JP2008130376A - Vacuum device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent evaporation of frit glass and occurrence of cracks in a glass member in the vicinity of a getter lead in producing a getter flash. <P>SOLUTION: The vacuum device includes: a first substrate 1 having a cathode electrode with an emitter formed thereon; a second substrate 2 having an anode electrode; and a getter box 3 having a current-carrying type getter 12 housed therein for keeping a space in the vacuum device in a vacuum condition. Getter leads 31 for carrying a current to the current-carrying type getter are respectively connected to both ends of the current-carrying type getter. The getter leads are led out to the outside of the vacuum device through a position on a line 13b generally orthogonal to a line 13a connecting connection points 13 with the getter leads at both ends of the current-carrying type getter. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a vacuum apparatus having a built-in electron source and kept inside a vacuum. In particular, the present invention relates to a vacuum apparatus that can be preferably applied to a field emission display device (hereinafter referred to as FED).

  In recent years, vacuum microelectronics in which a cold cathode as an electron source in which micron-sized vacuum microstructures are integrated in a vacuum vessel made of glass or the like has attracted attention. As applications of this vacuum microelectronics, active devices, various sensors for detecting magnetism, vacuum tubes with built-in electron sources such as imaging tubes, lithography electron beam devices, and thin flat panel display devices have been researched and developed.

  In a thin flat panel display device, a plurality of micro cold cathodes are associated with one pixel. As this micro cold cathode, a field emission device, an MIM type electron emission device, a surface conduction type electron emission device, a PN junction type electron emission device, and the like have been proposed. As the most typical flat panel display device, there is an FED using a field emission element as described in Non-Patent Document 1 or the like. In this FED, for example, a field emission device called a Spindt type is used.

  In an electron source using a field emission device, a plurality of striped cathode electrodes are provided on a cathode substrate, and an insulating layer is formed over the entire surface. A plurality of stripe-shaped gate electrodes are formed on the insulating layer. The extending direction of the striped gate electrode is perpendicular to the extending direction of the striped cathode electrode. At each intersection of the plurality of cathode electrodes and the plurality of gate electrodes, an opening penetrating the gate electrode and the insulating layer therebelow is formed. In each opening, a cone-shaped emitter is formed on the cathode electrode. A resistance layer may be formed between the cathode electrode and the insulating layer. An anode electrode is disposed opposite the electron source. In such a configuration, an anode voltage is supplied to the anode electrode, and an image signal is supplied to each of the plurality of cathode electrodes while scanning by sequentially applying extraction voltages to the plurality of gate electrodes. Electrons are emitted from the emitter by an electric field formed between the emitter and the gate electrode. The emitted electrons travel toward the anode electrode, and collide with a phosphor provided on the anode electrode to emit light so that a display operation is performed.

  FIG. 9 is a plan view showing a schematic configuration of a conventional electron source built-in vacuum apparatus. In the figure, 1 is a cathode substrate, 2 is an anode substrate, 3 is a getter box, 4 is a communication hole, and 5 is an exhaust pipe. The cathode substrate 1 and the anode substrate 2 are spaced apart from each other by a minute distance (for example, about 200 μm to 500 μm), and the anode substrate 2 is disposed so as to face the cathode substrate 1 while being shifted obliquely upward. As a result, the two sides of the anode substrate 2 protrude outward from the cathode substrate 1. A rectangular getter box 3 is provided on one of the two protruding sides of the anode substrate 2 so as to cover a part of the protruding anode substrate 2. The periphery of the cathode substrate 1 and the anode substrate 2 is sealed with a sealing member such as frit glass except for the portion of the getter box 3. The space between the cathode substrate 1 and the anode substrate 2 is connected to the space in the getter box 3. The space in the getter box 3 is connected to the exhaust pipe 5 through a communication hole 4 formed on the bottom surface.

  In the vacuum device with a built-in electron source, the space between the cathode substrate 1 and the anode substrate 2 needs to be evacuated. Therefore, a getter for adsorbing the gas remaining after the exhaust process is accommodated in the getter box 3 at the time of manufacture.

  FIG. 10 is a plan view showing the vicinity of the getter box 3. FIG. 10 shows a state where the anode substrate 2 is removed in order to simplify the drawing. In the figure, 12 is an energizing getter, 11 is a pair of getter leads for energizing the getter 12, and 13 is a welding point connecting both ends of the getter 12 and the pair of getter leads 11.

  11A is an enlarged plan view showing the energized getter 12 and the getter lead 11 in the vicinity of the welding point 13 in FIG. 10, and FIG. 11B is a cross-sectional view taken along the line XIB-XIB in FIG. It is. 12 is a cross-sectional view taken along line XII-XII in FIG. 10, and FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG. 12 and 13, the anode substrate 2 not shown in FIG. 10 is also shown.

