JP2000021335A - Panel type vacuum sealing container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a panel type vacuum sealing container provided with a supporter having a sufficient supporting strength with respect to the board of a large area and being capable of coping with the structure of a high electric field type. SOLUTION: A back surface panel 1 having a cathode board formed thereon and a front face panel 2 having an anode electrode facing to the back surface panel 1 are air-tightly connected to each other with a predetermined interval via a sealing frame 3. The inside of the sealing frame 3 is partitioned into a plurality of chambers R by a plurality of first plate-like members 6. Among them, a plurality of second plate-like members 7 formed in a direction perpendicular to the first plate-like member 6 are further partly fixed in the first plate- like members 6 disposed at most flexible portions in the vicinity of the center of the panel, thus forming a supporter S having a high aspect ratio.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel type vacuum hermetic container enclosing a field emission type cathode substrate, such as a vacuum hermetic container constituting a field emission display (FED).

[0002]

2. Description of the Related Art FIG. 106 shows a main part of a conventional panel-type vacuum hermetic container constituting a field emission display (Japanese Patent Laid-Open No. 6-310054). In the vacuum-tight container shown in FIG. 106, a plurality of columnar supports 109 are formed between an anode substrate 100 and a cathode substrate 103. The cathode line 1 is provided on the cathode substrate 103.
04, an insulating layer 105, a gate line 106, and an emitter 107 are formed. Also, the anode substrate 100
An anode conductor 101 and a phosphor layer 102 are formed thereon, and each columnar support 109 is provided so as to avoid these regions.

Next, FIGS. 107 and 108 show a part of a manufacturing process of such a panel-type vacuum hermetic container. First, as shown in FIG. 107, a bundle 111 of hardened glass fibers is sliced to a predetermined length (FIG. 107 (a)
), Ni 112 is attached to one end of each glass fiber 109 (FIGS. 107 (b), (c)). Next, a paste 113 containing magnet powder is filled in a recess formed in a desired pattern on a glass substrate 114, and one end of a support pillar 109 made of glass fiber is held by a magnetic force (FIG. 107 (d)), and the other end is held at the other end. Transfers the adhesive 115 from the glass substrate 116 coated with the ultraviolet curable adhesive 115 (FIG. 107 (e)).

On the other hand, as shown in FIG. 108, a low-melting glass pattern 108 is provided so as to avoid the area of the anode conductor 101 and the phosphor layer 102 on the anode substrate 100, and a seal glass paste 110 is attached to the peripheral frame. Forming (FIG. 108)
(a)). Next, the support column 109 is attached to the anode substrate 10.
The low-melting glass pattern 108 is aligned with the low-melting glass pattern 108, the other end of the support pillar 109 is attached, and the adhesive 115 is cured with ultraviolet rays. 108 (b), (c)).

[0005] By these steps, φ50 μm, height 2
A phosphor patterning substrate having the columnar support columns 109 of 00 μm formed at a pitch of 360 μm is obtained. Then, a low-melting glass 1 was added to the Ni-coated end of the glass fiber 109.
08, the field emission type cathode substrate 103 is attached, and hermetically sealed to obtain a panel-type vacuum hermetic container as shown in FIG.

[0006]

However, in the conventional panel-type vacuum hermetic container as described above, since the distance between the anode substrate 100 and the cathode substrate 103 is held by the support columns 109 having minute diameters interspersed with each other, When applied to a display element having a large area, there is a disadvantage that sufficient supporting strength to support the atmospheric pressure cannot be obtained. The column 109 made of glass fiber has an aspect ratio (ratio of height to diameter) of 4. For example, when electrons are emitted in a high electric field, the distance between the substrates 100 and 103 is maintained at a larger distance. The aspect ratio is required to be 30 or more, and the columnar structure has a disadvantage that it is easily bent and a sufficient supporting strength cannot be obtained.

The present invention has been made in view of the above points, and has a sufficient support strength even for a large-area substrate, and can support a high electric field type structure. An object of the present invention is to provide a panel-type vacuum hermetic container provided with:

[0008]

The first means comprises a first substrate having a field emission type cathode substrate provided on one surface thereof, and a first substrate disposed opposite to a surface of the first substrate on the cathode substrate side, A second substrate having an anode electrode provided on a surface facing the first substrate;
A substrate, a sealing frame that air-tightly connects the first substrate and the second substrate at a predetermined interval, and an intervening portion between the first substrate and the second substrate in the sealing frame. Provided, wherein the support has one or more first and second plate-shaped members, and the first and second plate-shaped members are A first substrate and the second substrate
A panel-type vacuum hermetic container characterized by being disposed substantially perpendicular to a substrate and substantially perpendicular to each other.

According to the first means, the first plate-like member and the second plate-like member of the support are arranged substantially perpendicular to the first substrate and the second substrate and substantially perpendicular to each other. Therefore, even when the areas of the first substrate and the second substrate are large, the support can support the first substrate and the second substrate with sufficient strength.

[0010] Further, with the above-described configuration of the first and second plate members of the support, the first and second plate members have an aspect ratio (ratio of height to thickness). ), A sufficient supporting strength between the first substrate and the second substrate can be obtained.

In the first means, further, a conductive pattern is formed on the first plate-like member or the second plate-like member of the support so as to make electrical contact with the anode electrode. , And a decrease in electron emission efficiency from the cathode substrate can be suppressed.

[0012] A second means is the first means, wherein the support defines a plurality of chambers in the closed frame that are permeable by the first plate-shaped member and the second plate-shaped member. It is forming.

According to the second means, the support area of the support can be increased, and the pressure applied to the support can be distributed to the first and second plate-like members that define each chamber. In addition, the supporting strength between the first substrate and the second substrate by the support can be further increased.

Further, since the plurality of chambers defined by the support are surrounded by the first plate-shaped member and the second plate-shaped member so that they can be ventilated, the first substrate and the second substrate are hermetically sealed by the closed frame. After connecting to the container, the inside of the container can be evacuated. For this reason, the exhaust stroke in the container can be simplified.

In the second means, one of the first plate member and the second plate member of the support member connects the first substrate and the second substrate, and the other is the first substrate member. Alternatively, the structure may be separated from any one of the second substrates.

The third means is the second means, wherein the inside of the closed frame is permeable to a main chamber corresponding to the cathode substrate and an exhaust chamber provided outside the main chamber. And an exhaust member for exhausting air from the exhaust chamber to the outside of the vacuum airtight container.

According to the third means, the exhaust from the main chamber divided into a plurality of chambers by the support is once collected in the exhaust chamber, and then exhausted to the outside by the exhaust member, whereby the vacuum-tight container is provided. The exhaust efficiency from the exhaust can be increased.

In the third means, further, a getter material is disposed inside the exhaust chamber or the exhaust member, and the getter material is heated after exhausting from the vacuum hermetic container, whereby the degree of vacuum in the vacuum hermetic container is increased. Can be increased.

A fourth means is the device according to any one of the first to third means, wherein the supporting member comprises the first plate member or the second plate member and the first substrate or the second substrate. It has a plurality of projections interposed between them.

According to the fourth means, it is possible to finely adjust the unevenness of the height of the support and the distance between the first substrate and the second substrate by the plurality of projections of the support. Becomes In addition, a gap is formed between the first plate member or the second plate member of the support and the first substrate or the second substrate by these projections, so that the plate member can be ventilated. it can.

[0021] In the fourth means, furthermore, the projecting portion of the support is formed to include a conductor portion which is in electrical contact with the cathode substrate, so that the projecting portion is used as an electric terminal of the cathode substrate. It becomes possible.

A fifth means is that in any one of the first to fourth means, the first plate-like member or the second plate-like member of the support is provided with respect to the first substrate and the second substrate. It has a structure including a plurality of glass fibers arranged substantially vertically.

According to the fifth means, since the glass fiber is particularly excellent in the compressive strength in the axial direction, the supporting strength between the first substrate and the second substrate by the supporting body is maintained while the supporting strength is maintained. It is possible to further increase the aspect ratio of the first plate-shaped member and the second plate-shaped member.

In the fifth means, the glass fiber preferably has a structure in which a plurality of layers of glass materials having different softening points are combined in a concentric cylindrical shape. With this, the layer of the glass material having the lower softening point of the glass fiber can be softened by heating, and the glass fiber can be bonded to the first substrate and the second substrate. Therefore, an adhesive is separately applied. Eliminates the need.

In this case, by setting the glass material of the inner layer of the glass fiber to have a lower softening point than that of the outer layer, only the glass material of the inner layer of the glass fiber is softened by heating. Thus, the glass fiber can be bonded to prevent the adhesive (in this case, the softened glass material) from protruding to the cathode substrate and the anode electrode. In the first to fifth means, a transparent electrode is used as the anode electrode, and a phosphor is provided on the transparent electrode, whereby a field emission display can be constituted by a panel-type vacuum hermetic container. .

[0026]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 to 105 are views showing an embodiment in which a field emission display (FED) is constituted by a panel-type vacuum hermetic container according to the present invention.

[First Embodiment] First, a first embodiment of a panel-type vacuum airtight container according to the present invention will be described with reference to FIGS.

Referring to FIGS. 1 and 2, the panel-type vacuum hermetic container is hermetically sealed at a predetermined interval by a sealing frame 3 between a rear panel (first substrate) 1 and a front panel (second substrate) 2. It is connected to. Further, a plurality of exhaust pipes (exhaust members) for exhausting the inside of the container to a vacuum are provided in the sealing frame 3.
50 are provided.

As shown in FIG. 2, both panels 1 and 2 are joined via a sealing frame 3 to a sealing portion 14 using frit glass mainly composed of low melting point glass, and an exhaust pipe 50 is provided inside the container. After being evacuated to a high vacuum through, the end of the exhaust pipe 50 is chipped off to seal while being kept at a high vacuum.

Here, the front panel 2 has translucency and insulating properties. For example, an ITO (Ind
A light-transmissive anode electrode (transparent electrode) 5 such as an ium tin oxide (electrode) is provided in a predetermined pattern. On the anode electrode 5, a layer of a phosphor 5a is applied. In the case of a configuration in which a metal back layer for preventing charge-up of the phosphor 5a layer is formed, the transparent electrode 5 may not be necessary. On the other hand, a cathode substrate 4 on which a field emission type emitter array (described later) as an electron source is formed is mounted on the inner surface of the insulating back panel 1 facing the front panel 2.

As shown in FIGS. 1 and 2, the wiring from the cathode substrate 4 is connected to the extraction electrode 40 formed on the back panel 1 by wire bonding (not shown). Further, the extraction electrode 40 is drawn out of the sealing frame 3 across the seal portion 14 so that the cathode substrate 4 can be driven from the outside.

As shown in FIGS. 1 and 3, the inside of the sealing frame 3 is divided into a plurality of chambers R by a plurality of first plate-like members 6. Among these, the first plate-shaped member 6 provided in the most flexible part near the center of the panel further partially includes a plurality of second plate-shaped members 7 in a direction perpendicular to the first plate-shaped member 6.
Are fixed to form the support S. The first plate member 6 and the second plate member 7 are connected to the front panel 2.
Are vertically arranged with respect to the rear panel 1 and the front panel 2 at a position overlapping the region where the black matrix (not shown) is formed.

Here, as shown in FIGS. 4 and 5, on both wall surfaces of the sealing frame 3 perpendicular to the first plate-like member 6, grooves 18 having a depth of 0.5 mm and a width of 50 μm are provided at corresponding positions. Are formed. Then, by inserting the end of the first plate-shaped member 6 having a width of 40 μm and a height of 2 mm along the groove 18,
The first plate member 6 is fixed to the sealing frame 3. Further, a plurality of exhaust pipe insertion tags 3a are opened on both wall surfaces of the sealing frame 3 which are also perpendicular to the first plate member 6, and exhaust pipes 50 are respectively provided in the respective chambers R partitioned by the first plate member 6. (See FIGS. 1 and 3).

Next, the manufacturing process of this embodiment will be described with reference to FIGS. First, in FIG.
A glass plate cut to a width of 2.1 mm is prepared, and a plurality of 1.2 mφ exhaust pipe insertion holes 3a are opened in two of them at desired positions by ultrasonic processing. This exhaust pipe insertion hole 3a
A glass tube having an outer diameter of 1.2 mmφ and a length of 15 mm is inserted into the tube, and an unfired paste of frit glass is applied to the tube.
The glass tube 50 for an exhaust pipe is fixed by firing at ℃.

Next, the surface of the glass plate opposite to the surface on which the exhaust pipe 50 was formed was formed to a depth of 0.5 mm by ultrasonic processing.
A plurality of grooves 18 having a width of 50 μm are formed. A pair of these glass plates are arranged so as to face each other in a direction in which the grooves 18 face each other, another pair of glass plates are arranged in a direction perpendicular to the grooves, and the ends are welded, and the grooves 18 and the exhaust pipe are provided on two opposite sides. The sealing frame 3 in which 50 is formed is formed.

Next, the cathode substrate 4 is mounted on the rear panel 1 on which the extraction electrode 40 has been formed in advance, and each wiring at the end of the cathode substrate 4 and the extraction electrode 40 on the rear panel 1 are connected to an 18 μm φ Au wire. (See FIG. 8). Next, an unfired paste 14 of frit glass is applied to the lower portion of the sealing frame 3 and mounted on the back panel 1 while being positioned and temporarily fixed at 120 ° C. (see FIG. 8).

