JP2016072585A - Cleaning method for susceptor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a cleaning gas from being wasted, by shortening an etching time without generating a deposit that is deposited on a carbon susceptor, left from removal.SOLUTION: A cleaning method includes the steps of: heating a susceptor 3 while rotating it around an axis and supplying the predetermined cleaning gas into a reactor 2; repeating the process of detecting surface temperatures during a first period and a second period following the first period and measuring a temperature difference between the surface temperatures until the temperature difference becomes equal to or more than a first temperature difference; repeating the process of detecting the surface temperatures of the susceptor during the first period and the second period following the first period after the temperature difference becomes equal to or more than the first temperature difference and measuring a temperature difference between the surface temperatures until the temperature difference becomes equal to or less than a second temperature difference; and stopping supplying the cleaning gas after the lapse of a predetermined time from the temperature difference becoming equal to or less than the second temperature difference.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a susceptor cleaning method, for example, a susceptor cleaning method for removing deposits attached to a carbon susceptor of an epitaxial growth furnace by etching.

An epitaxial growth furnace (also referred to as a reaction tube) used in a semiconductor manufacturing process is constituted by a quartz bell jar in which, for example, a barrel-type carbon susceptor is disposed as disclosed in Patent Documents 1 and 2. The carbon susceptor holds a plurality of substrates to be processed, and, for example, monosilane gas (SiH ₄ ) is introduced into the reaction tube and heated. By this processing, a silicon thin film is generated on the surface of the substrate to be processed. At this time, silicon-based deposits adhere to the exposed surface of the susceptor and the inner surface of the quartz bell jar. If the deposit remains, the deposit may be mixed as an impurity in the thin film of the substrate to be processed in the next film forming process. Therefore, as disclosed in Patent Document 2, conventionally, a cleaning gas (hydrogen gas mixed with hydrogen chloride gas) is supplied into the reaction tube, the susceptor is heated to about 1200 ° C., and dry etching is performed. The deposits are removed.

By the way, conventionally, dry etching performed for cleaning the inside of the reaction tube is performed as follows.
First, after forming a film on the substrate to be processed and taking out the substrate to be processed, the inside of the reaction tube is set to a predetermined high temperature environment, and a cleaning gas is supplied, so that a silicon-based deposit adhered to the carbon susceptor. Etching is started.
Here, the etching time is set by adding a predetermined time to the time obtained by multiplying the film thickness formed on the substrate to be processed by a predetermined coefficient so that there is no residual removal.

JP 2000-54140 A JP-A-7-122493

However, when cleaning gas is supplied into the reaction tube as described above and the reaction tube is cleaned, if the etching time is set long so that there is no residual removal, the etching time becomes excessive and wastes the cleaning gas. There was a technical problem.
Furthermore, there has been a technical problem that the carbon susceptor is easily damaged due to etching with an excessive cleaning gas.

  As a result of intensive research to solve the above problems, the present inventor determined that the timing for completing etching for susceptor cleaning is predetermined after the variation in the temperature of the susceptor heated during etching converges. Obtaining the knowledge that time has elapsed, the present invention has been completed.

  The present invention has been made in order to solve the above-described technical problems, and the etching time was shortened and wasteful consumption of the cleaning gas was suppressed without causing the removal of the deposit adhered to the carbon susceptor. An object of the present invention is to provide a method for cleaning a carbon susceptor.

A susceptor cleaning method according to the present invention is a susceptor cleaning method for removing deposits attached to a susceptor in a reaction tube by etching, heating the susceptor while rotating it around an axis, and in the reaction furnace. A step of supplying a predetermined cleaning gas, a step of detecting a surface temperature of the susceptor in a first period and a second period following the first period, and measuring a temperature difference between them; The step of repeating until the difference becomes greater than or equal to the first temperature difference, and the susceptor in a first period and a second period following the first period after the temperature difference becomes greater than or equal to the first temperature difference. Detecting the surface temperature of each and measuring the temperature difference thereof until the temperature difference becomes equal to or less than the second temperature difference, and the temperature difference becomes equal to or less than the second temperature difference. Characterized in that comprising the step of stopping the supply of the cleaning gas after a predetermined time me.
In each of the first period and the second period, a plurality of monitoring periods for measuring the temperature of the susceptor are provided, and the maximum value and the minimum value of the temperature of the susceptor are set in each monitoring period. It is desirable to provide a plurality of sampling periods for detecting.
Each monitoring period is preferably a period in which at least the susceptor makes one rotation around the axis.
The sampling period is preferably 0.05 sec or less.

