm～570nm), nitride semiconductor _{(In X Al Y Ga 1-} X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) and the like can be used. As the red light emitting element 10 (light having a wavelength of 620 nm to 750 nm), GaAlAs, AlInGaP, or the like can be used.

In this embodiment, since the phosphors 70 are introduced into the sealing resin 50 as will be described later, a nitride semiconductor (In _X Al _Y Ga _1-1 that can emit light of a short wavelength that can efficiently excite those phosphors. _X−YN , 0 ≦ X, 0 ≦ Y, and X + Y ≦ 1) are preferably used. For example, white light with improved color rendering can be obtained by combining a blue light emitting element 10, a yellow phosphor, and a red phosphor and mixing these light emissions. However, the component composition, emission color, size, and the like of the light emitting element 10 are not limited to the above, and can be appropriately selected according to the purpose.

<Protective element>
Specifically, the protection element 12 is a Zener diode that is energized when a voltage equal to or higher than a specified voltage is applied. Although not shown, the protective element 12 is a semiconductor element having a p-electrode and an n-electrode like the light-emitting element 10 described above, and is in antiparallel with the p-electrode and the n-electrode of the light-emitting element 10. The lead frame (−pole) 20 is electrically connected by the wire 60.

<Lead frame>
The lead frame (−pole) 20 and the lead frame (+ pole) 30 are a pair of positive and negative electrodes. The lead frames 20 and 30 connect the light emitting element 10 to an external electrode (not shown), and are made of a metal member of a good electrical conductor such as iron, phosphor bronze, or copper alloy. As shown in FIG. 1, the lead frames 20 and 30 have a part of the upper surface (hereinafter referred to as “main surface”) and the back surface exposed from the base material 40. The main surfaces of the lead frames 20 and 30 are formed smoothly.

  The lead frame 20 includes a first inner lead portion 20a and a first outer lead portion 20b as portions exposed from the base material 40. The first inner lead portion 20 a is electrically connected to the n electrode 13 of the light emitting element 10 via the wire 60. The first outer lead portion 20b is electrically connected to an external electrode (negative electrode) (not shown).

  The lead frame 30 has a second inner lead portion 30 a and a second outer lead portion 30 b as portions exposed from the base material 40. The second inner lead portion 30 a is electrically connected to the p electrode 14 of the light emitting element 10 through the wire 60. As shown in FIG. 1A, the protection element 12 is placed on the second inner lead portion 30 a in order to protect the light emitting element 10. The second outer lead portion 30b is electrically connected to the external electrode (positive electrode). The second outer lead portion 30b and the first outer lead portion 20b form a plane having substantially the same back surface.

<Base material>
As a material of the base material 40, it is preferable to use an insulating material, and it is preferable to use a material that hardly transmits light emitted from the light emitting element 10 or external light. Moreover, it is preferable to use a material having a certain degree of strength. Specifically, ceramics (Al ₂ O ₃ , AlN, etc.), or resins such as phenol resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), polyphthalamide (PPA), and the like can be given.
Moreover, the member which provided the insulating layer on the surface of the metal plate can also be used as a material of the base material 40.

<Sealing resin>
The sealing resin 50 covers the light emitting element 10 accommodated in the recess 40 a of the base material 40 and contains the phosphor 70 at a predetermined ratio. The sealing resin 50 is provided to protect the light emitting element 10 from external force, dust, moisture, and the like, and to improve the heat resistance, weather resistance, and light resistance of the light emitting element 10.

  As the material of the sealing resin 50, a material that can transmit laser light having a laser wavelength used in the laser light irradiation process is used. That is, it is necessary for the laser light to pass through the sealing resin 50 and reach the phosphor 70 contained therein. Further, as the material of the sealing resin 50, a material having translucency capable of transmitting light from the light emitting element 10 is preferable. Specific examples of the material include a silicone resin, an epoxy resin, and a urea resin. In addition to such materials, a colorant, a light diffusing agent, a filler, and the like can be contained as desired.

  The sealing resin 50 can be formed of a single member, or can be formed as a plurality of layers of two or more layers. Further, the filling amount of the sealing resin 50 may be an amount that covers the light emitting element 10, the wire 60, and the like disposed in the recess 40 a. In addition, when the sealing resin 50 has a lens function, the surface of the sealing resin 50 may be raised to form a shell shape or a convex lens shape.

<Wire>
The wire 60 is a conductive wiring for electrically connecting electronic components such as the light emitting element 10 and the protection element 12 to the lead frames 20 and 30. Examples of the material of the wire 60 include metals such as Au, Cu (copper), Pt (platinum), and Al (aluminum), and those using alloys thereof. It is preferable to use Au. The diameter of the wire 60 is not particularly limited and can be appropriately selected according to the purpose and application.

<Phosphor>
The phosphor 70 (phosphor particles) is a wavelength conversion member that is contained in the sealing resin 50. The phosphor 70 absorbs at least part of the light from the light emitting element 10 and emits light having different wavelengths. The phosphor 70 is preferably one that converts light from the light emitting element 10 into a longer wavelength. The phosphor 70 may be a single type of phosphor (fluorescent substance) or a mixture of two or more types of phosphors (fluorescent substances). Further, it is preferable that the concentration of the phosphor 70 is high on the light emitting element 10 side and low on the light extraction side. Such a distribution of the phosphor 70 can be formed by, for example, precipitating the phosphor 70 before the sealing resin 50 is cured. Accordingly, the density of the phosphor 70 on the light extraction side can be lowered while ensuring light emission of a desired color tone, so the density of the dark color portion (dark color portion 71: see FIG. 4C) formed by laser light irradiation. In view of the appearance of the light emitting device 1. Furthermore, since the phosphors 70 are distributed at a low density in the vicinity of the surface of the sealing resin 50, the laser light can easily reach the inside of the sealing resin 50, and the dark color portion 71 is also formed at a low density in the depth direction. Can be distributed. Further, by forming the phosphor 70 by sedimentation, it is easy to control the distribution state of the phosphor 70 between the light emitting devices. For this reason, the dark color portion 71 can be formed to the same extent by irradiating the same level of laser light, and the color tone can be corrected with a good reproducibility.