Next, in FIG.
The first plate-like member 6 made of mica having a height of 2 mm and made of mica is provided with the above-mentioned groove 18 cut on two opposite sides of the sealing frame 3 (see FIG. 5).
Insert along. The first plate member 6 constituting the support S corresponding to the vicinity of the center of the sealing frame 3 further partially includes a second plate member 7 made of mica having a width of 40 μm and a height of 2 mm. It is fixed at a position perpendicular to the shape member 6. In this case, as shown in FIG. 7, the first and second plate-like members 6, 7 are cut into each other to a central position in the height direction.
a, 7a are inserted, and these cuts 6a, 6b are fixed by correspondingly fitting each other.

In this way, the plate-like members 6,
8, the unfired paste 14 of frit glass is applied on the front panel 2 side of the sealing frame 3 as shown in FIG. 8, and the anode electrode 5 and the phosphor 5a are formed beforehand. After the panels 2 are aligned and stacked, the paste is temporarily dried at 120 ° C., and the frit glass is baked at 410 ° C. to fix the panels 1 and 2 and the sealing frame 3 (FIG. 2).
reference). At this time, if necessary, an unfired paste of frit glass may be partially adhered to the front end surfaces of the plate members 6 and 7 to partially adhere to the front panel 2.

Next, each exhaust pipe 50 is connected to an external exhaust system, and the inside of the container is kept at 10 ^-7 T through each exhaust pipe 50.
The chamber is evacuated to an orr (approximately 1.3 × 10 ⁻⁵ Pa) stage and the tip of each exhaust pipe 50 is chipped off to complete a vacuum-tight container as shown in FIGS. In the case of the present embodiment, the height of the first and second plate-like members 6 and 7 is 2 mm, the thickness is 40 μm, and the aspect ratio (the ratio of the height to the thickness).
Was 50.

Next, the operation and effect of this embodiment having the above configuration will be described. According to the present embodiment, the first and second plate-like members 6, 7 of the support S corresponding to the central portions of the rear panel 1 and the front panel 2 are substantially perpendicular to the panels 1, 2. And since they are arranged substantially orthogonal to each other, even when the area of both panels 1 and 2 is large,
The support S can support the panels 1 and 2 with sufficient strength.

Since each first plate member 6 is fixed to the sealing frame 3, a part of the load applied from both panels 1 and 2 is supported by the sealing frame 3. The support strength between the panels 1 and 2 as a whole can be increased in a well-balanced manner.

Therefore, even the first and second plate-like members 6, 7 having a fine thickness corresponding to the black matrix, which is a non-display area on the front panel 2 side, support the panels 1, 2 with sufficient strength. Things become possible. For this reason, a large-area panel-type vacuum hermetic container having high pressure resistance and capable of accurately maintaining the interval between the panels 1 and 2 is provided, whereby a sufficient display area can be secured and the luminance can be improved. It is possible to realize a large-area field-emission display excellent in withstand voltage performance without variation.

Also, due to the structure of the first and second plate-like members 6, 7 as described above, the first and second plate-like members 6, 7 having a large aspect ratio as described above are used. However, sufficient supporting strength between the first substrate and the second substrate can be obtained. For this reason, the support and the anode 4
The distance between the panels 1 and 2 is increased while avoiding interference with the portions (other than the black matrix), so that it is possible to cope with a high electric field type structure.

Further, the first plate-like member 6 is provided with the groove 1 of the sealing frame 3.
8, the second plate member 7 is also fixed and supported by the first plate member 6 in advance, so that the first and second plate members 6, 7 can be easily attached and fixed. In addition, since the arrangement of the first plate member 6 merely changes the position of the groove 18 of the sealing frame 3, the design can be easily changed corresponding to the arrangement of the emitter array on the cathode substrate 4 [Second Embodiment] Embodiment] Next, referring to FIG. 9 to FIG.
A second embodiment of the panel-type vacuum airtight container according to the present invention will be described. As shown in FIGS. 9 to 12, this embodiment includes a partition 15 that divides the inside of the closed frame 3 into a main chamber R ′ and an exhaust chamber E so as to allow ventilation, and a getter disposed in the exhaust chamber E. The third embodiment is different from the first embodiment in that a material 11 is further used, and the other configuration is substantially the same as the first embodiment shown in FIGS. 1 to 8.

Specifically, as shown in FIGS. 9 to 12, the inside of the sealing frame 3 is provided with a partition 15 having a plurality of exhaust ports 5a.
Thereby, a main chamber R 'corresponding to the cathode substrate 4 is provided,
It is partitioned so as to be able to ventilate with the exhaust chamber E provided outside the main chamber R '. The interior of the main chamber R 'is further divided into a plurality of chambers R by a plurality of supports S and a first plate-like member 6 as in the sealing frame 3 in the first embodiment (see FIG. 1). See FIG. 11).

As shown in FIGS. 9 and 12, the partition 15 has an exhaust hole 15a corresponding to each chamber R in the main chamber R '.
Is provided. As shown in FIGS. 11 and 12, a rod-shaped getter material 11 made of, for example, a Ba getter is provided in the exhaust chamber E so that the getter material 11 can be activated by an external power supply through the exhaust pipe 50. Is provided.
After evacuation of the container through the exhaust pipe 50, the end of the exhaust pipe 50 is chipped off so as to leave the rod-shaped getter material 11.

Next, the manufacturing process of this embodiment will be described with reference to FIGS. First, for sealing frame 3, thickness 5
A glass plate cut to a width of 3.1 mm was prepared, and one of the plates was ultrasonically processed to a desired position in an area of 2.2 m.
A plurality of mφ exhaust pipe insertion holes 3a are opened. A glass tube having an outer diameter of 2.2 mmφ and a length of 15 mm is inserted into the exhaust pipe insertion tag 9, and an unfired paste of frit glass is applied, and 450 mm is applied.
The glass tube 5 for an exhaust pipe is fixed by firing at ℃.

Next, a plurality of 2.2 mmφ exhaust holes 15a are opened at desired positions on the glass plate for the partition walls 15 by ultrasonic processing, and one of the surfaces has a depth of 1 mm by ultrasonic processing.
A plurality of grooves 18 having a width of 80 μm are formed (see FIG. 13).

A plurality of grooves 18 having a depth of 1 mm and a width of 80 μm are formed on one surface of another glass plate for the sealing frame 3 by ultrasonic processing. Of the glass plates for the sealing frame 3,
A glass plate in which only the groove 18 is formed and a glass plate in which the exhaust pipe 50 is formed are arranged so that the groove 18 side and the opposite surface of the exhaust pipe 50 face each other, and a pair of glass plates are arranged in a direction perpendicular to the glass plate. Place and weld the ends.

Further, the partition wall 15 having the exhaust hole 15a and the groove 18 formed thereon is connected to the exhaust pipe 5 of the sealing frame 3 in FIG.
0, and the groove 18 is formed in the sealing frame 3
Then, the rod-shaped getter member 11 is inserted into the exhaust pipe 50 after being attached so as to face the groove 18 on the other side.

Next, the cathode substrate 4 is mounted on the back panel 1 on which the extraction electrode 40 has been previously formed.
Each wiring at the end and the lead electrode 40 on the rear panel 1 are connected by wire bonding (see FIG. 10). next,
An unfired paste of frit glass is applied to the lower portion of the sealing frame 3 and is mounted on the rear panel while being positioned and temporarily fixed at 120 ° C. (see FIG. 10).

On the other hand, a 70 μm-thick stainless steel plate is cut into a strip having a width of 3 mm for the first and second plate-like members 6 and 7, and cuts 6a and 7a as shown in FIG. . Next, a silicon dioxide film is coated on the surface of these stainless steel plates by a liquid phase growth method, and insulation treatment is performed.

Next, in FIG. 14 (b) and FIG.
A first stainless steel plate coated with a silicon dioxide film having a width of 70 μm and a height of 3 mm on the main chamber R ′ side of the sealing frame 3.
The plate member 6 is inserted along one side of the sealing frame 3 and the groove 18 formed in the partition wall 15. On the first plate member 6 corresponding to the vicinity of the center of the main chamber R ', a second plate member 7 made of a stainless steel plate coated with a silicon dioxide film having a width of 70 μm and a height of 3 mm is further partially provided. It is fixed at a position perpendicular to the plate member 6.

Thereafter, the sealing frame 3 and the front panel 2 are fixed in the same manner as in the first embodiment. Next, each exhaust pipe 50 connected to an external exhaust system respectively performs activation of Gettta member 11 by energizing the rodlike Gettta member 11 while evacuating the interior of the vessel through the exhaust pipes 50, 10 ^- After exhausting to ⁷ Torr, the tip of each exhaust pipe 50 is chipped off, and a vacuum-tight container as shown in FIGS. 9 and 10 is completed. In the case of this embodiment, the height of the first and second plate-like members 6 and 7 is 3 mm, and the thickness is 70 μm.
m and the aspect ratio was 43.

Next, the operation and effect of this embodiment having the above configuration will be described. According to the present embodiment, the same operation and effect as those of the first embodiment can be obtained, and the exhaust from the main chamber R ′ divided into the plurality of chambers R by the support body S and the first plate-like body 106 is temporarily stopped. , After being collected in the exhaust chamber E, and exhausted to the outside by the exhaust pipe 50,
Efficiency of evacuation from the vacuum-tight container can be increased.

The getter material 1 is provided inside the exhaust chamber E.
1 is provided, the degree of vacuum in the vacuum hermetic container can be increased by heating the getter material 11 after evacuation from the vacuum hermetic container. The getter material 11
After the tip of the exhaust pipe 50 is turned off, the electric current is appropriately supplied as necessary to activate the exhaust pipe 50, so that a high vacuum inside the container can be maintained.

[Third Embodiment] Next, a third embodiment of a panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. In the present embodiment, FIG.
As shown in FIG. 6 and FIG. 17, an exhaust pipe 51 is formed on the rear panel 1 side, and the getter material attached to the heater 10 provided in the exhaust chamber E by the heater electrode 12 inserted through the exhaust pipe 51. 11 is different from the second embodiment in that it can be activated by applying an electric current from outside.
Other configurations are substantially the same as those of the second embodiment shown in FIGS.

Specifically, in FIG. 16, a 10 mmφ exhaust pipe insertion hole is opened at a position corresponding to the exhaust chamber E of the rear panel 1, and a glass tube for the exhaust pipe 51 having an outer diameter of 10 mmφ is inserted by frit glass. A heater 10 provided with a getter material 11 is provided in an exhaust chamber E, and a heater electrode 12 is inserted through an exhaust pipe 51.

As shown in FIG. 17, the exhaust hole 15b provided in the partition wall 15 has a rectangular notch formed below the partition wall 15 so as to enhance the exhaust efficiency. In the present embodiment, an evaporable type is used as the getter material 11, but the heater 10 is provided above the exhaust hole 15b, and the evaporated getter material 11 is provided in the main chamber corresponding to the cathode substrate 4. The structure does not contaminate the inside of R '.

In this embodiment, the getter material 11 is used.
A solid getter is mounted on the heater 10 and a current is applied appropriately after the tip of the exhaust pipe 51 is turned off, not only at the time of evacuation, but also by activation to maintain a high vacuum inside the container. May be obtained.

In this embodiment, as shown in FIG. 18, a solid getter material 13 is mounted in an exhaust pipe 51 instead of the heater 10, the rod-shaped getter material 11 and the heater electrode 12, and the exhaust pipe 51 is provided. A high-frequency coil may be applied from outside to activate the getter material 13.

[Fourth Embodiment] Next, with reference to FIG. 19, a fourth embodiment of the panel-type vacuum airtight container according to the present invention will be described. In this embodiment, as shown in FIG. 19, the inside of the closed frame 3 is partitioned into a main chamber R ′ and two exhaust chambers E by a pair of partition walls 15 so as to allow ventilation, and a heater is provided in each exhaust chamber E. Getter material 1 attached to 10
The second embodiment differs from the above-described second embodiment in that the first embodiment is disposed, and the other configuration is substantially the same as the second embodiment shown in FIGS. 9 to 15.

More specifically, as shown in FIG. 19, exhaust chambers E are provided on both sides of the main chamber R ', and the heater electrodes 12 are inserted through the exhaust pipes 50 on both sides.
The getter material 11 attached to the heater 10 provided therein can be activated by applying an electric current from the outside, thereby further improving the exhaust efficiency. Each partition 15 is made of a glass plate having a rectangular cutout exhaust hole 15b (see FIG. 17) as described in the third embodiment as appropriate.

[Fifth Embodiment] Next, a fifth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIG. In the present embodiment, as shown in FIG. 20, a main chamber R 'is formed inside the sealed frame 3 by a frame-shaped partition wall 15'.
And an exhaust chamber E1 surrounding the main chamber R ', and is different from the second embodiment in that a getter material 11 attached to a heater 10 is disposed in the exhaust chamber E1. Other configurations are the same as those of the second embodiment shown in FIGS.
This is substantially the same as the embodiment.

