JP2002358915A - Image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image display device with excellent display performance by keeping a vacuum envelope in a high degree of vacuum. SOLUTION: A vacuum envelope 10 of the image display device is provided with a back face substrate 12 and a front face substrate 11 opposed to each other, side walls 18 arranged between the back face substrate and the front face substrate, and a plurality of support members 14 arranged between the back face substrate and the front face substrate supporting atmospheric pressure load acting on there substrates. The front face substrate and the side walls are sealed together through an aluminum film. The height of the plurality of the support members are formed lower than that of the side walls.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image display device having a substrate arranged oppositely, and a plurality of electron-emitting devices provided on the inner surface of one of the substrates, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, there has been a demand for an image display device for high-definition broadcasting or a high-resolution image display associated therewith, and the screen display performance is required to be even more severe. In order to achieve these demands, it is necessary to flatten the screen surface and increase the resolution, and at the same time, it is necessary to reduce the weight and thickness.

As an image display device that satisfies the above demands, for example, a flat display device such as a field emission display (hereinafter, referred to as FED) has attracted attention. The FED has a front substrate and a rear substrate which are opposed to each other with a predetermined gap therebetween, and these substrates are joined to each other directly or via a rectangular frame-shaped side wall. Is composed. A phosphor screen is formed on the inner surface of the front substrate, and a plurality of electron-emitting devices are provided on the inner surface of the rear substrate as electron emission sources for exciting the phosphor to emit light.

In order to support the atmospheric load applied to the rear substrate and the front substrate, a plurality of support members are disposed between the substrates. An exhaust pipe for exhausting the inside after sealing the vacuum envelope is provided at an end of the rear substrate. In this FED, an electron beam emitted from the electron-emitting device is irradiated on the phosphor screen,
When the phosphor screen emits light, an image is displayed.

In such an FED, the size of the electron-emitting device is on the order of micrometers, and the distance between the front substrate and the rear substrate can be set on the order of millimeters. Therefore, higher resolution, lighter weight, and thinner thickness can be achieved as compared with a cathode ray tube (CRT) used as a display of a current television or computer.

[0006]

However, in the above-described flat display device, the length of the exhaust pipe protruding from the vacuum envelope is increased, although the thickness of the vacuum envelope can be reduced. The length is longer than the thickness specified by the rear substrate, the side wall, and the transparent substrate. This exhaust pipe has no particular use after the vacuum envelope is completed and is unnecessary.
The entire flat display device becomes thicker by the length of the exhaust pipe.

In the above-described flat display device, the degree of vacuum inside the vacuum envelope is set to, for example, 10 ⁻⁷ to 10 ⁻⁸ Torr.
Need to be kept. In the conventional evacuation process, the surface adsorbed gas inside the envelope is released by a baking process of heating the vacuum envelope to about 300 ° C.

[0008] However, such an exhaust method cannot sufficiently release the surface adsorbed gas. Therefore, for example, Japanese Patent Application Laid-Open No. 9-82245 discloses that a metal back formed on a phosphor screen of a front substrate is made of Ti, Z
or a structure in which the metal back itself is formed of the above-mentioned getter material, or a portion other than the electron-emitting device in the image display area. A flat panel display device having a configuration in which materials are arranged is described. Attempts have been made to increase the degree of vacuum in the vacuum envelope by absorbing the gas in the vacuum envelope with the getter material.

However, in the image display device disclosed in Japanese Patent Application Laid-Open No. 9-82245, since the getter material is formed in a normal panel process, the surface of the getter material is naturally oxidized. Since the getter material is particularly important in the degree of surface activity, a getter material whose surface has been oxidized cannot obtain a satisfactory gas adsorption effect.

In view of the above, the present inventors disclosed in Japanese Patent Application No. 11-122220 filed earlier that the back substrate, the side wall, and the front substrate were put into a vacuum apparatus, and these backing, electron beam irradiation and electron beam irradiation were performed in a vacuum atmosphere. A method has been proposed in which a getter film is formed after irradiation to release the surface adsorption gas, and the side wall and the back substrate and the front substrate are sealed using frit glass or indium in a vacuum atmosphere. .