As a material of the phosphor 70, for example, a YAG phosphor (yellow phosphor) in which yttrium, aluminum, and garnet are mixed can be used. As another phosphor, an oxynitride phosphor that is mainly activated by a lanthanoid element such as Eu or Ce can be used. Moreover, as a material of the phosphor 70, for example, a nitride phosphor that is mainly activated by a lanthanoid element such as Eu or Ce can be used. Among these, as the europium-doped red phosphor, for example, a CASN phosphor such as (Sr, Ca) AlSiN ₃ : Eu (hereinafter referred to as SCASN), CaAlSiN ₃ : Eu, or SrAlSiN ₃ : Eu is used. Can do.

[Outline of Manufacturing Method of Light-Emitting Device]
The method for manufacturing the light emitting device 1 shown in FIG. 1 can include, for example, a first step to an eighth step as main steps, as shown in FIG.
The first step is a step of fixing the light emitting element 10 to the bottom surface portion 40c of the recess 40a of the package (S1: die bonding step).
The second step is a step of connecting the inner lead portions 20 a and 30 a and the n electrode 13 and the p electrode 14 of the light emitting element 10 with the wires 60 (S2: wire bonding step).
The third step is a step of connecting the inner lead portion 20 a wire 60 with bonding the protective element 12 to the inner lead portion 30 a (S3: protection element bonding step).
The fourth step is a step of sealing the light emitting element 10 mounted in the recess 40a of the package with the sealing resin 50 containing the phosphor 70 (S4: sealing step).
The fifth step is a step of inspecting the performance of the light emitting device 1 (S5: inspection step).
The sixth step is a step of determining whether or not the light emitting device 1 has a color tone of a predetermined chromaticity rank (S6: selection step). When it is determined that the color tone has a predetermined chromaticity rank (S6: Yes), the product can be shipped.
In the seventh step, when it is determined that the color tone does not have a predetermined chromaticity rank (S6: No), sealing around a part of the phosphors 70 contained in the sealing resin 50 of the light emitting device 1 is performed. This is a step of irradiating a laser beam to change the color of the resin to form a dark color part (S7: laser beam irradiation step).
The eighth step is a step of reinspecting the performance of the light emitting device 1 irradiated with the laser light (S8: reinspection step). When it is determined that the color tone has a predetermined chromaticity rank by re-examination, the product can be shipped.

  Furthermore, a manufacturing process for manufacturing the package, a plating process for plating the package, and a heating process for heating the package can be included. Moreover, you may include processes other than the above-described process between or before and after each process. For example, other processes such as a substrate cleaning process for cleaning the substrate, an unnecessary object removing process for removing unnecessary substances such as dust, a mounting position adjusting process for adjusting the mounting position of the light emitting element and the protective element, etc. May be included. In the manufacturing method of the light-emitting device 1, it is possible to apply a well-known manufacturing method except a laser irradiation process (S7). Of course, the light emitting device 1 may be manufactured by sharing the entire process among a plurality of manufacturers.

[Laser beam irradiation process]
Next, the laser beam irradiation step (S7) shown in FIG. 2 will be described in detail with reference to FIGS. The laser light irradiation step (S7) is a step of irradiating the inside of the sealing resin 50 of the light emitting device 1 with laser light. The condensing position of the laser beam at this time is set not in the surface of the sealing resin 50 but in the sealing resin 50. When the laser light reaches the inside of the sealing resin 50, a part of the phosphors contained in the sealing resin 50 is excited by the laser light, so that the surrounding sealing resin 50 is removed. The dark color portion can be formed around the phosphor 70 by changing the color and changing the color. Here, the alteration of the resin includes, for example, oxidation and carbonization. Thereby, the function of converting the wavelength of light is reduced in some phosphors 70 contained in the sealing resin 50. Therefore, if the light emitting element 10 is, for example, a blue light emitting element, the chromaticity can be shifted in the blue direction.

<Laser irradiation area>
The laser light irradiation region is not particularly limited as long as the laser light can reach the inside of the sealing resin 50 of the light emitting device 1 and can be absorbed by the phosphor 70. In order to prevent damage to the package of the light emitting device 1, it is preferable to irradiate the inside of the recess 40a, preferably the inside of the bottom surface portion 40c of the recess 40a in FIG. For example, the inner side is more preferable than the virtual line 102 in FIG. In the present embodiment, as shown in FIG. 3, the laser light is irradiated to the sealing resin 50 disposed in the peripheral portion of the light emitting element 10 while avoiding the upper side on the light extraction side of the light emitting element 10 of the light emitting device 1. It was decided. It shows that the laser beam is not irradiated on the inner side of the imaginary line 101 in FIG. Thereby, damage to the light emitting element 10 can be prevented. In FIG. 3A, a part of the inner side of the concave portion 40a is transmitted. Moreover, FIG.3 (b) is sectional drawing in the AA arrow line of Fig.3 (a).

  In the example shown in FIG. 3, laser light is emitted from the sealing resin 50 disposed in the inner region of the periphery of the recess 40 a provided in the package, which surrounds the light emitting element 10, avoiding the upper side of the light emitting element 10. I decided to irradiate. That is, in FIG. 3A, a region surrounded by the virtual line 101 and the virtual line 102 indicates a laser light irradiation region. Thereby, the burnout of the part used as the wall of a package can be prevented.