According to such a method, when the deposit attached to the surface of the susceptor is etched by the cleaning gas, the timing at which the deposit is removed can be specified by detecting the temperature change of the susceptor.
As a result, it is possible to shorten the work for removing the extraneous matter, which is conventionally excessive, to reduce the cost, to improve the productivity, and to extend the life of the susceptor.

  According to the present invention, it is possible to provide a method of cleaning a carbon susceptor that can reduce the etching time and suppress wasteful consumption of the cleaning gas without causing the removal of deposits attached to the carbon susceptor.

FIG. 1 is a cross-sectional view of an epitaxial growth furnace in which the susceptor cleaning method according to the present invention is implemented. FIG. 2 is a flowchart showing the flow of the susceptor cleaning method of the present invention. FIG. 3 is a graph showing a change in temperature of the susceptor heated during the susceptor cleaning process. FIG. 4 is a graph showing the temperature change of the susceptor in an enlarged manner.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a cross-sectional view of an epitaxial growth furnace in which the susceptor cleaning method according to the present invention is implemented. FIG. 2 is a flowchart showing the flow of the susceptor cleaning method of the present invention. FIG. 3 is a graph showing a temperature change of the susceptor heated during the susceptor cleaning process, and FIG. 4 is a graph showing an enlarged temperature change of the susceptor.
An epitaxial growth furnace 1 shown in FIG. 1 includes a quartz bell jar 2 as a reaction tube for vapor-phase-growing a silicon epitaxial film on the surface of a silicon wafer (hereinafter simply referred to as a wafer) W which is a substrate to be processed, And a carbon susceptor 3 (susceptor) for holding a plurality of wafers W.

A gas introduction pipe 6 for introducing a vapor phase growth gas into the reaction chamber 5 is provided on the upper side of the quartz bell jar 2, and a vapor phase growth in the reaction chamber 5 is provided at the lower end of the quartz bell jar 2. A gas exhaust pipe 7 for exhausting gas is provided.
The quartz bell jar 2 is a cylinder in which a lower end side of a cylindrical body portion is gradually tapered, and an upper end opening thereof is closed by a lid 8.
Further, around the quartz bell jar 2, for example, a number of halogen lamps are arranged as the heating unit 4 for heating the inside of the reaction chamber 5.

  The carbon susceptor 3 is suspended by a rotary shaft 10 in the internal space of the reaction chamber 5 and is rotatable about the axis. The carbon susceptor 3 is, for example, a so-called barrel-shaped cylindrical body having a hexagonal frustum shape, and circular counterbore 11 is formed on six peripheral side surfaces in two upper and lower stages (total of 12 positions). Each counterbore 11 is formed in a shallow circular recess to place the wafer W thereon.

The epitaxial growth furnace 1 includes a temperature sensor 12 and a radiation thermometer 13. These are for measuring the surface temperature of the carbon susceptor 3. The temperature sensor 12 detects, for example, an infrared energy amount emitted from the carbon susceptor 3 in a non-contact manner, and the energy amount is detected by a radiation thermometer 13. Measured as temperature.
Further, the measured temperature information of the carbon susceptor 3 is input to the control unit 14 as a computer and displayed on the temperature display unit 15 having, for example, a liquid crystal monitor screen.

In the control unit 14, a computer program is executed so as to perform output and stop control of the cleaning gas for dry etching based on the temperature of the carbon susceptor 3.
Moreover, in order to perform dry etching, the carbon susceptor 3 in the reaction chamber 5 is heated to a high temperature. As shown in the graph of FIG. Not stable. That is, as shown in the figure, until about 1000 seconds elapse from the start of heating, a variation of up to 10 ° C. occurs, and then the variation converges. In the present invention, the variation in temperature variation that changes with the elapsed time is used.

Next, the operation of the susceptor cleaning process in the epitaxial growth furnace 1 based on the control of the control unit 14 performed along the flow of FIG. 2 will be described.
As described above, the control unit 14 performs a control operation according to the computer program being executed, but the program is heated at the time of etching when the etching is completed for susceptor cleaning. This was created based on the inventor's knowledge that a predetermined time has elapsed after the dispersion of the temperature of the susceptor converged.