According to this method, the surface adsorbed gas can be sufficiently released by the electron beam cleaning, and the getter film is not oxidized, so that a sufficient gas adsorbing effect can be obtained. Further, since no exhaust pipe is required, the space of the image display device is not wasted.

On the other hand, when sealing is performed using frit glass in a vacuum, a large number of air bubbles are generated from the frit glass, and the airtightness and sealing strength of the vacuum envelope are deteriorated, and the reliability is reduced. There was a problem of lowering. In addition, when sealing is performed using indium, there is a problem that handling becomes difficult because the viscosity of the indium decreases and flows at a baking temperature.

The present invention has been made in view of the above points, and an object of the present invention is to provide an image display device which maintains a vacuum envelope at a high degree of vacuum and has excellent display performance.

[0014]

In order to achieve the above object, an image display apparatus according to the present invention comprises a rear substrate and a front substrate opposed to each other, and a side wall provided between the rear substrate and the front substrate. A plurality of support members provided between the rear substrate and the front substrate and supporting an atmospheric load acting on the front substrate and the rear substrate; anda vacuum envelope having a plurality of support members formed on an inner surface of the front substrate. A phosphor screen provided on the back substrate, and an electron emission source for emitting an electron beam to the phosphor screen to emit light from the phosphor screen, wherein at least one portion of the vacuum envelope is a metal film. The height of the plurality of support members is smaller than the height of the side wall.

According to another aspect of the present invention, there is provided an image display apparatus comprising: a rear substrate and a front substrate facing each other; a side wall provided between the rear substrate and the front substrate; A vacuum envelope having a plurality of support members provided on the front substrate and supporting an atmospheric pressure acting on the rear substrate, a phosphor screen formed on an inner surface of the front substrate, and the rear substrate An electron emission source that emits an electron beam to the phosphor screen to emit light from the phosphor screen, wherein at least one portion of the vacuum envelope is sealed to each other via a metal film, The side wall has a plurality of protrusions protruding outward, and the metal film has connection terminals for extending on the protrusions and applying a voltage to the metal film. .

Further, another image display device according to the present invention comprises a rear substrate and a front substrate opposed to each other; a substantially rectangular frame-shaped side wall provided between the rear substrate and the front substrate; And a plurality of support members provided between the front substrate and the atmospheric pressure load acting on the front substrate and the rear substrate, and a phosphor screen formed on the inner surface of the front substrate And an electron emission source that is provided on the back substrate and emits an electron beam to the phosphor screen to cause the phosphor screen to emit light. At least one portion of the vacuum envelope is mutually separated via a metal film. It is characterized in that each corner portion of the side wall is sealed and formed in a polygonal shape or a smooth curved shape.

According to the image display device configured as described above, the sealing is performed via the metal film, so that the device can be easily handled even in a vacuum, and can be easily and reliably surrounded by the vacuum. The vessel can be sealed. Furthermore, since each support member is formed lower than the side wall, the front substrate is reliably brought into contact with the joining surface of the side wall without any gap, and an image display device having high vacuum tightness can be obtained.

Further, by providing a plurality of protrusions on the side wall 18 for use in applying a voltage to the metal film, even if a connection terminal is peeled off from one protrusion, the connection terminal provided on another protrusion is provided. Can be used for sealing, and reliable sealing can be achieved. Further, by making each corner portion of the side wall a polygonal shape or a smooth curved shape, floating of the sealing portion at the outer portion of the corner can be prevented, and the side wall and the substrate can be hermetically sealed on the entire surface.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment in which an image display device of the present invention is applied to an FED will be described in detail with reference to the drawings.

As shown in FIGS. 1 to 3, this FED
Includes a rectangular insulating substrate, for example, a front substrate 11 and a rear substrate 12 made of a glass plate, and these substrates are opposed to each other with a gap of 1.6 mm, for example. The size of the rear substrate 12 is larger than that of the front substrate 11, and a lead wire (not shown) for inputting a video signal described later is formed on an outer peripheral portion thereof.
The front substrate 11 and the rear substrate 12 are joined to each other via a rectangular frame-shaped side wall 18 to form a flat rectangular vacuum envelope 10 whose inside is maintained in a vacuum state. .