  In the example illustrated in FIG. 3, the region surrounded by the virtual line 101 and the virtual line 102 is an annular region. Thereby, the light of the yellow ring can be reduced. In order to eliminate the yellow ring, a region where the intensity of the converted light by the phosphor 70 is large on the light emitting surface is specified in advance by measurement, and a dark color portion is arranged using the specified region as a laser light irradiation region. preferable. In this case, for example, the dark color portion is dispersed in a donut-shaped region surrounding the light emitting element 10. Even in the case of an annular yellow ring that does not become a perfect circle, light can be reduced similarly.

  Further, as shown in FIG. 3B, the laser beam is irradiated to the sealing resin 50 disposed in the region excluding the portion (top) 61 closest to the light emission surface of the sealing resin 50 in the wire 60. It was. When laser light is irradiated in the vicinity of the wire, the wire easily absorbs the laser light and is heated to alter the surrounding sealing resin, but such a situation can be prevented in the vicinity of the wire top 61. Since the wire portion other than the wire top portion 61 is located at a position close to the lead frames 20, 30, when condensing laser light aiming at a position above the lead frames 20, 30 inside the sealing resin 50, the wire The wire portions other than the top portion 61 are not easily irradiated with laser light. Even if the laser beam hits the wire below the wire top portion 61, since the position where the sealing resin is deteriorated is relatively low, it is possible to suppress output reduction due to light absorption.

  FIG. 4A shows a cross-sectional view of the light emitting device 1 when the sealing resin 50 is irradiated with laser light. Virtual lines 101 and 102 are virtual lines indicating laser light irradiation areas similar to those shown in FIG. When the thickness of the sealing resin 50 is 2D, the focal point of the objective lens 103 of a laser light source (not shown) is preferably set in accordance with the position of the depth D from the light emitting surface of the light emitting device 1. The laser light is applied to a part of the phosphors 70 contained in the sealing resin 50.

  A cross-sectional view of the light-emitting device 1 before laser light irradiation is shown in FIG. 4B, and a cross-sectional view of the light-emitting device 1 after laser light irradiation is shown in FIG. As shown in FIG. 4C, among the phosphors 70 dispersed in the laser light irradiation region of the sealing resin 50, around some of the phosphors dispersed near the laser light condensing position. A dark color portion 71 is formed. Further, as shown in FIG. 4C, a phosphor whose wavelength conversion function is not reduced in the laser light irradiation region of the sealing resin 50 and below the condensing position of the laser light. 70 also exists.

<Wavelength of laser beam>
The wavelength of the laser light used in the laser light irradiation step is a laser wavelength that passes through the sealing resin 50 according to the material of the sealing resin 50, and the phosphor 70 can be excited by the laser light. Such a laser wavelength is selected.
When, for example, a silicone resin is used as the material of the sealing resin 50, the infrared laser wavelength of 1064 nm burns the surface of the sealing resin 50, so that the infrared laser wavelength cannot be used. Then, since the sealing resin 50 permeates, it can be used.

  A preliminary experiment was conducted to examine the light of the laser wavelength absorbed by the phosphor 70. In the light emitting device 1, samples with different types of phosphors were prepared, irradiated with laser light under the same conditions, and the color tone before and after laser light irradiation was compared to investigate the amount of shift in emitted color.

The laser usage conditions were the following (A1) to (A6).
(A1) Laser light source: Laser marker device (A2) Laser wavelength: 532 nm
(A3) Laser power: 2.6%
(A4) Scan speed: 100 mm / s
(A5) Laser frequency: 10 kHz
(A6) Focus position of laser beam: position about half the sealing resin thickness The constituent conditions of the light emitting device 1 were the following (B1) to (B3).
(B1) Sealing resin material: Silicone resin (B2) Light emitting element type: Blue light emitting element (B3) Phosphor type: SCASN, YAG (1), YAG (2), YAG (3), chlorosilicate. Here, the difference between YAG (1), YAG (2), and YAG (3) is the emission color and the accompanying composition, and (1) to (3) are from the short wavelength side (green side) of the emission color. Means ranking.

The excitation spectrum for each phosphor used is shown in FIG. In the graph of FIG. 5, the horizontal axis represents the wavelength of light from the excitation light source, and the vertical axis represents the relative luminous efficiency.
Further, the excitation spectrum of YAG (1) is indicated by a long broken line. Similarly, the excitation spectrum of YAG (2) is indicated by a straight line, YAG (3) is indicated by a two-dot chain line, SCASN is indicated by a short dashed line, and chlorosilicate is indicated by a one-dot chain line. Each excitation spectrum is normalized so that the value at which the luminous efficiency is maximum in each phosphor is 100%. In the graph of FIG. 5, the position of the laser wavelength (532 nm) of the laser light used in the laser light irradiation process is indicated by a bold line.

As shown in FIG. 5, when compared at a wavelength of 532 nm, the relative luminous efficiency of SCASN that is a red phosphor is much higher than the relative luminous efficiencies of YAG (1) to YAG (3) that are yellow phosphors. large. SCASN has a high ratio of absorbing light having a wavelength of 532 nm.
In addition, at the wavelength of 532 nm, the difference in the relative luminous efficiencies of the yellow phosphors YAG (1) to YAG (3) is small. YAG (1) to YAG (3) absorb light with a wavelength of 532 nm to some extent, but have a high transmission rate.
Here, since YAG (1) becomes impossible to measure as it approaches the wavelength of the emission color of the phosphor, the light emission efficiency at a wavelength of 532 nm is unknown, but is estimated to be smaller than YAG (3). And compared.
In addition, since chlorosilicate, which is a green phosphor, becomes impossible to measure as it approaches the wavelength of the emission color of the phosphor, the luminous efficiency at a wavelength of 532 nm is unknown, but from YAG (1) to (3) Is estimated to be small. The graph of the excitation spectrum of this chlorosilicate is considered not to cross the thick line at the position of the laser wavelength (532 nm), so that the chlorosilicate transmits without absorbing the laser beam with the laser wavelength of 532 nm. It can be considered.
Therefore, the relationship when the phosphors are arranged in descending order at the wavelength of 532 nm is expressed by the following equation (1).
SCASN >> YAG (2)> YAG (3)> YAG (1)> chlorosilicate Formula (1)

