JP2016050863A - Optical cell and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical cell made of crystal, which is assembled with high accuracy and without the crystal heated at high temperature.SOLUTION: In an optical cell 10, a sample S is held in a hollow part 11, light P1 is allowed to enter through an incident surface 12, and light P2 which has passed through the sample S is allowed to exit from an output surface 13. The optical cell 10 includes: first to forth crystal pieces 21 to 24 including surfaces as the incident surface 12 and the output surface 13; joint materials 25 for joining the first to forth crystal pieces 21 to 24 by an atomic diffusion joining method; and the hollow part 11 formed by being surrounded by the joined first to forth crystal pieces 21 to 24.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an optical cell used in a spectrophotometer and the like, and a manufacturing method thereof.

  An optical cell used in a spectrophotometer or the like holds a sample in a hollow portion, enters light from an incident surface, and emits light passing through the sample from an output surface. Such an optical cell is manufactured by molding a highly transparent resin or glass.

  An optical cell used for analysis with ultraviolet light is generally made of quartz glass that is highly transparent to ultraviolet light (see, for example, Patent Document 1). However, the ultraviolet light which permeate | transmits quartz glass is 190 nm or more. Examples of materials that efficiently transmit ultraviolet light having a shorter wavelength include magnesium fluoride and calcium fluoride. However, since these materials are water-soluble, they have a drawback of lacking chemical stability and mechanical strength.

WO2008 / 105191 JP 2011-187867 A JP 2012-078476 A JP 2013-027844 A JP 2013-238738 A

  On the other hand, quartz crystal is excellent in terms of chemical durability and mechanical strength, as well as transmitting from about 140 nm ultraviolet light to far infrared light and terahertz light. However, since quartz is weak to heat, there is a problem that it is damaged when heated to a high temperature like quartz glass. This is because quartz has a crystal transition point at 573 ° C.

  To assemble the optical cell without heating the crystal, it is conceivable to use an adhesive. However, even if the thickness of the adhesive is thin, it is about several μm to 10 μm, and thus variations in the thickness cannot be ignored, and it is difficult to assemble the optical cell with high accuracy.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an optical cell made of quartz that can be assembled with high precision without heating the quartz to a high temperature.

The optical cell according to the present invention comprises:
In the optical cell that holds the sample in the hollow part, puts light from the incident surface, and emits the light that has passed through the sample from the exit surface,
A plurality of crystal pieces having surfaces to be the entrance surface and the exit surface;
A bonding material for bonding these crystal pieces by an atomic diffusion bonding method;
The hollow part formed by being surrounded by the bonded crystal pieces;
It is provided with.

The method for producing an optical cell according to the present invention includes:
A method for producing an optical cell according to the present invention, comprising:
Forming the bonding material on the plurality of crystal pieces;
Arranging the plurality of crystal pieces formed with the bonding material so as to form the hollow portion;
Bonding the plurality of crystal pieces via the bonding material by the atomic diffusion bonding method;
including. Hereinafter, the “optical cell manufacturing method” is simply referred to as “manufacturing method”.

  According to the present invention, by bonding a plurality of crystal pieces by the atomic diffusion bonding method, bonding can be performed even at room temperature, and the thickness of the bonding material can be less than 1 nm, so that the crystal can be assembled with high accuracy without heating to a high temperature. An optical cell made of quartz can be provided.

The optical cell of Embodiment 1 is shown, FIG. 1 [A] is a perspective view, FIG. 1 [B] is an exploded perspective view. It is a perspective view (the 1) which shows an example of the manufacturing method of Embodiment 1, and a process advances in order of FIG. 2 [A] and FIG. 2 [B]. It is a perspective view (the 2) which shows an example of the manufacturing method of Embodiment 1, and a process progresses in order of FIG. 3 [C] and FIG. 3 [D]. The optical cell of Embodiment 2 is shown, FIG. 4 [A] is a perspective view, FIG. 4 [B] is an exploded perspective view. It is a perspective view (the 1) which shows an example of the manufacturing method of Embodiment 2, and a process advances in order of FIG. 5 [A] and FIG. 5 [B]. It is a perspective view (the 2) which shows an example of the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 6 [C] and FIG. 6 [D]. The optical cell of Embodiment 3 is shown, FIG. 7 [A] is a perspective view, FIG. 7 [B] is an exploded perspective view. FIG. 8A is a plan view, FIG. 8B is a front view, and FIG. 8C is a right side view. The optical cell of Embodiment 4 is shown, FIG. 8 [A] is a perspective view, FIG. 8 [B] is an exploded perspective view. FIG. 10A is a plan view, FIG. 10B is a front view, and FIG. 10C is a right side view.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. In the present specification and drawings, the same reference numerals are used for substantially the same components. The shapes depicted in the drawings are drawn so as to be easily understood by those skilled in the art, and thus do not necessarily match the actual dimensions and ratios.