More specifically, as shown in FIG. 20, a plurality of exhaust pipes 50 are formed on one side of the sealing frame 3, and the inside of a main chamber R 'surrounded by a partition 15' in the sealing frame 3. , A plurality of supports S, S1 having first and second plate-like members 6, 7 are provided.

The partition wall 15 'is provided at its lower portion with a rectangular cutout exhaust hole 15 as described in the third embodiment.
b (see FIG. 17). Of the four sides of the partition wall 15 ′, the first plate-like member 6
Is formed, and two sides having no groove are welded in a direction perpendicular to the two sides to form a frame-shaped partition wall 15 'surrounded by four sides.

The sealing frame 3 is a glass plate provided with an exhaust pipe insertion hole and an exhaust pipe 50 on one side, and a normal glass plate on the other three sides. The heater electrode 12 is inserted through the exhaust pipe 50. Then, the getter material 11 attached to the heater 10 provided in the exhaust chamber E1 can be activated by an external electric current.

In the present embodiment, the exhaust efficiency is improved by appropriately providing the exhaust holes 15b at desired positions in the frame-shaped partition wall 15 ', and the manufacturing process can be shortened even for a panel having a large area. Although the exhaust pipe 50 is formed only on one side of the sealing frame 3, the exhaust pipe 50 may be provided on other sides to further reduce the exhaust time.

In the above embodiment, the first and second plate members 6 and 7 having a high aspect ratio are made of mica flakes or insulated stainless steel plates.
For example, a Si substrate may be polished to a plate of 100 μm or less, and cut into a desired width for use. In addition, for example, by a method of etching a photosensitive glass or a method of patterning a dry film, the second
After molding a mold corresponding to the shape of the plate member 7, embedding an inorganic cement material in the mold, and curing the cement material,
High aspect ratio plate-shaped members 6, 7 even when removed from mold
Is obtained. Similar effects can be obtained by forming the plate-like members 6 and 7 other than inorganic materials, for example, using an organic resin material and then coating and using a silicon dioxide layer to reduce gas emission.

[Sixth Embodiment] Next, a panel-type vacuum airtight container according to a sixth embodiment of the present invention will be described with reference to FIGS. 21 and 22. In the present embodiment, FIG.
1 and FIG. 22, instead of the support S,
The first and second plate-like bodies 16 and 17 are different from the first embodiment in that a support S2 having a shape in which the first and second plate-like bodies 16 and 17 are alternately combined in an uneven shape is used, and other configurations are shown in FIGS. 1 and 2. This is substantially the same as the first embodiment.

Specifically, as shown in FIGS. 21 and 22, the first and second plate-like members 16, 1 constituting the support S1 are formed.
Numerals 7 extend at right angles from the side edges of each other, and have an uneven shape. In this case, the support S1 is formed by cutting a plate of Invar alloy containing Fe-Ni as a main component and having a thickness of 40 μm into a strip having a width of 2 mm, and then bending a plurality of right angles.

Here, the surface of the Invar alloy plate is insulated by blackening. The invar alloy is an alloy having a low coefficient of thermal expansion. However, since the seal portion 14 between the panels 1 and 2 may be deformed due to heat history when frit glass is fired, any one of the panels 1 and 2 or the cathode substrate may be deformed. 4 may be partially adhered with frit glass. In the case of the present embodiment, the height of the first and second plate-like members 16 and 17 was 2 mm, the thickness was 40 μm, and the aspect ratio was 50.

In the above embodiment, the range in which the second plate-like bodies 7, 17 are provided on the supports S, S1, S2 is as follows.
The area ratio including the midpoint of the cathode substrate 4 is preferably in the range of 20 to 80% in order to effectively secure the support strength of the supports S, S1, and S2.

[Seventh Embodiment] Next, FIGS.
With reference to FIG. 1, a seventh embodiment of the panel-type vacuum airtight container according to the present invention will be described. In the present embodiment, FIG.
As shown in FIG. 26 to FIG. 26, in place of the support S, a lattice-like support S3 that defines a plurality of chambers R1 that are surrounded by the first and second plate-like members 26 and 27 so as to be permeable is used. In this point, the second embodiment is different from the first embodiment in other respects, and other configurations are substantially the same as those in the first embodiment shown in FIGS.

Specifically, as shown in FIGS. 23 to 26, the support S3 of the present embodiment comprises a plurality of first plate members 2
6 and a plurality of second plate-like members 27 provided in a direction orthogonal to the first plate-like members 26 and having a lower height than the first plate-like members 26. Among these, the first plate-like member 26 is
The second plate-like member 27 has a structure separated from the front panel 2 by contacting both the panels 1 and 2 by contacting both the anode electrode 5 and the cathode substrate 4.

A conductive pattern 8 made of a metal metallized layer is formed in a desired region of each first plate-like member 26, and a part of the conductive pattern 8 is electrically connected to the anode 5. It is connected.

Next, the manufacturing process of this embodiment will be described with reference to FIGS. First, the support S of the present embodiment
A method for producing a green sheet of glass (hereinafter abbreviated as green sheet) used in No. 3 will be described. Organic synthetic resins such as polyvinyl butyral, acrylic acid ester polymer, methacrylic acid ester polymer, and copolymer of acrylic acid ester and methacrylic acid ester on glass frit powder mainly composed of lead borosilicate glass Is used as a binder, and 0.2 to 30% by volume of an organic solvent such as acetone, toluene and butyl alcohol is added to 3 to 50% by volume, and the mixture is kneaded to form a slurry.

At this time, a dispersant may be added in an amount of 0.01 to 3% by volume. The dispersing agent may be a surfactant, and may be one which has been reacted or imparted to the above-mentioned binder at the time of synthesis. Further, esters may be added as a plasticizer to impart flexibility to the green sheet. In the present invention, 1% by volume of a phthalic acid ester was added. From the slurry, a green sheet having a thickness of 50 μm is obtained by a forming apparatus such as a doctor blade method or a calender roll method.

Next, in FIG. 27, the first plate-like member 26
Then, a conductive pattern 8 made of a metallized layer containing a metal as a main component is formed on the green sheet. In this embodiment, a paste mainly composed of Ag-Pd is printed on a green sheet to form a conductive pattern 8 having a width of 100 μm.
And dried at 120 ° C. in air. The printing thickness of the conductive pattern 8 was 20 μm. After drying, a punching hole having a diameter of 50 μm is continuously formed by punching to form a cut 26a, and the green sheet is cut at an interval of 2.1 mm in width. In FIG. 28, green sheets are cut as the second plate-like members 27 at an interval of 1.25 mm in width. These green sheets 26 and 27 are heated in the air from room temperature to 500 ° C. at 1000 ° C./H or lower, kept at 500 ° C. for 20 minutes, and further heated from 500 ° C. to 650 ° C. at 400 ° C./H. At 650 ° C. for 20 minutes. In this heat treatment step, the binder, the residual organic solvent, and the dispersant are thermally decomposed and oxidized and disappear, and sintering of the glass and the metallization is performed simultaneously. The thickness of the plate members 26 and 27 after firing is 42 μm,
The thickness of the cut 26a was 40 μm.

After firing, the second plate 27 is inserted into the notch 26a of the first plate 26 shown in FIG. 29, and the support S3 is assembled in a lattice as shown in FIG. After this, 4
By holding at 80 ° C. for 20 minutes, the first and second plate-like bodies 26, 2
A step of partially fusing the joint of No. 7 to improve the strength of the lattice-shaped support S3 may be added.

Next, the manufacturing process of the vacuum-tight container will be described with reference to FIG. First, the lattice-shaped support S3 formed according to the above manufacturing method is mounted on a support plate 122 made of a glass plate having a thickness of 2 mm via a urethane-based adhesive layer 120 (FIG. 31A). Next, a conductive adhesive 12 is applied to a portion of the lattice-shaped support S3 corresponding to the conductive pattern 8 with a dispenser.
4 is applied (FIG. 31 (b)) and preliminarily dried, and is positioned on the black matrix of the front panel 2 on which the anode electrode 5 is formed so that the grid pattern of the support S3 is overlapped. S3 is mounted on the front panel 2 side (FIG. 31 (c)). Next, the urethane-based adhesive layer 120 is melted through a drying oven at 100 ° C., and the support plate 122 is peeled off (FIG. 31D).

Next, the thickness 2 previously cut to a width of 2.1 mm
Combine four glass plates of 45 mm
Sealed frame 3 bonded with frit glass having a melting point of 0 ° C.
Prepare A plurality of 1.2 mmφ exhaust pipe insertion holes 3a are opened in the sealed frame 3 on two opposing sides by ultrasonic processing, and a glass tube having an outer diameter of 1.2 mmφ and a length of 15 mm is inserted.
The exhaust pipe 50 is fixed by firing frit glass having a melting point of 400 ° C. (see FIG. 26).
After applying the frit glass having the melting point, a degreasing process is performed.

The sealing frame 3 is temporarily mounted on the support plate 122 in the same manner as the lattice-shaped support S3, and is positioned and mounted on the front panel 2. After the mounting, the grid-like support S3 is coated with a fixing insulating adhesive 14 made of frit glass at a desired position for fixing to the cathode substrate 4 in a later step (FIG. 31 ( e)).

Next, the front panel 2 on which the lattice-shaped support S3 and the sealing frame 3 are mounted is aligned and adhered to the rear panel 1, and the sealing section 12 and the insulating adhesive for fixing are fixed at 430 ° C. in a nitrogen atmosphere. Bake 19 frit glass,
Form a vacuum tight container. After the firing, a step of blowing a reducing gas from the exhaust pipe 50 to reduce the emitter electrode of the cathode substrate 4 may be inserted.

After these steps, the vessel is connected to an external exhaust device via an exhaust pipe 50, the inside of the container is evacuated to a vacuum of 10 ⁻⁷ Torr, the tip of the exhaust pipe 50 is chipped off, and the interior becomes high. A vacuum-tight container as shown in FIG. 24, which is kept in a vacuum, is completed.

In the case of this embodiment, the height of the first plate member 6 was 2 mm, the thickness was 40 μm, and the aspect ratio was 50. The height of the second plate-like member 7 was 1.2 mm, the thickness was 40 μm, and the aspect ratio was 30.

In this embodiment, the frit glass powder containing lead borosilicate glass as a main component is used. However, barium borosilicate glass, barium borosilicate.
Glass frit powder such as lead glass or aluminum borosilicate glass may be used as a raw material. These firings are performed at 300 to 800 ° C. as a degreasing step and at 500 ° C. as main firing.
The desired spacer can be obtained in a firing step in the range of 1 to 1200 ° C. In addition, although the film thickness of 50 μm is used as it is as the green sheet, for example, a green sheet of 30 μm may be formed and laminated to a desired thickness.

Next, the operation and effect of this embodiment having the above configuration will be described. According to the present embodiment, the same operation and effect as those of the first embodiment are obtained, and the support S3 is surrounded by the first plate-like member 16 and the second plate-like member 27 in the closed frame 3. Since the plurality of chambers R1 are defined, the first plate-like member 26 and the second plate-like member 2 that partition the respective chambers R1 with the pressure applied to the support S3 are applied.
7, the support strength between the panels 1 and 2 by the support S3 can be further increased.

The plurality of chambers R1 partitioned by the support S3 are provided with the first plate member 26 and the second plate member 27.
Panels 1 and 2
After airtightly connected by the closed frame 3, the inside of the container can be evacuated. For this reason, the exhaust stroke in the container can be simplified.

Further, the first plate-like member 26 of the support S3
In addition, the formation of the conductive pattern 8 that is in electrical contact with the anode electrode 5 prevents the support S3 from being charged,
A decrease in the efficiency of emitting electrons from the cathode substrate 4 can be suppressed.

[Eighth Embodiment] Next, FIGS.
Referring to FIG. 4, an eighth embodiment of the panel-type vacuum airtight container according to the present invention will be described. In the present embodiment, FIG.
As shown in FIG. 34 to FIG. 34, the support S3 of the seventh embodiment shown in FIG. 23 to FIG. 26 is used instead of the support S of the second embodiment shown in FIG. 9 to FIG. The other configuration is the same as that of the second embodiment shown in FIGS. 9 to 12.

In the present embodiment, the thickness of the first and second plate-like bodies 26 and 27 after firing is 70 μm,
A glass plate having a thickness of 3 mm cut into a width of 3.1 mm is used. The joining process of the support S3, the sealing frame 3 and the panels 1 and 2 is substantially the same as that of the seventh embodiment. In the case of the present embodiment, the height of the first plate member 6 was 3 mm, the thickness was 70 μm, and the aspect ratio was 43. The height of the second plate-like member 7 is 2 mm, and the thickness thereof is 7 mm.
At 0 μm, the aspect ratio was 29.

Although the exhaust hole 15a in the partition wall 15 of the present embodiment is a hole of 2.2 mmφ, in order to improve the exhaust efficiency, for example, a rectangular notched exhaust hole 15b as shown in FIG. May be used.

[Ninth Embodiment] Next, FIGS.
A ninth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIG. In the present embodiment, FIG.
As shown in FIG. 37 to FIG. 37, the third embodiment differs from the eighth embodiment in that a lattice-shaped support S4 corresponding to only the central portion of the emitter forming region in the cathode electrode 4 is used instead of the support S3. Is substantially the same as that of the eighth embodiment shown in FIGS. 32 to 34.