As a result of the preliminary experiment, the light emission color shift amount by the light emitting device using SCASN was the largest. In this light emitting device, the discoloration of the sealing resin was the largest in appearance.
There was no significant difference in the amount of shift in emission color between the light emitting devices using YAG (1) to YAG (3). In these light emitting devices, the discoloration of the sealing resin was small.
The light emitting device using chlorosilicate did not cause a shift in emission color. This light-emitting device was not visually discolored in the sealing resin.
Therefore, when laser light having a wavelength of 532 nm is irradiated under the same conditions, the relationship when the emission amounts of phosphors are arranged in descending order is expressed by Expression (2). YAG in formula (2) represents YAG (1) to YAG (3). There was a slight difference between them.
SCASN>YAG> Chlorosilicate ... Formula (2)

  Comparing the above equations (1) and (2), there is a correlation between the excitation spectrum intensity (relative luminous efficiency) at a wavelength of 532 nm of the laser light irradiated to the light emitting device and the shift amount of the emission color. It was seen. As a result of the preliminary experiment, it was confirmed that the more the laser beam was excited, the more heat was generated, and the sealing resin 50 around the phosphor 70 had a tendency to discolor.

  In the following description, it is assumed that in the laser light irradiation step, the light emitting device 1 is irradiated with laser light having a wavelength of 532 nm as an example. However, the laser wavelength can be changed to an arbitrary value in accordance with the excitation spectrum of the phosphor 70 contained in the sealing resin 50 of the light emitting device 1. For example, when chlorosilicate is used as the phosphor 70 of the light emitting device 1, the sealing resin 50 can be discolored by irradiating light with a laser wavelength of 500 nm or less.

<Irradiated laser output>
A plurality of light emitting devices 1 shown in FIG. 1 were prepared as samples, and an experiment was conducted to examine the correlation between the irradiated laser output and the color tone. Note that samples vary in color tone due to individual differences. Regarding the laser use conditions, among (A1) to (A6) described above, (A3) laser power and (A5) laser frequency were changed as follows (A31) and (A51).
(A31) Laser power: Varyed within a range of about 2 to 23% (see FIG. 7B).
(A51) Laser frequency: 50 kHz
The structural condition of the light-emitting device 1 was changed as follows (B31) in the type of (B3) phosphor among (B1) to (B3) described above.
(B31) Type of phosphor: YAG and SCASN were mixed.

The measurement results of the color tone before and after laser light irradiation are shown in FIGS.
In FIG. 6, the horizontal axis represents the x value of the xy chromaticity values defined by the International Commission on Illumination (CIE), and the vertical axis represents the y value. Line 111 shows a blackbody radiation locus (BBC).
A frame 112 indicates an area of a chromaticity rank of a warm white light emitting device specified by a color temperature of 3500K, and includes a range of a color temperature of 3200 to 3700K.
An ellipse 113 indicates an area in the chromaticity range in the vicinity of the color temperature of 3500K in the range of the color temperature of 3200 to 3700K. The color tone before laser light irradiation is represented by a triangle, and the color tone after laser light irradiation is represented by a circle. As shown in FIG. 6, qualitatively, it can be seen that the color tone after laser light irradiation has shifted to the blue chromaticity side.

  The graph of FIG. 6 is arranged, and the relationship between the irradiated laser output and the shift amount of the x value is shown in FIG. 7A, and the relationship between the irradiated laser output and the shift amount of the y value is shown in FIG. Shown in b). In FIG. 7A, the horizontal axis indicates the laser output, and the vertical axis indicates the shift amount Δx of the x value of the xy chromaticity value. In FIG. 7B, the horizontal axis represents the laser output, and the vertical axis represents the shift amount Δy of the y value of the xy chromaticity value. In the graph, the shift amounts of the values of x and y are represented by diamonds.

  As shown in FIG. 7A, when the laser output is 2.5%, the shift amount Δx is −0.001, and it can be seen that there is an effect of shifting the x value by the laser light irradiation. At this time, as shown in FIG. 7B, the shift amount Δy was almost 0, and the effect of shifting the y value by laser light irradiation could not be confirmed. However, since there was an effect of shifting the x value, an effect of shifting the color tone of the emitted color is recognized when the laser output of the laser light irradiated to this sample is 2.5%.

  As shown in FIGS. 7 (a) and 7 (b), when the laser output is 3%, the effect of shifting the x value and the y value due to laser light irradiation could not be confirmed, so when the laser output is 3%. The effect of shifting the color tone of the luminescent color of this sample could not be confirmed.

  As shown in FIGS. 7A and 7B, when the laser output is 6 to 23%, the shift effect of the x value and the y value by the laser light irradiation can be confirmed, and the color tone of the emission color of each sample can be confirmed. The effect of shifting was confirmed. All of these samples maintained an aesthetic appearance with no noticeable discoloration of the laser-irradiated portion, and were able to reduce the light emission output to an excellent product within an allowable range.

  Although not shown in the drawing, the sample whose absolute value of the shift amount Δy in the minus direction is 0.005 or more is noticeable in the discoloration of the laser light irradiated portion and the emission output is greatly reduced beyond the allowable range. I was able to confirm. Therefore, the value of the shift amount Δy to be reduced is preferable when it is 0.001 or more and 0.004 or less because there is an effect of shifting the color tone of the emission color.

  As shown in FIGS. 7A and 7B, for example, when the laser output is 23%, Δx = −0.006 and Δy = −0.004. In this case, the absolute value of the shift amount Δx is 0.005 or more, but since the absolute value of the shift amount Δy is 0.004 or less, it is confirmed that the product is excellent in appearance and light output after the color tone is shifted. did it.