In the epitaxial growth furnace 1, a film forming process is performed on the wafer W, and then the wafer W held on the carbon susceptor 3 is taken out.
As shown in the flow of FIG. 2, the controller 14 heats the inside of the reaction chamber 5 by the heating unit 4 and raises the temperature of the carbon susceptor 3 (step S1 in FIG. 2).
In the quartz bell jar 2, for example, a cleaning gas in which 20 to 40% hydrogen chloride gas is mixed with hydrogen as a balance gas is introduced, and dry etching is started while the carbon susceptor 3 is rotated by the rotating shaft 10 (FIG. 2). Step S2)

  Next, the surface temperature of the carbon susceptor 3 is measured by the temperature sensor 12 and the radiation thermometer 13. Specifically, temperature detection (referred to as initial period) in a predetermined first period (step S3 in FIG. 2), and temperature detection in a predetermined second period (referred to as the latest period) following the initial period ( Step S4) in FIG. 2 and the step of measuring the temperature difference between them are repeated until a predetermined condition (measured temperature difference is 5 ° C. or more) is satisfied (step S5 in FIG. 2). In FIG. 3, the portion surrounded by a dashed box indicates the initial period temperature, and the portion surrounded by a solid line box indicates the latest period temperature.

Here, the detected temperature in one initial period is an average temperature of the measured temperatures obtained in each monitoring period (for example, 20 sec, respectively) from symbol a to symbol f, for example, as shown in an enlarged manner in FIG.
In each monitoring period, sampling is performed a plurality of times (for example, 400 times) by the temperature sensor 12, and the maximum value (max) and the minimum value (min) obtained by the sampling are extracted and used for calculation. .
In order to obtain the maximum value (max) and the minimum value (min) with high accuracy, the sampling time is set to 0.05 sec or less, and the monitoring period is a period during which the carbon susceptor 3 rotates at least once around the axis (for example, 20 sec) is secured, and the initial period is 2 min (desirably 1 min or more and 3 min or less) in the present embodiment.

  More specifically, the detected temperature in the initial period is obtained by, for example, the arithmetic expression (1). In Equation (1), max is the maximum detected temperature, and min is the minimum detected temperature.

  Temperature of initial period = ((max-min of monitoring period a) + (max-min of monitoring period b) + (max-min of monitoring period c) + (max-min of monitoring period d) + (monitoring period e) Max-min) + (max-min of monitoring period f)) / number of monitoring periods: 6 (1)

Further, the detected temperature in the latest period is, for example, an average temperature obtained in each monitoring period (for example, 20 sec) indicated by reference signs A to F in FIG.
Similar to the initial period, in each monitoring period, the temperature sensor 12 samples a plurality of times (for example, 400 times), and the maximum value (max) and the minimum value (min) of the temperature obtained by the sampling are obtained. Extracted and used for calculation.
That is, the detected temperature in the latest period is obtained by the calculation formula (2). In Equation (2), max is the maximum detected temperature, and min is the minimum detected temperature.

  Temperature of latest period = ((max-min of monitoring period A) + (max-min of monitoring period B) + (max-min of monitoring period C) + (max-min of monitoring period D) + (monitoring period E) Max-min) + (max-min of monitoring period F)) / number of monitoring periods: 6 (2)

  As described above, the control unit 14 measures the temperature difference based on the difference value between the results of the expressions (1) and (2) (step S5 in FIG. 2). Here, in step S5, when the difference between the temperature of the initial period and the temperature of the latest period is 5 ° C. or more, it is preferable to output a warning by sound or voice so as to prompt the operator to perform a monitoring operation. In other words, by outputting a warning when the difference between the initial period temperature and the latest period temperature is 5 ° C. or more, the operator can be notified of the timing at which the highly varied temperature difference converges (around 1000 seconds in FIG. 3). it can.

  On the other hand, when the difference between the temperature of the initial period and the temperature of the latest period is less than 5 ° C., the temperature detection of the initial period (step S3), the temperature detection of the latest period (step S4), and those temperatures again. The determination on the difference (step S5) is repeated until the temperature difference reaches 5 ° C. or more (for example, the first to third measurements indicated by the combination of the dashed box and the solid box in FIG. 3).