  FIG. 1 shows an optical cell of Embodiment 1, FIG. 1 [A] is a perspective view, and FIG. 1 [B] is an exploded perspective view. Hereinafter, a description will be given based on FIG.

  The optical cell 10 of Embodiment 1 holds the sample S in the hollow portion 11, enters light P <b> 1 from the incident surface 12, and emits light P <b> 2 that has passed through the sample S from the output surface 13. The optical cell 10 joins the first to fourth crystal pieces 21 to 24 and the first to fourth crystal pieces 21 to 24 having surfaces to be the entrance surface 12 and the exit surface 13 by an atomic diffusion bonding method. And a hollow portion 11 formed by being surrounded by the joined first to fourth crystal pieces 21 to 24.

  Each of the first to fourth crystal pieces 21 to 24 has a flat plate shape. In a state where a gap 26 is generated between the third crystal piece 23 and the fourth crystal piece 24, the third and fourth crystal pieces 23, 24 are the first crystal piece 21 and the second crystal piece 22. The gap 26 becomes the hollow portion 11 by being joined to each other.

  Next, the optical cell 10 will be described in more detail.

  The optical cell 10 has a rectangular parallelepiped shape as a whole. The first to fourth crystal pieces 21 to 24 are also rectangular parallelepiped, the first crystal piece 21 has a surface that becomes the incident surface 12, and the second crystal piece 22 has a surface that becomes the output surface 13. . At this time, since the light P1 and P2 do not pass through the third and fourth crystal pieces 23 and 24, they may be replaced with other materials. The entrance surface 12 and the exit surface 13 may be in any combination as long as they are parallel across the hollow portion 11, and may be the outer surfaces of the third and fourth crystal pieces 23 and 24, for example.

  The material of the bonding material 25 is, for example, Cr (chrome). The atomic diffusion bonding method utilizes the high surface activity of the bonding material 25 formed by sputtering or the like under a high vacuum, and causes the atomic diffusion between the bonding materials 25 by superimposing the bonding materials 25 to form crystal. This is a technique for joining the pieces 21 to 24. Regarding this atomic diffusion bonding method, patent applications by the present inventors have been published (see Patent Documents 2 to 5).

  The sample S is a gas or a liquid and flows through the hollow portion 11. That is, the sample S passes through the hollow portion 11 from the inlet 111 to the outlet 112. When the sample S passes from the inlet 111 to the outlet 112, the light P1 enters from the incident surface 12 and strikes the sample S. A part of the light P1 is absorbed by the sample S and becomes light P2 and exits from the emission surface 13. By splitting the light P1 or the light P2, the wavelength of the light absorbed by the sample S becomes clear, and the components of the sample S are identified.

  In a general spectrophotometer, two identical optical cells 10 are used for a measurement sample and a reference sample, and the same light P1 is applied to each of them to compare the light P2. Therefore, it is necessary to manufacture these two optical cells 10 with high accuracy so that the dimensional difference is not reflected in the analysis result. In addition, although the case where the sample S flows through the hollow part 11 was taken up, the exit 112 side of the hollow part 11 was made into the shape which becomes a bottom part (for example, cross-sectional U shape etc.), or the exit 112 was made into another crystal piece (for example, bottom plate etc.) ), The sample S may remain in the hollow part 11. Further, the sample S is not limited to liquid or gas, but may be solid.

  Next, the operation and effect of the optical cell 10 will be described.

  (1) According to the optical cell 10, the first to fourth crystal pieces 21 to 24 can be bonded by the atomic diffusion bonding method, so that they can be bonded even at room temperature, and compared with the conventional method using an adhesive. Since the thickness of the material 25 can be less than 1 nm, it is possible to assemble the crystal with high accuracy without heating the crystal to a high temperature. The Japanese Industrial Standard defines “normal temperature” as a range of 20 ° C. ± 15 ° C. (5-35 ° C.) (JIS Z 8703).

  (2) By using quartz as the material of the optical cell 10, it is possible to cope with analysis using a very wide range of light from vacuum ultraviolet light to far infrared light and terahertz light.

  (3) Since the atomic diffusion bonding method allows bonding at room temperature, the influence of thermal strain can be avoided. For example, even if the third and fourth crystal pieces 23 and 24 are replaced with metal pieces or the like, the distortion due to the difference between these thermal expansion coefficients does not occur by bonding at room temperature. That is, since atomic diffusion bonding can be performed at room temperature, it is not necessary to use quartz for all of the components of the optical cell 10, for example, by replacing the third and fourth crystal pieces 23 and 24 with catalysts. Depending on the measurement application including the dynamic measurement of the chemical reaction, a part can be made of other materials.