  Therefore, it is preferable to irradiate the sealing resin 50 with the laser beam so that one of the values of x or y is reduced as compared with that before the laser beam irradiation and the decreased value is 0.001 or more and 0.004 or less. Furthermore, it is more preferable that both the values of x and y are reduced as compared with those before laser light irradiation and the reduced value is 0.001 or more and 0.004 or less.

When the sample was cut after laser light irradiation and the cross section of the sealing resin 50 was observed, the dark color part 71 was confirmed (refer FIG.4 (c)). The dark color portion 71 has a hard texture, almost no color unevenness, and is entirely black. It is considered that the dark color portion 71 is formed by adhering the surrounding sealing resin that has been denatured and discolored by the absorption of the laser beam of the phosphor around the phosphor. Although the size of the dark color portion 71 varies, for example, the granular portion has a diameter of about 24 μm. At this time, the phosphor 70 had a diameter of about 20 μm. From this, it is considered that the dark color portion 71 is formed in a layered manner around the phosphor. Further, since the laser beam is irradiated aiming at a position about half the thickness 2D of the sealing resin 50 (see FIG. 4C), the dark color portion 71 is distributed in the vicinity of the position of the depth D from the light emission surface of the sample. I was able to confirm.
In addition, when the silicone resin containing YAG was irradiated with a green laser, it was confirmed that the resin around the phosphor was discolored by oxidation. However, the alteration of the resin is not limited to oxidation, and other phenomena such as carbonization may occur if the resin material changes.

  In the above measurement, the maximum laser power at a wavelength of 532 nm of a predetermined laser light source is set to 100%, and the relative value of the predetermined ratio is exemplified as the laser output. The laser power, laser irradiation time, and the like vary depending on the size of the light emitting device 1, the material of the sealing resin 50, the type of the phosphor 70, and the like. Further, the original color tone differs depending on the individual difference of the light emitting devices acquired before the laser light irradiation, so the degree of color change after the laser light irradiation also differs. Therefore, it is only necessary to appropriately select a condition that can realize a desired shift amount in the xy chromaticity value and irradiate the laser beam under the optimum condition.

  In the experiment for examining the correlation between the laser output and the color tone, the same laser beam irradiation region was irradiated with the laser beam while changing (increasing) the laser output for each sample. The same effect can be obtained by irradiating the laser beam by changing (increasing) the laser beam irradiation region for each sample with the same laser output.

  For example, in FIG. 8A, the region surrounded by the imaginary line 121 and the imaginary line 122 indicates the laser light irradiation region, and after the laser light irradiation, the laser light irradiation region is a single dark color portion as a dark color portion. Assume that 123 occurs. When the laser output is applied to the laser light irradiation region with the laser output increased, the dark color portion 123 may increase although illustration is omitted. In this case, the amount of shift increases as the number of discolored dark color portions 123 increases. In another example, when the laser output is increased and the laser light is irradiated to the laser light irradiation region shown in FIG. 8A, the dark color portion 123 becomes large as shown in FIG. 8C. There is a case. In this case, the shift amount increases as the discolored dark color portion 123 increases.

  In yet another example, the imaginary line 121 shown in FIG. 8A is moved toward the center of the light emitting element to expand the laser light irradiation region, and the entire laser light irradiation region after the expansion is enlarged. When laser light having the same laser output is irradiated, the dark color portion 123 may increase as shown in FIG. In this case, the amount of shift increases as the number of discolored dark color portions 123 increases. When a predetermined shift amount of the color tone is realized by irradiating the laser beam irradiated with the laser beam having the reference intensity to the enlarged laser beam irradiation region as in the example shown in FIG. In another similar sample, the same predetermined shift amount can be realized if the laser light irradiation area is reduced and the dark color portion 123 that has been discolored by irradiating laser light with increased intensity is enlarged. That is, the area of the laser light irradiation region on the light emitting surface and the intensity of the irradiated laser output have a trade-off relationship. For example, if the main purpose is to improve the appearance of the light emitting device 1, it is preferable that the area of the laser light irradiation region on the light emitting surface is wide. Thus, the dark color portions 123 that realize a predetermined shift amount can be arranged at a low density, which is preferable in terms of the appearance of the light emitting device 1.

Moreover, in the said measurement, although the laser marker apparatus was illustrated as a laser light source, a laser light source is not limited to a laser marker. The type of laser is not particularly limited, but a YAG laser, a YVO ₄ laser, or the like can be used if it is a solid-state laser.

(Light-emitting device of 2nd form)
[Outline of configuration of light emitting device]
The light emitting device of the second form is a light emitting device 201 called a side view type shown in FIG. In the configuration of the light-emitting device 201, the same reference numerals are given to the same configurations as those of the light-emitting device 1 of the first embodiment, and detailed description of the configuration is omitted. Moreover, about the structure from which a shape differs simply, 200 is added formally to the code | symbol of the structure of the light-emitting device 1 shown in FIG.

  The light emitting device 201 is a light emitting device having a light emitting surface provided in a direction substantially perpendicular to the mounting surface of the light emitting device 201 and capable of irradiating light in a direction substantially parallel to the mounting surface of the light emitting device 201. For convenience of explanation, FIG. 9A shows a state in which the inside of the recess 240a is transmitted.