  As shown in FIG. 10 and FIG. 11A, the pair of getter leads 11 and the energized getter 12 are along an axis 13 a that connects two welding points 13 that connect the pair of getter leads 11 and the energized getter 12. They are arranged substantially in parallel.

  As shown in FIGS. 12 and 13, the getter box 3 includes a side plate 3a and a bottom plate 3b. The side plate 3a and the anode substrate 2, the side plate 3a and the cathode substrate 1, the side plate 3a and the bottom plate 3b, the bottom plate 3b and the exhaust pipe 5 Are sealed with a sealing material 20 such as frit glass. The pair of getter leads 11 extends substantially in parallel with the axis 13a, passes through a sealing material 20 that seals the side plate 3a and the cathode substrate 1, and is led out of the vacuum apparatus. As a result, the getter 12 can be energized from outside the vacuum apparatus.

  As shown in FIG. 11 (B), the getter 12 is, for example, Ba (barium), Al (aluminum) in a hollow rectangular column-shaped metal case (getter container) 15 in which a slit-like opening is formed on one surface. And a getter mixture 14 made of Ni (nickel). From outside the vacuum apparatus, a current is passed through the metal case 15 through a pair of getter leads 11 to heat, and Ba is evaporated from the getter mixture 14 and deposited on the inner wall surface of the getter box 3 as a getter mirror (mirror surface). This process is generally called getter flash. When the electron source is driven, a minute gas occluded in the inner wall of the vacuum device is released, contaminating the inside and reducing the degree of vacuum. The getter mirror adsorbs the released gas to keep the inside of the vacuum apparatus clean and vacuum. As a result, emission deterioration from the electron source can be prevented and stable emission can be performed for a long time.

  As the metal case 15 of the energization type getter 12, generally, a long wire-like material having a substantially square cross-sectional shape with a side of about 0.7 mm is cut to a predetermined length. Therefore, the getter mixture 14 is not covered with the metal case 15 and exposed at both ends of the energized getter 12. In general, the temperature at which the getter mixture 14 dissolves and Ba evaporates is about 800 ° C. For this reason, at the time of getter flash, the getter mixture 14 heated to about 800 ° C. is exposed at both ends of the energized getter 12, and the nearby getter lead 11 is heated by the heat radiation. As a result, heat is transmitted through the getter lead 11 to heat and evaporate the frit glass 20 that seals the getter lead 11, or a portion of the glass member such as the frit glass 20, the getter box 3, and the cathode substrate 1 in the vicinity of the getter lead 11. There is a problem of generating cracks.

In the energized getter 12, the amount of Ba scattering is determined by the amount of current (hereinafter referred to as "applied current") to the energized getter 12 and the time during which the current is energized (hereinafter "applied time"). In general, the smaller the cross-sectional area of the getter lead 11 passing through the frit glass 20 that seals between the cathode substrate 1 and the getter box 3, the better the adhesion between the getter lead 11 and the frit glass 20, and the airtightness of the vacuum apparatus. Improves. However, the smaller the cross-sectional area of the getter lead 11, the higher the resistance value of the getter lead 11. The amount of Joule heat Q (J) generated by energization is defined as I (A) for the applied current, R (Ω) for the combined resistance value of the getter lead 11 and the energized getter 12, and t (second) for the application time. Q = I ² * R * t. That is, when the cross-sectional area of the getter lead 11 is small, the combined resistance value R increases, the getter lead generates heat, and the temperature rises. Accordingly, in the same manner as when the getter lead 11 is heated by the getter 12 at the time of getter flash, the heated getter lead 11 heats and evaporates the frit glass 20, or the frit glass 20, the getter box 3, the cathode substrate 1, and the like. There is a problem that a crack is generated in the vicinity of the getter lead 11 of the glass member.

  In order to deal with such problems, there is a method using a non-evaporable getter in which a getter mixture is sintered in a resistance heating body such as a nichrome wire instead of the energized getter (see, for example, Patent Document 1). In order to activate the non-evaporable getter, the nichrome wire is energized from outside the vacuum apparatus, and the nichrome wire is usually used at 400 to 430 ° C. for about 30 minutes, 500 ° C. for about 10 minutes, or 850 to 900 ° C. It is necessary to heat for about 1 minute. However, it is common knowledge that the non-evaporable getter is activated in a sealing process in which the exhaust pipe is chipped off. In this state, field emission elements are already arranged on the cathode substrate. The field emission device is generally formed on a vapor deposition film as a cathode electrode formed on a cathode substrate made of a glass substrate by high-precision positioning and die-bonding using silver brazing or an adhesive. However, the silver brazing solder and adhesive used for die bonding usually lose their adhesive strength at 120 to 200 ° C. Therefore, when the non-evaporable getter is activated by heating at 400 to 430 ° C. for about 30 minutes as described above, the temperature at which the vacuum device itself in which the non-evaporable getter is stored loses the above-described adhesive strength. Therefore, the silver brazing and the adhesive fixing the field emission element are softened, and the position of the field emission element is displaced, and in the worst case, the field emission element is peeled off.

