JP2016063221A5 - - Google Patents
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- Publication number
- JP2016063221A5 JP2016063221A5 JP2015173478A JP2015173478A JP2016063221A5 JP 2016063221 A5 JP2016063221 A5 JP 2016063221A5 JP 2015173478 A JP2015173478 A JP 2015173478A JP 2015173478 A JP2015173478 A JP 2015173478A JP 2016063221 A5 JP2016063221 A5 JP 2016063221A5
- Authority
- JP
- Japan
- Prior art keywords
- processing system
- collar
- substrate processing
- stem portion
- showerhead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 75
- 239000007789 gas Substances 0.000 claims description 23
- 238000010926 purge Methods 0.000 claims description 17
- 239000010409 thin film Substances 0.000 claims description 16
- 230000003071 parasitic effect Effects 0.000 claims description 15
- 239000012495 reaction gas Substances 0.000 claims description 14
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 12
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001272 nitrous oxide Substances 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 229910021529 ammonia Inorganic materials 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 230000003750 conditioning effect Effects 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462049767P | 2014-09-12 | 2014-09-12 | |
| US62/049,767 | 2014-09-12 | ||
| US14/668,174 US9793096B2 (en) | 2014-09-12 | 2015-03-25 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity |
| US14/668,174 | 2015-03-25 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019155241A Division JP6878527B2 (ja) | 2014-09-12 | 2019-08-28 | 寄生プラズマを抑制してウエハ内での不均一性を低減するための基板処理システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016063221A JP2016063221A (ja) | 2016-04-25 |
| JP2016063221A5 true JP2016063221A5 (https=) | 2018-11-01 |
| JP6580426B2 JP6580426B2 (ja) | 2019-09-25 |
Family
ID=55455414
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015173478A Active JP6580426B2 (ja) | 2014-09-12 | 2015-09-03 | 寄生プラズマを抑制してウエハ内での不均一性を低減するための基板処理システム |
| JP2019155241A Active JP6878527B2 (ja) | 2014-09-12 | 2019-08-28 | 寄生プラズマを抑制してウエハ内での不均一性を低減するための基板処理システム |
| JP2021075846A Active JP7232864B2 (ja) | 2014-09-12 | 2021-04-28 | 寄生プラズマを抑制してウエハ内での不均一性を低減するための基板処理システム |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019155241A Active JP6878527B2 (ja) | 2014-09-12 | 2019-08-28 | 寄生プラズマを抑制してウエハ内での不均一性を低減するための基板処理システム |
| JP2021075846A Active JP7232864B2 (ja) | 2014-09-12 | 2021-04-28 | 寄生プラズマを抑制してウエハ内での不均一性を低減するための基板処理システム |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9793096B2 (https=) |
| JP (3) | JP6580426B2 (https=) |
| KR (2) | KR102333806B1 (https=) |
| CN (1) | CN105428194B (https=) |
| SG (1) | SG10201507194VA (https=) |
| TW (1) | TWI671842B (https=) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8673080B2 (en) | 2007-10-16 | 2014-03-18 | Novellus Systems, Inc. | Temperature controlled showerhead |
| CN106884157B (zh) | 2011-03-04 | 2019-06-21 | 诺发系统公司 | 混合型陶瓷喷淋头 |
| US9388494B2 (en) * | 2012-06-25 | 2016-07-12 | Novellus Systems, Inc. | Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region |
| US10741365B2 (en) * | 2014-05-05 | 2020-08-11 | Lam Research Corporation | Low volume showerhead with porous baffle |
| US9793096B2 (en) * | 2014-09-12 | 2017-10-17 | Lam Research Corporation | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity |
| US10378107B2 (en) | 2015-05-22 | 2019-08-13 | Lam Research Corporation | Low volume showerhead with faceplate holes for improved flow uniformity |
| US10023959B2 (en) | 2015-05-26 | 2018-07-17 | Lam Research Corporation | Anti-transient showerhead |
| US10403474B2 (en) | 2016-07-11 | 2019-09-03 | Lam Research Corporation | Collar, conical showerheads and/or top plates for reducing recirculation in a substrate processing system |
| JP6794184B2 (ja) * | 2016-08-31 | 2020-12-02 | 株式会社日本製鋼所 | プラズマ原子層成長装置 |
| US10622243B2 (en) | 2016-10-28 | 2020-04-14 | Lam Research Corporation | Planar substrate edge contact with open volume equalization pathways and side containment |
| KR102762543B1 (ko) * | 2016-12-14 | 2025-02-05 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
