JP2002100311A - Picture display device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a picture display device and its manufacturing method wherein sealing can be easily and surely made in a vacuum atmosphere. SOLUTION: A vacuum package 10 of the picture display device has a rear face substrate 12 and a front face substrate 11, which are arranged opposing to each other, and a side wall 18 arranged between the rear face substrate and the front face substrate. The rear face substrate and the side wall are sealed together with a low melting point glass 30. The front face substrate and the side wall are sealed together via an aluminum film 32. Another aluminum film 34 opposing to the aluminum film 32 via this front face substrate is formed in an external face peripheral part of the front face substrate. The sealing of the front face substrate with the side wall is performed by a voltage applied between the aluminum films 32, 34.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image display device having a substrate arranged oppositely and a large number of electron-emitting devices provided on the inner surface of one of the substrates, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, there has been a demand for an image display device for high-definition broadcasting or a high-resolution image display associated therewith. In order to achieve these demands, it is necessary to flatten the screen surface and increase the resolution, and at the same time, it is necessary to reduce the weight and thickness.

As an image display device that satisfies the above demands, for example, a flat display device such as a field emission display (hereinafter, referred to as FED) has attracted attention. The FED has a front substrate and a rear substrate that are arranged to face each other with a predetermined gap therebetween. Make up. A phosphor screen is formed on the inner surface of the front substrate, and a number of electron-emitting devices are provided on the inner surface of the rear substrate as electron emission sources for exciting the phosphor to emit light.

In order to support the atmospheric load applied to the rear substrate and the front substrate, a plurality of support members are provided between these substrates. An exhaust pipe for exhausting the inside after sealing the vacuum envelope is provided at an end of the rear substrate. In this FED, an image is displayed by irradiating the phosphor screen with an electron beam emitted from the electron-emitting device and causing the phosphor screen to emit light.

In such an FED, the size of the electron-emitting device is on the order of micrometers, and the distance between the front substrate and the rear substrate can be set on the order of millimeters. Therefore, higher resolution, lighter weight, and thinner thickness can be achieved as compared with a cathode ray tube (CRT) used as a display of a current television or computer.

[0006]

However, in the above-mentioned flat display device, although the vacuum envelope can be formed thin, the length of the exhaust pipe protruding from the vacuum envelope can be reduced. The length is longer than the thickness defined by the rear substrate, the side wall, and the transparent substrate. After the vacuum envelope is completed, this exhaust pipe has no particular use and is unnecessary, and the entire flat display device becomes thicker by the length of the exhaust pipe.

In the above-mentioned flat display device, the degree of vacuum inside the vacuum envelope is set to, for example, 10 ⁻⁷ to 10 ⁻⁸ Torr.
Need to be kept. In the conventional evacuation process, the surface adsorbed gas inside the envelope was released by baking treatment of heating the vacuum envelope to about 300 ° C.

[0008] However, such an exhaust method cannot sufficiently release the surface adsorbed gas. Therefore, for example, Japanese Patent Application Laid-Open No. 9-82245 discloses that a metal back formed on a phosphor screen of a front substrate is made of Ti, Z
or a structure in which the metal back itself is formed of the above-mentioned getter material, or a portion other than the electron-emitting device in the image display area. A flat panel display device having a configuration in which materials are arranged is described. Attempts have been made to increase the degree of vacuum in the vacuum envelope by absorbing the gas in the vacuum envelope with the getter material.

However, in the image display device disclosed in Japanese Patent Application Laid-Open No. 9-82245, since the getter material is formed in a normal panel process, the surface of the getter material is naturally oxidized. Since the getter material is particularly important in the degree of surface activity, a getter material whose surface has been oxidized cannot obtain a satisfactory gas adsorption effect.

In view of the above, the present inventors disclosed in Japanese Patent Application No. 11-122220 filed earlier that the back substrate, the side wall, and the front substrate were put into a vacuum apparatus, and these backing, electron beam irradiation and electron beam irradiation were performed in a vacuum atmosphere. A method has been proposed in which a getter film is formed after irradiation to release the surface adsorption gas, and the side wall and the back substrate and the front substrate are sealed using frit glass or indium in a vacuum atmosphere. .

According to this method, the surface adsorbed gas can be sufficiently released by the electron beam cleaning, and the getter film is not oxidized, so that a sufficient gas adsorbing effect can be obtained. Further, since no exhaust pipe is required, the space of the image display device is not wasted.