On the other hand, in the getter flash process of the energized getter, heating of the energized getter is only about 30 seconds at about 1000 ° C., and the cathode substrate having a large heat capacity does not reach a high temperature by such a short time heating. Therefore, there is no problem such as a position defect or peeling of the field emission element fixed to the cathode substrate.
JP 10-199453 A Nikkei Electronics, No. 654 (1996.1.29) p. 89-98

  The present invention solves the above-described conventional problems, and during the getter flash, the frit glass evaporates, or cracks occur in glass members near the getter lead such as the frit glass, the cathode substrate, and the getter box. It is an object of the present invention to provide a vacuum apparatus that prevents the deterioration of the degree of vacuum caused by them and does not reduce emission characteristics.

  A vacuum apparatus according to the present invention includes a first substrate having a cathode electrode on which an emitter is formed, and a second substrate having an anode electrode spaced apart from the first substrate in the direction of electron emission from the emitter. And a getter box in which an energized getter is accommodated, and the internal space is a vacuum device. Getter leads for energizing the energized getter are connected to both ends of the energized getter.

  In the first vacuum apparatus of the present invention, the getter lead is led out of the vacuum apparatus through a position on a straight line that is substantially orthogonal to a straight line that connects the connection points with the getter leads at both ends of the energized getter. It is characterized by.

  In the second vacuum apparatus of the present invention, the width of the getter lead is enlarged at the position immediately after the getter lead is led out of the vacuum apparatus or in the vicinity thereof, or the getter lead has a larger width than the getter lead. Also, a wide member is joined.

  According to the present invention, it is possible to prevent the frit glass from evaporating during the getter flash and the generation of cracks in the glass members near the getter leads such as the frit glass, the cathode substrate, and the getter box. As a result, it is possible to provide a vacuum apparatus that eliminates the deterioration of the vacuum caused by these and does not reduce the emission characteristics.

  In the first vacuum apparatus of the present invention, the getter lead is led out of the vacuum apparatus through a position on a straight line that is substantially orthogonal to a straight line that connects the connection points with the getter leads at both ends of the energized getter. ing. This increases the distance along the getter lead from the connection point between the getter lead and the energized getter to the sealing material such as frit glass, so even if the temperature of the getter lead rises due to thermal radiation during the getter flash The heat is dissipated between the getter lead and the sealing material. Therefore, since the temperature of the getter lead is lowered at the point where the getter lead penetrates the sealing material, the frit glass does not evaporate and the glass member does not crack.

  In the second vacuum apparatus of the present invention, the width of the getter lead is enlarged at the position immediately after the getter lead is led out of the vacuum apparatus or in the vicinity thereof, or the getter lead has a larger width than the getter lead. Also, a wide member is joined. As a result, the wide portion outside the vacuum device functions as a heat radiating plate to lower the temperature of the getter lead. Therefore, since the temperature of the getter lead at the point where the getter lead penetrates the sealing material can be lowered, the frit glass does not evaporate and the glass member does not crack.

  In the second vacuum apparatus of the present invention, the getter leads pass outside the vacuum apparatus through positions on a straight line that is substantially orthogonal to a straight line that connects the connection points of the getter leads at both ends of the energized getter. It is preferably derived. As a result, the above-described effect of the first vacuum device of the present invention can be further obtained, and therefore it is possible to further prevent the frit glass from evaporating and the glass member from cracking.

  In the first and second vacuum apparatuses of the present invention, it is preferable that the number of getter leads connected to one end of the energized getter is plural. As a result, the current flowing through one getter lead is reduced, so heat generation of the getter lead is reduced. Furthermore, since the heat transferred from the energized getter to one getter lead during the getter flash is reduced, the temperature of each getter lead is lowered. Accordingly, the temperature of the getter lead at the point where the getter lead penetrates the sealing material can be further lowered, and therefore, the frit glass can be further prevented from evaporating and the glass member can be prevented from cracking.

  Hereinafter, preferred embodiments of the present invention will be described.

(Embodiment 1)
FIG. 1 is a plan view showing a schematic configuration of an electron source built-in vacuum apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 1 shows a state where the anode substrate 2 is removed in order to simplify the drawing. Also, the sealing material 20 such as frit glass is not shown. FIG. 3 is an enlarged plan view showing one end of the energized getter 12 and the getter lead 31 connected thereto. In these drawings, the same components as those in the prior art are denoted by the same reference numerals, and description thereof will be omitted.