  As shown in FIG. 9, the light emitting device 201 mainly includes a light emitting element 210, lead frames 220 and 230, a base material 240, and a sealing resin 50. In the light emitting device 201, the side on which the light emitting element 210 is placed is called a main surface side, and the opposite side is called a back surface side. The main surface side is the light emitting surface side of the light emitting device 1, and the lower side in FIG. 9A is the mounting surface side of the light emitting device 201. The lead frames 220 and 230 are electrically connected to the light emitting element 210. The base material 240 is made of a thermosetting resin such as an epoxy resin, for example, and is integrally formed with the lead frames 220 and 230. The lead frames 220 and 230 and the base material 240 are formed with recesses 240 a for accommodating the light emitting elements 210. An inner side wall 240b of the recess 240a is constituted by the base material 240 and forms an inclined surface. One surface of the lead frames 220 and 230 is exposed on the bottom surface 240c of the recess 240a, and a part of the base material 240 is disposed as an insulating portion 241 between the lead frame 220 and the lead frame 230 on the bottom surface 240c of the recess 240a. Has been. The sealing resin 50 contains the phosphor 70 at a predetermined ratio, and covers the light emitting element 210 accommodated in the recess 240 a of the base material 240.

  The light emitting device 201 includes one light emitting element 210. Note that the number of the light emitting elements 210 is not particularly limited, and at least one is sufficient. The light emitting element 210 is formed in a rectangular shape as shown in FIG. The light emitting element 210 is a face-up (FU) element provided with a pair of positive and negative n electrodes (cathodes) 213 and p electrodes (anodes) 214, as shown in FIG. 9B. The n electrode 213 and the p electrode 214 are formed on the same surface (upper surface). In addition, the shape of the four corners of the main surface of the base material 240 is asymmetric, and the side processed into a linear shape is a cathode mark 280 indicating the cathode side.

[Details of each configuration of light emitting device]
The details of each configuration of the light emitting device 201 are the same as the respective configurations of the light emitting device 1, and thus the description thereof is omitted.
[Outline of Manufacturing Method of Light-Emitting Device]
The outline of the manufacturing method of the light-emitting device 201 is the same as the manufacturing method of the light-emitting device 1, and thus the description thereof is omitted.

[Laser beam irradiation process]
Next, the laser beam irradiation process will be described with reference to FIGS. In addition, description is abbreviate | omitted suitably about the method similar to the laser beam irradiation process with respect to the light-emitting device 1 of a 1st form.

<Laser irradiation area>
In the present embodiment, as shown in FIG. 10, the sealing resin 50 disposed in the peripheral portion of the light emitting element 210 is irradiated with laser light while avoiding the upper side on the light extraction side of the light emitting element 210 of the light emitting device 201. It was decided. Laser light is irradiated to the substantially rectangular regions 301, 302, 303, and 304 indicated by hatching in FIG. 10A in the sealing resin 50. Thereby, damage to the light emitting element 210 can be prevented. In FIG. 10A, a part of the inner side of the concave portion 240a is transmitted.

  Moreover, FIG.10 (b) is sectional drawing in the BB arrow of FIG.10 (a). As shown in FIG. 10B, the laser light is irradiated to the sealing resin 50 arranged in the region of the wire 60 excluding the portion (top) 61 closest to the light emission surface of the sealing resin 50. . Further, for example, as shown by regions 305 and 306 surrounded by a broken line, the laser beam is irradiated aiming at a position at a depth half the thickness of the sealing resin 50.

<Irradiated laser output>
A plurality of light emitting devices 201 shown in FIG. 9 were prepared as samples, and an experiment was conducted to examine the correlation between the irradiated laser output and the color tone. Note that samples vary in color tone due to individual differences. Hereinafter, three types of experiments performed under different conditions will be described.

≪First experiment condition≫
In the first experimental conditions, the laser use conditions are as follows in addition to some of the conditions for the top view type described above ((A1), (A2), (A4), (A51), (A6)). (A32). The laser light irradiation area is as shown in FIG.
(A32) Laser power: Changed in the range of 6, 8, and 10% (see FIG. 11).
Further, in the first experimental condition, the configuration condition of the light emitting device 201 is the following (B32) in addition to the above-described conditions for the top view type (described above (B1), (B2)).
(B32) Type of phosphor: YAG only

The color tone measurement results before and after laser light irradiation are shown in FIG. In FIG. 11, the horizontal axis represents the x value of the xy chromaticity value, and the vertical axis represents the y value. In FIG. 11, the areas indicating the predetermined chromaticity ranks r1 to r7 are indicated by square frames.
When the laser power is 6%, the color tone before irradiation is represented by a white square, and the color tone after laser light irradiation is represented by a black square.
When the laser power is 8%, the color tone before irradiation is represented by a white triangle, and the color tone after laser light irradiation is represented by a black triangle.
When the laser power is 10%, the color tone before irradiation is represented by a white circle, and the color tone after laser light irradiation is represented by a black circle.
As shown in FIG. 11, qualitatively, it can be seen that the color tone after laser light irradiation is shifted from the chromaticity rank r6 toward the chromaticity rank r5 toward the blue chromaticity side. Moreover, the amount of shift was larger as the laser power was larger.

≪Second experiment condition≫
The second experimental condition is different from the first experimental condition in that a large number of samples of the light emitting device 201 are ranked in advance according to chromaticity, and the laser power is 5.2 to 10.2% for each rank. This is the point set by the range. Other conditions are the same as the first experimental conditions.

  The color tone measurement results before and after laser light irradiation are shown in FIG. In FIG. 12, the horizontal axis represents the x value of the xy chromaticity value, and the vertical axis represents the y value. A frame 311 indicates an area of the chromaticity rank r5 illustrated in FIG. The color tone was shifted from the side 311 a side of the frame 311 toward the side 311 b facing the frame 311 in the direction indicated by the white arrow 312. For this purpose, for each sample, broken lines 314, 315, and 316 are defined parallel to the side 311a and at equal intervals, with the chromaticity position at the center of the frame 311 being parallel to the side 311a as the target value 313. . The light emitting device group having the color tone specified at the position from the target value 313 to the broken line 314 is set as the first rank, and the light emitting device group having the color tone specified at the position from the broken line 314 to the broken line 315 is the second rank. The light emitting device group having the color tone specified at the positions from the broken line 315 to the broken line 316 is set as the third rank, and the light emitting device group having the color tone specified at the position where the xy value is larger than the broken line 316 is the first rank. 4 ranks were set.