Here, the manufacturing process of this embodiment will be described with reference to FIGS. 38 and 39. First, similarly to the manufacturing process of the seventh embodiment, the green sheet is fired to form the grid-like support S4 including the first and second plate-like bodies 36 and 37 (see FIG. 35). First and second plate-like bodies 3 after firing
The thickness of 6, 37 was 70 μm. In FIG. 38, the grid-like support S4 is mounted on a support film 130 on which a urethane-based adhesive layer 131 is applied on one side.

Next, in FIG. 39, the lattice-shaped support S4
A conductive adhesive 132 is applied to a portion corresponding to the conductive pattern 8 by a dispenser, and after preliminarily dried, it is positioned and mounted on the front panel 2 on which the anode electrode 5 is formed (FIG. 39A). Next, the urethane-based adhesive layer 131 is melted through a drying oven at 100 ° C., and is separated from the support film 130 (FIG. 39B).

Next, in the same manner as in the method of manufacturing the sealed frame 3 according to the seventh embodiment, the exhaust pipe 50 is attached and the partition wall 1 is mounted.
A sealed frame 3 integrated with 5 is prepared. Then, after the sealing frame 3 is temporarily mounted on the support film 130 in the same manner as the lattice-shaped support member S4, the sealing frame 3 is positioned and aligned.
(FIG. 39 (c)).

Next, the rear panel 1 on which the cathode substrate 4 is mounted is aligned with and bonded to the front panel 2 on which the grid-like support S4 and the sealing frame 3 are mounted, and the frit glass 14 is fired, and the vacuum-tight container is mounted. Form. After that, similarly to the case of the second embodiment, after inserting the rod-shaped getter material 11 into the exhaust pipe 50, the rod-shaped getter material 11 is activated by conducting electricity while exhausting the inside of the container via the exhaust pipe 50. After exhausting to 10 ^-7 Torr level, exhaust pipe 50
Is chipped off, and a vacuum-tight container as shown in FIG. 37 is completed.

As a modification of the above manufacturing process, as shown in FIG. 40, a lattice-shaped support S4 is mounted on the back panel 1 via the support film 130 (FIG. 4).
0 (a)) and after mounting the sealing frame 3, the front panel 2
(FIG. 40B).

In the seventh to ninth embodiments,
The case where the supports S3 and S4 in which the conductive pattern 8 is formed only on the first plate-like members 26 and 36 has been described. However, as shown in FIG. 41, the first plate-like members 26 and 36 and the second plate A support having antistatic conductive patterns 8 and 8 'formed on both of the shape members 27 and 37 may be used.

[Tenth Embodiment] Next, a tenth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. In this embodiment, as shown in FIGS. 42 to 45, instead of the support S,
The first embodiment in that an integrated grid-like support S5 that defines a plurality of chambers R4 surrounded by first and second plate-like members 46 and 47 is used and the exhaust pipe 50 is omitted. Unlike the first embodiment, the other configuration is substantially the same as that of the first embodiment shown in FIGS.

Specifically, as shown in FIGS. 42 to 45, a lattice-like support S5 having an integral structure is provided between the front panel 2 and the back panel 1. The lattice-shaped support S5 is formed by processing a glass substrate into a predetermined pattern, and is arranged in a region of the cathode substrate 4 where no field emission array exists. As shown in FIG. 44, the end of the lattice-shaped support S5 on the front panel 2 side is electrostatically joined to the front panel 2 via the anode electrode 5, and the phosphor 5a is placed on the anode electrode 5. A layer is formed.

Next, the manufacturing process of this embodiment will be described with reference to FIGS. First, in FIG. 46, a photosensitive glass plate 90 having a thickness of 0.5 mm is irradiated with ultraviolet rays through a mask 96 having a pattern 96a corresponding to the lattice-shaped support S5 (FIG. 46 (a)). The portion exposed to the ultraviolet rays crystallizes 91 and becomes easily soluble in the solvent (FIG. 46 (a)).
By the etching process, a glass substrate having a lattice pattern as shown in FIG. 45 is formed as the support S5 (FIG. 4).
6 (b)).

Next, this glass substrate is heat-treated at 450 ° C. to make it difficult to dissolve in a solvent. Then, in FIG. 47, the glass substrate is aligned with the front panel 2 on which an ITO thin film has been previously formed by coating and baking as an anode electrode 5. Then, the joining electrode 184 is brought into contact with the lattice-shaped support S5 side, and the anode electrode 5
By applying a voltage V between the support S5 and the bonding electrode 184, the support S5 and the front panel 2 are fixed by electrostatic bonding.

Next, in FIG. 48, a low-melting glass 1 containing lead oxide as a main component is provided on one side of a sealing frame 3 having a thickness of 0.5 mm.
4 is applied, and the low-melting glass 14 is calcined after being positioned on the front panel 2 integrated with the lattice-shaped support S5.
The low-melting glass 14 is applied to the other side of the sealing frame 3 and pre-baked.

Then, the front panel 2 and the sealing frame 3 temporarily fixed and the rear panel 1 on which the cathode substrate 4 is mounted are put in a vacuum chamber 30, and the inside of the chamber is evacuated to the order of 10 ^-7 Torr. With the temperature of the panel 1 raised to 450 ° C. via the heater 33 on which the rear panel 1 is installed, the front panel 2 is aligned and fixed on the rear panel 1, and the low-melting glass 14 is baked. To obtain a vacuum-tight container as shown in FIG. In the case of the present embodiment, the height of the lattice-shaped support S5 is 0.5.
5 mm, the thickness was 50 μm, and the aspect ratio was 10. In addition, each room R partitioned by the lattice-shaped support S5
4 was 2 mm square.

Next, the operation and effect of this embodiment having the above configuration will be described. According to this embodiment, the same operation and effect as those of the first embodiment can be obtained, and the use of the integral lattice-shaped support S5 enables the support S
5, the pressure applied to the support S5 can be distributed to the first and second plate-like members 46 and 47 that define the respective chambers R4.
The support strength between the two can be further increased.

As can be seen from the above-described manufacturing process, if a glass plate 90 having a predetermined thickness is prepared, the support S5
Can be easily formed at a predetermined height. Further, the lattice-shaped support S5 is etched from the photosensitive glass 90.
Is formed, a support S5 having a large area can be easily obtained even with a support S5 having a small thickness and a high height, that is, a so-called large aspect ratio. Then, by integrally joining the integral support S5 to the front panel 2, a panel in which the support S5 is fixed over a wide area by a simple manufacturing process can be obtained.

[Eleventh Embodiment] Next, an eleventh embodiment of a panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. In this embodiment, as shown in FIG. 49 and FIG.
Instead of the tenth embodiment, a lattice-shaped support S6 for partitioning each chamber R4 to allow ventilation is used, and a plurality of exhaust pipes 50 are provided. This is substantially the same as the tenth embodiment shown in FIG.

More specifically, as shown in FIG. 49, the vacuum-tight container is provided with a plurality of exhaust pipes 50 for evacuating the inside to a vacuum. As shown in FIGS. 49 and 50, the support S6 is an integrated lattice-like structure similar to the support S5 of the tenth embodiment, but has a rectangular cutout 57a at the upper center.
Is formed on the second plate-shaped body 57. Then, due to the presence of the notch 57a, each chamber R4 is surrounded by the first and second plate-shaped bodies 46 and 57 so as to be able to ventilate, and forms a continuous space in the sealing frame 3 so that the air is exhausted. The gas inside flows efficiently.

Next, the manufacturing process of this embodiment will be described with reference to FIG. In FIG. 51, first, as in the manufacturing process of the tenth embodiment, a photosensitive glass plate having a thickness of 1 mm is processed to form a lattice-shaped glass substrate S5 having a plate thickness of 30 μm and a chamber R4 of 2 mm square. (FIG. 51A).
Then, ultraviolet rays are irradiated thereon through a mask 97 having a pattern having an opening 97a corresponding to the notch 57a (FIG. 51A).

As a result, the portion of the glass substrate S5 'irradiated with the ultraviolet rays is crystallized 91 over a width of 200 μm (FIG. 51 (b)). Next, this is removed by etching to a depth of 0.3 mm from above, and the glass substrate S having a cutout 57a formed in a portion 57 'corresponding to the second plate-like body is formed.
6 '(FIG. 51 (c)), and heat-treated at 450 ° C. to make it difficult to dissolve in a solvent to obtain the support S6 (FIG. 51 (d)).

Thereafter, as described in the manufacturing process of the tenth embodiment, the support S6 is aligned with the front panel 2, the bonding electrode 184 is brought into contact with the support S6, and an electric field is applied to the front surface. It is electrostatically bonded to the panel 2 (see FIG. 47).

Next, a hole was made in a part of the sealing frame 3 having a thickness of 1 mm, and a 0.8 mmφ glass tube was inserted as the exhaust pipe 50.
450 ゜ using low-melting glass mainly composed of lead oxide
Secure with C. A low-melting glass is applied to both sides of the sealing frame 3, and the front panel 2 and the rear panel 1 on which the cathode substrate 4 is mounted are aligned with each other. Thereafter, the inside of the container is evacuated to a level of 10 ^-7 Torr through the exhaust pipe 50, and then the exhaust pipe 50 is sealed to obtain a vacuum-tight container. In the case of the present embodiment, the height of the lattice-shaped support S6 was 1 mm, the thickness was 30 μm, and the aspect ratio was 33.

Next, the operation and effect of this embodiment having the above configuration will be described. According to the present embodiment, the same operation and effect as those of the tenth embodiment can be obtained,
Each chamber R4 partitioned by the support member S6 can be ventilated by the cutout 57a of the second plate-shaped member 57, so that both panels 1 and 2 are airtightly connected by the closed frame 3 as described above. Later, the inside of the container can be evacuated from the exhaust pipe 50. Therefore, the exhaust stroke in the container can be simplified as compared with the tenth embodiment.

[Twelfth Embodiment] Next, a twelfth embodiment of a panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. In the present embodiment, the following manufacturing steps shown in FIGS. 52 to 54 are used as the manufacturing steps of the support S5 of the tenth embodiment, and the other structures are shown in FIGS. This is the same as the tenth embodiment shown in FIGS. 47 and 48.

More specifically, first, in FIG.
mm, the glass substrate 160 whose surface is flattened by optical polishing.
Are sandwiched by a water-soluble resist resin 170 having a thickness of 50 μm, and a plurality of sheets are bonded together (FIG. 52 (a)). The bonded substrate is cut out to a thickness of 2 mm (FIG. 52 (b)), and further bonded with a 50 μm thick water-soluble resist resin 170 (FIG. 52 (c)). In the case of the present embodiment, if the height of the finally formed support S5 is H and the thickness is W, H = 2 m
m, W = 50 μm (FIGS. 52 (b), (c)).

Next, in FIG. 53, the bonded substrate is replaced with a base substrate 180 on which an a1 electrode 182 has been formed in advance.
After being mounted on the substrate via an adhesive, the water-soluble resist resin 17
By removing 0, a mold M is formed in which glass cubes 160 each having a height of 2 mm and a 2 mm square shape are arranged with a gap 161 having a width of 50 μm.

Next, in FIG. 54, the mold M is immersed in a nickel plating bath, and the gap 161 between the cubes 160 is filled with a nickel layer by electrolytic plating to form a nickel body S7 in the shape of the support S5. This nickel body S7 is formed into a mold M
After peeling off, the surface is blackened and insulated to obtain a lattice-shaped support S5 (see FIG. 45) having a thickness of 50 μm, a height of 2 mm and a space of 2 mm square.

[Thirteenth Embodiment] Next, a thirteenth embodiment of a panel-type vacuum airtight container according to the present invention will be described with reference to FIG. In the present embodiment, the following manufacturing steps shown in FIG. 55 are used as the manufacturing steps of the support S5 of the tenth embodiment, and other configurations are shown in FIGS. 42 to 45, FIGS. This is the same as the tenth embodiment shown in FIG.

More specifically, in FIG.
The photosensitive glass plate 90 mm is sandwiched between the bonding electrode 184 and the base substrate 180 on which the a1 electrode 182 has been formed in advance, and a voltage V is applied to fix it to the a1 electrode 184 side by electrostatic bonding (FIG. 55 (a)). ~ (B)). Next, ultraviolet rays are irradiated through a mask 98 having a pattern having an opening 98a corresponding to the shape of the support S5 (FIG. 55 (c)). Then, a glass substrate 163 having a gap 161 corresponding to the shape of the support S5 is formed by an etching process.
A heat treatment is performed at 50 ° C. to make the resin hardly soluble in the solvent to obtain a mold M1 (FIG. 55 (d)).

In the case of this embodiment, the gap of the mold M1 has a width of 50.
μm, depth 2 mm, and finally formed lattice-shaped support S
Assuming that the height of 5 is H and the thickness is W, H = 2 mm and W = 50
In μm, the aspect ratio is 40.

Next, as in the case of the twelfth embodiment, the mold M1 is immersed in a nickel plating bath, and the gap 161 is filled with a nickel layer by electrolytic plating (see FIG. 54). Then, the surface is blackened and insulated to obtain a lattice-shaped support S5 (see FIG. 45) having a thickness of 50 μm, a height of 2 mm and a space of 2 mm square.