  In these drawings, 1 is a cathode substrate, 2 is an anode substrate, 3 is a getter box, 4 is a communication hole, and 5 is an exhaust pipe. A plurality of striped cathode electrodes (not shown) are provided on the cathode substrate 1, and an insulating layer (not shown) is formed on the entire surface. A plurality of striped gate electrodes (not shown) are formed on the insulating layer. The extending direction of the striped gate electrode is perpendicular to the extending direction of the striped cathode electrode. At each intersection of the plurality of cathode electrodes and the plurality of gate electrodes, an opening penetrating the gate electrode and the insulating layer therebelow is formed. In each opening, a cone-shaped emitter (not shown) is formed on the cathode electrode. The anode substrate 2 is disposed with a small distance (for example, about 200 μm to 500 μm) from the cathode substrate 1. An anode electrode (not shown) is formed on the surface of the anode substrate 2 facing the cathode substrate 1.

  For example, when a vacuum device is used as a display device, an anode voltage is supplied to the anode electrode, and an image signal is supplied to each of the plurality of cathode electrodes while scanning by sequentially applying an extraction voltage to the plurality of gate electrodes. . Electrons are emitted from the emitter by an electric field formed between the emitter and the gate electrode. The emitted electrons travel toward the anode electrode, and collide with a phosphor (not shown) provided on the anode electrode to emit light, thereby performing a display operation.

  In the vacuum device with a built-in electron source, the space between the cathode substrate 1 and the anode substrate 2 needs to be evacuated. For this reason, an energized getter 13 for adsorbing the gas remaining after the exhaust process is accommodated in the getter box 3 at the time of manufacture.

  As shown in FIGS. 1 and 2, the getter box 3 is provided on the opposite side of the cathode substrate 1 from the anode substrate 2. The edge of the anode substrate 2 protrudes outward from the edge of the cathode substrate 1, and the getter box 3 is located above the edge of the cathode substrate 1 so that the protruding anode substrate 2 faces a part thereof. Projects outward. The getter box 3 includes a side plate 3a and a bottom plate 3b. The side plate 3a and the anode substrate 2, the side plate 3a and the cathode substrate 1, the side plate 3a and the bottom plate 3b, and the bottom plate 3b and the exhaust pipe 5 are all sealed with frit glass or the like. The material 20 is sealed so that no leakage occurs and the inside of the vacuum device is maintained at a predetermined degree of vacuum. Thereby, the space in the getter box 3 and the space between the cathode substrate 1 and the anode substrate 2 are connected in the vacuum apparatus. A communication hole 4 is formed in the bottom plate 3 b, and the space in the getter box 3 and the exhaust pipe 5 are connected via the communication hole 4.

  The energization type getter 12 is disposed in the getter box 3 between the cathode substrate 1 and the bottom plate 3b so that the anode substrate 2 cannot be directly seen. The energized getter 12 is a getter made of, for example, Ba (barium), Al (aluminum), or Ni (nickel) in a hollow rectangular column-shaped metal case (getter container) 15 having a slit-like opening formed on one surface. The mixture 14 is stored.

  As shown in FIGS. 1 and 3, getter leads 31 are connected to both ends of the energized getter 12 by welding. Reference numeral 13 denotes a welding point between the energized getter 12 and the getter lead 31. The getter lead 31 is led out of the vacuum apparatus, so that the getter 12 can be energized from outside the vacuum apparatus.

  In the present embodiment, when viewed in plan as shown in FIG. 1, the pair of getter leads 31 is led out of the vacuum apparatus through a position on a straight line 13 b that is substantially orthogonal to the axis 13 a that connects the pair of welding points 13. Has been. That is, one of the pair of getter leads 31 extends substantially parallel to the straight line 13b from the welding point 13 to one side with respect to the axis 13a, and is bent along the straight line 13b, and then the side plate 3a and the anode substrate. 2 is led out of the vacuum device through the position where the straight line 13b of the sealing material 20 that seals 2 passes, and the other is substantially parallel to the straight line 13b from the welding point 13 to the other side with respect to the axis 13a. After extending and bending along the straight line 13 b, the sealing material 20 sealing the side plate 3 a and the cathode substrate 1 passes through a position where the straight line 13 b passes and is led out of the vacuum apparatus.

  The effect of the vacuum device of this embodiment configured as above will be described.