On the other hand, when sealing is performed using frit glass in a vacuum, a large number of air bubbles are generated from the frit glass, and the airtightness and sealing strength of the vacuum envelope are deteriorated, and the reliability is reduced. There was a problem of lowering. In addition, when sealing is performed using indium, there is a problem that handling becomes difficult because the viscosity of the indium decreases and flows at a baking temperature.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide an image display device capable of easily and reliably sealing in a vacuum atmosphere, and a method of manufacturing the same. is there.

[0014]

In order to achieve the above object, an image display apparatus according to the present invention comprises a rear substrate and a front substrate opposed to each other, and a side wall provided between the rear substrate and the front substrate. And a phosphor screen formed on the inner surface of the front substrate, and an electron emission device provided on the back substrate, which emits an electron beam to the phosphor screen to cause the phosphor screen to emit light. And at least one between the front substrate and the side wall and between the rear substrate and the side wall is sealed with a metal film therebetween.

According to another aspect of the present invention, there is provided an image display apparatus comprising: a rear substrate and a front substrate facing each other; a side wall provided between the rear substrate and the front substrate; A vacuum envelope having a support member provided with a gap between the rear substrate and the front substrate, a phosphor screen formed on the inner surface of the front substrate, and a phosphor screen formed on the phosphor screen. A formed metal back layer, provided on the back substrate, comprising an electron emission source for emitting an electron beam to the phosphor screen to emit light from the phosphor screen, between the front substrate and the side wall, and At least one between the front substrate and the support member is sealed via the metal back layer.

A method of manufacturing an image display device according to the present invention includes a vacuum envelope having a rear substrate and a front substrate opposed to each other, and a side wall provided between the rear substrate and the front substrate; A phosphor screen formed on the inner surface of the front substrate, and an electron emission source provided on the back substrate and emitting an electron beam to the phosphor screen to emit light from the phosphor screen; In the manufacturing method, a step of forming a metal film on at least one of a sealing surface between the rear substrate and the side wall, and a sealing surface between the front substrate and the side wall; Placing the side wall in a vacuum atmosphere and applying a voltage to the metal film to seal the metal film.

Also, a method of manufacturing an image display device according to the present invention is directed to a vacuum envelope having a rear substrate and a front substrate opposed to each other, and a side wall provided between the rear substrate and the front substrate. A phosphor screen formed on the inner surface of the front substrate, a metal back layer formed on the phosphor screen, and provided on the back substrate, emitting an electron beam to the phosphor screen. An electron emission source that emits light from a phosphor screen; and
Sealing with a conductive layer located on the side wall side and an adhesive located on the rear substrate side, arranging the side wall and the front substrate to face each other with the metal back layer interposed therebetween, Disposing the substrate and the side wall in a vacuum atmosphere, applying a voltage between the conductive layer and the metal back layer, and sealing the front substrate and the side wall via the metal back layer. It is characterized by.

According to the image display apparatus and the method of manufacturing the same, the metal film is formed on at least one of the front substrate and the side wall, the rear substrate and the side wall, the support member and the front substrate, and the support member and the rear substrate. By performing the sealing, the sealing can be easily performed in a vacuum atmosphere, and further, a decrease in vacuum airtightness due to an outflow of the adhesive or the generation of bubbles generated by a portion can be prevented. Therefore, the vacuum envelope can be maintained at a high degree of vacuum, and an image display device excellent in display performance and a method of manufacturing the same can be obtained.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment in which an image display device of the present invention is applied to an FED will be described in detail with reference to the drawings. As shown in FIGS. 1 to 3, the FED includes a front substrate 11 and a rear substrate 12 each made of rectangular glass, and these substrates are opposed to each other with a gap of about 1.5 to 3.0 mm. Are located. The front substrate 11 and the rear substrate 12 are joined to each other via a rectangular frame-shaped side wall 18 to form a flat rectangular vacuum envelope 10 whose inside is maintained in a vacuum state. .

Inside the vacuum envelope 10, a back substrate 11
And to support the atmospheric pressure applied to the front substrate 12,
A plurality of plate-like support members 14 are provided, and these support members extend in a direction parallel to the short side of the vacuum envelope, and have a predetermined interval along a direction parallel to the long side. Placed and placed. Note that the shape of the support member 14 is not particularly limited to this.