[Fourteenth Embodiment] Next, a fourteenth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. 56 and 57. In this embodiment,
Instead of the support S5 of the tenth embodiment, a lattice-like support S8 as shown in FIGS. 56 and 57 is used, and the other configurations are shown in FIGS. 42 to 45 and FIG.
This is similar to the tenth embodiment shown in FIGS. 7 and 48.

More specifically, as shown in FIGS. 56 and 57, a plurality of fibers F3 woven using a mold M2 similar to the molds M and M1 used in the twelfth and thirteenth embodiments. And a lattice-shaped support S8.

In this case, after forming a mold M2 having a grid-shaped gap 165 having a width of 50 μm and a depth of 2 mm,
Are alternately incorporated into the gaps 165 to obtain a fibrous structure. The fiber F3 has a structure in which the fibers are woven with each other, the load is dispersed, and the fiber F3 can withstand sufficient strength. Assuming that the height of the formed fibrous lattice-shaped support S8 is H and the thickness is W, H = 2 mm, W
= 50 μm and the aspect ratio was 40. Further, since there is a fine gap between the fibers F3, gas flows efficiently at the time of exhaust, and the exhaust efficiency can be improved.

[Fifteenth Embodiment] Next, a fifteenth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIG. In the present embodiment, a collective tubular support S9 as shown in FIG. 58 is used in place of the support S5 of the tenth embodiment, and other configurations are shown in FIGS. This is the same as the tenth embodiment shown in FIGS. 47 and 48.

More specifically, in FIG. 58, a side wall of a plurality of hollow pipes T is bonded to each other to form a support S9 having a space. In this case, the thickness is 40 μm
Stainless steel hollow pipe T having a 2 mm outer diameter
Are bundled, and a thermosetting adhesive previously applied to the outer surface between the pipes T is cured and joined to each other. This pipe T
Is cut to a length of 2 mm, and further immersed in a low-viscosity thermosetting resin bath to perform insulation treatment, whereby the support S9 is obtained. The height of the formed support S9 is H,
Assuming that the thickness is W, H = 2 mm, W = 50 μm, and the aspect ratio is 40.

[Sixteenth Embodiment] Next, a sixteenth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. In the present embodiment, as shown in FIGS. 59 to 61, a separate grid-shaped support S10 is used instead of the integrated grid-shaped support S5, and the rear panel 1 is used instead of the exhaust pipe 50. The tenth embodiment is different from the tenth embodiment in that an exhaust pipe 51 is provided.
This is substantially the same as the embodiment.

More specifically, as shown in FIGS. 59 to 61, an exhaust pipe 51 for evacuating the inside of the container to vacuum is provided on the back panel 1 of the vacuum-tight container. Is being worn. Further, the support S10 has a substantially lattice shape as a whole, but has a shape in which the second plate 67 is cut between the first plates 66. By forming a continuous space, the gas inside flows efficiently at the time of exhaust.

In FIG. 61, the support S10 is
Thickness W = 50 μm, distance L between side surfaces of second plate-shaped body 67
1 = 2 mm, distance L2 between first plate-like bodies 66 = 2 mm, second
The gap L3 between the end faces of the plate 67 is 0.6 mm.

Next, the manufacturing process of the support S10 of this embodiment will be described with reference to FIG. First, as in the case of the thirteenth embodiment shown in FIG. 55, the photosensitive glass plate 90 having a thickness of 2 mm is joined to the base substrate 180 on which the a1 electrode 182 has been formed in advance by electrostatic bonding. After exposing and etching through a mask corresponding to the shape of the body S10, as shown in FIG. 62, W = 50 μm, L1 = 2 mm,
A mold M3 having a shape of L2 = 2 mm and L3 = 0.6 mm is formed. In the case of this embodiment, the depth of the mold is 2 mm, and the height of the finally formed separated grid-like support S10 is H,
Assuming that the thickness is W, H = 2 mm, W = 50 μm, and the aspect ratio is 40.

Next, as in the case of the twelfth embodiment, the mold M3 is immersed in a nickel plating bath, and the gap 167 is filled with a nickel layer by electroplating (see FIG. 54). The surface is blackened and insulated to obtain a support S10 as shown in FIG.

[Seventeenth Embodiment] Next, a seventeenth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. In this embodiment,
As shown in FIG. 63, the tenth through the tenth through the point that the thickness W1 of the portion in contact with the rear panel 2 side is greater than the thickness W2 of the portion in contact with the front panel 1 side is used. Unlike the sixteenth embodiment, the other configuration is substantially the same as the tenth to sixteenth embodiments shown in the corresponding drawings.

Specifically, as shown in FIG. 63, the lattice-shaped support S11 has a thickness W1 of a portion in contact with the back panel 2 (cathode substrate 4) side in a vertical cross section.
However, greater strength is obtained by forming a tapered shape such that the thickness of the portion in contact with the front panel 1 (anode electrode 5) side is equal to or greater than W2.

The lattice-shaped support S11 having such a shape
The manufacturing process will be described with reference to FIG. First, I
2 mm thick on the base substrate 180 on which the TO electrode 184 is formed.
Laminated dry film, exposure through a mask,
After the etching process, W3 = 65 μm, W2 = 30 μm
m, L4 = resist pattern 168 having dimensions of 2 mm
Is formed (FIG. 64A).

The substrate with the resist 168 is immersed in a nickel plating bath, the gap 169 is filled with a nickel layer 200 by electrolytic plating (FIG. 64 (b)), and the surface is polished until the height becomes 2 mm, thereby forming a grid-like support. After obtaining a nickel body having the shape of S11 (FIG. 64 (c)), this was
Peel from 4.

Thereafter, the resist 168 is removed, and the surface of the nickel body is blackened to form a lattice-shaped support S11 having a shape of W1 = 50 μm, W2 = 30 μm and L4 = 2 mm as shown in FIG. obtain. In the case of this embodiment,
Assuming that the height of the lattice-shaped support S11 is H, H = 2 mm, W
2 = 30 μm and the aspect ratio is 67.

Here, in the tenth to seventeenth embodiments, when a conductive material is used as the material of the lattice-like supports S5 to S11, an insulating process such as a blackening process is performed.
As another method, a similar effect can be obtained by a method of performing an insulating treatment by applying an insulating layer such as silicon dioxide and coating by a dipping method.

If necessary, by leaving a part of the conductive region, it can be used as an electrode for controlling the emitted electron beam. In this case, a lattice layer having a conductive region can be easily obtained by forming a resist layer in a desired pattern in advance at the time of the insulation treatment and peeling the resist after the insulation treatment.

Further, an organic resin material such as a resist is used as a mold, and this mold is immersed in a liquid containing, for example, hydrofluoric acid as a main component to form an LPD (Liquid Phase Deposit).
There is also a method in which a silicon dioxide layer is grown in the groove region of the mold by ion (liquid phase precipitation method), and then the resist is removed to obtain a lattice-shaped support made of silicon dioxide. In this case, the insulating process when the lattice-shaped support S is formed of a conductive material is not required, and a simple manufacturing method is provided.

Further, a large-area lattice-like structure is obtained in advance by using the manufacturing method of the tenth to seventeenth embodiments, and is cut into a desired region as necessary to form a lattice-like support. It can also be incorporated in a vacuum vessel to simplify the manufacturing process.

[Eighteenth Embodiment] Next, an eighteenth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. In this embodiment, as shown in FIGS. 65 to 68, a grid-like support S12 having a plurality of projections 9 is used instead of the grid-like support S5, and an exhaust pipe 51 provided on the back panel 1 is provided. The fourth embodiment differs from the tenth embodiment in that the third embodiment has the same configuration as that of the tenth embodiment shown in FIGS. 42 to 45.

Specifically, as shown in FIG. 65, the vacuum-tight container is provided with an exhaust pipe 51 for evacuating the inside to a vacuum. FIG.
As shown in FIG. 5 and FIG. 66, between the front panel 2 and the back panel 1, an integrated lattice-like support S12 having first and second plate-like bodies 76 and 77 (see FIG. 67) is provided on the front surface. The panel 2 is arranged so as to overlap the region where the black matrix is formed. This support S12 is formed by processing a glass substrate into a predetermined pattern. As shown in FIGS. 65 and 68, a plurality of protrusions mainly composed of Ag are provided at predetermined positions on the second plate 77 constituting the support S12 on the cathode substrate 4 side of the support S12. A part 9 is formed. The support S12 is mechanically fixed on the cathode substrate 4 via the plurality of protrusions 9. In this case, each chamber R4 partitioned by the support S12 corresponds to a region of the cathode substrate 4 where the emitter array is formed.

Next, the manufacturing process of this embodiment will be described with reference to FIG. First, in the same manner as in the tenth embodiment, an integral lattice-like glass substrate S12 'is formed from a 0.5 mm-thick photosensitive glass plate by etching (see FIG. 46). Next, in FIG. 69, a resist layer 94 is formed on the base substrate 180, and the resist layer 94 is patterned to embed an Ag paste at a predetermined position (FIG. 69 (a)).

The embedded Ag paste is preliminarily dried to form a plurality of protruding Ag patterns 9 and then the resist 94 is formed.
Is peeled off, and the underlying substrate 180 and the lattice-shaped glass substrate S12 'are removed.
And a plurality of projections 9 made of an Ag pattern are transferred to the glass substrate S12 '(FIG. 69 (b)).
After the transfer, it is heat-treated at 450 ° C.
At the same time that the 2 ′ portion is hardly dissolved in the solvent, the Ag paste is fully baked to obtain a lattice-shaped support S12 provided with a plurality of projections 9 (FIG. 69 (c)).

Next, the cathode substrate 4 is mounted on the back panel 1 provided with the exhaust pipe 51 before chip-off, and the support member S12 is arranged such that the lattice-shaped openings overlap the emitter array formation region of the cathode substrate 4. Are aligned, and each projection 9 is fixed to a part of the region of the cathode substrate 4 where the emitter array is not formed (FIG. 69 (d)). Next, a front panel 2 on which an anode electrode 5 and a phosphor 5a layer are formed in advance is prepared, and a low-melting glass 14 is formed on both sides of a sealing frame 3 having a thickness of 0.5 mm.
Is applied, and the front panel 2 and the rear panel 1 are positioned and temporarily fixed via the sealing frame 3, then heat-treated at 430 ° C., and the low-melting glass 14 is fired to form a vacuum-tight container (FIG. 69 (e)).

Next, the inside of the container is evacuated to 10
^A vacuum is exhausted to the ^-7 Torr table, and the tip of the exhaust pipe 51 is chipped off to complete a vacuum-tight container as shown in FIG. In the case of the present embodiment, the height of the lattice-shaped support S12 was 0.5 mm, the thickness was 50 μm, the aspect ratio was 10, and the height of the projection 9 was 60 μm. The lattice space of the support S12 was 2 mm square.

Next, the operation and effect of this embodiment having the above configuration will be described. According to the present embodiment, the same operation and effect as those of the tenth embodiment can be obtained,
Even if the thickness of the glass constituting the support S12 varies, the height of the front panel 2 can be finely adjusted by deforming the plurality of projections 9 formed on the rear panel 1 side.
And the rear panel 1 can be held at a constant interval.

Further, since a gap corresponding to the height of the projection 9 is left below the support S12, after the panels 1 and 2 are air-tightly connected by the closed frame 3 as described above, the air is exhausted. It becomes possible to exhaust the inside of the container from the pipe 51. Therefore, the exhaust stroke in the container can be simplified as compared with the tenth embodiment.

In this embodiment, the support S12
The case where a plurality of protrusions 9 are provided only on the side of the back panel 1 has been described, but as shown in FIGS. 70 and 71,
A plurality of projections 9 may be provided on both the back panel 1 side and the front panel 2 side of the support S12. By doing so, a continuous space is formed on both the panels 1 and 2 side of the support S12, so that the gas inside can flow efficiently at the time of exhaust.
In this case, by applying the above-described manufacturing process, the projection 9 of the Ag pattern previously formed on another substrate can be used as the support S12.
It can be easily manufactured by transferring and baking on both sides.

[Nineteenth Embodiment] Next, a nineteenth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. In this embodiment, as shown in FIGS. 72 to 74, a lattice-shaped support S13 having a projection 19 is used in place of the lattice-shaped support S12 having the projection 9 and provided on the back panel 1. The present embodiment differs from the eighteenth embodiment in that an exhaust pipe 50 provided in a sealing frame 3 is provided instead of the exhaust pipe 51 described above, and other configurations are the same as those of the eighteenth embodiment shown in FIGS. 65 to 67. It is almost the same.

More specifically, as shown in FIGS. 72 to 74, the support S13 of the present embodiment is a grid composed of the first and second plate-like bodies 76 and 77 similar to the support S12. The first and second plate-like bodies 76 and 77 are provided on the four sides around the
A thicker third plate 78 is provided. On the cathode substrate 4 side of the support S13, a plurality of projections 19 are arranged on the third plate 78.