| KR101850895B1 (ko) * | 2017-01-03 | 2018-04-20 | 한국표준과학연구원 | 플라즈마 발생 장치 |
| TWI649446B (zh) * | 2017-03-15 | 2019-02-01 | 漢民科技股份有限公司 | 應用於半導體設備之可拆卸式噴氣裝置 |
| US10851457B2 (en) * | 2017-08-31 | 2020-12-01 | Lam Research Corporation | PECVD deposition system for deposition on selective side of the substrate |
| KR102889276B1 (ko) * | 2019-03-11 | 2025-11-20 | 램 리써치 코포레이션 | 플라즈마 챔버들을 세정하기 위한 장치 |
| KR102901543B1 (ko) * | 2019-05-29 | 2025-12-17 | 램 리써치 코포레이션 | 균일성 튜닝을 위한 샤워헤드 인서트 |
| KR102935543B1 (ko) * | 2019-07-17 | 2026-03-05 | 램 리써치 코포레이션 | 기판 프로세싱을 위한 산화 프로파일의 변조 |
| WO2021034508A1 (en) | 2019-08-16 | 2021-02-25 | Lam Research Corporation | Spatially tunable deposition to compensate within wafer differential bow |
| US12486574B2 (en) | 2019-08-23 | 2025-12-02 | Lam Research Corporation | Thermally controlled chandelier showerhead |
| JP2022546404A (ja) | 2019-08-28 | 2022-11-04 | ラム リサーチ コーポレーション | 金属の堆積 |
| WO2021188597A1 (en) * | 2020-03-19 | 2021-09-23 | Lam Research Corporation | Showerhead purge collar |
| KR102781656B1 (ko) * | 2020-04-06 | 2025-03-13 | 램 리써치 코포레이션 | 가스 주입기들을 위한 세라믹 애디티브 제작 (additive manufacturing) 기법들 |
| US20230416918A1 (en) * | 2020-11-18 | 2023-12-28 | Lam Research Corporation | Pedestal including seal |
| KR102500678B1 (ko) * | 2021-08-25 | 2023-02-16 | 주식회사 아이에스티이 | 기생 플라즈마 방지를 위한 샤워헤드 가스 공급장치 |
| KR102816283B1 (ko) | 2022-12-29 | 2025-06-04 | (주)씨엔원 | 기생 플라즈마 방지를 위해 종방향으로 배치된 다공관 구조체가 구비된 샤워헤드 장치 |
| FI131467B1 (en) * | 2023-04-11 | 2025-05-07 | Beneq Oy | An atomic layer deposition apparatus and a method for coating a substrate |
| WO2024243145A1 (en) * | 2023-05-22 | 2024-11-28 | Lam Research Corporation | Showerhead optimization for reducing showerhead impedance in semiconductor fabrication equipment |
Family Cites Families (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE628052A (https=) * | 1962-03-15 | |||
| JPS63227011A (ja) * | 1987-03-17 | 1988-09-21 | Fujitsu Ltd | 化学気相成長装置 |
| JP2725081B2 (ja) * | 1990-07-05 | 1998-03-09 | 富士通株式会社 | 半導体装置製造用熱処理装置 |
| US5446824A (en) * | 1991-10-11 | 1995-08-29 | Texas Instruments | Lamp-heated chuck for uniform wafer processing |
| US5453124A (en) * | 1992-12-30 | 1995-09-26 | Texas Instruments Incorporated | Programmable multizone gas injector for single-wafer semiconductor processing equipment |
| GB9410567D0 (en) * | 1994-05-26 | 1994-07-13 | Philips Electronics Uk Ltd | Plasma treatment and apparatus in electronic device manufacture |
| JP3295336B2 (ja) * | 1996-03-01 | 2002-06-24 | キヤノン株式会社 | マイクロ波プラズマ処理装置およびプラズマ処理方法 |
| US5741363A (en) * | 1996-03-22 | 1998-04-21 | Advanced Technology Materials, Inc. | Interiorly partitioned vapor injector for delivery of source reagent vapor mixtures for chemical vapor deposition |
| US7004107B1 (en) | 1997-12-01 | 2006-02-28 | Applied Materials Inc. | Method and apparatus for monitoring and adjusting chamber impedance |
| US6474258B2 (en) | 1999-03-26 | 2002-11-05 | Tokyo Electron Limited | Apparatus and method for improving plasma distribution and performance in an inductively coupled plasma |
| DE60003850T2 (de) * | 1999-12-22 | 2004-03-11 | Aixtron Ag | Cvd reaktor und prozesskammer dafür |
| DE10007059A1 (de) * | 2000-02-16 | 2001-08-23 | Aixtron Ag | Verfahren und Vorrichtung zur Herstellung von beschichteten Substraten mittels Kondensationsbeschichtung |
| DE10043601A1 (de) * | 2000-09-01 | 2002-03-14 | Aixtron Ag | Vorrichtung und Verfahren zum Abscheiden insbesondere kristalliner Schichten auf insbesondere kristallinen Substraten |
| US20030042227A1 (en) * | 2001-08-29 | 2003-03-06 | Tokyo Electron Limited | Apparatus and method for tailoring an etch profile |
| JP4338355B2 (ja) * | 2002-05-10 | 2009-10-07 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US20070187363A1 (en) * | 2006-02-13 | 2007-08-16 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
| KR101020160B1 (ko) | 2006-03-03 | 2011-03-09 | 엘아이지에이디피 주식회사 | 플라즈마 처리장치 |
| JP2008078515A (ja) * | 2006-09-25 | 2008-04-03 | Tokyo Electron Ltd | プラズマ処理方法 |
| US8673080B2 (en) * | 2007-10-16 | 2014-03-18 | Novellus Systems, Inc. | Temperature controlled showerhead |