  When the energized getter 12 is energized through the pair of getter leads 31 to perform getter flash, the getter mixture 14 in the metal case 15 is melted and Ba evaporates at about 1000 ° C. At the same time, heat is radiated from the getter mixture 14 exposed without being covered by the metal case 15 at both ends of the energized getter 12. In the present embodiment, since the getter lead 31 extends from the welding point 13 in a direction substantially perpendicular to the axis 13a, it is difficult to be heated by heat radiation from the getter mixture 14. Further, the getter lead 31 is led out of the vacuum apparatus through a position through which the straight line 13b of the sealing material 20 passes. As a result, the distance along the getter lead 31 from the welding point 13 to the sealing material 20 is significantly longer than in the prior art (about four times longer in the example of FIGS. 1 to 3). Therefore, even if the getter lead 31 is heated in the vicinity of the welding point 13, the heat is dissipated while propagating through the getter lead 31. Compared to, it is significantly lower. Therefore, the frit glass of the sealing material 20 that seals the getter lead 31 is heated and evaporated by the heat of the getter lead 31, or glass such as the sealing material 20, the getter box 3, the cathode substrate 1, and the anode substrate 2. No cracks occur in the vicinity of the getter lead 31 of the member. As a result, it is possible to prevent a problem that the degree of vacuum in the vacuum device is lowered and the vacuum device itself is broken.

  In FIG. 2, one of the pair of getter leads 31 penetrates the sealing material 20 between the side plate 3 a and the anode substrate 2, and the other penetrates the sealing material 20 between the side plate 3 a and the cathode substrate 1. However, the present invention is not limited to this. For example, one or both of the pair of getter leads 31 may be led out of the vacuum device through the sealing material 20 between the side plate 3a and the bottom plate 3b.

  The position of the straight line 13b in the direction of the axis 13a is not particularly limited, but when the straight line 13b passes through the approximate center of the pair of welding points 13, the length of the getter leads connected to the pair of welding points 13 in the getter box 3 respectively. Is preferable since the temperature becomes substantially uniform and the temperature at the portion where each sealant 20 penetrates is substantially uniform.

(Embodiment 2)
4 is a plan view showing a schematic configuration of an electron source built-in vacuum apparatus according to Embodiment 2 of the present invention, and FIG. 5 is a cross-sectional view taken along line VV in FIG. FIG. 4 shows a state in which the anode substrate 2 is removed in order to simplify the drawing. Also, the sealing material 20 such as frit glass is not shown. FIG. 6 is an enlarged plan view showing one end of the energized getter 12 and the getter lead 41 connected thereto. In these drawings, the same components as those in the first embodiment and the conventional ones are denoted by the same reference numerals, and the description thereof is omitted. Hereinafter, the present embodiment will be described focusing on the differences from the first embodiment.

  As shown in FIGS. 4 to 6, getter leads 41 are connected to both ends of the energized getter 12 by welding. Reference numeral 13 denotes a welding point between the energized getter 12 and the getter lead 41. The getter lead 41 is led out to the outside of the vacuum device, so that the getter 12 can be energized from outside the vacuum device.

  In the second embodiment, unlike the first embodiment, the getter lead 41 is led out of the vacuum apparatus in a direction substantially parallel to the axis 13 a connecting the pair of welding points 13. That is, the getter lead 41 extends from the welding point 13 substantially parallel to the axis 13a, passes through the sealing material 20 that seals the side plate 3a and the cathode substrate 1, and is led out of the vacuum apparatus. This lead-out direction of the getter lead 41 is the same as that of the conventional vacuum apparatus (see FIGS. 10 and 13).

  However, unlike the conventional vacuum device, the width of the getter lead 41 is greater in the portion immediately after being led out of the vacuum device from the sealing material 20 than in the getter box 3 and the portion passing through the sealing material 20. wide. That is, the wide portion 42 is formed in a portion outside the vacuum device in the vicinity of the sealing material 20 of the getter lead 41. 4 and 6, the wide portion 42 is formed integrally with the getter lead 41. However, the present invention is not limited to this. For example, the vacuum device in the vicinity of the sealing material 20 of the getter lead 41 formed to have a uniform width. The wide portion 42 may be joined to the outer portion by welding or the like. Further, the shape of the wide portion 42 is not limited to a quadrangle as shown in FIGS.

  The effect of the vacuum device of this embodiment configured as above will be described.

  When the energized getter 12 is energized through the pair of getter leads 41 to perform getter flash, the getter mixture 14 in the metal case 15 is melted and Ba evaporates at about 1000 ° C. At the same time, heat is radiated from the getter mixture 14 exposed without being covered by the metal case 15 at both ends of the energized getter 12. As a result, the getter lead 41 is heated, and the heat is transmitted through the getter lead 41 to the sealing material 20 side. Since the wide portion 42 is provided outside the vacuum device in the vicinity of the sealing material 20 of the getter lead 41, the heat transmitted from the welding point 13 to the getter lead 41 is radiated from the wide portion 42 to the outside of the vacuum device. Therefore, the temperature of the getter lead 41 at the portion penetrating the sealing material 20 of the getter lead 41 can be greatly reduced as compared with the conventional case. Therefore, the frit glass of the sealing material 20 that seals the getter lead 41 is heated and evaporated by the heat of the getter lead 41, or getter leads of glass members such as the sealing material 20, the getter box 3, and the cathode substrate 1 are used. No cracks occur in the vicinity of 41. As a result, it is possible to prevent a problem that the degree of vacuum in the vacuum device is lowered and the vacuum device itself is broken.