As shown in FIG. 4, a phosphor screen 16 is formed on the inner surface of the front substrate 11. The phosphor screen 16 is constituted by arranging red, blue, and green striped phosphor layers, and a striped black light absorbing layer 20 as a non-light emitting portion located between these phosphor layers. The phosphor layers extend in a direction parallel to the short side of the vacuum envelope, and are arranged at predetermined intervals along a direction parallel to the long side. Note that a metal back layer 17 made of, for example, an aluminum layer is deposited on the phosphor screen 16.

On the inner surface of the back substrate 12, a large number of electron-emitting devices 22 each emitting an electron beam are provided as electron-emitting sources for exciting the phosphor layer of the phosphor screen 16. These electron-emitting devices 22 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. More specifically, a conductive cathode layer 24 is formed on the inner surface of the rear substrate 12, and a silicon dioxide film 26 having a number of cavities 25 is formed on the conductive cathode layer. On the silicon dioxide film 26, a gate electrode 28 made of molybdenum, niobium or the like is formed. A cone-shaped electron-emitting device 22 made of molybdenum or the like is provided in each cavity 25 on the inner surface of the back substrate 11.

In the FED configured as described above,
The video signal is input to the electron-emitting device 22 and the gate electrode 28 formed in a simple matrix system. On the basis of the electron-emitting device 22, when the brightness is the highest, +
A gate voltage of 100 V is applied. Further, +10 kV is applied to the phosphor screen 16. This allows
An electron beam is emitted from the electron-emitting device 22. The size of the electron beam emitted from the electron-emitting device 22 is modulated by the voltage of the gate electrode 28, and the electron beam excites the phosphor layer of the phosphor screen 16 to emit light, thereby displaying an image. .

As described above, since a high voltage is applied to the phosphor screen 16, a high strain point glass is used for the front substrate 11, the rear substrate 12, the side wall 18, and the plate glass for the support member 14. . The rear substrate 11 and the side wall 18 are joined by a low-melting glass 30 such as frit glass, and the front substrate 12 and the side wall 18 are joined via an aluminum thin film 32 functioning as a first metal film. The thickness of the low melting point glass 30 is 80 μm, and the thickness of the aluminum thin film 32 is 0.1 μm. A rectangular aluminum thin film 34 functioning as a second metal film is formed on the outer peripheral portion of the front substrate 12, and faces the aluminum thin film 32 with the front substrate interposed therebetween.

Next, a method of manufacturing the FED configured as described above will be described in detail. First, an electron-emitting device is formed on a sheet glass for a rear substrate. In this case, a matrix-like conductive cathode layer 24 is formed on a sheet glass,
On this conductive cathode layer, for example, thermal oxidation method, CVD
An insulating film 26 of a silicon dioxide film is formed by a sputtering method or a sputtering method.

Thereafter, a metal film for forming a gate electrode such as molybdenum or niobium is formed on the insulating film 26 by, for example, a sputtering method or an electron beam evaporation method. Next, a resist pattern having a shape corresponding to the gate electrode to be formed is formed on the metal film by lithography. Using this resist pattern as a mask, the metal film is etched by a wet etching method or a dry etching method to form a gate electrode 28.

Next, the resist pattern and the gate electrode 2
The cavity 25 is formed by etching the insulating film 26 by wet etching or dry etching using the mask 8 as a mask. Then, after removing the resist pattern, the gate electrode 28 is formed by performing electron beam evaporation from a direction inclined at a predetermined angle with respect to the surface of the rear substrate 12.
A release layer made of, for example, aluminum or nickel is formed thereon. Thereafter, for example, molybdenum as a material for forming a cathode is deposited by an electron beam evaporation method from a direction perpendicular to the surface of the back substrate 12. by this,
The electron-emitting device 22 is formed inside each cavity 25. Subsequently, the release layer is removed by a lift-off method together with the metal film formed thereon.

Next, as shown in FIG. 5, a rectangular frame-shaped side wall 18 is cut from sheet glass, and one surface, that is,
An aluminum film 32 is deposited on a surface to be joined to the front substrate 11. In this case, an outwardly protruding portion 40 is integrally formed on the side wall 18 in advance, and the aluminum film 32 is also formed on the protruding portion 40. A portion of the aluminum film 32 located on the protruding portion 40 is exposed to the outside and functions as a connection portion 32a when a voltage is applied, which will be described later.