Inside the vacuum envelope 10, a front substrate 11 is provided.
And to support the atmospheric pressure load applied to the rear substrate 12,
A plurality of elongated plate-shaped support members 14 are provided. These support members extend in a direction parallel to the long side of the vacuum envelope 10 and are arranged at predetermined intervals along a direction parallel to the short side.

The space between the rear substrate 12 and the side wall 18 and the space between the rear substrate and the support member 14 are sealed with a low-melting glass 30 such as frit glass. The thickness of the low-melting glass 30 is set to about 100 μm. An aluminum film 3 is provided between the front substrate 11 and the side wall 18.
2 are joined. The thickness of this aluminum film 32 is set to about 0.1 μm. Since the bonding by the aluminum film is performed in a vacuum atmosphere, a conventional exhaust pipe is not required.

As shown in FIG. 4, the plurality of support members 14 have a height a of the side wall 18 and a height b of the support member 14.
Are formed such that a> b. With such a configuration, the front substrate 11 is in close contact with the side wall 18 over the entire bonding surface without being interfered by the support member 14, and can be bonded without a gap. Therefore, even in the case of a large-sized substrate, it is possible to stably secure the vacuum tightness.

Theoretically, if a = b, air-tight bonding can be performed. However, in practice, the height of the supporting member 14 when it is formed, or when the supporting member 14 is bonded to the Due to the variation in the joining height, the height b of the support member may slightly differ depending on the positions p1, p2, p3,. Therefore, when a = b is designed, a portion where a <b occurs in the actual vacuum envelope 10, and in this case, the front substrate 11 is interfered by the support member 14, and the side wall 18
Therefore, it is difficult to adhere tightly to the surface, and it is difficult to stably secure vacuum tightness. Therefore, the height a of the side wall 18 and the height b of the support member 14 are set so that a> b.

For example, in this embodiment, the height a of the side wall is set to 1.5 mm, and the height b of each support member 14 is set.
Is set to 1.47 mm. It is desirable that the difference between the heights a and b is set to about 0.005 to 0.1 mm. If the difference is less than 0.005 mm, it is difficult to control the height variation and the joining height variation of the support member with this accuracy, and therefore it is highly possible that a> b. On the other hand, if the thickness exceeds 0.1 mm, the stress applied to the glass due to the atmospheric pressure load increases, which causes a problem in reliability as a vacuum envelope.

In the case of a> b as described above, the stress distribution due to the atmospheric pressure load differs from that of the conventional vacuum envelope. As shown in FIG. 4, in the present embodiment, the position at which the tensile stress changes is a position f1 at which the front substrate 11 warps due to a change in the height of the support member 14, and the position at which the front substrate 11
Are the outer surface side positions f2, f3,... Among them, f1 has a higher tensile stress than the conventional one, but its magnitude is smaller than f2, f3,..., And f2, f3,. , Its size is smaller than before.

Further, the support member 1 of the inner surface of the front substrate 11 is provided.
It is known that the tensile stress at the portion where the glass substrate 4 comes into contact increases, but the tensile stress generated in such a minute area cannot be a base point for breaking glass, and the glass substrate has a higher strength than usual. (For example, "Micro Strength
Of Glass "The Journal of the American Ceramic Society), (" Micro strength o
f Glass '' The Journalof the American Ceramic Societ
y) Volume 6, No. 28, 145, 146, 1945).
Therefore, the vacuum envelope 10 can ensure the atmospheric pressure resistance equal to or higher than the conventional one.

The support member 14 is not limited to the above-described elongated plate shape, but may have a configuration in which short plate-like support members as shown in FIG. 5 are arranged in a plurality of rows, or a column shape. As the columnar support member 14, FIG.
Alternatively, as shown in FIG. 6 (c), various shapes such as a columnar shape, a prismatic shape, or a cross-shaped cross section can be used.
When a support member having a cross-shaped cross section is used, a matrix-type black light absorption layer and a phosphor layer may be formed, and the support member may be positioned and sealed with respect to the black light absorption layer.