  In FIG. 5, the pair of getter leads 41 penetrates the sealing material 20 between the side plate 3a and the cathode substrate 1, but the present invention is not limited to this. For example, one or both of the pair of getter leads 41 may be led out of the vacuum device through the sealing material 20 between the side plate 3a and the bottom plate 3b.

  The second embodiment is the same as the first embodiment except for the above.

(Embodiment 3)
FIG. 7 is a plan view showing a schematic configuration of an electron source built-in vacuum apparatus according to Embodiment 3 of the present invention. FIG. 7 shows a state in which the anode substrate 2 is removed in order to simplify the drawing. Also, the sealing material 20 such as frit glass is not shown. In FIG. 7, the same reference numerals are given to the same constituent members as those in Embodiments 1 and 2 and the related art, and description thereof will be omitted. Hereinafter, the present embodiment will be described focusing on differences from the first and second embodiments.

  As shown in FIG. 7, getter leads 51 are connected to both ends of the energized getter 12 by welding. Reference numeral 13 denotes a welding point between the energized getter 12 and the getter lead 51. The getter lead 51 is led out of the vacuum apparatus, so that the getter 12 can be energized from outside the vacuum apparatus.

  When viewed in plan as shown in FIG. 7, like the pair of getter leads 31 of the first embodiment, the pair of getter leads 51 is on straight lines 13 c and 13 d that are substantially orthogonal to the axis 13 a that connects the pair of welding points 13. It is led out of the vacuum device through the position. That is, one of the pair of getter leads 51 extends substantially parallel to the straight line 13c from the welding point 13 to one side with respect to the axis 13a, and is bent along the straight line 13c, and then the side plate 3a and the anode substrate. 2 is led out of the vacuum device through a position where the straight line 13c of the sealing material 20 for sealing 2 passes, and the other is substantially parallel to the straight line 13d from the welding point 13 to the other side with respect to the axis 13a. After extending and bending along the straight line 13d, the sealing material 20 sealing the side plate 3a and the cathode substrate 1 passes through a position where the straight line 13d passes and is led out of the vacuum apparatus.

  Similarly to the getter lead 41 of the second embodiment, the width of the getter lead 51 is immediately after being derived from the sealing material 20 to the outside of the vacuum device as compared with the portion passing through the getter box 3 and the sealing material 20. The part of is wider. That is, the wide portion 52 is formed in a portion outside the vacuum apparatus near the sealing material 20 of the getter lead 51. In FIG. 7, the wide portion 52 is formed integrally with the getter lead 51, but the present invention is not limited to this, for example, a portion outside the vacuum device in the vicinity of the sealing material 20 of the getter lead 51 formed with a uniform width. Alternatively, the wide portion 52 may be joined by welding or the like. Further, the shape of the wide portion 52 is not limited to a quadrangle as shown in FIG.

  Thus, since this Embodiment 3 has the structure of Embodiment 1, 2, there exists an effect similar to having added the effect of Embodiment 1,2. That is, the frit glass of the sealing material 20 that seals the getter lead 51 is heated and evaporated by the heat of the getter lead 51, or the glass of the sealing material 20, the getter box 3, the cathode substrate 1, the anode substrate 2, and the like. No cracks occur in the vicinity of the getter lead 51 of the member. As a result, it is possible to prevent a problem that the degree of vacuum in the vacuum device is lowered and the vacuum device itself is broken.

  The third embodiment is the same as the first and second embodiments except for the above.

(Embodiment 4)
FIG. 8 is a plan view showing a schematic configuration of an electron source built-in vacuum apparatus according to Embodiment 4 of the present invention. FIG. 8 shows a state where the anode substrate 2 is removed in order to simplify the drawing. Also, the sealing material 20 such as frit glass is not shown. In FIG. 8, the same reference numerals are given to the same constituent members as in the first to third embodiments and the conventional one, and the description thereof is omitted. Hereinafter, the present embodiment will be described focusing on differences from the first to third embodiments.

  As shown in FIG. 8, two getter leads 61 are connected to both ends of the energized getter 12 by welding. Reference numeral 13 denotes a welding point between the energized getter 12 and the getter lead 61. The getter lead 61 is led out to the outside of the vacuum device, so that the getter 12 can be energized from outside the vacuum device.