Subsequently, as shown in FIG. 6, the side wall 18 and the plurality of support members 14 are sealed on the rear substrate 12 by the low melting point glass 30. At this time, the surface of the side wall 18 opposite to the surface on which the aluminum film 32 is formed is sealed to the inner peripheral edge of the rear substrate 12.

On the other hand, a phosphor screen 16 is formed on a plate glass serving as the front substrate 11. For this, a glass plate having the same size as the front substrate 11 is prepared, and a stripe pattern of the phosphor layer is formed on the glass plate by a plotter machine. The plate glass on which the phosphor stripe pattern is formed and the plate glass for the front substrate are placed on a positioning jig and set on an exposure table, thereby exposing and developing to form a phosphor screen 16.

Next, a metal back layer 17 made of an aluminum film is formed over the phosphor screen 16.
Further, as shown in FIG. 6, a rectangular frame-shaped aluminum film 34 having the same size as the side wall 18 is provided on the surface opposite to the surface on which the phosphor screen 16 is formed, that is, on the outer peripheral portion of the front substrate 11. Form.

As described above, the side wall 18 and the support member 14
The rear substrate 12 on which is sealed and the front substrate 11 on which the phosphor screen 16 and the aluminum film 34 are formed are placed in the vacuum processing apparatus 100 in a state where they are opposed to each other with a predetermined gap therebetween. . For the above-described series of steps, for example, a vacuum processing apparatus 100 as shown in FIG. 7 is used.

The vacuum processing apparatus 100 includes a load chamber 101, a baking chamber, and an electron beam cleaning chamber 1 provided in order.
02, a cooling chamber 103, a getter film deposition chamber 104, an assembly chamber 105, a cooling chamber 106, and an unloading chamber 107. Each of these chambers is configured as a processing chamber capable of performing vacuum processing, and all the chambers are evacuated during the manufacture of the FED. Adjacent processing chambers are connected by a gate valve or the like.

The above-described back substrate, side wall, support member, assembly of the aluminum film 32, and the front substrate on which the aluminum film 34 is formed are loaded into the load chamber 101, and after the load chamber 101 is evacuated to a vacuum atmosphere. Baking and sent to the electron beam cleaning room 102. In the baking / electron beam cleaning room 102, the assembly and the front substrate are heated to a temperature of 300 ° C. to release the surface adsorbed gas of each member.

Simultaneously with the heating, an electron beam is applied to the phosphor screen surface of the front substrate 11 and the electron emission element surface of the rear substrate 12 from an electron beam generator (not shown) attached to the baking and electron beam cleaning chamber 102. Irradiate. Since the electron beam is deflected and scanned by a deflecting device mounted outside the electron beam generating device, it is possible to clean the entire phosphor screen surface and the electron emitting element surface with the electron beam.

After the heating and the electron beam cleaning, the assembly and the front substrate are sent to the cooling chamber 103 and cooled to a temperature of about 100 ° C., for example. Subsequently, the assembly and the front substrate are sent to a deposition chamber 104 for getter film formation, where a Ba film is deposited as a getter film outside the phosphor screen. Since the surface of the Ba film can be prevented from being contaminated with oxygen, carbon, or the like, the Ba film can maintain an active state.

Subsequently, the assembly and the front substrate are sent to the assembly chamber 105. In the assembly chamber 105, the assembly and the front substrate are heated up to 400 ° C., and the front substrate and the rear substrate are pressed with a predetermined pressure with the side wall interposed therebetween.
Then, as shown in FIG. 8, the high voltage terminal is brought into contact with the connection portion 32a of the aluminum film 32 formed on the protrusion 40 of the side wall 18, and the ground terminal is brought into contact with the aluminum film 34 on the front substrate 11. As a result, a DC voltage of 1000 V is applied between the aluminum films 32 and 34. Thus, the side wall 18 and the front substrate 11 are sealed by the aluminum film 32, and a vacuum envelope is formed.

The vacuum envelope thus formed is
After being cooled to room temperature in the cooling chamber 106, the unloading chamber 1
It is sent to 07 and taken out. Thereafter, the pixel display device is completed by cutting and removing the protruding portion 40 of the side wall 18. Although the aluminum film 34 remains on the surface of the front substrate 11, when the image display device is incorporated in a television receiver or the like, the aluminum film 34 is located inside the cabinet and is not exposed to the outside. .