As shown in FIGS. 73 and 74, each protrusion 19 is provided with a lead wiring 190 formed on the third plate-like body 78, and two kinds of heights h1 and h2 connected by the lead wiring 190. Of the first and second projections 191 and 1
92. The first of the projections 19,
The second protrusions 191 and 192 are respectively connected to the cathode substrate 4.
By electrically connecting the upper electrode terminal (not shown) and the extraction electrode 40 formed on the rear panel 1 side, the cathode inside the container is externally connected via the extraction electrode 40 on the rear panel 1. The substrate 4 can be driven.

Next, the manufacturing process of this embodiment will be described with reference to FIGS. First, in FIG. 75, a plurality of the lead wires 190 are formed in advance on the periphery of a photosensitive glass plate 90 having a thickness of 1.5 mm using gold paste. Next, in FIG. 76, as in the case of the tenth embodiment, an integral lattice-shaped glass substrate S13 'is formed from the photosensitive glass plate 90 by etching.

Next, referring to FIG. 77, the ITO layer 18
After applying a resist to the base substrate 180 on which the substrate 4 is formed and patterning it, the substrate is immersed in a Ni plating bath to precipitate Ni metal in a predetermined pattern, and a Ni having a height h1 = 30 μm is formed.
A plurality of first protrusions 191 mainly composed of metal are formed (FIG. 77A).

These first projections 191 are aligned with the lattice-shaped glass substrate S13 ', and are transferred onto the routing wiring 190 (FIGS. 77 (a) and (b)). Further, in the same process, a second projection 192 mainly composed of Ni metal having a height h2 = 60 μm is formed, and is transferred to the other end of the lead-out wiring 190 of the grid glass substrate S13 ′ (FIG. 77).
(b)). By these steps, as shown in FIGS. 73 and 74, the lattice-shaped support S1 having the plurality of projections 19 is provided.
3 is obtained.

Next, a back panel 1 on which a lead electrode 40 was formed in advance with a sputtered gold film was prepared.
Is installed. Next, in FIG. 78, the support S13 is aligned with the back panel 1 on which the cathode substrate 4 is mounted, and the first protrusion 1 in each protrusion 19 of the support S13 is formed.
91 is connected to the electrode terminal of the cathode substrate 4, and the second protrusion 192 is connected to the lead electrode 40 of the back panel 1, thereby obtaining an electrical connection.

Thereafter, a thickness of 1.5 mm provided with the exhaust pipe 50 is provided.
A low-melting glass 14 is applied to both sides of the sealing frame 3, the panels 1 and 2 are adhered to each other via the sealing frame 3, heat-treated at 400 ° C., and the low-melting glass 14 is fired to form a vacuum-tight container. Thereafter, the inside of the container is evacuated to 10 ⁻⁷ through the exhaust pipe 50.
The chamber is evacuated to a vacuum and the tip of the exhaust pipe 50 is chipped off to complete a vacuum-tight container as shown in FIG. In the case of the present embodiment, the height of the lattice-shaped support S13 is 1.5 m.
m, the thickness was 50 μm, and the aspect ratio was 30.
The lattice space of the support S13 was 2 mm square.

[Twentieth Embodiment] Next, a twentieth embodiment of a panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. In this embodiment, as shown in FIGS. 79 to 82, a grid-like support S14 having a plurality of projections 29 is used instead of the grid-like support S5, and a lead-out wiring is used instead of the rear panel 1. 42 in that it has a back panel 1 'having
0 to FIG. 6 to FIG.
This is substantially the same as the tenth embodiment shown in FIG.

Specifically, first, as shown in FIGS. 79 and 80, the cathode substrate 4 comprises an emitter array 21 and an emitter line 20 with an insulating layer 23 interposed therebetween, on a substrate 24.
And a gate line 22 are formed.

As shown in FIGS. 79 and 81,
In the outer peripheral portion of the back panel 1 ', a plurality of lead-out lines 42 are formed on the front side, and connection electrodes 44 are formed on the back side corresponding to the respective lead-out lines 42. Then, inside the rear panel 1 ′, each lead-out wiring 4
2 is connected to the connection electrode 44 through the via hole 43 so that an electric signal can be taken out.

As shown in FIGS. 79 and 82,
The grid-like support S14 is provided on the four sides of a grid-like structure composed of the first and second plate-like bodies 76 and 77 similar to the support S12, on the first and second plate-like bodies 76 and 77. A third plate 79 slightly thicker than 77 is provided. Further, on the cathode substrate 4 side of the support S14, a plurality of protrusions 29 are arranged on the third plate-like body 79.

Then, as shown in FIG. 79, the support S1
The end of the emitter line 20 and the gate line of the cathode substrate 4 and the lead-out wiring 42 of the rear panel 1 are electrically connected through the respective projections 29 of the cathode substrate 4. It is possible to drive from.

Next, the manufacturing process of this embodiment will be described with reference to FIGS. First, in FIG. 63, a dry film 9 having a thickness of 2.3 mm
2 is applied, light is irradiated through a pattern mask 96 for a support, and the dry film 92 is developed 92a (FIG. 83A).
), Patterning into the shape of the support S14 main body (FIG. 83 (b)). An inorganic cement material is embedded in the patterning portion of the dry film 92, and the cement material is
The lattice-shaped glass substrate S14 'is formed by curing at 20 ° C., and the surface is polished to a thickness of 2 mm to obtain a flat surface (FIG. 83 (c)). Next, in FIG. 84, a resist layer 93 is formed on the outermost surface of the lattice-shaped glass substrate S14 ', and the resist layer 93 is developed 94 by irradiating ultraviolet rays through a projection pattern mask 99 (FIG. a)), patterning into the shape of each projection 29 (FIG. 84 (b)). An Ag paste is buried in the patterning portion and is preliminarily dried (FIG. 84 (c)). Next, after the resist 93 and the dry film 92 are peeled off, heat treatment is performed at 450 ° C.
At the same time as making the lattice-shaped glass substrate S14 'hardly soluble in the solvent, the Ag paste is fired to obtain a lattice-shaped support S14 having a plurality of Ag projections 29 (FIG. 8).
4 (d)).

Next, in FIG. 85, the lattice-shaped support S14 is positioned on the back panel 1 on which the cathode substrate 4 is mounted, and the respective projections 29 of the lattice-shaped support S14 are connected to the extraction electrodes 42 and the back panel 1. It is electrically connected to the end of the emitter line 20 of the cathode substrate 4. At this time, with respect to the gate line 22 of the cathode substrate 4 as well, an electrical connection with the outside is achieved by the protrusion 29 in the same manner via the gate lead-out electrode and the connection electrode formed on the back panel 1 in advance (shown in the drawing). Zu). Next, the low-melting point glass 14 applied to both sides of the sealing frame 3 having a thickness of 2 mm is aligned with and bonded to the back panel 1, and the low-melting point glass 14 is pre-fired.

Next, in FIG. 86, the back panel 1 and the sealing frame 3 temporarily fixed and the front panel 2 are placed in a vacuum chamber 30, and the inside of the chamber is evacuated to the order of 10 ^-7 Torr. Then, on the back panel 1 fixed on the stage 31 in the vacuum chamber 30,
The front panel 2 is aligned, the temperature of the vicinity of the seal portion 14 is increased to 400 ° C. by the panel heater 32, and the front panel 2 is joined to the rear panel 1 while applying pressure, and the low melting glass 1
4 is fired to complete a vacuum-tight container as shown in FIG. In the case of the present embodiment, the grooves of the lattice-shaped support S14 are 50 μm in width and 2 mm in depth, and finally have an aspect ratio of 40 μm.
It is. The height of the projection 29 was 70 μm.

[Twenty-First Embodiment] Next, a twenty-first embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. The present embodiment is different from the twentieth embodiment in that it has a structure in which a plurality of cathode substrates 4 are electrically connected to each other using a lattice-shaped support S15 instead of the support S14, as shown in FIGS. Unlike the embodiment, the other configuration is substantially the same as that of the twentieth embodiment shown in FIGS. 79 to 82.

More specifically, as shown in FIGS. 87 and 88, the support S15 used in the present embodiment has a plurality of protrusions for mechanically fixing the support S14 on the cathode substrate 4 side. A portion 39 is added to strengthen the strength to keep the gap between the panels 1 and 2 constant.
These projections 39 are provided at intersections between the first and second plate-like bodies 76 and 77, for example, as shown in FIG.

As shown in FIG. 87, the electrical connection between the adjacent cathode substrates 4 (see FIG. 88) on the back panel 1 is achieved via the protrusions 29 of the support S15. More specifically, the ends of the emitter lines 20 of the adjacent cathode substrates 4 are electrically connected by the protrusions 29. The ends of the gate lines 22 of each cathode substrate 4 are also electrically connected to each other by the protrusions 29 (not shown).

In the manufacture of the present embodiment, as a modification of the twentieth embodiment shown in FIG. 84, the pattern mask 99 for the projection is partially improved to add the pattern of the projection 39, When forming the projections 29, the projections 3
9 is formed.

According to this embodiment, even when a plurality of cathode substrates 4 are arranged to form a large-area cathode array, the electrical connection between the cathode substrates 4 is made via the projections 29 of the grid-like support S15. Therefore, a display element having a large surface can be easily realized. In addition, since a grid-like support corresponding to a single cathode substrate 4 can be applied, even if the area is to be increased, it can be performed at low cost.

[Twenty-second Embodiment] Next, a twenty-second embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. This embodiment has a structure in which a plurality of cathode substrates 4 are electrically connected to each other by using a grid-like support S16 instead of the support S15 as shown in FIGS. Unlike the embodiment, the other configuration is substantially the same as that of the twenty-first embodiment shown in FIGS. 87 to 89.

More specifically, as shown in FIGS. 90 and 91, a vacuum-tight container containing a plurality of cathode substrates 4 is provided between the panels 1 and 2 in a grid-like support S16 common to each cathode substrate 4. By inserting the two panels 1, 2
The gap between them is kept constant, and electrical connection between the adjacent cathode substrates 4 is achieved via the plurality of projections 49 formed on the support S16. The adjacent cathode substrates 4 are arranged with glass fibers F2 interposed therebetween, adjusted so that the gap between the respective cathode substrates 4 is constant, and aligned when a plurality of cathode substrates 4 are arranged at the same time. Can be easily done.

As shown in FIG. 92 and FIG. 93, the grid-like support S16 has a third plate thicker than the first and second plate-like members 76 and 77 at a portion corresponding to a space between the adjacent cathode substrates 4. It has a body 89. And each protrusion 49
It has a routing wire 490 formed on the third plate-like body 89 of the lattice-shaped support S16, and a pair of protrusions 492 formed on both ends of the routing wire 490.

As shown in FIG. 90, the ends of the emitter line 20 and the gate line 22 of the adjacent cathode substrate 4 are electrically connected to each other by the projections 49. Further, in the lattice-shaped support S16, the second
A plurality of projections 59 are formed on both sides of the panels 1 and 2 of the plate-like body 77 and on the side of the front panel 2 of the third plate-like body 89 for the purpose of mechanical fixing and increasing the exhaust porosity.

In the eighteenth to twenty-second embodiments described above, an example was described in which glass was used as the lattice supports S12 to S16. However, for example, the lattice supports S12 to S16 were formed using an organic resin material. After that, the same effect can be obtained by coating and using a silicon dioxide layer in order to reduce outgassing.

As the material of the projections 9 to 59,
Although silver and nickel were used, in addition to these materials, any of metals such as gold and copper, or solder alloys composed of lead, tin, indium, silver, bismuth and antimony, or organic conductive materials such as polypyrrole and polyacetylene The same effect can be obtained with the projections 9 to 59 mainly composed of the above.

Further, by using the manufacturing methods of the eighteenth to twenty-second embodiments, a large-area lattice-like structure was obtained in advance, and projections 9 to 59 were formed in desired regions as needed. Thereafter, the substrate is appropriately cut to form a lattice-shaped support S12 to S16.
A manufacturing method for simplifying the manufacturing process by incorporating the device in a vacuum vessel is also possible.

[Twenty-third Embodiment] Next, with reference to FIG. 94, a twenty-third embodiment of the panel-type vacuum airtight container according to the present invention will be described. In this embodiment, the support S
The plate-like bodies 6 to 76 and 7 to 77 in S16 to S16 are configured by the plate-like member 60 made of a plurality of glass fibers F as shown in FIG. 94, and other configurations are shown in the corresponding drawings. This is substantially the same as any of the first to twenty-second embodiments.

More specifically, as shown in FIG.
A plurality of glass fibers F having a thickness of 40 μm and a height of 2 m are arranged by arranging a plurality of glass fibers F having a length of 0 μm and a length of 2 mm in a row in a direction perpendicular to the fiber axis and bonding the side surfaces of the adjacent glass fibers F together.
A plate-like member 60 having m (aspect ratio 50) is formed. That is, the plate-like member 60 has a structure including a plurality of glass fibers F arranged perpendicularly to the panels 1 and 2.

In any of the first to twenty-second embodiments, the end of the plate-like member 60 is connected to the sealing frame 3.
The plate member 6 can be fixed to the sealing frame 3 or the like by being inserted along a groove having a depth of 0.5 mm and a width of 50 μm.

