JPH0512994A - Manufacture of laminate type micro-channel - Google Patents

Abstract

PURPOSE:To facilitate alignment of channel holes and reduce the cost for fabricating a large area plate by joining micro-channel plates in lamination at a low temp. under ultra-high vacuum while a voltage is impressed between electroconductive layers provided on both surfaces of each micro-channel plate. CONSTITUTION:Through a mask, ultraviolet rays are cast aslant from above onto micro-channel plates 5-8 made of plate-shaped photo-sensitive glass of approx. 0.2mm thick, followed by a heat treatment and acid treatment, and the resultant is etched from both surfaces to form easy-to-align micro-channel holes 9 in the form with wider mouth at the ends of the micro-channel part. A Pb oxide thin film 15 is provided on the inner wall of each hole 9 by means by evaporation process while Al films 10-14 are formed on both surfaces of the glass by similar method, followed by coordination so that the holes 9 in the plates 5-8 are aligned, and the Al surface is subjected to Ar sputtering process under an ultra-high vacuum and adhesion is made quickly with a low pushing force at approx. 200 deg.C. As a result, micro-channel plates having a large aspect ratio can be achieved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microchannel plate for performing electron beam amplification by utilizing a microchannel, and in particular, an aspect ratio (d / L, d: microchannel diameter, L: microchannel hole). The present invention relates to a method for manufacturing a laminated microchannel plate including a laminated body of microchannel plates having a small length.

[0002]

2. Description of the Related Art Conventionally, for example, "Applied Physics (40, No. 9, 1971; 41, No. 6, 1972; 43, No. 2,
1974) ", etc., the microchannel plate is formed by repeatedly performing the above steps in order to obtain the desired microchannel diameter by fusing glass materials together while simultaneously fusing the capillaries together. Need to repeat. Finally, after being cut into a plate having a thickness corresponding to an aspect ratio of 40 to 90, heat treatment is performed to form a conductive layer.

[0003]

However, in the above-described conventional example, the microchannel plate is manufactured by cutting the capillaries bundles fused to each other after the capillaries are hot drawn out, and There was a flaw. 1. When the capillary diameter is gradually reduced, the microchannel plate is inevitably thin due to the aspect ratio. Therefore, it is difficult to cut the microchannel plate into thin pieces, considering the possibility of cracking during this processing. For this reason, the length of the microchannel becomes long, the electron flight time becomes long, and as a result, the response speed becomes slow. 2. Since the noise is removed by using a plurality of chevron-type microchannel plates, it is difficult to remove the noise with only one microchannel plate manufactured by the hot drawing method. 3. When a plurality of chevron-type microchannel plates created by the hot drawing method are stacked in close contact with each other, it is difficult to align the microchannel holes so as not to prevent the passage of electrons at the stacked parts.

[0004]

SUMMARY OF THE INVENTION The present invention facilitates the fabrication of micro-aspect plates with a large aspect ratio as a result of laminating plates of micro-channels with a low aspect ratio in a laminated fashion.