As shown in FIG. 7, a phosphor screen 16 is formed on the inner surface of the front substrate 11. The phosphor screen 16 is formed of phosphor layers R, G, and B that emit light in three colors of red, green, and blue, and a black light absorbing portion 20 in a matrix. The above-mentioned support member 14 is arranged so as to be hidden by the shadow of the black light absorbing portion. Note that a metal back layer 17 made of, for example, an aluminum layer is deposited on the phosphor screen 16.

As shown in FIG. 3, on the inner surface of the rear substrate 12, a large number of electron-emitting devices 22 each emitting an electron beam are provided as electron emission sources for exciting the phosphor layer of the phosphor screen 16. ing. These electron-emitting devices 22 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. More specifically, a conductive cathode layer 24 is formed on the inner surface of the rear substrate 12, and a silicon dioxide film 26 having a number of cavities 25 is formed on the conductive cathode layer. Silicon dioxide film 26
A gate electrode 28 made of molybdenum, niobium, etc.
Are formed. In each cavity 25 on the inner surface of the back substrate 12, a cone-shaped electron-emitting device 22 made of molybdenum or the like is provided.

In the FED configured as described above,
The video signal is input to the electron-emitting device 22 and the gate electrode 28 formed in a simple matrix system. On the basis of the electron-emitting device, +10 at the highest luminance state
A gate voltage of 0 V is applied. Further, +10 kV is applied to the phosphor screen 16. Thereby, an electron beam is emitted from the electron-emitting device 22. The magnitude of the electron beam emitted from the electron-emitting device is modulated by the voltage of the gate electrode 28, and the electron beam excites the phosphor layer of the phosphor screen 16 to emit light, thereby displaying an image.

Next, a method of manufacturing the FED configured as described above will be described in detail. First, an electron-emitting device is formed on a sheet glass for a rear substrate. In this case, a matrix-like conductive cathode layer 24 is formed on a sheet glass,
On this conductive cathode layer, for example, thermal oxidation method, CVD
An insulating film 26 of a silicon dioxide film is formed by a sputtering method or a sputtering method.

Thereafter, a metal film for forming a gate electrode such as molybdenum or niobium is formed on the insulating film 26 by, for example, a sputtering method or an electron beam evaporation method. Next, a resist pattern having a shape corresponding to the gate electrode to be formed is formed on the metal film by lithography. Using this resist pattern as a mask, the metal film is etched by a wet etching method or a dry etching method to form a gate electrode 28.

Next, the resist pattern and the gate electrode 2
The cavity 25 is formed by etching the insulating film 26 by wet etching or dry etching using the mask 8 as a mask. After removing the resist pattern, the gate electrode 28 is formed by performing electron beam evaporation from a direction inclined at a predetermined angle with respect to the surface of the rear substrate 12.
A release layer made of, for example, aluminum or nickel is formed thereon. Thereafter, for example, molybdenum as a material for forming a cathode is deposited by an electron beam evaporation method from a direction perpendicular to the surface of the back substrate 12. by this,
The electron-emitting device 22 is formed inside each cavity 25. Subsequently, the release layer together with the metal film formed thereon is removed by a lift-off method.

Next, as shown in FIG. 8, a rectangular frame-shaped side wall 18 is cut from sheet glass, and one surface, that is,
An aluminum film (first metal film) 32 is deposited on the surface to be joined to the front substrate 11. In this case, an outwardly protruding portion 40 is integrally formed on the side wall 18 in advance, and the aluminum film 32 is also formed on the protruding portion 40. A portion of the aluminum film 32 located on the protruding portion 40 is exposed to the outside and functions as a connection terminal 32a when a voltage is applied, which will be described later.

Subsequently, as shown in FIG. 9, the side wall 18 and the plurality of support members 14 are joined on the back substrate 12 by the low melting point glass 30. At this time, the surface of the side wall 18 opposite to the surface on which the aluminum film 32 is formed is joined to the inner peripheral edge of the rear substrate 12.

On the other hand, a phosphor screen 16 is formed on a plate glass serving as the front substrate 11. For this, a glass plate having the same size as the front substrate 11 is prepared, and a stripe pattern of the phosphor layer is formed on the glass plate by a plotter machine. The plate glass on which the phosphor stripe pattern is formed and the plate glass for the front substrate are placed on a positioning jig and set on an exposure table, thereby exposing and developing to form a phosphor screen 16.