  Next, the manufacturing method of the first embodiment will be described. The manufacturing method of Embodiment 1 is a method of manufacturing the optical cell 10 and includes the following steps.

  Forming the bonding material 25 on the first to fourth crystal pieces 21 to 24; In this step, the bonding material 25 is formed in a state where the first to fourth crystal pieces 21 to 24 are divided one by one, and the first to fourth crystal pieces 21 to 24 are divided one by one. And the case where the bonding material 25 is formed in the state of the previous crystal wafer.

  The process of arrange | positioning the 1st thru | or 4th crystal pieces 21-24 in which the bonding | jointing material 25 was formed so that the hollow part 11 might be formed. For example, the third crystal piece 23 is overlaid on the first crystal piece 21, and the fourth crystal piece 24 is provided with a gap 26 between the third crystal piece and the first crystal piece 21. The second crystal piece 22 is overlaid on the third crystal piece 23, the gap 26 and the fourth crystal piece 24. This step is performed when the first to fourth crystal pieces 21 to 24 are arranged one by one and before the first to fourth crystal pieces 21 to 24 are divided one by one. Including the case of arranging them in the state of a crystal wafer.

  A step of bonding the first to fourth crystal pieces 21 to 24 through the bonding material 25 by an atomic diffusion bonding method. This step is performed when the first to fourth crystal pieces 21 to 24 are joined one by one, and before the first to fourth crystal pieces 21 to 24 are divided one by one. And the case of bonding them in the state of a crystal wafer.

  Next, a more detailed example of the manufacturing method of Embodiment 1 will be described. 2 and 3 are perspective views showing an example of the manufacturing method according to the first embodiment, and the process proceeds in the order of FIG. 2 [A], FIG. 2 [B], FIG. 3 [C], and FIG. . Hereinafter, description will be given with reference to FIGS.

  First, first, second and third quartz wafers 31 to 33 are prepared in advance. And the through-hole 331 used as the clearance gap 26 is formed in the 3rd crystal wafer 33 (FIG. 2 [A]). For example, a corrosion-resistant film pattern made of Cr (chromium) is formed on both surfaces of the third crystal wafer 33 by using a film formation technique, a photolithography technique, and an etching technique, and the third crystal wafer 33 is formed by wet etching with hydrofluoric acid. A through hole 331 is formed. Since the first, second, and third crystal wafers 31 to 33 are sized to take a total of four optical cells 10 in two vertical and horizontal directions, two through holes 331 are formed in the third crystal wafer 33. .

  The through hole 331 can be formed by grinding or the like. The size of the first, second and third quartz wafers 31 to 33 is desirably as large as possible so that as many optical cells 10 as possible can be taken at one time. In the first embodiment, all the Cr used as the anticorrosion film on the third crystal wafer 33 is removed by etching before the next process.

Subsequently, the bonding material 25 is formed on one surface of each of the first and second crystal wafers 31 and 32 and on both surfaces of the third crystal wafer 33 (FIG. 2 [A]). For example, a sputtering method is used as the vacuum film forming method, and a magnetron sputtering device is used as the film forming apparatus. First, the first, second and third crystal wafers 31 to 33 are carried into the chamber of the film forming apparatus. Then, after the chamber is evacuated to a pressure of about 10 ⁻⁶ Pa, argon gas is introduced into the chamber as a sputter gas, and plasma is generated by applying plasma power to start sputtering film formation. A material (for example, Cr) constituting the bonding material 25 is used for a target installed in the chamber.

  Subsequently, the third crystal wafer 33 is stacked on the first crystal wafer 31 and the second crystal wafer 32 is stacked on the third crystal wafer 33 so that the bonding materials 25 are in contact with each other. The first, second, and third crystal wafers 31 to 33 are bonded via the bonding material 25 by the diffusion bonding method (FIG. 2B). For example, when the thickness of the bonding material 25 becomes 0.2 nm or more and less than 1 nm in the chamber, the sputtering is stopped, and the first, second, and third crystal wafers 31 to 33 are brought into contact with each other. Overlap like so. At this time, it is not necessary to apply pressure, but if the first, second, and third crystal wafers 31 to 33 are warped or the respective surface roughness is large, a load may be appropriately applied. Good. Usually, the first, second, and third quartz wafers 31 to 33 can be bonded by their own weight.

  Note that the bonding material 25 may be made of, for example, a metal such as Ti, Ta, Cu, and Al or a non-metal such as Si in addition to Cr. Regardless of the material of the bonding material 25, the bonding material 25 having a thickness of less than 1 nm has a tensile strength (bonding force) of about 25 MPa or more. By setting the thickness of the bonding material 25 to less than 1 nm, a strong bonding strength can be obtained. (See Patent Document 2). Since the thickness of the bonding material 25 is less than 1 nm, the surface roughness of the first, second, and third crystal wafers 31 to 33 is preferably less than 1 nm.