  The laser output was increased in this order from the first rank to the fourth rank, and four types of laser outputs of the first to fourth laser outputs were set. Then, all the light emitting devices belonging to the first rank are irradiated with laser light at the first laser output (5.2%), and all the light emitting devices belonging to the second rank are irradiated with the second laser output ( (6.8%) was irradiated with laser light. Similarly, all light emitting devices belonging to the third rank are irradiated with laser light at the third laser output (8.5%), and all light emitting devices belonging to the fourth rank are irradiated with the fourth laser output. The laser beam was irradiated at (10.2%). Note that the color tone before laser light irradiation for all light emitting devices is represented by a triangle, and the color tone after laser light irradiation is represented by a square.

As shown in FIG. 12, qualitatively, it can be seen that the color tone after laser light irradiation has shifted to the blue chromaticity side. In addition, by setting the laser power for each rank, it was possible to realize a shift amount near the target value in the same manner for samples belonging to any rank.
For many samples used in this experiment, the amount of chromaticity variation before and after laser light irradiation was calculated. The calculation results are shown in Table 1. Here, σx and σy indicate standard deviations of the x value and y value of the sample used in the experiment. Thereby, reduction of the amount of chromaticity variation was confirmed. In the example shown in Table 1, σx slightly increases. However, since σy decreases by the amount of change that greatly exceeds the slight increment, it can be concluded that the variation has been improved overall.

≪Third experimental condition≫
The third experimental condition is different from the first experimental condition in that the laser power of the sample of the light emitting device 201 is set to any value in the range of 4.7 to 10% for each sample. Other conditions are the same as the first experimental conditions.

  The color tone measurement results before and after laser light irradiation are shown in FIG. In FIG. 13, the horizontal axis represents the x value of the xy chromaticity value, and the vertical axis represents the y value. Here, for all the samples having the color tone specified at the position of the chromaticity rank r6, the laser output is changed according to each color tone, and the laser output is individually set. The color tone was shifted in the direction shown. The color tone before laser light irradiation for all samples is represented by a triangle, and the color tone after laser light irradiation is represented by a square.

As shown in FIG. 13, qualitatively, it can be seen that the color tone after laser light irradiation is shifted from the chromaticity rank r6 toward the chromaticity rank r5 toward the blue chromaticity side. Further, by changing the laser power for each product, it was possible to obtain a shift amount closer to the target value as compared with the case where the laser power was changed for each rank (second experimental condition).
For many samples used in this experiment, the amount of chromaticity variation before and after laser light irradiation was calculated. The calculation results are shown in Table 2. Here, σx and σy indicate standard deviations of the x value and y value of the sample used in the experiment. This confirmed that the amount of chromaticity variation can be reduced as compared with the case where the laser power is changed for each rank (second experimental condition).

  As described above, according to the method for manufacturing the light emitting device according to the present embodiment, the dark color portion is formed around the part of the phosphors 70 contained in the sealing resin 50 by the laser light irradiation process. Thus, the function of converting the wavelength of light is reduced, and the color tone of the light emitting device can be corrected to a color tone of a desired chromaticity rank. Further, the amount of change in the sealing resin 50 can be changed by changing the laser irradiation intensity and the laser light irradiation range, so that the color tone shift amount can be easily adjusted. Thereby, the color tone yield can be improved.

  Further, according to the method for manufacturing the light emitting device of the present embodiment, even if the light emitting device is irradiated with laser light, no dent is formed on the surface of the sealing resin 50, so the reliability is not lowered. For example, with a sample of 1000 units as one lot, the light output, light distribution, etc. after 1000 hours from the start of the on / off switching operation for the lot irradiated with laser light and the lot not irradiated with laser light As a result of carrying out the normal characteristic measurement, no significant error in the lifetime occurred in the lot irradiated with the laser light and the lot not irradiated with the laser light. For this reason, it was confirmed that the reliability was not lowered even by laser beam irradiation. This is considered to be caused by irradiating the sealing resin 50 disposed in the peripheral portion of the light emitting element 10 with laser light while avoiding the upper side of the light emitting element 10 on the light extraction side.

  In the method for manufacturing a light emitting device according to the present embodiment, when the laser light irradiation region of the sample of the target light emitting device is irradiated with laser light having a predetermined laser output, the desired shift amount is not reached. The laser beam irradiation can be repeated after changing the same conditions or conditions as appropriate. Further, in order to improve the appearance of the light emitting device, the color tone can be finely adjusted while suppressing discoloration as much as possible.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, It can change in the range which does not deviate from the meaning of this invention. That is, each form of the light-emitting device described above exemplifies a light-emitting device for embodying the technical idea of the present invention, and the present invention does not limit the light-emitting device to each of the above-described forms. . Moreover, the member etc. which are shown by a claim are not specified as the member of embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the extent that there is no specific description. It is just an example.

  In the above embodiment, the light-emitting element is described as a single-sided electrode in which an n-electrode and a p-electrode are formed on the same side, but a counter electrode structure in which an n-electrode or a p-electrode is formed on the back surface of the element substrate ( It may be an element having a double-sided electrode structure. A light emitting device 1B shown in FIG. 14 includes a light emitting element 10B having one counter electrode structure. The electrode on the lower surface of the light emitting element 10 </ b> B is electrically connected to the lead frame 20 via the bonding member 11. On the other hand, a wire 60 is attached to the electrode on the upper surface of the light emitting element 10 </ b> B, and the electrode on the upper surface is electrically connected to the lead frame 30 via the wire 60. In the case of the light emitting device 1B, for example, in FIG. 14, a region surrounded by the virtual line 401 and the virtual line 402 is set as a laser light irradiation region. Also in this case, similarly, the color tone of the light emitting device 1B can be corrected to the color tone of a desired chromaticity rank.