Next, a metal back layer 17 made of an aluminum film is formed over the phosphor screen 16.
Further, as shown in FIG. 9, a rectangular frame-shaped aluminum film (having a size corresponding to the size of the side wall 18) is formed on the surface opposite to the surface on which the phosphor screen 16 is formed, that is, on the peripheral portion of the outer surface of the front substrate 11. A two-metal film 34 is formed.

As described above, the side wall 18 and the support member 14
The rear substrate 12 on which is sealed and the front substrate 11 on which the phosphor screen 16 and the aluminum film 34 are formed are placed in the vacuum processing apparatus 100 in a state where they are opposed to each other with a predetermined gap therebetween. . In the above-described series of steps, for example, a vacuum processing apparatus 100 as shown in FIG. 10 is used.

The vacuum processing apparatus 100 includes a load chamber 101, a baking chamber, and an electron beam cleaning chamber 1 provided in order.
02, a cooling chamber 103, a getter film deposition chamber 104, an assembly chamber 105, a cooling chamber 106, and an unloading chamber 107. Each of these chambers is configured as a processing chamber capable of performing vacuum processing, and all the chambers are evacuated during the manufacture of the FED. Adjacent processing chambers are connected by a gate valve or the like.

The above-described rear substrate 12, the side wall 18, the support member 14, the assembly of the aluminum film 32, and the front substrate 11 on which the aluminum film 34 is formed
1, the inside of the load chamber 101 is made into a vacuum atmosphere, and then sent to the baking and electron beam cleaning chamber 102. In the baking / electron beam cleaning room 102, the assembly and the front substrate are heated to a temperature of 300 ° C. to release the surface adsorbed gas of each member.

Simultaneously with the heating, an electron beam is applied from the electron beam generator (not shown) attached to the baking and electron beam cleaning chamber 102 to the phosphor screen surface of the front substrate 11 and the electron emission element surface of the rear substrate 12. Irradiate. Since the electron beam is deflected and scanned by a deflecting device mounted outside the electron beam generator, it is possible to clean the entire surface of the phosphor screen surface and the electron emission element surface with the electron beam.

After heating and electron beam cleaning, the assembly and the front substrate are sent to a cooling chamber 103 and cooled to a temperature of about 100 ° C., for example. Subsequently, the assembly and the front substrate are sent to a deposition chamber 104 for getter film formation, where a Ba film is deposited as a getter film outside the phosphor screen. Since the surface of the Ba film can be prevented from being contaminated with oxygen, carbon, or the like, the Ba film can maintain an active state.

Subsequently, the assembly and the front substrate are sent to the assembly chamber 105. In the assembly chamber 105, the assembly and the front substrate are heated up to 400 ° C., and the front substrate and the rear substrate are pressed with a predetermined pressure with the side wall interposed therebetween.
Then, as shown in FIG. 11, the connection terminals 32a of the aluminum film 32 formed on the protrusions 40 of the side walls 18 are formed.
A high-voltage terminal is brought into contact with the aluminum film 34 on the front substrate 11, and a ground terminal is brought into contact with the aluminum film 34, whereby a DC voltage of 1000 V is applied between the aluminum films 32 and 34. Thus, the side wall 18 and the front substrate 11 are sealed by the aluminum film 32, and a vacuum envelope is formed.

The vacuum envelope thus formed is
After being cooled to room temperature in the cooling chamber 106, the unloading chamber 1
It is sent to 07 and taken out. Thereafter, the protrusion 40 of the side wall 18 is cut and removed to complete the FED. Although the aluminum film 34 remains on the surface of the front substrate 11, the aluminum film 34 is located inside the cabinet and is not exposed to the outside when the FED is incorporated in a television receiver or the like.