  Finally, the bonded first, second and third crystal wafers 31 to 33 are cut out (FIG. 3C) to obtain the optical cell 10 (FIG. 3D). For this cutting, for example, a dicing saw is used, and four optical cells 10 are obtained by pressing the blade along the cutting line 34. Before or after this step, it is desirable to remove unnecessary portions of the bonding material 25 that do not contribute to bonding by etching. This is because the unnecessary bonding material 25 may hinder the progress of the lights P1 and P2.

  According to the manufacturing method of the first embodiment, the through hole 331 serving as the gap 26 is formed in the third crystal wafer 33, the bonding material 25 is formed in the first to third crystal wafers 31 to 33, and atomic diffusion is performed. The first, second and third crystal wafers 31 to 33 are bonded via the bonding material 25 by the bonding method, and the bonded first, second and third crystal wafers 31 to 33 are cut out to form the optical cell 10. Thus, the crystal can be processed in the state of the crystal wafer, the bonding material can be formed, and the crystal can be bonded. Thus, a large number of optical cells 10 can be produced at one time, which is suitable for mass production.

  Further, by setting the thickness of the bonding material 25 to 0.2 nm or more and less than 1 nm, the first to third crystal wafers 31 to 33 via the bonding material 25 can be bonded with more sufficient strength. Furthermore, since it is not necessary to heat the first to third quartz wafers 31 to 33 to a high temperature, damage due to generation of stress can be suppressed.

  Supplementally, the bonding material 25 may be made of a metal material containing a metal having a positive free energy of formation of oxide at room temperature, such as Au, Pt, and alloys containing these metals (see Patent Document 5). ). In this case, since the bonding material 25 is composed of a metal material containing a metal having a positive free energy of formation of oxides at room temperature, a natural oxide film is not formed on the surface even in the atmosphere. By bringing them into contact, a directly joined state can be easily obtained. This joining is not limited to the atmosphere, and may be performed in a reduced pressure environment, or may be performed in an atmosphere at or above atmospheric pressure. Further, the bonding environment is not limited to the atmosphere, and may be, for example, nitrogen or an inert gas. The bonding temperature may be room temperature. Moreover, you may heat as needed in order to assist the spreading | diffusion of the joining materials 25. FIG. Further, the bonding material 25 may be a multilayer film including a base layer made of Cr or the like for improving the adhesion to the crystal and a bonding layer made of Au or the like formed thereon.

  Next, the optical cell of Embodiment 2 will be described. FIG. 4 shows an optical cell according to the second embodiment, where FIG. 4A is a perspective view and FIG. 4B is an exploded perspective view. Hereinafter, a description will be given based on FIG.

  The optical cell 40 according to the second embodiment holds the sample S in the hollow portion 11, enters light P <b> 1 from the incident surface 12, and emits light P <b> 2 that has passed through the sample S from the output surface 13. The optical cell 40 joins the first and second crystal pieces 41 and 42 having surfaces to be the entrance surface 12 and the exit surface 13 and the first and second crystal pieces 41 and 42 by an atomic diffusion bonding method. And a hollow portion 11 formed by being surrounded by the joined first and second crystal pieces 41 and 42.

  The first and second crystal pieces 41 and 42 each have a flat plate shape. Grooves 43 are formed in the first and second crystal pieces 41 and 42, respectively. The first crystal piece 41 and the second crystal piece 42 are joined with the groove 43 interposed therebetween, whereby the groove 43 becomes the hollow portion 11.

  Next, the optical cell 40 will be described in more detail.

  The optical cell 40 has a rectangular parallelepiped shape as a whole. The first and second crystal pieces 41 and 42 are also rectangular parallelepiped, the first crystal piece 41 has a surface that becomes the incident surface 12, and the second crystal piece 42 has a surface that becomes the output surface 13. . The hollow portion 11 is formed by the groove 43 of the first crystal piece 41 and the groove 43 of the second crystal piece 42 facing each other and overlapping.

  According to the optical cell 40 of the second embodiment, since the number of crystal pieces can be reduced as compared with the optical cell of the first embodiment, processes such as bonding of crystal pieces can be simplified. The groove 43 may be formed in both the first and second crystal pieces 41 and 42 or in one of them. When formed in both, there is an advantage that the depth of the groove 43 can be reduced, and when formed in one, there is an advantage that the number of the grooves 43 can be reduced.

  Other configurations, operations, and effects of the optical cell 40 of the second embodiment are the same as those of the optical cell of the first embodiment.