According to the image display apparatus and the method of manufacturing the image display apparatus constructed as described above, the side wall and the front substrate are sealed in a vacuum atmosphere, and the surface adsorbed gas is used in combination with baking and electron beam cleaning. Can be sufficiently released, the getter film is not oxidized, and a sufficient gas adsorption effect can be maintained. Further, by sealing through the aluminum film 32, handling is easy even in a vacuum, and the vacuum envelope can be sealed easily and reliably.

Next, an image display device and a method of manufacturing the same according to a second embodiment of the present invention will be described. As shown in FIG. 9, according to the second embodiment, the rear substrate 12 is formed larger than the front substrate 11, and the peripheral edge protrudes outward from the front substrate. A lead line (not shown) for inputting a video signal to the electron-emitting device is screen-printed on the peripheral surface of the rear substrate 12.

The side wall 18 has a protruding portion 40, and the side wall 18 and the protruding portion are sealed on the rear substrate 12 by the low-melting glass 30. In addition, the side wall 18 has an aluminum film 32
And is sealed to the inner surface of the front substrate 11 through the opening. Side wall 1
The projection 40 of 8 is left as it is even after completion of the image display device. In this case, the step of cutting the protrusion 40 can be omitted. After sealing, the aluminum film on the protrusions 40 is sealed so that an undesired voltage is not applied.
0 may be covered with an insulating layer or the like.

The other structure is the same as that of the first embodiment described above, and the same portions are denoted by the same reference characters and will not be described in detail. In the second embodiment configured as described above, the same operation and effect as in the first embodiment can be obtained.

As shown in FIG. 10, according to the image display device and the method of manufacturing the same according to the third embodiment of the present invention, the side wall 18 has the front substrate 11 with the metal back layer 17 made of an aluminum film interposed therebetween. Is sealed inside.
That is, the metal back layer 17 is formed so as to extend to the vicinity of the peripheral edge of the front substrate 11 and extends between the front substrate and the side wall 18. The side wall 18 is sealed to the front substrate via the metal back layer 17.

On the other hand, the other side of the side wall 18 is sealed to the back substrate 12 via an Ag paste 46 as a conductive layer and a low-melting glass 30. At this time, the side wall 18 has a protruding portion 40 protruding outward, and the Ag paste 46 is also applied to this protruding portion, and the connecting portion 46 for applying a voltage is formed.
a.

In the manufacturing process of the image display device having the above structure, first, the back substrate 12 on which the electron-emitting devices are formed and the side wall 18 coated with the Ag paste 46 are sealed via the low-melting glass 30. Then, an assembly of the rear substrate and the side wall is formed. On the other hand, the front substrate 11 on which the phosphor screen 16 and the metal back layer 17 are formed is prepared.

Thereafter, the above assembly and the front substrate 11 are placed in the vacuum processing apparatus 100 in a state where they are opposed to each other with a predetermined gap therebetween. After the same desired steps as described above, the assembly and the front substrate 11 are heated to 400 ° C. in the assembly chamber, and the front substrate 11 and the rear substrate 12 are pressed at a predetermined pressure with the side wall 18 interposed therebetween. And pressurize. Further, the metal back layer 17 is connected to the high voltage side, and the metal back layer 17 and the Ag paste are brought into contact by connecting a ground terminal to a connection portion 46a of the Ag paste 46 formed on the protrusion 40 of the side wall 18. 4
And a DC voltage of 1000 V is applied between them. As a result, the side wall 18 and the front substrate 11 are sealed via the metal back layer 17, and a vacuum envelope is formed.

The other structure is the same as that of the first embodiment described above, and the same parts are denoted by the same reference characters and will not be described in detail. Also, in the third embodiment configured as described above, the same operation and effect as in the first embodiment can be obtained. Further, according to the third embodiment, the front substrate and the side walls are sealed by using the metal back layer 17 as the metal film, so that it is not necessary to form a metal film exclusively for sealing, and the manufacturing process and Manufacturing costs can be reduced.

In the above-described embodiment, the structure in which the front substrate and the side wall are sealed with the aluminum film has been described. However, the present invention is not limited to this, and the rear substrate and the side wall, the front substrate and the support member, and the rear substrate are not limited thereto. Any of the support members may be sealed with an aluminum film.

When the front substrate and the support member are sealed with a metal film, the metal film can be sealed using a metal back layer deposited and formed on a phosphor screen. That is, an aluminum film acting as a metal back layer is vacuum-deposited on the phosphor screen, and an earth electrode film is formed on one side surface of each support member in advance. Then, the other side surface of each support member is positioned and arranged at a position facing the black light absorbing layer of the phosphor screen. In this state, by applying a high voltage to the metal back layer and connecting the electrode film of the support member to the ground,
Each support member is sealed to the phosphor screen.