  When viewed in plan as shown in FIG. 8, the two pairs of getter leads 61 are substantially the same with respect to the axis 13 a connecting the pair of welding points 13 as in the pair of getter leads 31 and 51 of the first and third embodiments. It is led out of the vacuum apparatus through positions on the orthogonal straight lines 13c and 13d. That is, one of the pair of getter leads 61 connected to one welding point 13 and one of the pair of getter leads 61 connected to the other welding point 13 are connected from the welding point 13 to the axis 13a. On the other hand, the straight lines 13c and 13d of the sealing material 20 that seals the side plate 3a and the anode substrate 2 after being bent substantially along the straight lines 13c and 13d on one side are parallel to the straight lines 13c and 13d. It passes through the passing position and is led out of the vacuum apparatus. The other of the pair of getter leads 61 connected to one welding point 13 and the other of the pair of getter leads 61 connected to the other welding point 13 are connected from the welding point 13 to the axis 13a. On the other hand, the straight lines 13c and 13d of the sealing material 20 that extend substantially parallel to the straight lines 13c and 13d and bend along the straight lines 13c and 13d are sealed. It passes through the passing position and is led out of the vacuum apparatus.

  Similarly to the getter lead 41 of the second embodiment, the width of the getter lead 61 is immediately after being led out of the vacuum device from the sealing material 20 as compared with the portion passing through the getter box 3 and the sealing material 20. The part of is wider. That is, the wide portion 62 is formed in a portion outside the vacuum device near the sealing material 20 of the getter lead 61. In FIG. 8, the wide portion 62 is formed integrally with the getter lead 61. However, the present invention is not limited to this. For example, a portion outside the vacuum device in the vicinity of the sealing material 20 of the getter lead 61 formed to have a uniform width. The wide portion 62 may be joined by welding or the like. Further, the shape of the wide portion 62 is not limited to a quadrangle as shown in FIG.

  As described above, in the fourth embodiment, each of the four getter leads 61 has the same configuration as the getter lead 51 of the third embodiment.

  In the fourth embodiment, a current can be passed to the energized getter 12 via the two getter leads 61 connected to one welding point 13. As a result, the current flowing through one getter lead 61 can be reduced to half that of the third embodiment, so that the amount of heat generated by the getter lead 61 itself during getter flash can be reduced. Accordingly, the frit glass of the sealing material 20 that seals the getter lead 61 is heated and evaporated by the heat of the getter lead 61, or glass members such as the sealing material 20, the getter box 3, the cathode substrate 1, and the anode substrate 2. The generation of cracks in the vicinity of the getter lead 61 can be suppressed to the third embodiment or more. As a result, it is possible to further prevent a problem that the degree of vacuum in the vacuum device is lowered and the vacuum device itself is broken.

  In addition, since two getter leads 61 are connected to one welding point 13, heat transferred from the energized getter 12 to one getter lead 61 is less than that in the third embodiment. Thereby, the temperature rise of each getter lead 61 can be suppressed. Accordingly, the frit glass of the sealing material 20 that seals the getter lead 61 is heated and evaporated by the heat of the getter lead 61, or glass members such as the sealing material 20, the getter box 3, the cathode substrate 1, and the anode substrate 2. The generation of cracks in the vicinity of the getter lead 61 can be suppressed to the third embodiment or more. As a result, it is possible to further prevent a problem that the degree of vacuum in the vacuum device is lowered and the vacuum device itself is broken.

  In the fourth embodiment, a current may be supplied to the energized getter 12 through only one of the two getter leads 61 connected to one welding point 13.

  Although FIG. 8 shows an example in which two getter leads 61 are connected to one welding point 13, three or more getter leads may be connected to one welding point 13.

  Although FIG. 8 shows an example in which the wide portion 62 is provided in the getter lead 61, a configuration in which the wide portion 62 is not provided in the getter lead 61 is also possible.

  The fourth embodiment is the same as the first to third embodiments except for the above.

  The energization type getter 12 shown in the first to fourth embodiments has an elongated shape extending in a straight line, but the energization type getter of the present invention is not limited to this, for example, an S-shape or a C-shape. It may be curved or bent. Further, the cross-sectional shape of the energization type getter 12 is not necessarily a square as shown in FIG. 11B, and may be various shapes such as a rectangle, a circle, an ellipse, and an oval.

  The vacuum devices shown in the first to fourth embodiments are connected to the exhaust pipe 5 through the communication holes 4 formed in the bottom plate 3 b of the getter box 3. This is because the vacuum device is formed by forming a vacuum structure with a sealed structure and then evacuating the internal space of the vacuum container through the exhaust pipe 5 under an atmospheric pressure atmosphere and then sealing the exhaust pipe 5. is there. However, the vacuum apparatus of the present invention is not limited to this, and the communication hole 4 and the exhaust pipe 5 are not necessary when the vacuum apparatus can be completed in a vacuum atmosphere in a vacuum chamber, for example.