In step S5, when the difference between the temperature of the initial period and the temperature of the latest period is 5 ° C. or more, temperature detection in the initial period (step S6 in FIG. 2) and measurement of temperature detection in the latest period (step S7 in FIG. 2). , The fourth measurement in FIG. 3). And if those temperature differences are 1 degrees C or less (step S8 of FIG. 2), the control part 14 will stop supply of etching gas after progress of predetermined time (step S9 of FIG. 2), Further, the heating process of the carbon susceptor 3 is stopped (step S10 in FIG. 2).
That is, the computer program executed in the control unit 14 defines a processing procedure in which the etching process is terminated after a predetermined time has elapsed since the temperature variation has converged to 1 ° C. or less. As a result, the supply of the etching gas is stopped at the timing when the actual etching process ends.

As described above, according to the embodiment of the present invention, the temperature change of the carbon susceptor 3 is detected when the Si deposit adhered to the surface of the carbon susceptor 3 after the epitaxial process is etched with the cleaning gas (hydrogen chloride gas). By doing so, the timing at which the deposits are removed can be specified.
As a result, it is possible to shorten the work for removing deposits that has been excessive in the past, reduce costs, improve productivity, and extend the life of the carbon susceptor 3.

In the above embodiment, the carbon susceptor 3 is a barrel susceptor. However, in the present invention, the shape of the susceptor is not limited.
In the above embodiment, the temperature of the carbon susceptor 3 is detected in a non-contact manner using the temperature sensor 12, but this is not limited, and the temperature of the contact type with respect to the carbon susceptor 3 is not limited. It is good also as a structure which detects temperature using a sensor.

  The susceptor cleaning method according to the present invention will be further described based on examples. In this example, verification was performed by implementing the susceptor cleaning method described in the above embodiment.

[Example 1]
As the conditions of the example, the sampling time of the temperature sensor was 0.05 sec or less, the monitoring period was 20 sec, which is the time of one rotation of the carbon susceptor, and the initial period and the latest period were 2 min.
Under this condition, the amount of cleaning gas (hydrogen chloride gas) used until the end of etching and the etching time were measured.

[Comparative Example 1]
In Comparative Example 1, the etching time was set based on the time obtained by multiplying the epitaxial film thickness formed on the substrate to be processed by a predetermined coefficient, as conventionally performed.
Specifically, the etching time was 25 minutes.

As a result of Example 1, the amount of hydrogen chloride gas used for the cleaning gas was reduced by 20% compared to Comparative Example 1, and the etching time was also reduced by 20% compared with Comparative Example 1.
As a result of the above examples, according to the present invention, it has been confirmed that the etching time can be shortened and wasteful consumption of the cleaning gas can be suppressed without causing the removal of the deposit attached to the carbon susceptor.

1 Epitaxial growth furnace 2 Quartz bell jar (reaction tube)
3 Carbon susceptor (susceptor)
4 Heating unit 5 Reaction chamber 6 Gas introduction tube 7 Gas exhaust tube 8 Lid 10 Rotating shaft 11 Counterbore 12 Temperature sensor 13 Radiation thermometer 14 Control unit 15 Temperature display unit W Silicon wafer (substrate to be processed)

Claims (4)

A method of cleaning a susceptor that removes deposits attached to a susceptor in a reaction tube by etching,
Heating while rotating the susceptor around an axis, and supplying a predetermined cleaning gas into the reaction furnace;
The step of detecting the surface temperature of the susceptor in each of the first period and the second period following the first period and measuring the temperature difference between them is equal to or greater than the first temperature difference. Steps to repeat until
After the temperature difference becomes equal to or greater than the first temperature difference, the surface temperature of the susceptor in the first period and the second period following the first period is detected, and the temperature difference is measured. Repeating the process until the temperature difference is less than or equal to a second temperature difference;
And a step of stopping the supply of the cleaning gas after a predetermined time has elapsed since the temperature difference became equal to or less than the second temperature difference.   In each of the first period and the second period, a plurality of monitoring periods for measuring the temperature of the susceptor are provided, and the maximum value and the minimum value of the temperature of the susceptor are detected in each monitoring period. The susceptor cleaning method according to claim 1, wherein a plurality of sampling periods are provided.   The susceptor cleaning method according to claim 2, wherein each of the monitoring periods is a period in which the susceptor rotates at least once around an axis.   The susceptor cleaning method according to claim 2, wherein the sampling period is 0.05 sec or less.

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