That is, according to the method of the present invention, in adhering microchannel plates in a laminated manner in the production of laminated microchannels, conductive layers are provided on both sides of each laminated microchannel plate, and two microchannel plates are provided. A feature of the present invention is that the conductive layers are bonded to each other at a low temperature in an ultra-high vacuum at a low temperature in a state where a voltage is applied between the conductive layers facing each other with the channel plates sandwiched between them. Aspect ratio of microchannel plate (d / L,
d: microchannel diameter, L: microchannel hole length) is usually 40 to 90. For this reason, when the microchannel diameter is reduced, it is easier to open a large number of holes with a small aspect ratio than to open a large number of holes with a large aspect ratio. Therefore, after making many holes with a small aspect ratio in the thin plate,
Adhesion makes it possible to form microchannels with a large aspect ratio. In this case, it is possible to manufacture a multi-microchannel plate having a chevron type structure by forming the microchannel holes at an angle with respect to the normal line direction of the plate surface. Furthermore, by using a conductive substance at the bonding point, an electron accelerating voltage is applied to each thin plate microchannel plate through this conductive substance, and the electrodes on both ends of each thin plate microchannel plate are stripped to the inner wall surface of the channel plate. By passing an electric current, it becomes possible to replenish the electrons emitted as a multiplication in a short time. That is, the dead time of the electron multiplier can be improved. In addition, it is easier to process microchannels with a small aspect ratio than to process microchannel holes with a large aspect ratio, so it is also possible to create thin and large-area microchannel plates. Is. Such a thin microchannel plate has a shorter response distance of electrons in the multiplication process, and thus has better response. On the other hand, as the shape of the thin plate-like microchannel plate, by making the cross-sectional shapes in the normal direction and the parallel direction to the electron passage direction into a similar circular shape and a taper shape or a wide mouth shape at both ends, when laminating, the microchannel holes Are easily aligned, and the electron passing area is less likely to be reduced. Since a low temperature bonding method is used as a bonding method during this lamination, it is possible to reduce the thermal expansion strain of each thin plate-shaped microchannel plate as compared with bonding at a high temperature. Also, in terms of manufacturing, the laminated microchannel does not need to be integrally processed with the microchannel holes having a high aspect ratio, and thus is easy to manufacture.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1, 2, 3, 4, 5 and 6 show a first embodiment of the present invention, and FIG. 1 shows the overall appearance of a laminated microchannel manufactured according to the method of the present invention. Represent.
In FIG. 1, the line AA indicates a cross section cut in the z-axis direction and viewed from the y-axis direction. FIG. 2 shows A of FIG.
-A is a view as seen from the direction of the arrow, and in FIG.
2, 3 and 4 are electron accelerating power sources applied to both ends of the thin plate-shaped microchannel plates 5, 6, 7 and 8, respectively, and B is a microchannel obtained by stacking the thin plate-shaped microchannel plates. It shows a region in which a part is enlarged. FIG. 3 is an enlarged view of a portion B of FIG. 2 and is a drawing that best represents the features of the present invention. In FIG. 3, 9 is each thin microchannel plate 5, as described above.
Microchannel holes drilled in 6, 7, and 8
_IN and 9 _OUT represent wide mouths at both ends of the microchannel hole 9, and 10, 11, 12, 13, and 14 represent electrons applied to both ends of each thin microchannel plate 5, 6, 7, and 8. The electrodes 11, 12 and 13 are made of Al and are electrically connected to the acceleration power supplies 1, 2, 3 and 4 by the lead wires, and the electrodes 11, 12, and 13 are thin microchannel plates 5, 6, 7 and at the same time. It also acts as an adhesive layer for adhering 8 to each other in a laminated form. Reference numeral 15 is a thin film lead oxide layer obtained by vapor deposition on the inner wall surface of the microchannel holes of the thin plate-shaped microchannel plates 5, 6, 7, and 8. FIG. 4 shows a microchannel plate before bonding. In the figure, reference numerals 5, 6, 7, and 8 denote thin plate-shaped microchannel plates as described above, and the arrow directions indicate the thin plate-shaped microchannel plates 5, 6, 7, and 8. The pressing direction for adhering 8 together is shown.

Here, each of the thin microchannel plates 5, 6, 7, and 8 is made of plate-shaped photosensitive glass having a thickness of about 0.2 mm, and the microchannel holes are formed by exposing the mask to the above-mentioned photosensitive glass. UV light from a direction inclined by about 10 degrees with respect to the normal direction of the photosensitive glass surface, that is, obliquely above, and then heat-treated, followed by acid treatment (6%). Hydrofluoric acid treatment). In this case, only the portion irradiated with the ultraviolet light through the mask is perforated by the above-mentioned etching process by the heat treatment and the acid treatment. During this acid treatment, the plate-shaped photosensitive glass is first etched from both surfaces, and as a result, wide-mouthed holes are formed on both surfaces of the photosensitive glass. That is, both ends 9 _IN , 9 of the microchannel portion 9 of each thin microchannel plate 5, 6, 7, 8
A microchannel hole is formed so that it has a wide mouth at _OUT . After processing the microchannel holes, a lead oxide thin film layer is formed on the inner wall surface of the microchannel holes 9 by the above-mentioned means by vapor deposition, and thereafter, Al is formed on both surfaces of each individual plate-like photosensitive glass in the above-mentioned manner. To film. And
When laminating the individual thin microchannel plates, the microchannels 9 are aligned so that they are aligned with each other so that the passage of electrons is not hindered, and then they are pressed at a low temperature (about 200 ° C.). The thin microchannel plates 5, 6, 7, and 8 are bonded by force. The alignment at the time of stacking is relatively easy because the shape of the microchannel holes 9 is wide at both ends. When the thin plate-shaped microchannel plates 5, 6, 7, and 8 are bonded to each other, the Al surface formed in advance is subjected to Ar ⁺ sputter ring (in an ultrahigh vacuum (10 ^-8 Torr or less)). Acceleration voltage: 2 kV) treatment is performed, and then the adhesive is quickly adhered in the same manner as above without taking it out of the vacuum chamber. Each thin microchannel plate 5, 6 as described above
Adhesion between 7 and 8 results in an aspect ratio ( ~
40) Large microchannel plates can be obtained.