According to the FED configured as described above,
By performing the sealing between the side wall and the front substrate in a vacuum atmosphere, the surface adsorbed gas can be sufficiently released by using the baking and the electron beam cleaning in combination, and the getter film is not oxidized and has a sufficient gas adsorbing effect. Can be maintained. Also,
By sealing through the aluminum film 32, handling is easy even in a vacuum, and the sealing of the vacuum envelope can be performed easily and reliably. Furthermore, since each support member is formed lower than the side wall, the front substrate can be reliably brought into contact with the joining surface of the side wall without any gap, and an FED having high vacuum tightness can be obtained.

Next, an FED according to a second embodiment of the present invention will be described. As shown in FIG. 12, according to the second embodiment, the configuration of the FED is basically the same as that of the above-described first embodiment, but the protrusion 40 for applying a high pressure used at the time of sealing is not provided. A plurality is provided on the side wall 18.

For example, a vapor-deposited film that is vacuum-deposited on the side wall 18 as a metal film for bonding has a low adhesive strength. Therefore, when the high-voltage terminal is rubbed when the high-voltage terminal is brought into contact, the protrusion 4
0 There is a possibility of peeling from the surface. in this case,
Since a high voltage cannot be applied to the metal film, the front substrate 11 and the side wall 18 are not sealed, and a vacuum envelope is not formed. Therefore, as in the second embodiment, by providing a plurality of protrusions 40 for applying a high voltage on the side wall 18, even when the connection terminal 32 a is peeled off from one protrusion 40.
Sealing can be performed using connection terminals provided on the other protrusions 40.

Further, when the front substrate 11 and the side wall 18 are joined, an appropriate load is applied to the plurality of protrusions 40 to suppress the warp of the rear substrate and the side wall due to the heat distribution when the metal film is electrically heated. The bonding surface between the front substrate and the side wall can be brought into close contact with high accuracy.
This makes it possible to manufacture a vacuum envelope by performing sealing with a high yield even for a large-sized substrate.

Next, an FED according to a third embodiment of the present invention will be described. As shown in FIG. 13, according to the present embodiment, each corner of side wall 18 formed in a rectangular frame shape is formed in a quarter arc shape. The present inventors have made a prototype of the above-described vacuum envelope, and as a result of repeated examination, when the corner seals the right-angled side wall 18 and the front substrate, the vacuum tightness of the vacuum envelope is secured. However, as shown in FIG. 14, it has been found that a portion that is not hermetically sealed occurs at the outside of the corner of the side wall 18. This is considered to be caused by the fact that the substrate surface located in the region inside the side wall 18 is deformed by the atmospheric pressure load, and the outside of the corner relatively floats. Even in such a state, the vacuum tightness of the vacuum envelope is ensured, but in some cases, the airtight width of the side wall corner part may be less than half of other parts, so that it may be improved. More desirable.

According to the present embodiment, FIGS.
As shown in FIG. 5A, each corner of the side wall 18 is formed into a smooth curved shape, or is formed into a polygonal shape as shown in FIG. As a result, the sealing portion does not rise, and the corner portion of the side wall 18 can be hermetically sealed on the entire surface. In a third embodiment,
Other configurations are the same as those of the above-described first embodiment, and a detailed description thereof will be omitted.

The present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the present invention. For example, in the above-described embodiment, the configuration in which the front substrate and the side wall are sealed with the aluminum film has been described. However, the present invention is not limited to this, and the rear substrate and the side surface, the front substrate and the support member, and the rear substrate and the support The member may be sealed with a metal film. The metal film used for sealing is not limited to aluminum, and another metal film such as chromium or molybdenum may be used.

For example, it is also possible to seal the front substrate and the support member via an aluminum layer deposited on the phosphor screen. As described above, the phosphor screen is vacuum-deposited with an aluminum layer serving as a metal back. Therefore, an earth electrode film is formed in advance on one surface of the support member, and the opposite surface is positioned at the position of the black light absorbing layer of the phosphor screen. Then, by applying a high voltage to the aluminum layer and grounding the grounding electrode film of the support member, the support member can be sealed to the phosphor screen.

The electron-emitting device may be a pn-type cold cathode device or a surface conduction electron-emitting device. Further, in the above-described embodiment, the configuration is provided with the independent side wall. However, the peripheral portion of the front substrate or the rear substrate may be bent to have the same function as the side wall. Further, the present invention is applicable to other flat display devices such as a plasma display panel.

