JP2016066054A - 光電気混載基板およびその製法 - Google Patents
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Classifications
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- G—PHYSICS
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- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optical Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
<アンダークラッド層6、オーバークラッド層8の形成材料>
脂環骨格を含むエポキシ樹脂(ダイセル化学工業社製、EHPE3150) 20重量部
液状長鎖二官能半脂肪族エポキシ樹脂(DIC社製、EXA−4816) 80重量部
光酸発生剤(アデカ社製、SP170) 2重量部
乳酸エチル(武蔵野化学研究所社製) 40重量部
<コア7の形成材料>
o−クレゾールノボラックグリシジルエーテル(新日鐵住金化学社製、YDCN−700−10) 50重量部
ビスフェノキシエタノールフルオレンジグリシジルエーテル(大阪ガスケミカル社製、オグゾールEG) 50重量部
光酸発生剤(アデカ社製、SP170) 1重量部
乳酸エチル(武蔵野化学研究所社製) 50重量部
レーザスポット径:30μm
レーザ出力:0.5W
周波数:50kHz
走査速度:145mm/s
前述の記載にしたがって、互いに共通する材料、層厚みとなる条件下で、下記の表1に示す断面形状の光電気混載基板を作製した。そして、各光電気混載基板の端面部を、測定顕微鏡(ミツトヨ社製:MF−B2017D)で観察し、端面の幅方向の中心を算出した。その中心からコア7の中心座標を測定し、設計値に対してどの程度ずれているかを算出して、擬似的な「アライメントずれ幅(μm)」とした。なお、各例とも、サンプルを5個ずつ作製し、その算出値の平均値を求めた。それらの結果を、下記の表1に併せて示す。
W 光導波路
1 絶縁層
2 電気配線
10 光電気混載基板
Claims (10)
- 絶縁層の表面に電気配線が形成された電気回路基板と、この電気回路基板の裏面側に形成された光導波路とを備えた光電気混載基板であって、上記光導波路が延びる方向に沿う電気回路基板の両側面と、光導波路の両側面とが、上から見て互いに重なるか、電気回路基板の両側面の方が光導波路の両側面の位置より内側に入り込んだ配置になっていることを特徴とする光電気混載基板。
- 上記電気回路基板の厚みより光導波路の厚みの方が大きく設定されている請求項1記載の光電気混載基板。
- 上記電気回路基板の厚みが3〜200μm、光導波路の厚みが20〜500μmである請求項2記載の光電気混載基板。
- 上記光導波路がクラッド層とコアを備え、上記コアが、上記クラッド層に囲われた部分と、光導波路の、光導波路が延びる方向に沿う両側面に露出して位置決めガイド作用を果たす部分とを有している請求項1〜3のいずれか一項に記載の光電気混載基板。
- 上記コアが、上記クラッド層に囲われた部分と、光導波路の、光導波路が延びる方向に沿う両側面に露出しさらにその上の電気回路基板の両側面を覆って位置決めガイド作用を果たす部分とを有している請求項4記載の光電気混載基板。
- 請求項1記載の光電気混載基板を製造する方法であって、絶縁層の表面に電気配線が形成された電気回路基板を準備する工程と、上記電気回路基板の裏面側に光導波路を形成する工程とを備え、上記電気回路基板の裏面側に光導波路を形成する際、上記光導波路が延びる方向に沿う電気回路基板の両側面が、上から見て光導波路の両側面の位置より外側に突出した形状となるよう光導波路を形成した後、上記電気回路基板の上方からレーザ照射を行い、上記光導波路が延びる方向に沿う電気回路基板の両側縁部を除去加工することにより、上記電気回路基板の両側面が、上から見て上記光導波路の両側面の位置と重なるかその内側に入り込む配置になるようにしたことを特徴とする光電気混載基板の製法。
- 上記電気回路基板の厚みより光導波路の厚みの方が大きくなるようにした請求項6記載の光電気混載基板の製法。
- 上記電気回路基板の厚みが3〜200μm、光導波路の厚みが20〜500μmとなるようにした請求項7記載の光電気混載基板の製法。
- 上記光導波路がクラッド層とコアを備え、上記コアが、上記クラッド層に囲われた部分と、光導波路の、光導波路が延びる方向に沿う両側面に露出して位置決めガイド作用を果たす部分とを有するようにした請求項6〜8のいずれか一項に記載の光電気混載基板の製法。
- 請求項5記載の光電気混載基板を製造する方法であって、絶縁層の表面に電気配線が形成された電気回路基板を準備する工程と、上記電気回路基板の裏面側にクラッド層とコアを備えた光導波路を形成する工程とを備え、上記電気回路基板の裏面側に光導波路を形成する際、少なくとも上記コアを形成する前に、上記電気回路基板の表面側に、上からみて、上記光導波路が延びる方向に沿う電気回路基板の両側面の位置より外側に突出した形状となる支持層を形成し、上記支持層裏面側の、電気回路基板の両側面の位置より外側に突出した部分を利用して、光導波路が延びる方向に沿う両側面に露出しさらにその上の電気回路基板の両側面を覆って位置決めガイド作用を果たすコア部分を含むコアパターンを形成し、その後、上記支持層を電気回路基板から除去するようにしたことを特徴とする光電気混載基板の製法。
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KR1020177008039A KR102461441B1 (ko) | 2014-09-24 | 2015-09-10 | 광 전기 혼재 기판 및 그 제조법 |
US15/512,963 US10606002B2 (en) | 2014-09-24 | 2015-09-10 | Opto-electric hybrid board and manufacturing method for same |
CN201580051529.9A CN107076924B (zh) | 2014-09-24 | 2015-09-10 | 光电混合基板及其制造方法 |
TW104129953A TWI670534B (zh) | 2014-09-24 | 2015-09-10 | 光電混合基板及其製法 |
PCT/JP2015/075678 WO2016047447A1 (ja) | 2014-09-24 | 2015-09-10 | 光電気混載基板およびその製法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018151570A (ja) * | 2017-03-14 | 2018-09-27 | 日東電工株式会社 | 光電気混載基板、コネクタキットおよびその製造方法 |
WO2020158606A1 (ja) * | 2019-01-31 | 2020-08-06 | 日東電工株式会社 | 複数の積層部材の製造方法、および、積層部材集合体 |
WO2021161915A1 (ja) * | 2020-02-12 | 2021-08-19 | 日東電工株式会社 | 光電気混載基板および光電気複合伝送モジュール |
US11320613B2 (en) | 2018-03-30 | 2022-05-03 | Nitto Denko Corporation | Opto-electric hybrid board, connector kit, and producing method of connector kit |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI781162B (zh) * | 2018-03-30 | 2022-10-21 | 日商日東電工股份有限公司 | 光電混合基板、連接器組及其製造方法 |
WO2021085621A1 (ja) * | 2019-10-31 | 2021-05-06 | 京セラ株式会社 | 光導波路パッケージおよび発光装置 |
US20230025872A1 (en) * | 2019-12-20 | 2023-01-26 | Kyocera Corporation | Optical circuit board |
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CN107076924A (zh) | 2017-08-18 |
TW201621368A (zh) | 2016-06-16 |
JP6712742B2 (ja) | 2020-06-24 |
KR102461441B1 (ko) | 2022-10-31 |
TWI670534B (zh) | 2019-09-01 |
CN107076924B (zh) | 2020-11-10 |
US20170299823A1 (en) | 2017-10-19 |
US10606002B2 (en) | 2020-03-31 |
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