According to the present embodiment, since the glass fibers F are particularly excellent in the compressive strength in the axial direction, the support members S to S are formed by the plate-like member 60 made of a plurality of glass fibers F.
By configuring the sixteen plate members 6 to 76 and 7 to 77, the plate members 6 forming the supports S to S16 are maintained while maintaining the support strength between the panels 1 and 2 by the supports S to S16. ~ 7
The aspect ratio of 6, 7 to 77 can be further increased.

[Twenty-fourth Embodiment] Next, a twenty-fourth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. In this embodiment,
In place of the plate member 60, a plate member 61 obtained by fixing a plurality of glass fibers F with frit glass as shown in FIG. 95 is used, which is different from the twenty-third embodiment. This is the same as the twenty-fourth embodiment.

More specifically, as shown in FIG. 95, a glass fiber F having a diameter of 40 μm is arranged in a mold M5 having a rectangular concave portion m so as to be aligned in the axial direction so as to form a groove in the concave portion m. Is applied to a depth of 40 μm so as to fill the gap. This is temporarily dried at 120 ° C., 45
After firing at 0 ° C., the mold is removed from the mold M5 and the glass fiber F
Then, a plurality of plate members 6 each having a thickness of 40 μm and a height of 2 mm as shown in FIG. 96 are formed.

[Twenty-Fifth Embodiment] Next, a twenty-fifth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIG. In the present embodiment, as shown in FIG. 97, instead of the glass fiber F, two softening points having different softening points are used.
The second embodiment is different from the twenty-fourth embodiment in that a glass fiber F1 having a structure in which two glass material layers f1 and f2 are combined in a concentric cylindrical shape is used. This is substantially the same as the embodiment.

Specifically, as shown in FIG. 97, the softening point of the glass material of the inner layer (core portion) f1 is 410 ° C., and the softening point of the glass material of the outer layer (cladding portion) f2 is 510.
A glass fiber F1 having a diameter of 40 μm and a temperature of 40 ° C. is used. Such a glass fiber F1 is aligned in the axial direction so as to form a concave portion m having a depth of 1 mm in a mold M5 having a shape as shown in FIG. 95, and an unfired paste of frit glass so as to fill a gap. 80 to a depth of 40 μm. 120 ° C
After pre-drying and baking at 400 ° C., the mold is removed from the mold M5, and cut and cut at intervals of 2 mm at right angles to the axis of the glass fiber F1, and a plate having a thickness of 40 μm and a height of 2 mm as shown in FIG. A plurality of shaped members 62 are formed.

The support is formed by using such a plate-like member 62 and assembled into the sealing frame 3. This sealed frame 3
Are bonded to both panels 1 and 2 via an unfired paste of frit glass, temporarily fixed at 120 ° C., and fired and fixed at 410 ° C. At this time, the cores f1 of the glass fibers F1 in the plate members 62 constituting the supports S to S16 are softened, so that the supports S to S16 and the panels 1 and 2 are bonded.

Next, the operation and effect of this embodiment having the above-described configuration will be described. According to this embodiment, the same operation and effect as those of the twenty-third embodiment can be obtained,
Due to the softening of the core portion f1 of the glass fiber F1, the support S ~
Since S16 and the panels 1 and 2 are bonded, it is not necessary to separately apply an adhesive. Also, since only the core portion f1, which is the inner layer of the glass fiber F1, is softened and the glass fiber F1 is bonded, an adhesive (in this case, a softened glass material) is applied to the cathode substrate 4 and the anode electrode 5. Extrusion can be prevented.

[Twenty-sixth Embodiment] The present embodiment is different from the embodiment shown in FIG.
In the glass fiber F1 shown in FIG. 7, a core member f1 having a softening point of 580 ° C. and a clad portion f2 having a softening point of 480 ° C. is used to form a plate member having an outer shape as shown in FIG. 94. The other configuration is the same as that of the twenty-third embodiment.

In this case, the plurality of glass fibers F1 are
By axially aligning the concave portions m of the mold M5 as shown in FIG. 95 so as to form grooves, and heating the entire mold M5 to 500 ° C., the clad portion f2 of each glass fiber F1 is softened. The side surfaces of the adjacent glass fibers F1 can be bonded to each other.

[Twenty-Seventh Embodiment] A twenty-seventh embodiment of the panel-type vacuum airtight container according to the present invention will be described below with reference to FIGS. In this embodiment,
As shown in FIG. 99, a support made of a cord-shaped member 63 in a state where a plurality of glass fibers F1 are arranged at intervals,
(Finally) is different from the above-described twenty-fifth embodiment in that it is formed between the two panels 1 and 2, and the other structure is substantially the same as the twenty-fifth embodiment shown in FIG.

Specifically, as shown in FIG. 98, the same glass fiber F1 (core part f1 has a softening point of 410 ° C. and clad part f2 has a softening point of 510
° C) in the same direction as the axial direction in the concave portion m of the mold M5.
The adhesive paste 80 containing sodium chloride, potassium chloride, or a water-soluble carbonate powder is applied so as to fill the gap so that the sides are not in contact with each other with an appropriate gap. This is temporarily dried at 120 ° C. to temporarily bond the glass fibers F1 to each other. After cooling, the glass fibers F1 are cut at a distance of 2 mm at right angles to the axis of the glass fibers F1 and folded.
A plate member having a height of 0 μm and a height of 2 mm is formed.

This plate-like member is assembled in the above-mentioned sealing frame 3,
The sealing frame 3 is bonded to the front panel 2 via an unfired paste of frit glass, and temporarily fixed at 120 ° C.
Bake at 10 ° C and fix. At this time, the softening of the core portion f1 of the glass fiber F1 in the plate member causes the individual glass fibers F1 constituting the plate member to be bonded to the front panel 2.

Next, the integrated front panel 2 and the plate-like member are immersed in water, and the glass fibers F1
The adhesive paste 80 between them is removed. In this way, by removing the adhesive paste 80 between the glass fibers F1, the adhesion between the glass fibers F1 constituting the plate-like member is released, and as shown in FIG. 99, the individual glass fibers F1 are separated. The structure of the cord-shaped member 63 independently fixed on the front panel 2 is formed.

Thereafter, an unfired paste of frit glass is applied to the back panel 1 side of the sealing frame 3 integrated with the front panel 2, and the sealing frame 3 integrated with the front panel 2 is positioned on the back panel 1. After the paste is temporarily dried at 120 ° C., the frit glass is baked at 410 ° C. to fix the back panel 1 and the sealing frame 3. At this time,
The core f1 of the glass fiber F1 bonded to the front panel 2 is melted, and the glass fiber F1 and the rear panel 1 are also bonded.

Next, the operation and effect of this embodiment having the above-described configuration will be described. According to the present embodiment, the same operations and effects as those of the twenty-fifth embodiment can be obtained,
Eventually, the adhesion between the side surfaces of the glass fiber F1 is eliminated, so that the flexibility against impact or the like, that is, the mechanical strength is further improved. Further, since there is a gap between the glass fibers F1, the exhaust efficiency is improved.

[Twenty-eighth Embodiment] Next, a twenty-eighth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. In the present embodiment, as shown in FIG. 100, a support S17 having a configuration in which the plate-like members 61 containing the glass fibers F (see FIG. 96) are combined in a lattice shape is integrally formed. .

More specifically, in FIG. 101, a glass fiber F having a diameter of 40 μm is formed on the bottom surface of a mold M6 having a rectangular concave portion.
Are spread in parallel with each other in the axial direction without any gaps.
A rectangular parallelepiped metal block 82 having a square shape of mm square
Is placed. At this time, the glass fibers F having a diameter of 40 μm are arranged between the blocks 82 without any gap therebetween, and after the blocks 82 are placed, the glass fibers F are laminated in a vertical line in the gap between the blocks 82. After filling the glass fibers F up to the upper surface of each block 82, the glass fibers F are arranged on the upper surfaces of these blocks 82 without any gap.

By repeating this operation and sequentially laminating the block 82 and the glass fiber F as shown in FIG. 101,
Fill low melting point frit glass between glass fibers F,
Dry at 0 ° C and bake at 450 ° C. After cooling, after slicing the metal block 82 with a dicer at intervals of 2 mm, the metal block 82 is removed or removed with a solvent, and the height is 2 mm and the thickness is 40 μm as shown in FIG.
A lattice-like support S17 made of a plate-like member 61 having an aspect ratio of 50 is obtained.

By applying the method of this embodiment, a grid-like support in which the plate-like members of any of the twenty-fifth to twenty-seventh embodiments are combined in a grid-like manner can also be produced. (However, when applied to the above-described twenty-seventh embodiment, a lattice-shaped support body in which the cord-like members 63 are combined in a lattice shape is finally obtained.) [Twenty-ninth Embodiment] Next, A twenty-ninth embodiment of the panel-type vacuum airtight container according to the present invention will be described with reference to FIGS. This embodiment is different from the above-described twenty-fourth embodiment in that a plate-like member 64 having a notch 64a is formed as shown in FIG. 105, and the other structure is the same as that of the twenty-fourth embodiment shown in FIGS. This is substantially the same as the embodiment.

Specifically, first, a resist pattern is formed on a metal plate having a thickness of 2 mm by a normal PEP (Planar Epitaxial Passivation) process, and then an etching process is performed.
As shown in FIG. 102, a mold M5 ′ having a concave portion m with a depth of about 1 mm in which a pair of rectangular protrusions m1 of 60 μm × 2 mm is formed.

Next, as shown in FIG.
5 ′ glass fiber F having a diameter of 40 μm so as to fill the recess m.
Are aligned in the axial direction, and an unfired paste 80 of frit glass is applied to a depth of 40 μm so as to fill the gap.
After calcination at 450 ° C. at 120 ° C. and then removal from the mold M5 ′, as shown in FIG.
A plate 64 'having a rectangular slit 64b of 2 mm is obtained.

When this is cut at a distance of 2 mm perpendicular to the axis of the glass fiber F at a position where the long side of the slit 64b is bisected, a thickness of 40 μm having a notch 64a as shown in FIG. Many plate-like members 64 are obtained. Then, by combining these plate-like members 64 with each other, for example, a lattice-like support S17 as shown in FIG. 100 can be formed.

In the above embodiment, the case of a vacuum-tight container constituting a field emission display (FED) has been described. However, the present invention is not limited to this, and an anode electrode may be used instead of the transparent electrode 5 and the phosphor 5a layer. By forming a layer on the front panel 2, a panel-type vacuum airtight container constituting a power conversion element may be provided.

[0207]

According to the present invention, the first plate member and the second plate member of the support are arranged substantially perpendicular to the first substrate and the second substrate and substantially perpendicular to each other. So
Even if the area of the first substrate and the second substrate is large, the support can support the first substrate and the second substrate with sufficient strength. For this reason, it is possible to provide a large-area panel-type vacuum hermetic container having high pressure resistance and capable of accurately maintaining the distance between the first substrate and the second substrate.

Further, the first plate member and the second plate member of the support as described above have an aspect ratio (the ratio of the height to the thickness) of the first plate member and the second plate member. ), A sufficient supporting strength between the first substrate and the second substrate can be obtained. Therefore, while avoiding interference between the support and the anode electrode, the first
By increasing the distance between the substrate and the second substrate, it is possible to cope with a high electric field type structure.

[Brief description of the drawings]

FIG. 1 is a cutaway perspective view showing a first embodiment of a panel-type vacuum airtight container according to the present invention.

2A is a longitudinal sectional view of the panel-type vacuum hermetic container shown in FIG. 1, and FIG. 2B is a longitudinal sectional view in a direction orthogonal to FIG.

FIG. 3 is a plan view showing the panel-type vacuum airtight container shown in FIG. 1 with a front panel removed.

FIG. 4 is a perspective view of a sealing frame and a support of the panel-type vacuum airtight container shown in FIG.

FIG. 5 is a diagram showing a manufacturing process of the panel-type vacuum airtight container shown in FIG.

FIG. 6 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG.

7 (a) to 7 (c) are views showing a manufacturing process of the panel-type vacuum airtight container shown in FIG.

FIG. 8 is a diagram showing a manufacturing process of the panel-type vacuum airtight container shown in FIG.

FIG. 9 is a cutaway perspective view showing a second embodiment of the panel-type vacuum airtight container according to the present invention.

10A is a longitudinal sectional view of the panel-type vacuum hermetic container shown in FIG. 10, and FIG. 10B is a longitudinal sectional view in a direction orthogonal to FIG.

11 is a plan view of the panel-type vacuum airtight container shown in FIG. 10 with a front panel removed.

FIG. 12 is a perspective view of a sealing frame and a support of the panel-type vacuum airtight container shown in FIG.

FIG. 13 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 10;

14 (a) and (b) are diagrams showing a manufacturing process of the panel-type vacuum airtight container shown in FIG.

FIG. 15 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 10;

FIG. 16 is a longitudinal sectional view showing a third embodiment of the panel-type vacuum airtight container according to the present invention.

17 is a perspective view of a sealing frame and a support of the panel-type vacuum airtight container shown in FIG.

FIG. 18 is a longitudinal sectional view showing a modification of the panel-type vacuum airtight container shown in FIG.

FIG. 19 is a plan view showing a fourth embodiment of a panel-type vacuum airtight container according to the present invention, from which a front panel is removed.