In addition, the present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the present invention. For example, the metal film used for sealing is not limited to aluminum, and another metal film such as chromium or molybdenum may be used. In addition, a pn-type cold cathode device or a surface conduction type electron-emitting device may be used as the electron-emitting device. Further, the phosphor screen may be formed of a matrix-shaped black light absorbing layer and a phosphor layer, and a columnar support member having a cross-shaped cross section may be positioned and arranged with respect to the black light absorbing layer.

[0051]

As described in detail above, according to the present invention, at least one of the front substrate and the side wall, the rear substrate and the side wall, the support member and the front substrate, and the support member and the rear substrate are interposed via the metal film. By sealing, it is possible to easily seal in a vacuum atmosphere, and at the same time, it is possible to sufficiently release the surface adsorption gas by performing baking and electron beam cleaning in a vacuum, and the getter film is also oxidized. A sufficient gas adsorption effect can be obtained. Therefore, the vacuum envelope can be maintained at a high degree of vacuum, and an image display device excellent in display performance and a method of manufacturing the same can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an FED according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a state where a front substrate of the FED is removed.

FIG. 3 is a sectional view taken along line AA of FIG. 1;

FIG. 4 is a plan view showing a phosphor screen of the FED.

FIG. 5 is a perspective view showing a side wall on which an aluminum film is formed.

FIG. 6 shows a back substrate, a side wall, and an unsealed state in the FED.
FIG.

FIG. 7 is a view schematically showing a vacuum processing apparatus used for manufacturing the FED.

FIG. 8 is a sectional view showing a step of applying a voltage to the aluminum film in the manufacturing process of the FED according to the first embodiment.

FIG. 9 is a perspective view showing an FED according to a second embodiment of the present invention.

FIG. 10 is a sectional view showing a step of applying a voltage to a metal back layer in a process of manufacturing the FED according to the third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Vacuum envelope 11 ... Front substrate 12 ... Back substrate 14 ... Support member 16 ... Phosphor screen 17 ... Metal back layer 18 ... Side wall 22 ... Electron emission element 30 ... Low melting point glass 32, 34 ... Aluminum film 32a, 46a ... Connecting part 40 ... Protruding part 46 ... Ag paste 100 ... Vacuum processing device

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI theme coat ゛ (Reference) H01J 29/88 H01J 29/88

Claims (18)