  Next, the manufacturing method of this Embodiment 2 is demonstrated. The manufacturing method of Embodiment 2 is a method of manufacturing the optical cell 40 and includes the following steps.

  Forming the bonding material 25 on the first and second crystal pieces 41 and 42; In this step, the bonding material 25 is formed in a state where the first and second crystal pieces 41 and 42 are divided one by one, and the first and second crystal pieces 41 and 42 are divided one by one. And the case where the bonding material 25 is formed in the state of the previous crystal wafer.

  The process of arrange | positioning the 1st and 2nd crystal pieces 41 and 42 in which the bonding | jointing material 25 was formed so that the hollow part 11 may be formed. For example, the second crystal piece 42 is stacked on the first crystal piece 41 with the groove 43 interposed therebetween. This step is performed when the first and second crystal pieces 41 and 42 are arranged in a state where the first and second crystal pieces 41 and 42 are divided one by one, and before the first and second crystal pieces 41 and 42 are divided one by one. Including the case of arranging them in the state of a crystal wafer.

  A step of bonding the first and second crystal pieces 41 and 42 through the bonding material 25 by an atomic diffusion bonding method. This process is performed when the first and second crystal pieces 41 and 42 are joined one by one and before the first and second crystal pieces 41 and 42 are divided one by one. And the case of bonding them in the state of a crystal wafer.

  Next, a more detailed example of the manufacturing method of Embodiment 2 will be described. 5 and 6 are perspective views showing an example of the manufacturing method according to the second embodiment, and the process proceeds in the order of FIG. 5 [A], FIG. 5 [B], FIG. 6 [C], and FIG. . Hereinafter, a description will be given with reference to FIGS.

  First, first and second crystal wafers 51 and 52 are prepared in advance. And the groove | channel 43 is formed in both the 1st and 2nd crystal wafers 51 and 52 (FIG. 5 [A]). For example, a corrosion-resistant film pattern made of Cr is formed on one surface of the first and second crystal wafers 51 and 52 by using a film forming technique, a photolithography technique, and an etching technique, and the first and second crystal wafers 51 and 52 are wet-etched with hydrofluoric acid. Grooves 43 are formed in the second crystal wafers 51 and 52. Since the first and second crystal wafers 51 and 52 are sized so that a total of four optical cells 40 can be taken by two vertically and horizontally, two grooves 43 are formed on the first and second crystal wafers 51 and 52, respectively. Form one by one.

  The groove 43 can also be formed by grinding or the like. The size of the first and second quartz wafers 51 and 52 is desirably as large as possible so that as many optical cells 40 as possible can be taken at one time. In the second embodiment, all the Cr used as the anticorrosion film in the first and second crystal wafers 51 and 52 is removed by etching before the next process.

  Subsequently, the bonding material 25 is formed on one surface of each of the first and second crystal wafers 51 and 52 (FIG. 5A). For example, a sputtering method is used as the vacuum film forming method, and a magnetron sputtering device is used as the film forming apparatus.

  Subsequently, the second crystal wafer 52 is stacked on the first crystal wafer 51 with the groove 43 interposed therebetween so that the bonding materials 25 are in contact with each other, and the first and second crystal wafers 41 are bonded by the atomic diffusion bonding method. , 42 are joined through the joining material 25 (FIG. 5B).

  Finally, the bonded first and second crystal wafers 41 and 42 are cut out (FIG. 6 [C]) to obtain the optical cell 40 (FIG. 6 [D]). Before or after this step, it is desirable to remove unnecessary portions of the bonding material 25 that do not contribute to bonding by etching.

  According to the manufacturing method of the second embodiment, the groove 43 is formed in both the first and second crystal wafers 51 and 52, the bonding material 25 is formed in the first and second crystal wafers 51 and 52, By bonding the first and second crystal wafers 51 and 52 through the bonding material 25 by the atomic diffusion bonding method, and cutting the bonded first and second crystal wafers 51 and 52 to obtain the optical cell 40. Since the crystal is processed in the state of the crystal wafer, the bonding material is formed, and the crystal can be bonded, a large number of optical cells 40 can be produced at one time, which is suitable for mass production.

  Further, as compared with the first embodiment, the number of components and the number of joints can be reduced to form the groove 43, so that the dimensional accuracy of the optical cell 40 can be increased.

  Other configurations, operations, and effects of the manufacturing method of the second embodiment are the same as those of the manufacturing method of the first embodiment.

  Next, the optical cell of Embodiment 3 will be described. FIG. 7 shows an optical cell of Embodiment 3, FIG. 7A is a perspective view, and FIG. 7B is an exploded perspective view. FIG. 8 shows a crystal piece in the optical cell of Embodiment 3, FIG. 8A is a plan view, FIG. 8B is a front view, and FIG. 8C is a right side view. Hereinafter, a description will be given based on FIGS. 7 and 8.

  The optical cell 60 of Embodiment 3 holds the sample S in the hollow portion 11, enters light P <b> 1 from the incident surface 12, and emits light P <b> 2 that has passed through the sample S from the output surface 13. The optical cell 60 joins the first and second crystal pieces 61 and 62 having the surfaces to be the entrance surface 12 and the exit surface 13 and the first and second crystal pieces 61 and 62 by an atomic diffusion bonding method. And a hollow portion 11 formed by being surrounded by the joined first and second crystal pieces 61 and 62.

  The first and second crystal pieces 61 and 62 each have a triangular prism shape. Grooves 63 are formed in the first and second crystal pieces 61 and 62, respectively. The first crystal piece 61 and the second crystal piece 62 are joined with the groove 63 interposed therebetween, whereby the groove 63 becomes the hollow portion 11.

  The optical cell 60 has a rectangular parallelepiped shape as a whole. The first crystal piece 61 has a surface that becomes the entrance surface 12, and the second crystal piece 62 has a surface that becomes the exit surface 13. The hollow portion 11 is formed by the groove 63 of the first crystal piece 61 and the groove 63 of the second crystal piece 62 facing each other and overlapping.

  As shown in FIG. 8, each of the first and second crystal pieces 61 and 62 includes two end faces 641 and 642 that are parallel to each other and formed of a right triangle and a first side including one adjacent side of the right triangle. It has a side surface 651, a second side surface 652 including the other adjacent side of the right triangle, and a third side surface 653 including the hypotenuse of the right triangle. A straight groove 63 is formed on the third side surface 653 so as to connect the two end surfaces 641 and 642. More specifically, a groove 63 is formed on a line connecting the midpoints of the oblique sides of the right isosceles triangles of the two end faces 641 and 642, and the groove 63 is a V-groove having a V-shaped cross section. The V-shaped valley is a right angle. The opposite side of a right triangle is called the “slope side”. The simple term “neighboring” means a right-angled “neighboring”.

  Next, the manufacturing method of the third embodiment will be described. The manufacturing method of the third embodiment is a method of manufacturing the optical cell 60 and includes the following steps.

  Forming the first and second crystal pieces 61 and 62; For example, a triangular prism-shaped first and second crystal pieces 61 and 62 having the same shape and size are cut out from one crystal block using a dicing saw or a wire saw. And the groove | channel 63 is formed in those 1st and 2nd crystal pieces 61 and 62 using a V-groove processing machine.

  Forming the bonding material 25 on the first and second crystal pieces 61 and 62; For example, the bonding material 25 is formed on the entire surface of the first and second crystal pieces 61 and 62 by a film forming technique such as sputtering.

  The process of arrange | positioning the 1st and 2nd crystal pieces 61 and 62 in which the bonding | jointing material 25 was formed so that the hollow part 11 may be formed. As described above, the first and second crystal pieces 61 and 62 are overlapped.

  A step of bonding the first and second crystal pieces 61 and 62 through the bonding material 25 by an atomic diffusion bonding method. After this step, it is desirable to remove unnecessary portions of the bonding material 25 that do not contribute to bonding by etching. Thereby, the optical cell 60 is completed.

  As shown in FIG. 7A, according to the optical cell 60, the first and second crystal pieces 61 and 62 having a triangular prism shape are overlapped to form the entrance surface 12, the exit surface 13, and the light P1, Even when P2 is shifted by 90 ° to form the incident surface 12 ′, the output surface 13 ′, and the light P1 ′ and P2 ′, the bonding material 25 does not prevent the light P1 ′ and P2 ′ from traveling. Therefore, according to the optical cell 60 of the third embodiment, options for the light irradiation direction can be increased as compared with the optical cell of the second embodiment.

  Other configurations, operations, and effects of the optical cell 60 of the third embodiment and the manufacturing method thereof are the same as those of the optical cell of the first and second embodiments and the manufacturing method thereof.

  Next, the optical cell of Embodiment 4 will be described. FIG. 9 shows an optical cell of Embodiment 4, FIG. 9 [A] is a perspective view, and FIG. 9 [B] is an exploded perspective view. FIG. 10 shows a crystal piece in the optical cell of Embodiment 4, FIG. 10 [A] is a plan view, FIG. 10 [B] is a front view, and FIG. 10 [C] is a right side view. Hereinafter, a description will be given based on FIGS. 9 and 10.