[0055]

As described in detail above, according to the present invention,
In an image display device having a plurality of electron-emitting devices, the vacuum envelope can be maintained at a high degree of vacuum, and an image display device excellent in display performance can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an FED according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a state where a front substrate of the FED is removed.

FIG. 3 is a sectional view taken along line AA of FIG. 1;

FIG. 4 is a cross-sectional view schematically showing the relationship between the height of a side wall and a supporting member in the FED.

FIG. 5 is a perspective view corresponding to FIG. 2 and showing a modification of the support member in the FED.

FIG. 6 is a perspective view showing another modified example of the support member.

FIG. 7 is a plan view showing a phosphor screen of the FED.

FIG. 8 is a perspective view showing a side wall on which an aluminum film is formed.

FIG. 9 shows a back substrate, a side wall, and an unsealed state in the FED.
FIG.

FIG. 10 is a view schematically showing a vacuum processing apparatus used for manufacturing the FED.

FIG. 11 is a sectional view showing a step of applying a voltage to the aluminum film in the manufacturing process of the FED according to the first embodiment.

FIG. 12 is a perspective view showing an FED according to a second embodiment of the present invention.

FIG. 13 is a perspective view schematically showing a state in which a front substrate is removed in the FED according to the third embodiment of the present invention.

FIG. 14 is a plan view schematically showing a sealed state when a corner uses a right-angled side wall.

FIG. 15 is a plan view showing a modification of the corner portion of the side wall.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Vacuum envelope 11 ... Front substrate 12 ... Back substrate 14 ... Support member 16 ... Phosphor screen 17 ... Metal back layer 18 ... Side wall 22 ... Electron emission element 30 ... Low melting point glass 32, 34 ... Aluminum film 32a ... Connection Terminal 40: Projection 100: Vacuum processing device

Claims (5)

[Claims] 1. A back substrate and a front substrate which are opposed to each other, a side wall provided between the rear substrate and the front substrate, and a front surface substrate and a rear substrate which are provided between the rear substrate and the front substrate. A vacuum envelope having a plurality of support members for supporting an atmospheric pressure load to be applied; a phosphor screen formed on an inner surface of the front substrate; and An electron emission source that emits a beam to emit light from the phosphor screen, wherein at least one portion of the vacuum envelope is sealed to each other via a metal film, and the height of the plurality of support members is the side wall. An image display device formed to be lower than the height of the image display. 2. A back substrate and a front substrate which are opposed to each other, a side wall provided between the rear substrate and the front substrate, and a function provided on the front substrate and the rear substrate provided between the rear substrate and the front substrate. A vacuum envelope having a plurality of support members for supporting an atmospheric pressure load to be applied; a phosphor screen formed on an inner surface of the front substrate; and An electron emission source that emits a beam to emit light from the phosphor screen, wherein at least one portion of the vacuum envelope is sealed to each other via a metal film, and the side wall has a plurality of outwardly projecting protrusions. An image display device comprising: a metal film; and a connection terminal for applying a voltage to the metal film. 3. A rear substrate and a front substrate which are opposed to each other, a substantially rectangular frame-shaped side wall provided between the rear substrate and the front substrate, and the front substrate provided between the rear substrate and the front substrate. And a plurality of support members for supporting an atmospheric pressure load acting on the rear substrate; and a vacuum envelope having: a phosphor screen formed on an inner surface of the front substrate; and An electron emission source for emitting an electron beam to the phosphor screen to emit light from the phosphor screen, wherein at least one portion of the vacuum envelope is sealed to each other via a metal film, and each corner of the side wall is An image display device having a polygonal shape or a smooth curved shape. 4. The method according to claim 1, wherein at least one of the space between the front substrate and the side wall and the space between the rear substrate and the side wall is sealed via the metal film. The image display device according to claim 1. 5. The metal film has a first metal film formed on the side wall and sealed to an inner surface of the front substrate, wherein the front substrate faces the first metal film. The image forming apparatus according to claim 4, further comprising a second metal film formed on an outer surface of the front substrate and for applying a voltage between the first metal film and the first metal film.