[Claims] 1. A vacuum envelope having a rear substrate and a front substrate opposed to each other, a side wall provided between the rear substrate and the front substrate, and a fluorescent light formed on an inner surface of the front substrate. A body screen, and an electron emission source provided on the back substrate and emitting an electron beam to the phosphor screen to cause the phosphor screen to emit light, between the front substrate and the side wall, and between the back substrate and An image display device, wherein at least one between the side wall and the side wall is sealed via a metal film. 2. The semiconductor device according to claim 1, wherein the metal film has a first metal film formed on the side wall and sealed to an inner surface of the front substrate, and the front substrate faces the first metal film. 2. The image forming apparatus according to claim 1, further comprising a second metal film formed on an outer surface of the front substrate and for applying a voltage between the first metal film and the first metal film. 3. 3. The metal film has a first metal film formed on the side wall and sealed to an inner surface of the rear substrate, wherein the rear substrate faces the first metal film. 2. The image forming apparatus according to claim 1, further comprising a second metal film formed on an outer surface of the rear substrate and for applying a voltage between the second metal film and the first metal film. 3. 4. The semiconductor device according to claim 1, wherein the side wall has a projecting portion projecting outward, and the first metal film has a connecting portion extending on the projecting portion for applying a voltage. The image forming apparatus according to claim 2, wherein: 5. The image display device according to claim 4, wherein said projection is covered with an insulator. 6. The image display device according to claim 1, wherein said metal film is an aluminum vapor-deposited film. 7. A rear substrate and a front substrate which are opposed to each other, a side wall provided between the rear substrate and the front substrate, and a side wall provided between the rear substrate and the front substrate and between the rear substrate and the front substrate. A support member holding a gap,
A vacuum envelope having: a phosphor screen formed on the inner surface of the front substrate; a metal back layer formed on the phosphor screen; and a phosphor provided on the back substrate, An electron emission source that emits an electron beam to a screen to emit a phosphor screen, wherein at least one between the front substrate and the side wall and between the front substrate and the support member is provided with the metal back layer. An image display device characterized by being sealed through a gap. 8. The semiconductor device according to claim 7, wherein said metal back layer extends between said front substrate and a side wall, and said side wall is sealed to said front substrate via said metal back layer. An image display device according to claim 1. 9. The side wall is sealed to the rear substrate via a conductive layer and low-melting glass, the side wall has an outwardly projecting portion, and the conductive layer is formed on the projecting portion. The image forming apparatus according to claim 8, further comprising: a connecting portion extending to the metal back layer to apply a voltage to the metal back layer. 10. A vacuum envelope having a rear substrate and a front substrate opposed to each other, a side wall provided between the rear substrate and the front substrate, and a fluorescent light formed on an inner surface of the front substrate. Body screen, and an electron emission source provided on the back substrate and emitting an electron beam to the phosphor screen to cause the phosphor screen to emit light, a method of manufacturing an image display device, comprising: Forming a metal film on at least one of the sealing surface between the front substrate and the side wall, and disposing the rear substrate, the front substrate, and the side wall in a vacuum atmosphere; Applying a voltage to the metal film to seal the metal film. 11. A vacuum envelope having a rear substrate and a front substrate opposed to each other, a side wall provided between the rear substrate and the front substrate, and a fluorescent light formed on an inner surface of the front substrate. A method of manufacturing an image display device, comprising: a body screen; and an electron emission source provided on the back substrate and emitting an electron beam to the phosphor screen to emit light from the phosphor screen. Forming a first metal film on the sealing surface of the front substrate, forming a second metal film on the outer surface of the front substrate facing the first metal film across the front substrate, Disposing the front substrate and the side wall in a vacuum atmosphere, applying a voltage between the first and second metal films, and sealing the front substrate and the side wall via the first metal film. Image display device characterized by the following: Manufacturing method. 12. A vacuum envelope having a rear substrate and a front substrate opposed to each other, a side wall provided between the rear substrate and the front substrate, and a fluorescent light formed on an inner surface of the front substrate. A method of manufacturing an image display device, comprising: a body screen; and an electron emission source provided on the back substrate and emitting an electron beam to the phosphor screen to emit light from the phosphor screen. Forming a first metal film on the sealing surface of the back substrate; forming a second metal film on the outer surface of the back substrate facing the first metal film with the back substrate interposed; Disposing the front substrate and the side wall in a vacuum atmosphere, applying a voltage between the first and second metal films, and sealing the rear substrate and the side wall via the first metal film. Of an image display device characterized by that Production method. 13. The first metal film is grounded and the first metal film is grounded.
12. A high voltage is applied to the metal film.
Or a method for manufacturing an image display device according to item 12. 14. The method according to claim 14, further comprising: forming an outwardly projecting portion on the side wall; forming the first metal film on the sealing surface and the projecting portion of the side wall; The first formed on
14. The method according to claim 13, wherein a voltage is applied through a metal film. 15. The method according to claim 14, wherein after the front substrate and the side wall are sealed, the protrusion of the side wall is removed.
3. The method for manufacturing an image display device according to 1. 16. A vacuum envelope having a rear substrate and a front substrate opposed to each other, a side wall provided between the rear substrate and the front substrate, and a fluorescent light formed on an inner surface of the front substrate. Body screen, a metal back layer formed on the phosphor screen, and an electron emission source provided on the back substrate and emitting an electron beam to the phosphor screen to emit light from the phosphor screen. In the method for manufacturing an image display device provided with: a step of sealing the side wall and the rear substrate via a conductive layer positioned on the side wall side and an adhesive positioned on the rear substrate side, and sandwiching the metal back layer. Disposing the side wall and the front substrate facing each other; disposing the rear substrate, the front substrate, and the side wall in a vacuum atmosphere, applying a voltage between the conductive layer and the metal back layer, Method for manufacturing an image display apparatus comprising the a step of sealing the front substrate and the side wall via a click layer. 17. The method according to claim 17, further comprising: forming an outwardly projecting portion on the side wall, forming the conductive layer on the side wall and the projecting portion, and applying the voltage to the conductive layer. 17. The method according to claim 16, wherein a voltage is applied through a conductive layer. 18. A silver paste as the conductive layer,
17. The method according to claim 16, wherein a low-melting glass is used as the adhesive.