| US8137463B2 (en) * | 2007-12-19 | 2012-03-20 | Applied Materials, Inc. | Dual zone gas injection nozzle |
| CN101772833B (zh) * | 2008-02-20 | 2012-04-18 | 东京毅力科创株式会社 | 气体供给装置 |
| JP5659146B2 (ja) | 2008-04-12 | 2015-01-28 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | プラズマ処理装置及び方法 |
| US9728429B2 (en) | 2010-07-27 | 2017-08-08 | Lam Research Corporation | Parasitic plasma prevention in plasma processing chambers |
| CN106884157B (zh) * | 2011-03-04 | 2019-06-21 | 诺发系统公司 | 混合型陶瓷喷淋头 |
| US20130071581A1 (en) * | 2011-09-20 | 2013-03-21 | Jonghoon Baek | Plasma monitoring and minimizing stray capacitance |
| US10224182B2 (en) | 2011-10-17 | 2019-03-05 | Novellus Systems, Inc. | Mechanical suppression of parasitic plasma in substrate processing chamber |
| US9388494B2 (en) * | 2012-06-25 | 2016-07-12 | Novellus Systems, Inc. | Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region |
| US9121097B2 (en) * | 2012-08-31 | 2015-09-01 | Novellus Systems, Inc. | Variable showerhead flow by varying internal baffle conductance |
| US9399228B2 (en) * | 2013-02-06 | 2016-07-26 | Novellus Systems, Inc. | Method and apparatus for purging and plasma suppression in a process chamber |
| US9449795B2 (en) * | 2013-02-28 | 2016-09-20 | Novellus Systems, Inc. | Ceramic showerhead with embedded RF electrode for capacitively coupled plasma reactor |
| TWI654333B (zh) * | 2013-12-18 | 2019-03-21 | 美商蘭姆研究公司 | 具有均勻性折流板之半導體基板處理設備 |
| US10741365B2 (en) * | 2014-05-05 | 2020-08-11 | Lam Research Corporation | Low volume showerhead with porous baffle |
| US9617638B2 (en) * | 2014-07-30 | 2017-04-11 | Lam Research Corporation | Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system |
| US9793096B2 (en) * | 2014-09-12 | 2017-10-17 | Lam Research Corporation | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity |
| US10407771B2 (en) * | 2014-10-06 | 2019-09-10 | Applied Materials, Inc. | Atomic layer deposition chamber with thermal lid |
| CN104409309B (zh) * | 2014-12-01 | 2016-09-21 | 逢甲大学 | 大面积等离子体处理装置与均匀等离子体生成方法 |
| US11384432B2 (en) * | 2015-04-22 | 2022-07-12 | Applied Materials, Inc. | Atomic layer deposition chamber with funnel-shaped gas dispersion channel and gas distribution plate |
| US10378107B2 (en) * | 2015-05-22 | 2019-08-13 | Lam Research Corporation | Low volume showerhead with faceplate holes for improved flow uniformity |
| US9508547B1 (en) * | 2015-08-17 | 2016-11-29 | Lam Research Corporation | Composition-matched curtain gas mixtures for edge uniformity modulation in large-volume ALD reactors |
| US10157755B2 (en) * | 2015-10-01 | 2018-12-18 | Lam Research Corporation | Purge and pumping structures arranged beneath substrate plane to reduce defects |
| US9758868B1 (en) * | 2016-03-10 | 2017-09-12 | Lam Research Corporation | Plasma suppression behind a showerhead through the use of increased pressure |
| US9738977B1 (en) * | 2016-06-17 | 2017-08-22 | Lam Research Corporation | Showerhead curtain gas method and system for film profile modulation |
| US10403474B2 (en) * | 2016-07-11 | 2019-09-03 | Lam Research Corporation | Collar, conical showerheads and/or top plates for reducing recirculation in a substrate processing system |
| TWI838240B (zh) * | 2019-05-28 | 2024-04-01 | 美商應用材料股份有限公司 | 具有背側泵送的熱處理腔室蓋 |
-
2015
- 2015-03-25 US US14/668,174 patent/US9793096B2/en active Active
- 2015-09-03 JP JP2015173478A patent/JP6580426B2/ja active Active
- 2015-09-08 KR KR1020150126994A patent/KR102333806B1/ko active Active
- 2015-09-08 SG SG10201507194VA patent/SG10201507194VA/en unknown
- 2015-09-10 TW TW104129857A patent/TWI671842B/zh active
- 2015-09-10 CN CN201510573406.3A patent/CN105428194B/zh active Active
-
2017
- 2017-09-13 US US15/703,213 patent/US10665429B2/en active Active
-
2019
- 2019-08-28 JP JP2019155241A patent/JP6878527B2/ja active Active
-
2020
- 2020-05-04 US US16/866,065 patent/US11127567B2/en active Active
-
2021
- 2021-04-28 JP JP2021075846A patent/JP7232864B2/ja active Active
- 2021-11-26 KR KR1020210166172A patent/KR102525777B1/ko active Active
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