FIG. 20 is a plan view showing a fifth embodiment of a panel-type vacuum airtight container according to the present invention, from which a front panel is removed.

FIG. 21 is a plan view showing a sixth embodiment of a panel-type vacuum airtight container according to the present invention, with a front panel removed.

FIG. 22 is a cutaway perspective view of a support of the panel-type vacuum airtight container shown in FIG. 21.

FIG. 23 is a cutaway perspective view showing a seventh embodiment of the panel-type vacuum airtight container according to the present invention.

24A is a longitudinal sectional view of the panel-type vacuum hermetic container shown in FIG. 23, and FIG. 24B is a longitudinal sectional view in a direction orthogonal to FIG.

FIG. 25 is a plan view of the panel-type vacuum airtight container shown in FIG. 23 with a front panel removed.

26 is a perspective view of a sealing frame and a support of the panel-type vacuum airtight container shown in FIG.

FIG. 27 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 23;

FIG. 28 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 23;

FIG. 29 is a diagram showing a manufacturing process of the panel-type vacuum airtight container shown in FIG.

30 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 23;

FIGS. 31 (a) to 31 (e) are diagrams showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 23.

FIG. 32 is a cutaway perspective view showing an eighth embodiment of a panel-type vacuum airtight container according to the present invention.

FIG. 33 is a plan view of the panel-type vacuum airtight container shown in FIG. 32 with a front panel removed.

FIG. 34 is a perspective view of a main part of the panel-type vacuum airtight container shown in FIG. 32;

FIG. 35 is a cutaway perspective view showing a ninth embodiment of a panel-type vacuum airtight container according to the present invention.

36 is a plan view showing the panel-type vacuum airtight container shown in FIG. 35 with a front panel removed.

37 (a) is a longitudinal sectional view of the panel-type vacuum airtight container shown in FIG. 35, and FIG. 37 (b) is a longitudinal sectional view in a direction orthogonal to (a).

FIG. 38 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 35;

FIGS. 39 (a) to 39 (c) are diagrams showing the steps of manufacturing the panel-type vacuum airtight container shown in FIG. 35.

FIGS. 40 (a) and (b) are diagrams showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 35.

FIG. 41 is a perspective view of a support in a modification of the panel-type vacuum airtight container shown in FIG. 35;

FIG. 42 is a diagram illustrating a panel type vacuum airtight container according to the present invention.
FIG. 2 is a longitudinal sectional view showing the embodiment.

43 is a cutaway plan view of the panel-type vacuum airtight container shown in FIG. 42.

FIG. 44 is a longitudinal sectional view of a main part of the panel-type vacuum airtight container shown in FIG. 42;

FIG. 45 is a perspective view of a support of the panel-type vacuum airtight container shown in FIG. 42;

46 (a) and (b) are diagrams showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 42.

FIG. 47 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 42;

FIG. 48 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 42;

FIG. 49 is an eleventh embodiment of the panel-type vacuum airtight container according to the present invention.
The top view which removes a front panel and shows the embodiment of FIG.

50 is a perspective view of a support of the panel-type vacuum airtight container shown in FIG. 49.

FIGS. 51 (a) to 51 (d) are diagrams showing the steps of manufacturing the panel-type vacuum airtight container shown in FIG. 49.

FIGS. 52 (a) to 52 (c) are diagrams showing a manufacturing process of a twelfth embodiment of the panel-type vacuum airtight container according to the present invention.

FIG. 53 is a view showing a step of producing the panel-type vacuum airtight container shown in FIG. 52 (a perspective view of a mold for a support).

FIG. 54 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 52;

FIGS. 55 (a) to 55 (d) are views showing a manufacturing process of a panel-type vacuum airtight container according to a thirteenth embodiment of the present invention.

FIG. 56 shows a fourteenth panel-type vacuum airtight container according to the present invention.
FIG. 6 is a view showing a manufacturing process of the embodiment.

57 is a perspective view of a support of the panel-type vacuum airtight container shown in FIG. 56.

FIG. 58 shows a fifteenth panel-type vacuum airtight container according to the present invention.
The perspective view of the support which shows embodiment of FIG.

FIG. 59 shows a sixteenth panel-type vacuum airtight container according to the present invention.
FIG. 2 is a longitudinal sectional view showing the embodiment.

60 is a plan view showing the panel-type vacuum airtight container shown in FIG. 59 with a front panel removed.

FIG. 61 is a partial plan view of a support of the panel-type vacuum airtight container shown in FIG. 59.

FIG. 62 is a perspective view showing a type of a support of the panel-type vacuum airtight container shown in FIG. 59.

FIG. 63 shows a seventeenth panel-type vacuum airtight container according to the present invention.
FIG. 4 is a partial vertical cross-sectional view of a support showing the embodiment.

FIGS. 64 (a) to (c) are diagrams showing the steps of manufacturing the panel-type vacuum airtight container shown in FIG. 63.

FIG. 65 is an eighteenth embodiment of the panel-type vacuum airtight container according to the present invention.
FIG. 2 is a longitudinal sectional view showing the embodiment.

66 is a cutaway plan view of the panel-type vacuum airtight container shown in FIG. 65.

FIG. 67 is a perspective view of a support of the panel-type vacuum airtight container shown in FIG. 65.

FIG. 68 is a (back) perspective view of a support of the panel-type vacuum airtight container shown in FIG. 65;

FIGS. 69 (a) to (e) are views showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 65.

70 is a longitudinal sectional view showing a modified example of the panel-type vacuum airtight container shown in FIG. 65.

FIG. 71 is a partial longitudinal sectional view of a support of the panel-type vacuum airtight container shown in FIG. 70;

FIG. 72 shows a nineteenth embodiment of the panel-type vacuum airtight container according to the present invention.
FIG. 2 is a longitudinal sectional view showing the embodiment.

73 is a partial plan view of the support of the panel-type vacuum airtight container shown in FIG. 72.

74 is a partial longitudinal sectional view of a support of the panel-type vacuum airtight container shown in FIG. 72.

FIG. 75 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 72;

FIG. 76 is a view showing a manufacturing process of the panel-type vacuum airtight container shown in FIG. 72;

FIGS. 77 (a) and (b) are diagrams showing the steps of manufacturing the panel-type vacuum airtight container shown in FIG. 72.

FIG. 78 is a view showing a manufacturing step of the panel-type vacuum airtight container shown in FIG. 72;

FIG. 79 shows a twentieth embodiment of a panel-type vacuum airtight container according to the present invention.
FIG. 2 is a longitudinal sectional view showing the embodiment.

FIG. 80 is a plan view of a cathode substrate of the panel-type vacuum hermetic container shown in FIG. 79;

FIG. 81 is a longitudinal sectional view of a back panel of the panel-type vacuum airtight container shown in FIG. 79;

FIG. 82 is a perspective view of a support of the panel-type vacuum airtight container shown in FIG. 79;

FIGS. 83 (a) to 83 (c) are views showing the steps of manufacturing the panel-type vacuum airtight container shown in FIG. 79;

FIGS. 84 (a) to 84 (d) are diagrams showing the steps of manufacturing the panel-type vacuum airtight container shown in FIG. 79.

FIG. 85 is a view showing the manufacturing process of the panel-type vacuum airtight container shown in FIG. 79;

86 is a view showing a step of manufacturing the panel-type vacuum airtight container shown in FIG. 79;

FIG. 87 shows a twenty-first embodiment of the panel-type vacuum airtight container according to the present invention.
The principal part longitudinal cross-sectional view which shows embodiment of FIG.

FIG. 88 is a perspective view of a cathode substrate of the panel-type vacuum airtight container shown in FIG. 87.

89 is a perspective view of a support of the panel-type vacuum airtight container shown in FIG. 87.

FIG. 90 is a diagram illustrating a panel-type vacuum airtight container according to the present invention.
The principal part longitudinal cross-sectional view which shows embodiment of FIG.

FIG. 91 is a perspective view of a cathode substrate of the panel-type vacuum airtight container shown in FIG. 90;

92 is a partial longitudinal sectional view of a support of the panel-type vacuum airtight container shown in FIG. 90.

93 is a partial plan view of the support of the panel-type vacuum airtight container shown in FIG. 90.

FIG. 94 is a twenty-third embodiment of the panel-type vacuum airtight container according to the present invention.
The perspective view of the plate-shaped member which shows embodiment.

FIG. 95 shows a twenty-fourth panel-type vacuum airtight container according to the present invention.
FIG. 6 is a view showing a manufacturing process of the embodiment.

96 is a perspective view of a plate-shaped member of the panel-type vacuum airtight container shown in FIG. 95.

FIG. 97 is a diagram showing a twenty-fifth panel-type vacuum airtight container according to the present invention.
The perspective view of the plate-shaped member which shows embodiment.

FIG. 98 shows a twenty-sixth embodiment of the panel-type vacuum airtight container according to the present invention.
FIG. 6 is a view showing a manufacturing process of the embodiment.

FIG. 99 is a partial perspective view of a plate-shaped member and a front panel of the panel-type vacuum airtight container shown in FIG. 98;

FIG. 100 is a second view of the panel-type vacuum airtight container according to the present invention.
The perspective view of the support body which shows 7th Embodiment.

101 is a view showing a step of manufacturing the panel-type vacuum airtight container shown in FIG. 100;

FIG. 102 is a second view of the panel-type vacuum airtight container according to the present invention.
The figure (the perspective view of the type | mold for plate-shaped members) which shows the manufacturing process of 8th Embodiment.

103 is a view showing a step of manufacturing the panel-type vacuum airtight container shown in FIG. 102;

104 is a view showing a step of manufacturing the panel-type vacuum airtight container shown in FIG. 102;

105 is an elevation view of a plate-shaped member of the panel-type vacuum airtight container shown in FIG. 102;

FIG. 106 is a vertical sectional view of a main part showing an example of a conventional panel-type vacuum airtight container.

FIGS. 107 (a) to (e) are views showing the steps of manufacturing the conventional panel-type vacuum airtight container shown in FIG. 106.

FIGS. 108 (a) to (c) are views showing a manufacturing process of the conventional panel-type vacuum airtight container shown in FIG. 106.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 back panel (first substrate) 2 front panel (second substrate) 3 sealing frame 4 cathode substrate 5 anode electrode 5 a phosphor 6, 16, 26, 36, 46, 56, 66, 76 first
Plate member 7, 17, 27, 37, 47, 57, 67, 77 Second
Plate member 8, 8 'Conductive pattern 9, 19, 29, 39, 49, 59 Projection 15, 15' Partition 50, 51 Exhaust pipe (exhaust member) E, E1 Exhaust chamber F, F1 Glass fiber f1 Core part (Inner layer) f2 Cladding part (outer layer) R, R1 to R4 chamber R 'Main chamber S, S1 to S17 Support

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Nobuyoshi Ishikawa 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Prefecture Toshiba R & D Center (72) Inventor Masayuki Nakamoto Shin Isogo-ku, Yokohama-shi, Kanagawa 33 Isogo-cho, Toshiba Production Technology Research Laboratories (72) Inventor, etc.Kobayashi et al. 33 Shin-Isoko-cho, Isogo-ku, Yokohama, Kanagawa Prefecture, Japan 33 Toshiba Production Technology Research Laboratories, Inc. 33, Shinisogo-cho, Shin-ku, Tokyo, Japan Toshiba Production Technology Laboratory (72) Inventor Yumi Fukuda 33, Shinisogo-cho, Isogo-ku, Yokohama, Kanagawa, Japan 70 Yanagicho, Kawasaki-shi, Kawasaki-shi F-term in Toshiba Yanagicho factory (reference) 5C032 AA01 BB16 BB18 CC10 CD06 5C036 EF01 EF06 EG02 EG05 EG50

Claims (5)

[Claims] 1. A first substrate having a field emission type cathode substrate provided on one surface thereof, and a first substrate disposed opposite to a surface of the first substrate facing the cathode substrate, and an anode electrode provided on a surface facing the first substrate. A sealing substrate for airtightly connecting the first substrate and the second substrate at a predetermined interval, and the first substrate and the second substrate in the sealing frame. A support interposed between the substrate and the substrate, wherein the support comprises one or more first plate-like members and a second
It has a plate-like member, and the first plate-like member and the second plate-like member are arranged substantially perpendicular to the first substrate and the second substrate and substantially perpendicular to each other. Panel type vacuum airtight container. 2. The apparatus according to claim 1, wherein the support defines a plurality of chambers in the closed frame that are permeable by the first plate-shaped member and the second plate-shaped member. Item 7. A panel-type vacuum airtight container according to Item 1. 3. A partition which divides the inside of the closed frame into a main chamber corresponding to the cathode substrate and an exhaust chamber provided outside the main chamber so as to be able to ventilate. 3. The panel-type vacuum airtight container according to claim 2, further comprising an exhaust member for exhausting air to the panel. 4. The support member has a plurality of protrusions interposed between the first plate member or the second plate member and the first substrate or the second substrate. The panel-type vacuum airtight container according to any one of claims 1 to 3. 5. The first plate-like member or the second plate-like member of the support has a structure including a plurality of glass fibers arranged substantially perpendicular to the first substrate and the second substrate. The panel-type vacuum airtight container according to any one of claims 1 to 4, wherein: