JP2016055580A - Solder printing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automate all processes including a test printing process with simple constitution.SOLUTION: A cleaning unit comprises: a first roller which delivers and takes up cleaning paper; a second roller which takes up the cleaning paper as much as the cleaning paper is delivered when delivered by the first roller; and delivers the cleaning paper as much as the cleaning paper is taken up when taken up by the first roller; and a nozzle which is provided between the first roller and second roller. Test printing is carried out by: moving the cleaning unit to a metal mask side; making the nozzle abut on a squeeze with the cleaning paper and metal mask interposed; then interlocking the cleaning unit with the squeeze moving on the metal mask so as to hold the nozzle and squeeze in the abutting state; and delivering and taking up the cleaning paper by driving and rotating the first roller and second roller such that the cleaning paper is stationary relative to the metal mask.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a solder printer.

  2. Description of the Related Art When an electronic component or the like is soldered to a printed board, a technique is known in which a solder pattern is formed in advance on the printed board, the electronic component is placed on the printed board, and the solder is melted to melt the solder. At this time, the solder pattern is formed by placing a metal mask on a printed board and filling the opening of the metal mask with solder paste.

  Several proposals have been made regarding such solder pattern printing technology. For example, in Japanese Patent Application Laid-Open No. 4-247687, in order to fill the opening of the metal mask with a sufficiently kneaded solder paste, a cleaning paper is disposed between the metal mask and the printed board, Techniques for kneading have been proposed. The cleaning paper at this time is used to prevent the solder paste from adhering to the printed circuit board during kneading.

In Japanese Patent Laid-Open No. 2007-196562, a metal mask is cleaned each time a solder pattern is formed on a predetermined number of printed boards, and a cleaning film for protecting the printed board at that time is used as a metal mask. Techniques for arranging on the back side have been proposed.
That is, at the time of cleaning, the cleaning film is drawn out while the winding roller around which the cleaning film is wound moves so as to cover the printed board, thereby protecting the printed board. When the cleaning is completed, the take-up roller returns to the position while winding the fed cleaning film.

  Japanese Patent Laid-Open No. 2012-076432 proposes a configuration in which a brake mechanism for braking the rotation of the paper roll is provided in order to stabilize the delivery amount of the cleaning paper.

JP-A-4-247687 JP 2007-196562 A JP 2012-076432 A

  However, in the configuration according to Japanese Patent Laid-Open No. 4-247687, a mechanism for arranging the cleaning paper between the printed board and the metal mask has not been proposed.

  In the configuration according to Japanese Patent Laid-Open No. 2007-196562, the winding roller that rotates automatically moves the cleaning paper so that the printed circuit board is covered with the cleaning paper. At this time, it is necessary to perform printing to suppress the slack of the cleaning paper, and for that purpose, it is necessary to control the feeding amount, winding amount, and moving amount of the cleaning paper in conjunction with each other. However, the above patent document does not disclose such a configuration.

  Furthermore, in the configuration according to Japanese Patent Application Laid-Open No. 2012-076432, a brake mechanism that applies braking to the rotation of the paper roll is provided in order to stabilize the delivery amount of the cleaning paper. Since it varies depending on the paper feed amount and the winding amount, it is difficult to accurately determine the cleaning paper feed amount and the winding amount from the rotation amount of the paper roll. In addition, a time margin is required for the braking operation, and accurate control is difficult.

  Due to such problems, it is difficult to improve the solder pattern formation work efficiency in the configuration according to each patent document.

  Usually, when forming a solder pattern on a printed circuit board, it is necessary to confirm beforehand the conditions under which an appropriate solder pattern can be formed. Such conditions are acquired by performing test printing.

Of course, it is possible to perform test printing on a printed circuit board, but this is not preferable from the viewpoint of yield.
For this reason, masking the printed circuit board to prevent the solder pattern from adhering, or performing test printing on the printed circuit board, then removing the solder pattern formed on the printed circuit board and returning to the product process. Necessary.

Since the work for removing the solder pattern requires manual operation, the test printing cannot be automated. Therefore, it is difficult to improve the solder pattern forming work efficiency.
Further, in the process of masking the substrate surface of the printed circuit board, for example, use of a technique according to Japanese Patent Application Laid-Open No. 2007-196562 and Japanese Patent Application Laid-Open No. 2012-076432 can be considered. In this case, it is necessary that the cleaning paper does not slack, but it has been difficult to suppress such slack as described above.

  Accordingly, a main object of the present invention is to provide a solder printing machine having a simple configuration and capable of fully automatic solder pattern formation including a test printing process.

  In order to solve the above problems, an invention relating to a solder printing apparatus that fills an opening formed in a metal mask by a reciprocating operation of a squeegee and prints a solder pattern on a printed board holds the printed board, A printing stage for moving the printed circuit board forward and backward with respect to the metal mask, and when performing test printing, move to the lower part of the metal mask and feed the cleaning paper in a state of being in contact with the metal mask with the cleaning paper sandwiched therebetween, A cleaning unit that moves in conjunction with the squeegee while winding, and the cleaning unit includes a first roller that feeds and winds the cleaning paper, and when the first roller feeds the cleaning paper, The same amount of cleaning paper as the fed out cleaning paper is wound, and the first When the roller winds the cleaning paper, the roller includes a second roller for feeding out the same amount of cleaning paper as the winding cleaning paper, and a nozzle provided between the first roller and the second roller. When performing test printing, the cleaning unit moves to the metal mask side so that the nozzle is brought into contact with the squeegee through the cleaning paper and the metal mask, and then the contact state between the nozzle and the squeegee is maintained. The cleaning unit is interlocked with a squeegee that moves on the metal mask, and at that time, the first roller and the second roller are rotationally driven so that the cleaning paper is stationary with respect to the metal mask. It is characterized by performing.

  According to the present invention, solder pattern formation including a test printing process can be fully automated with a simple configuration, and solder pattern formation work efficiency is improved.

It is a side view of the solder printer which is performing test printing. It is a perspective view of the solder printer which is performing test printing. FIGS. 5A and 5B are diagrams illustrating a test printing process, in which FIG. 5A illustrates a state where the squeegee moves in the right direction of the drawing and performs trial printing, and FIG. (C) is a figure which shows the state which trial printing was completed. It is a side view of a solder printer provided with a cleaning paper amount regulating mechanism. It is a front view of a wheel part. FIGS. 5A and 5B are diagrams showing the operation of a solder printer equipped with a cleaning paper amount regulating mechanism, in which FIG. 5A shows a state where the squeegee is moved in the right direction of the drawing for trial printing, and FIG. FIG. 8C is a diagram illustrating a state where trial printing is performed, and FIG. 10C illustrates a state where trial printing is completed.

  An embodiment of the present invention will be described. FIG. 1 is a side view of the solder printer 2 when trial printing is performed by the solder printer 2 according to the present embodiment, and FIG. 2 is a perspective view.

  The solder printer 2 includes a printing stage 10 and a cleaning unit 20 as main components. Reference numeral 4 denotes cleaning paper, reference numeral 5 denotes a metal mask, reference numeral 6 denotes a squeegee, reference numeral 7 denotes solder paste, and reference numeral 8 denotes a printed board. The printing stage 10 is shown only in FIG. 1 and is not shown in FIG. 2 and other figures described later.

  The solder printer 2 can perform the test printing process, the cleaning process, and the printing process fully automatically. The test printing process is a process for printing a solder pattern on the cleaning paper 4, and the printing process is a process for printing a solder pattern on the printed circuit board 8.

  The cleaning process is a generic term for a metal mask cleaning process and a substrate cleaning process. The metal mask cleaning process is a process of cleaning the surface of the metal mask 5 on the printed board 8 side (surface to be cleaned) and the inner side surface (surface to be cleaned) of the opening 5a formed in the metal mask 5. The board cleaning process is a process of cleaning the surface (surface to be cleaned) of the printed board 8 on which the solder pattern is printed.

  The metal mask 5 has the opening 5a corresponding to the solder pattern to be transferred (printed). The squeegee 6 slides on the surface of the metal mask 5 and fills the openings 5 a while kneading the solder paste 7 on the metal mask 5.

  The printing stage 10 is a table that holds a printed circuit board 8 on which a solder pattern is printed, and is provided so as to be able to advance and retract with respect to the metal mask 5. That is, in FIG. 1, the printing stage 10 moves up and down.

  The cleaning unit 20 includes a first roller 21, a second roller 22, a draw bar 23, and a nozzle 24, and is provided so as to be movable in the vertical and horizontal directions in FIG. 1. The cleaning unit 20 moves in conjunction with the squeegee 6 when moving in the left-right direction. The reason for this operation will be described later.

  The cleaning paper 4 is wound around the second roller 22 and rotated by a motor 38 such as a stepping motor. Then, the cleaning paper 4 is fed out or the unused cleaning paper 4 is taken up by the fed out cleaning paper 4.