  The optical cell 70 according to the fourth embodiment is configured to hold the sample S in the hollow portion 11, enter light P <b> 1 from the incident surface 12, and emit light P <b> 2 that has passed through the sample S from the output surface 13. The optical cell 70 joins the first to fourth crystal pieces 71 to 74 having the surfaces to be the entrance surface 12 and the exit surface 13 and the first to fourth crystal pieces 71 to 74 by an atomic diffusion bonding method. And a hollow portion 11 formed by being surrounded by the joined first to fourth crystal pieces 71 to 74.

  The first to fourth crystal pieces 71 to 74 each have a rectangular parallelepiped shape, and all have the same shape and size. The second crystal piece 72 is joined to the first crystal piece 71 so that the hollow portion 11 is formed by the first to fourth crystal pieces 71 to 74, and the third crystal piece is connected to the second crystal piece 72. 73, the fourth crystal piece 74 is joined to the third crystal piece 73, and the first crystal piece 71 is joined to the fourth crystal piece 74.

  The optical cell 70 has a rectangular parallelepiped shape as a whole. The first crystal piece 71 has a surface that becomes the incident surface 12, and the third crystal piece 73 has a surface that becomes the emission surface 13. At this time, since the light P1 and P2 do not pass through the second and fourth crystal pieces 72 and 74, they may be replaced with other materials. The entrance surface 12 and the exit surface 13 may be in any combination as long as they are parallel across the hollow portion 11, and may be the outer surfaces of the second and fourth crystal pieces 73 and 74, for example.

  As shown in FIG. 10, each of the first to fourth crystal pieces 71 to 74 includes two end surfaces 751 and 752 that are parallel to each other and each of a first and second short side including the short side of the rectangle. It has side surfaces 761, 762 and first and second long side surfaces 771, 772 including the long sides of the rectangle. Then, the first short side surface 761 of the first crystal piece 71 and the first long side surface 771 of the second crystal piece 72 are joined so as to form the hollow portion 11. The first short side surface 761 and the first long side surface 771 of the third crystal piece 73 are joined together, and the first short side surface 761 of the third crystal piece 73 and the first long side of the fourth crystal piece 74 are joined. The side surface 771 is joined, and the first short side surface 761 of the fourth crystal piece 74 and the first long side surface 771 of the first crystal piece 71 are joined.

  At this time, the second crystal piece 72 is arranged so that the second long side surface 772 of the first crystal piece 71 and the second short side surface 762 of the second crystal piece 72 are flush with each other. The second long side surface 772 of the third crystal piece 73 and the fourth crystal piece 74 are arranged so that the second long side surface 772 and the second short side surface 762 of the third crystal piece 73 are flush with each other. The second long side surface 772 of the fourth crystal piece 74 and the second short side surface 762 of the first crystal piece 71 are flush with each other so that the second short side surface 762 is flush with the second short side surface 762. When these are joined, the hollow portion 11 is naturally formed at the center of the optical cell 70.

  Next, the manufacturing method of the fourth embodiment will be described. The manufacturing method according to the fourth embodiment is a method for manufacturing the optical cell 70 and includes the following steps.

  Forming the first to fourth crystal pieces 71 to 74; For example, the first to fourth crystal pieces 71 to 74 having the same shape and size are cut out from one crystal block using a dicing saw or a wire saw.

  Forming the bonding material 25 on the first to fourth crystal pieces 71 to 74; For example, the bonding material 25 is formed on the entire surface of the first to fourth crystal pieces 71 to 74 by a film forming technique such as sputtering.

  The process of arrange | positioning the 1st thru | or 4th crystal pieces 21-24 in which the bonding | jointing material 25 was formed so that the hollow part 11 might be formed. As described above, the first to fourth crystal pieces 71 to 74 are stacked.

  A step of bonding the first to fourth crystal pieces 21 to 24 through the bonding material 25 by an atomic diffusion bonding method. The optical cell 70 is obtained by repeating the previous process and the present process several times, that is, by stacking the first to fourth crystal pieces 71 to 74 little by little and bonding them. After this step, it is desirable to remove unnecessary portions of the bonding material 25 that do not contribute to bonding by etching.

  According to the optical cell 70 of the fourth embodiment, all of the first to fourth crystal pieces 71 to 74 have the same shape and size, and the process of forming a through hole or a groove in the crystal is not required. The production of the crystal pieces constituting the cell can be made efficient.

  Other configurations, operations, and effects of the optical cell 70 of the fourth embodiment and the manufacturing method thereof are the same as those of the optical cell of the first to third embodiments and the manufacturing method thereof.

  As described above, the present invention has been described with reference to each of the above embodiments, but the present invention is not limited only to the configuration and operation of each of the above embodiments, and can be made by those skilled in the art within the scope of the present invention. Of course, it includes various variations and modifications that can be made. Further, the present invention includes a combination of some or all of the configurations of the above-described embodiments as appropriate.