  In the vacuum apparatuses shown in the first to fourth embodiments, the getter box 3 is disposed on the lower side (the side opposite to the anode substrate 2) with respect to the cathode substrate 1, but the position of the getter box 3 is limited to this. Not. For example, the getter box 3 may be arranged on the upper side (opposite side of the cathode substrate 1) with respect to the anode substrate 2, or outward from the edges of the cathode substrate 1 and the anode substrate 2 (the cathode substrate 1 and the anode). You may arrange | position so that it may protrude in the direction parallel to the main surface of the board | substrate 2. In the vacuum apparatus shown in the first to fourth embodiments, the communication hole 4 and the exhaust pipe 5 provided in the getter box 3 are provided in the bottom plate 3b of the getter box 3 and are exhausted downward. However, the present invention is not limited to this. For example, the communication hole 4 and the exhaust pipe 5 may be provided in the side plate 3a of the getter box 3 so as to exhaust in the lateral direction, or the getter box 3 may be disposed above the anode substrate 2 as described above. It may be arranged to be exhausted upward or laterally, or the getter box 3 may be protruded outward as described above and exhausted downward, upward or laterally. Also good. Furthermore, in the vacuum apparatus shown in the first to fourth embodiments, the getter box 3 is composed of the side plate 3a and the bottom plate 3b. However, the getter box 3 may be composed of a single component in which these are integrated, or You may further have components other than the side plate 3a and the baseplate 3b. As described above, the present invention is not limited to the first to fourth embodiments described above, and can be implemented with various modifications. In any embodiment, the configuration of the present invention described above by the getter lead is described. In such a case, the above-described effects of the present invention can be obtained.

  The field of application of the vacuum device of the present invention is not particularly limited, but can be used for all kinds of vacuum devices with a built-in electron source, including, for example, a field emission display device (Field Emission Device).

FIG. 1 is a plan view showing a schematic configuration of an electron source built-in vacuum apparatus according to Embodiment 1 of the present invention. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3 is an enlarged plan view showing one end of an energization type getter of the electron source built-in vacuum apparatus according to Embodiment 1 of the present invention and a getter lead connected thereto. FIG. 4 is a plan view showing a schematic configuration of an electron source built-in vacuum apparatus according to Embodiment 2 of the present invention. FIG. 5 is a cross-sectional view taken along line VV in FIG. FIG. 6 is an enlarged plan view showing one end of an energization type getter of the vacuum device with a built-in electron source according to Embodiment 2 of the present invention and a getter lead connected thereto. FIG. 7 is a plan view showing a schematic configuration of an electron source built-in vacuum apparatus according to Embodiment 3 of the present invention. FIG. 8 is a plan view showing a schematic configuration of an electron source built-in vacuum apparatus according to Embodiment 4 of the present invention. FIG. 9 is a plan view showing a schematic configuration of a conventional electron source built-in vacuum apparatus. FIG. 10 is a plan view showing the vicinity of a getter box in a conventional vacuum apparatus with a built-in electron source. FIG. 11A is an enlarged plan view showing a current-carrying getter and a getter lead near the welding point in the conventional conventional electron source built-in vacuum device shown in FIG. 10, and FIG. Is a cross-sectional view taken along line XIB-XIB in FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cathode board | substrate 2 Anode board | substrate 3 Getter box 4 Communication hole 5 Exhaust pipe 11, 31, 41, 51, 61 Getter lead 12 Electricity type getter 13 Welding point 14 Getter mixture 15 Metal case (getter container)
20 Sealing material (frit glass)
42, 52, 62 Wide part

Claims (4)

A first substrate having a cathode electrode on which an emitter is formed, a second substrate having an anode electrode spaced apart from the first substrate in the direction of electron emission from the emitter, and an energized getter A vacuum apparatus having an internal space that is a vacuum,
Getter leads for energizing the energized getter are respectively connected to both ends of the energized getter, and the getter leads are straight lines connecting connection points with the getter leads at both ends of the energized getter. A vacuum apparatus that is led out of the vacuum apparatus through a position on a substantially orthogonal straight line. A first substrate having a cathode electrode on which an emitter is formed, a second substrate having an anode electrode spaced apart from the first substrate in the direction of electron emission from the emitter, and an energized getter A vacuum apparatus having an internal space that is a vacuum,
Getter leads for energizing the energized getter are respectively connected to both ends of the energized getter, and the getter lead is positioned at or near the position immediately after the getter lead is led out of the vacuum apparatus. Or a member having a width wider than that of the getter lead is bonded to the getter lead.   The vacuum apparatus according to claim 2, wherein the getter lead is led out of the vacuum apparatus through a position on a straight line that is substantially orthogonal to a straight line connecting connection points of the both ends of the energized getter with the getter lead. .   The vacuum apparatus according to claim 1, wherein the number of getter leads connected to one end of the energized getter is plural.

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