Now, as shown in FIG. 3, the flow of electrons in the present microchannel plate is such that the incident electrons are applied to both ends of each of the thin plate-shaped microchannel plates 5, 6, 7, and 8, and the electron acceleration power sources 1 and 2 are used. , 3, 4 are accelerated by the accelerating voltage and collide with the microchannel wall surface one after another,
The number of electrons is multiplied and the flow passes through the microchannel holes. As a result, the incident electrons are multiplied. The microchannel plate thus produced can multiply electrons by about 10 ² with respect to incident electrons when an applied voltage is 1 kV.

On the other hand, also in the case of the microchannel plate as shown in FIGS. 5 and 6, electron multiplication can be performed on incident electrons similarly to the above-mentioned microchannel plate. The reference numerals in FIGS. 5 and 6 are the same as those in FIGS. 2 and 3, respectively.

7, 8, 9, 10, 11, 12 do not show the second embodiment of the present invention. FIG. 7 is a drawing showing the overall appearance of the present invention. In FIG. 7, the view taken along the arrow A′-A ′ is cut in the z direction to indicate a cross section viewed from the y axis direction. FIG. 8 is a view taken along the line A′-A ′ of FIG. 7, in which 1, 2, 3 and 4 are provided at both ends of the thin microchannel plates 5, 6, 7 and 8, respectively. The electron acceleration power source is being applied, and B is an enlarged region of a part of a microchannel plate obtained by stacking thin plate-shaped microchannel plates. Figure 9
8 is an enlarged view of a portion B of FIG. 8 and is a drawing that best represents the features of the present invention. In FIG. 9, 9 is a microchannel hole formed in each of the thin plate-shaped microchannel plates 5, 6, 7, and 8 as described above, and 9 _INT and 9 _OUTT are wide mouth portions at both ends of the microchannel hole 9, respectively. And narrow mouths, and 10, 11, 12, 13, and 14 are electron acceleration power sources 1, 2, 3, 4 and leads applied to both ends of each thin microchannel plate 5, 6, 7, 8, respectively. It is an electrode made of Al that is electrically connected by a wire.
1, 12 and 13 are adhesive layers for simultaneously adhering the thin plate-shaped microchannel plates 5, 6, 7 and 8 to each other in a laminated form, and 15 is the thin plate-shaped microchannel plate 5,
It is a thin film lead oxide layer obtained by vapor deposition on the inner wall surfaces of the microchannel holes 6, 7, and 8. FIG. 10 shows a microchannel plate before bonding, and in FIG. 10, 5, 6, 7,
Reference numeral 8 indicates a thin plate-like microchannel plate as described above.
The pressing direction for adhering 6, 7, and 8 to each other is shown. Now, each thin plate-shaped micro channel plate 5, 6, 7, 8
Is made of a plate-shaped Vycor glass having a thickness of about 0.2 mm, and the microchannel holes are formed by a focused electron beam (energy: ~ 10 ⁶ W / cm ² ).
Microchannels are processed in an oblique direction by inclining by an angle of about 10 degrees with respect to the normal direction of the high-lead glass surface, that is, by obliquely irradiating a convergent electron beam. By the processing with this convergent electron beam, the shape of the microchannel hole 9 formed in the Vycor glass is wide at 9 _INT and _narrow at 9 _OUTT , as shown in FIGS.
That is, it is tapered. After processing the microchannel holes, a lead oxide thin film layer is formed on the inner wall surface of the microchannel holes 9 by vapor deposition by the same means as in the above embodiment, and thereafter, on both surfaces of each individual Vycor glass in the same manner as described above. A film of Al is formed. Then, when laminating the individual thin microchannel plates, the microchannels 9 are adjusted in position so as to be aligned with each other so that the passage of electrons is not hindered. Each thin microchannel plate 5,
Glue 6,7,8. The alignment at the time of stacking is such that since the shape of the microchannel 9 is tapered, the _narrow mouth portion 9 _{OUTT of} one thin plate microchannel plate and the wide mouth portion 9 of the other thin microchannel plate 9 are _aligned.
It is relatively easy to use in combination with _INT . The thin plate-shaped micro channel plates 5, 6,
When adhering 7 and 8 to each other, the previously formed Al surface was exposed to Ar ⁺ in an ultrahigh vacuum (10 ^-8 Torr or less).
Sputtering (accelerating voltage; 2 kV) is carried out, and then bonding is carried out immediately in the same manner as described above, without taking it out of the vacuum chamber. By adhering the thin plate-like microchannel plates 5, 6, 7, 8 to each other as described above, a microchannel plate having a large aspect ratio (up to 40) can be obtained as a result.

As shown in FIG. 9, the flow of electrons in the microchannel thus manufactured is such that the incident electrons are applied to both ends of each of the thin plate-shaped microchannel plates 5, 6, 7 and 8 as a power source 1 for electron acceleration. , 2, 3, 4 are accelerated by the acceleration voltage to collide with the wall surface of the microchannel one after another, multiply the number of electrons, and pass through the microchannel hole. As a result, the incident electrons are multiplied.

When the applied voltage is 1 kV, the micro-channel plate thus prepared has about 1 for incident electrons.
Enables electron multiplication of 0 ² .

On the other hand, also in the case of the micro channel plate as shown in FIGS. 11 and 12, electron multiplication can be carried out with respect to incident electrons as in the case of the micro channel plate. The numbers in FIGS. 11 and 12 correspond to those in FIGS.
It is similar to each number.

[0014]

As described above, according to the method of manufacturing a laminated microchannel of the present invention, the following excellent effects can be obtained: A microchannel plate having a large aspect ratio is formed by stacking microchannel plates having a small aspect ratio, so that a large-area microchannel plate can be manufactured without increasing the manufacturing cost. 2. Since the cross-sectional shape parallel to the axis of one microchannel hole is a wound type with wide-mouthed ends, it is easy to align the microchannel holes when laminating the microchannel plates. 3. The cross-sectional shape parallel to the axis of one microchannel hole has a wide mouth at one end and a narrow mouth at the other end, so when the microchannel plates are laminated together, the wide mouth and the narrow mouth should face each other. By stacking on
Alignment of microchannel holes is easy. 4. Low temperature (about 2)
Since it is performed at 00 ° C., the thermal strain of the microchannel plate can be reduced, and the alignment of the microchannel holes becomes easy.

[Brief description of drawings]

FIG. 1 is an external view of a laminated microchannel plate embodying the present invention.

FIG. 2 is a cross section of FIG. 1 in the z direction, and A when viewed from the y direction.
-A arrow view.

FIG. 3 is an enlarged view of portion B in FIG.

FIG. 4 shows each thin plate microchannel plate before lamination.

FIG. 5 is an A′-A ′ arrow view of FIG. 1 in the case where the microchannels are laminated and adhered to the chevron type, as viewed in the z-direction and viewed in the y-direction.

6 is an enlarged view of a portion B'in FIG.

FIG. 7 is an external view of a laminated microchannel plate that is a second embodiment of the present invention.

FIG. 8 is a cross section of FIG. 7 in the z direction viewed from the y direction.
-A arrow view.

9 is an enlarged view of portion B in FIG.

FIG. 10: Each thin microchannel plate before lamination.

FIG. 11 is a view taken along the arrow A′-A of FIG. 7 when the microchannels are laminated and adhered to the chevron type, as viewed in the z direction in a cross section.

FIG. 12 is an enlarged view of a B ′ portion of FIG. 11.

[Explanation of symbols]

1 Electron Acceleration Power Supply 2 Electron Acceleration Power Supply 3 Electron Acceleration Power Supply 4 Electron Acceleration Power Supply 5 Thin Micro Channel Plate 6 Thin Micro Channel Plate 7 Thin Micro Channel Plate 8 Thin Micro Channel Plate 9 Micro Channel Hole 9 _IN microchannel wide opening 9 _OUT microchannel narrow-mouthed portion 9 _INT microchannel wide opening 9 _OUTT microchannel narrow-mouthed portion 10 electrode 11 is an electrode 12 adhesive layer is an adhesive layer electrode 13 adhesive layer in which the electrodes 14 electrodes of the 15 Strip current layer

Claims (5)

[Claims] 1. In manufacturing a laminated type microchannel, when adhering the microchannel plates in a laminated form, a layer having conductivity is provided on both surfaces of each laminated microchannel plate, and two microchannel plates are separated from each other. 3. A method for manufacturing a laminated microchannel, which comprises bonding the microchannel plates to each other by bonding the conductive layers to each other at a low temperature in an ultrahigh vacuum while applying a voltage between the opposing conductive layers. 2. The method according to claim 1, wherein the conductive layer is an Al thin film. 3. The method according to claim 1, wherein the conductive layer is formed of Al, and each two microchannels are bonded together after Ar ⁺ irradiation. 4. The method according to claim 1, wherein each microchannel hole has a tapered shape with a wide mouth on the inlet side and a narrow mouth on the outlet side with respect to the traveling direction of electrons. 5. The method according to claim 1, wherein each microchannel hole has a shape of a wide mouth at both ends.