10 Optical cell (Embodiment 1)
11 hollow portion 111 entrance 112 exit 12 entrance surface 13 exit surface 21 first crystal piece 22 second crystal piece 23 third crystal piece 24 fourth crystal piece 25 bonding material 26 gap S sample P1, P2 light 31 first One crystal wafer 32 Second crystal wafer 33 Third crystal wafer 331 Through-hole 34 Cutting line 40 Optical cell (Embodiment 2)
41 First crystal piece 42 Second crystal piece 43 Groove 51 First crystal wafer 52 Second crystal wafer 60 Optical cell (Embodiment 3)
61 First crystal piece 62 Second crystal piece 63 Groove 641, 642 End face 651 First side face 652 Second side face 653 Third side face 12 'Incident face 13' Emission face P1 ', P2' Light 70 Optical cell (Embodiment 4)
71 First crystal piece 72 Second crystal piece 73 Third crystal piece 74 Fourth crystal piece 751, 752 End face 761 First short side 762 Second short side 771 First short side 772 Second Short side

Claims (8)

In the optical cell that holds the sample in the hollow part, puts light from the incident surface, and emits the light that has passed through the sample from the exit surface,
A plurality of crystal pieces having surfaces to be the entrance surface and the exit surface;
A bonding material for bonding these crystal pieces by an atomic diffusion bonding method;
The hollow part formed by being surrounded by the bonded crystal pieces;
An optical cell comprising: The plurality of crystal pieces are composed of flat, first, second, third and fourth crystal pieces,
With the gap formed between the third crystal piece and the fourth crystal piece, the third and fourth crystal pieces are between the first crystal piece and the second crystal piece. The gap is the hollow part by being joined to
The optical cell according to claim 1. The plurality of crystal pieces are composed of flat plate-like first and second crystal pieces,
A groove is formed in at least one of the first and second crystal pieces,
The first crystal piece and the second crystal piece are joined with the groove interposed therebetween, so that the groove is the hollow portion.
The optical cell according to claim 1. The plurality of crystal pieces are composed of triangular prism-shaped first and second crystal pieces,
These first and second crystal pieces are respectively
Two parallel end faces made of right triangles;
A first side including one side of the right triangle;
A second side including the other adjacent side of the right triangle;
A third side including the hypotenuse of the right triangle,
A groove is formed so as to connect the two end surfaces to the third side surface,
The first crystal piece and the second crystal piece are joined with the groove interposed therebetween, so that the groove is the hollow portion.
The optical cell according to claim 1. The plurality of crystal pieces are composed of rectangular parallelepiped first to fourth crystal pieces,
These first to fourth crystal pieces are respectively
Two end faces made of a rectangle parallel to each other;
First and second short sides including a short side of the rectangle;
The first and second long sides including the long side of the rectangle,
The first short side surface of the first crystal piece and the first long side surface of the second crystal piece are joined so as to form the hollow portion, and the first crystal side of the second crystal piece is joined. One short side and the first long side of the third crystal piece are joined, and the first short side of the third crystal piece and the first long side of the fourth crystal piece And the first short side surface of the fourth crystal piece and the first long side surface of the first crystal piece are joined,
The optical cell according to claim 1. A method for producing an optical cell according to claim 1, comprising:
Forming the bonding material on the plurality of crystal pieces;
Arranging the plurality of crystal pieces formed with the bonding material so as to form the hollow portion;
Bonding the plurality of crystal pieces via the bonding material by the atomic diffusion bonding method;
An optical cell manufacturing method comprising: A method for producing an optical cell according to claim 2, comprising:
First, second and third quartz wafers are prepared in advance,
Forming a through-hole serving as the gap in the third quartz wafer;
Forming the bonding material on one side of the first and second quartz wafers and on both sides of the third quartz wafer;
The third crystal wafer is stacked on the first crystal wafer, the second crystal wafer is stacked on the third crystal wafer, and the atomic diffusion contact is performed so that the bonding materials are in contact with each other. Bonding the first, second and third quartz wafers via the bonding material in a legal manner;
Cutting the bonded first, second and third quartz wafers to obtain the optical cell;
An optical cell manufacturing method comprising: A method for producing an optical cell according to claim 3,
First and second crystal wafers are prepared in advance,
Forming the groove in at least one of the first and second quartz wafers;
Forming the bonding material on one surface of the first and second quartz wafers;
The second crystal wafer is stacked on the first crystal wafer with the groove interposed therebetween so that the bonding materials are in contact with each other, and the first and second crystal wafers are stacked by the atomic diffusion bonding method. A step of bonding via a bonding material;
Cutting the bonded first and second quartz wafers to obtain the optical cell;
An optical cell manufacturing method comprising:

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