  The pull-out bar 23 is a rod body that extends over the width direction of the cleaning paper 4 and forms a folded end where the cleaning paper 4 is folded back. In order to reduce friction between the drawer bar 23 and the cleaning paper 4, the drawer bar 23 may be a rotatable rod.

  The first roller 21 is rotationally driven by a motor 37 such as a stepping motor. At this time, the first roller 21 performs winding when the second roller 22 feeds the cleaning paper 4, and feeds when the second roller 22 winds the cleaning paper 4.

  One end surface of the nozzle 24 forms a sliding portion and extends in the width direction of the cleaning paper 4. The nozzle 24 can be rotated 180 degrees toward the metal mask 5 side and the printed circuit board 8 side. The sliding part has a vacuum function, for example.

  Next, a trial printing operation in the solder printer having the above configuration will be described. FIGS. 3A and 3B are diagrams showing a test printing process, in which FIG. 3A shows a state where the squeegee 6 moves in the right direction of the drawing to perform test printing, and FIG. A state in which printing is being performed, (c) shows a state in which trial printing has been completed. FIG. 3A and FIG. 3B both show the state of trial printing, and actually one of them is performed.

  When starting trial printing, as shown in FIGS. 3A and 3B, the cleaning unit 20 moves up and stops when the nozzle 24 contacts the metal mask 5 with the cleaning paper 4 interposed therebetween. .

  In this state, the squeegee 6 moves on the surface of the metal mask 5. When the squeegee 6 moves in the right direction of the drawing as shown in FIG. 3A, the first roller 21 and the second roller 22 rotate, and the cleaning unit 20 moves in the right direction of the drawing in conjunction with the squeegee 6. At this time, the first roller 21 and the second roller 22 move together with the nozzle 24 and feed out and wind up the cleaning paper 4 so that the cleaning paper 4 does not slide relative to the metal mask 5. The same applies to the case where the squeegee 6 moves in the left direction of the drawing as shown in FIG. 3B. The first roller 21 and the second roller 22 rotate, and the cleaning unit 20 moves in the left direction of the drawing in conjunction with the squeegee 6. Move. Then, the first roller 21 and the second roller 22 move together with the nozzle 24 and feed out and wind up the cleaning paper 4 so that the cleaning paper 4 does not slide with respect to the metal mask 5.

  As a result, the solder pattern is printed on the cleaning paper 4 and the test printing is completed. Thereafter, the cleaning unit 20 descends, returns to the initial position, and enters the state shown in FIG.

  At this time, the printed solder pattern may straddle the extraction bar 23 as shown in FIG. In such a case, it is difficult to confirm the state of the test-printed solder pattern. Therefore, the first roller 21 and the second roller 22 are appropriately rotated, as shown in FIG. However, it is preferable not to straddle the drawer bar 23. In the case of FIG. 3B, the first roller 21 and the second roller 22 are rotated counterclockwise to obtain the state of FIG.

  In the above description, it has been described that the first roller 21 and the second roller 22 feed and wind the cleaning paper 4 so that the cleaning paper 4 does not slide with respect to the metal mask 5. This is for the purpose of accurately forming the solder pattern having the size and the interval of the opening 5 a formed in the metal mask 5 on the cleaning paper 4.

  Accordingly, it is necessary to accurately measure the feeding speed and winding speed of the cleaning paper 4 and control the rotation speed of the first roller 21 and the second roller 22. However, since the winding diameter of the first roller 21 and the second roller 22 changes with rotation, even if the rotation amount of the roller is measured, the feeding amount and the winding amount of the cleaning paper 4 cannot be accurately controlled.

  Therefore, in this embodiment, a cleaning paper amount regulating mechanism 30 that can control the feeding and winding amount is provided. FIG. 4 shows a side view of the solder printer 2 provided with the cleaning paper amount regulating mechanism 30.

  The cleaning paper amount regulating mechanism 30 includes a wheel portion 31 provided on the first roller 21 side and a wheel portion 32 provided on the second roller 22 side. Since the wheel portion 31 and the wheel portion 32 have the same configuration, the wheel portion 31 will be described as an example. FIG. 5 is a front view of the wheel unit 31. In FIG. 5, however, the cleaning paper 4 is also shown.