  In the above embodiment, the shape of the periphery of the concave portion of the package is described as being circular in the form shown in FIG. 1, but the shape is not limited to this, and a polygon such as a regular octagon or a part of a circle is linearized. The shape may be sufficient. In the light emitting device 1C shown in FIG. 15, the shape of the peripheral edge of the recess 501 is a shape in which four sides forming a part of a square corresponding to the four sides of a package whose upper surface shape is a square are connected by a smooth curvature curve. ing. In this case, in FIG. 15, the region surrounded by the virtual line 502 and the virtual line 503 indicates the laser light irradiation region. The outer peripheral shape and the inner peripheral shape of the laser light irradiation region are similar to the peripheral shape of the recess 501. However, the shape of the outer periphery or / and the inner periphery of the laser light irradiation region may be different from the shape of the peripheral edge of the recess 501. For example, if only the shape of the inner periphery of the laser light irradiation region is changed to a circle, the area of the laser light irradiation region can be increased.

  In the embodiment, the case where a face-up (FU) element is used as the light-emitting element has been described. However, a face-down (FD) element may be used. A light emitting device 1D illustrated in FIG. 16 includes two face-down (FD) elements 10D on the bottom surface of the recess 601. The shape of the peripheral edge of the recess 601 is a square shape corresponding to the four sides of the package having a square top surface. Further, the lead frames 20D and 30D are provided at symmetrical positions with the insulating portion 41D interposed therebetween in the base material 40D. One electrode of the face-down element 10 </ b> D is electrically connected to the lead frame 20 via the bonding member 11, and the other electrode is electrically connected to the lead frame 30 via the bonding member 11. Since the light emitting device 1D includes the protection element 12, it is preferable to irradiate the laser light while avoiding the top of the protection element 12 and the wire 60 of the protection element 12. For example, in FIG. 16, a region surrounded by the virtual line 602 and the virtual line 603 is defined as a laser light irradiation region.

  Moreover, in the said embodiment, although the top view type and the side view type light-emitting device were illustrated as a light-emitting device used as the object of a laser beam irradiation process, the shape of a package is not limited to these. For example, the main surface of the lead frame, which is a metal plate, is exposed in the recess, but the conductive member constituting the positive electrode and the negative electrode is formed on the substrate on which the plated wiring is formed, and the negative electrode of the conductive member is formed. The n-electrode (cathode) of the light-emitting element may be connected to the p-type electrode, and the p-electrode (anode) of the light-emitting element may be connected to the positive electrode of the conductive member.

  In the above embodiment, an example of a light emitting device in which a light emitting element is housed in a recess formed in the package is shown, but the recess of the package is not essential. A light-emitting device in which a light-emitting element is mounted on a package that is not provided with a recess does not easily cause a yellow ring, and can have a light-emitting color with little color unevenness. In addition, since the light emitting device 1 shown in FIG. 1 has the side wall 40b of the recess 40a inclined, the light emitted from the light emitting element efficiently radiates the reflected light reflected by the inner peripheral surface of the side wall 40b to the outside from the opening of the recess. be able to.

1, 1B, 1C, 1D, 201 Light-emitting device 10, 10B, 10D, 210 Light-emitting element 11 Joining member 12 Protection element 13, 213 n-electrode 14, 214 p-electrode 20, 20D, 220 First lead frame 20a, 220a First Inner lead portion 20b First outer lead portion 30, 30D, 230 Second lead frame 30a, 230a Second inner lead portion 30b Second outer lead portion 40, 40D, 240 Base material 40a, 240a, 501, 601 Recess 40b, 240b Side wall 40c, 240c Bottom portion 41, 41D, 241 Insulating portion 50 Sealing resin 60 Wire 61 Wire top 70 Phosphor 71 Dark color portion 80, 280 Cathode mark 103 Laser condensing lens 121, 122, 124 Laser light irradiation range 123 Dark color portion

Claims (9)

A method of manufacturing a light emitting device comprising at least one light emitting element and a sealing resin that covers the light emitting element and contains a phosphor,
Including a step of changing the color of the sealing resin around some phosphors to form a dark color portion,
A method for manufacturing a light-emitting device, wherein the dark color portion is formed by exciting the phosphor.   The method for manufacturing a light emitting device according to claim 1, wherein the phosphor is excited by laser light.   The method for manufacturing a light emitting device according to claim 1, wherein the dark color portion is formed in a peripheral portion of the light emitting element in a plan view.   The said light emitting device is provided with the package which has the recessed part in which the said light emitting element was mounted in the bottom face, The said dark color part is formed in the area | region surrounding the said light emitting element, The manufacturing of the light emitting device of Claim 3 characterized by the above-mentioned. Method.   The light emitting device includes at least one wire sealed with the sealing resin, and the dark color portion is formed in a region excluding a top portion of the wire in a plan view. Item 5. A method for manufacturing a light emitting device according to any one of Items 4 to 6.   The dark color portion is formed so that at least one of the x and y values in the xy chromaticity value of the light emitting device is reduced and the reduced value is 0.001 or more and 0.004 or less. The manufacturing method of the light-emitting device as described in any one of Claim 1 thru | or 5. A light-emitting device having at least one light-emitting element and a sealing resin that covers the light-emitting element and contains a phosphor,
The sealing resin includes a dark color portion around some phosphors,
The dark portion emitting device, characterized in that the said Futomeju butter or the sealing resin carbonized and oxidized. The light emitting device according to claim 7 , wherein the dark color portion is disposed in a peripheral portion of the light emitting element in a plan view. The light emitting device is a light emitting device configured by sealing the light emitting element mounted on a bottom surface of a recess provided in a package with the sealing resin,
The light emitting device according to claim 8 , wherein the dark color portion is disposed in a region surrounding the light emitting element.

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