  The wheel portion 31 includes a wheel shaft 31a and a generally spur-shaped wheel 31b having protrusions on the outer peripheral surfaces attached to both ends of the wheel shaft 31a. The reason why the wheel 31b is formed in the shape of a spur gear is to suppress slipping on the cleaning paper 4.

  The wheel unit 31 or the wheel unit 32 is provided with a tachometer (measuring instrument) 35. Accordingly, the feed amount and the winding amount of the cleaning paper 4 are measured as the rotation amount of the wheel portion 31 or the wheel portion 32. Therefore, the rotation amount of the first roller 21 and the second roller 22 is calculated by the control unit 36 from this rotation amount, and the rotation of the motors of the first roller 21 and the second roller 22 is controlled.

  FIG. 6 is a diagram showing the operation of the solder printer 2 provided with the cleaning paper amount regulating mechanism 30 corresponding to FIG. 3. FIG. 6A is a diagram in which the squeegee 6 moves to the right in the drawing to perform test printing. A state, (b) shows a state where the squeegee 6 moves in the left direction of the drawing to perform trial printing, and (c) shows a state where the trial printing has been completed. The basic operation is the same as that shown in FIG.

  The printing process is performed under the printing conditions acquired based on the result of the trial printing described above. In this case, the cleaning unit 20 retracts from the metal mask 5 and the print stage 10 so as not to interfere with the print stage 10 placed thereon. Then, the printing stage 10 is raised to bring the printed circuit board 8 into close contact with the metal mask 5. Thereafter, the solder pattern can be printed on the printed circuit board 8 by sliding the squeegee 6.

  The cleaning process is performed when the cleaning unit 20 moves along the mask surface in a state where the squeegee 6 in the trial printing described above is not operating.

  With the configuration described above, the entire process of the solder printing machine including test printing can be automated, and work efficiency is improved.

DESCRIPTION OF SYMBOLS 2 Solder printer 4 Cleaning paper 5 Metal mask 5a Opening 6 Squeegee 7 Solder paste 8 Printed circuit board 10 Print stage 20 Cleaning unit 21 1st roller 22 2nd roller 23 Pull-out bar 24 Nozzle 30 Cleaning paper amount regulation mechanism 31 Wheel part 31a Wheel shaft 31b Wheel 32 Wheel part 35 Measuring instrument (rotometer)
36 Control unit 37, 38 Motor

Claims (4)

A solder printing apparatus for filling a solder paste in an opening formed in a metal mask by a reciprocating operation of a squeegee and printing a solder pattern on a printed circuit board,
A printing stage that holds the printed circuit board and advances and retracts the printed circuit board with respect to the metal mask;
When performing test printing, it moves to the lower part of the metal mask, moves the cleaning paper in contact with the metal mask with the cleaning paper sandwiched, and moves in conjunction with the squeegee while winding up. A cleaning unit,
The cleaning unit includes
A first roller for feeding and winding the cleaning paper;
When the first roller feeds out the cleaning paper, the same amount of cleaning paper as the fed out cleaning paper is wound up, and when the first roller winds up the cleaning paper, the cleaning paper is taken up. A second roller for feeding out the same amount of cleaning paper as the paper;
Including a nozzle provided between the first roller and the second roller,
When performing test printing,
The cleaning unit moves to the metal mask side so that the nozzle is brought into contact with the squeegee through the cleaning paper and the metal mask, and thereafter the contact state between the nozzle and the squeegee is maintained. The first roller and the second roller are rotationally driven so that the cleaning unit is interlocked with the squeegee moving on the metal mask and the cleaning paper is stationary with respect to the metal mask. A solder printer that feeds and winds cleaning paper. The solder printer according to claim 1,
The cleaning unit makes the feeding amount of the cleaning paper fed out from the first roller or the second roller equal to the winding amount of the cleaning paper wound up by the second roller or the first roller. Thus, a solder printing machine comprising a cleaning paper amount defining mechanism for measuring the feeding amount and the winding amount and controlling the rotation of the first roller and the second roller. The solder printer according to claim 2,
The cleaning paper amount defining mechanism includes two wheel portions provided on the first roller and second roller side,
A measuring instrument for measuring the amount of rotation of the wheel part;
A control unit that drives and controls the rotation of the first roller and the second roller based on a measurement result from the measuring instrument;
A solder printing machine comprising: The solder printer according to claim 3,
The wheel portion includes a pair of wheels that sandwich a width end of the cleaning paper,
A solder printing machine, wherein a non-slip portion is formed at an outer peripheral edge portion where the wheel contacts the cleaning paper.

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