JP3104758B2 - Manufacturing method of laminated micro channel plate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microchannel plate for amplifying an electron beam using a microchannel, and more particularly to an aspect ratio (d / L, d: microchannel diameter, L: microchannel hole). The present invention relates to a method for manufacturing a laminated microchannel plate comprising a laminate of microchannel plates having a small length.

[0002]

2. Description of the Related Art Conventionally, for example, "Applied Physics (Vol. 40, No. 9, 1971; Vol. 41, No. 6, 1972; Vol. 43, No. 2,
1974) ”, a microchannel plate is formed by heating a glass material thinly and simultaneously fusing the capillaries together to obtain a desired microchannel diameter. Need to be repeated. Finally, after the plate is cut into a thickness corresponding to the aspect ratio of 40 to 90, a heat treatment is performed to form a conductive layer.

[0003]

However, in the above-mentioned conventional example, the microchannel plate is manufactured by hot-drawing the capillaries and then cutting the bundles of capillaries fused together. There were drawbacks. 1. If the capillary diameter is gradually reduced, the microchannel plate must be thinner due to the aspect ratio. Therefore, it is difficult to cut the microchannel plate thinly in consideration of the possibility of cracking during this processing. For this reason, the length of the microchannel becomes longer, so that the electron flight time becomes longer, and as a result, the response speed becomes slower. 2. Since noise is removed by using a plurality of microchannel plates of the chevron type, it is difficult to remove noise with only one microchannel plate manufactured by hot drawing. 3. When a plurality of chevron-type microchannel plates formed by hot drawing are stacked in close contact with each other, it is difficult to align the microchannel holes so as not to hinder the passage of electrons at the stacking points.

[0004]

SUMMARY OF THE INVENTION The present invention facilitates the production of a microchannel plate having a large aspect ratio as a result of adhering a plate of microchannels having a small aspect ratio in a laminated manner.

Namely The present invention provides a method of manufacturing a laminated microchannel plates, upon bonding the microchannel plate in layers, provided the conductive layer having conductivity on both surfaces of the microchannel plate are stacked, one another In a state where a voltage is applied between the conductive layers of two adjacent microchannel plates , the conductive layers are bonded at a low temperature in an ultrahigh vacuum to bond the microchannel plates to each other. The aspect ratio (d / L, d: microchannel diameter, L: length of the microchannel hole) of the microchannel plate is usually 40 to 90. Therefore, when Tsu been reduced microchannel size, to open a large number of small holes aspect ratio is easier than to open a large number of large pore aspect ratio. Therefore, it is possible to form a microchannel having a large aspect ratio by bonding a large number of holes having a small aspect ratio in a thin plate and then bonding the holes. In this case, by forming the microchannel holes at a certain angle with respect to the normal direction of the plate surface, it is also possible to manufacture a multi-microchannel plate having a chevron type structure. Furthermore, by using a conductive material at the bonding point, an electron accelerating voltage is applied to each of the thin microchannel plates through the conductive material, and stripped from the electrodes at both ends of each of the thin microchannel plates to the inner wall surface of the channel plate. By supplying a current, electrons emitted as a multiplication can be supplied in a short time. That is, the dead time of the electron multiplier can be improved. Processing microchannels with a small aspect ratio is easier than processing microchannel holes with a large aspect ratio, so it is possible to create a thin, large-area microchannel plate. It is. Such a thin micro-channel plate has a high responsiveness because the flight distance of electrons in the multiplication process is short. On the other hand, as the shape of the thin micro channel plate, the cross-sectional shape in the normal direction and the parallel direction with respect to the electron passing direction is made to be a similar circular shape and a tapered shape, or a wide-open shape at both ends. And the possibility of reducing the electron passage area is reduced. At the time of this lamination, since the bonding method at a low temperature is used as the bonding method, it is possible to reduce the thermal expansion distortion of each of the thin plate-shaped microchannel plates as compared with the bonding at a high temperature. Also, in terms of manufacturing, the stacked microchannel is easy to manufacture because it is not necessary to integrally process microchannel holes having a high aspect ratio.

[0006]

1, 2, 3, 4, 5, and 6 show a first embodiment of the present invention, and FIG. 1 shows the overall appearance of a stacked microchannel manufactured according to the method of the present invention. Express.
In FIG. 1, the line AA indicates a cross section cut in the z-axis direction and viewed from the y-axis direction. FIG. 2 shows A in FIG.
-A is a view taken in the direction of the arrow, and reference numerals 1 and 2
Reference numerals 2, 3, and 4 denote electron accelerating power supplies applied to both ends of the thin-plate microchannel plates 5, 6, 7, and 8, respectively. B denotes a microchannel of a microchannel obtained by laminating the thin-plate microchannel plates. It shows a partially enlarged region. FIG. 3 is an enlarged view of a portion B in FIG. 2 and is a drawing that best illustrates the features of the present invention. In FIG.
Microchannel holes drilled in 6, 7, 8
_IN and 9 _OUT denote wide-open portions at both ends of the microchannel hole 9, respectively. 10, 11, 12, 13, and 14 denote electrons applied to both ends of each of the thin microchannel plates 5, 6, 7, and 8, respectively. Electrodes made of Al that are electrically connected to the accelerating power supplies 1, 2, 3, and 4 by lead wires. Among these electrodes, the electrodes 11, 12, and 13 are simultaneously the thin microchannel plates 5, 6, 7, and 8 also functions as an adhesive layer for bonding the layers 8 to one another in a laminated manner. Reference numeral 15 denotes a thin-film lead oxide layer obtained by vapor deposition on the inner wall surfaces of the microchannel holes of the thin microchannel plates 5, 6, 7, and 8. FIG. 4 shows the microchannel plate before bonding. In the same figure, 5, 6, 7, and 8 indicate the thin microchannel plates in the same manner as described above, and the directions of the arrows are the respective thin microchannel plates 5, 6, 7,. 8 shows a pressing direction for bonding 8 to each other.

Here, each of the thin plate-like microchannel plates 5, 6, 7, 8 is made of a plate-like photosensitive glass having a thickness of about 0.2 mm. UV light is applied from a direction inclined at an angle of about 10 degrees with respect to the normal direction of the photosensitive glass surface, that is, obliquely above, and then heat-treated, and further subjected to an acid treatment (6% (Hydrofluoric acid treatment). In this case, only the portion irradiated with the ultraviolet light through the mask is perforated by the etching process by the above-described heat treatment and acid treatment. During this acid treatment, the plate-shaped photosensitive glass is first etched from both surfaces, and consequently, wide-open holes are formed on both surfaces of the photosensitive glass. That is, both ends 9 _IN , 9 _IN of the micro channel portion 9 of each of the thin plate micro channel plates 5, 6, 7, 8
A microchannel hole that forms a wide mouth at _OUT is formed. After the processing of the microchannel holes, a lead oxide thin film layer is formed on the inner wall surface of the microchannel holes 9 by vapor deposition by the above-described means, and thereafter, Al is formed on both surfaces of each plate-shaped photosensitive glass in the above-described manner. Film. And
When stacking the individual thin microchannel plates, the microchannels 9 are adjusted so as to be aligned with each other so that the passage of electrons is not hindered, and then pressed at a low temperature (about 200 ° C.). The thin microchannel plates 5, 6, 7, 8 are adhered by force. The alignment at the time of stacking is relatively easy because the shape of the microchannel hole 9 is wide at both ends. When the above-mentioned thin microchannel plates 5, 6, 7, and 8 are bonded to each other, the Al film formed on the previously formed Al surface in an ultra-high vacuum (10 ^-8 Torr or less) is subjected to Ar ⁺ sputtering ( (Acceleration voltage: 2 kV) The treatment is performed, and then the adhesive is quickly adhered as described above without being taken out of the vacuum chamber. Each of the thin microchannel plates 5, 6, as described above
As a result, the aspect ratio ( ~
40) A large microchannel plate can be obtained.

As shown in FIG. 3, the electron flow of the present microchannel plate is based on electron acceleration power sources 1 and 2 in which incident electrons are applied to both ends of each of the thin plate microchannel plates 5, 6, 7 and 8. Are accelerated by the accelerating voltage of
The number of electrons is multiplied, and the flow becomes such as to pass through the microchannel hole. As a result, the incident electrons are multiplied. When the applied voltage is 1 kV, the microchannel plate thus prepared can multiply the incident electrons by about 10 ² .

On the other hand, also in the case of a microchannel plate as shown in FIGS. 5 and 6, electron multiplication of incident electrons is enabled as in the case of the microchannel plate. The reference numerals in FIGS. 5 and 6 indicate the same as those in FIGS.

FIGS. 7, 8, 9, 10, 11 and 12 do not show a second embodiment of the present invention. FIG. 7 is a drawing showing the overall appearance of the present invention. In FIG. 7, the view taken along the line A′-A ′ is cut in the z direction and indicates a cross section viewed from the y axis direction. FIG. 8 is a view taken in the direction of arrows A′-A ′ in FIG. 7, in which 1, 2, 3, and 4 are located at both ends of the respective thin microchannel plates 5, 6, 7, and 8. A power supply for electron acceleration is applied, and B indicates an enlarged region of a part of a microchannel plate obtained by laminating thin microchannel plates. FIG.
FIG. 8 is an enlarged view of a portion B in FIG. 8 and is a drawing that best illustrates the features of the present invention. 9, 9 is a microchannel holes drilled on each thin plate microchannel plate 5, 6, 7, 8 as described above, the wide opening of the opposite end portions of each of 9 _INT and 9 _OUTT microchannel holes 9 10, 11, 12, 13, and 14 are electron accelerating power supplies 1, 2, 3, 4 and leads applied to both ends of each of the thin micro channel plates 5, 6, 7, 8 respectively. Al electrodes electrically connected by wires,
Reference numerals 1, 12, and 13 denote adhesive layers for simultaneously bonding the lamellar microchannel plates 5, 6, 7, and 8 to one another in a laminated manner, and 15 denotes a lamellar microchannel plate 5,
This is a thin-film lead oxide layer obtained by vapor deposition on the inner wall surfaces of 6, 7, and 8 microchannel holes. FIG. 10 shows a microchannel plate before bonding.
Reference numeral 8 denotes a thin plate-like microchannel plate in the same manner as described above.
The pressing direction for bonding 6, 7, 8 to each other is shown. Now, each of the thin micro channel plates 5, 6, 7, 8
Is made of a plate-like Vycor glass having a thickness of about 0.2 mm, and the microchannel holes are formed by a focused electron beam (energy: １０10 ⁶ W / cm ² ).
The microchannel is inclined at an angle of about 10 degrees with respect to the normal direction of the high lead glass surface, that is, the microchannel is machined in an oblique direction by irradiating a focused electron beam from obliquely above. As shown in FIGS. 9 and 12, the shape of the microchannel holes 9 formed in the Vycor glass by the processing with the convergent electron beam is wide at 9 _INT and _narrow at 9 _OUTT .
That is, it is tapered. After the processing of the microchannel hole, a lead oxide thin film layer is formed on the inner wall surface of the microchannel hole 9 by vapor deposition by the same means as in the above-described embodiment, and thereafter, on both surfaces of each Vycor glass in the same manner. An Al film is formed. When the individual thin microchannel plates are stacked on each other, the positions of the microchannels 9 are adjusted so as to align with each other so that the passage of electrons is not hindered. With each thin micro channel plate 5,
6, 7, 8 are adhered. The alignment at the time of this lamination is performed because the shape of the microchannel 9 is tapered, so that the _{narrow opening} 9 _{OUTT of} one thin microchannel plate and the wide opening 9 of the other thin microchannel plate.
It is relatively easy to combine with _INT . Each of the above-mentioned thin microchannel plates 5, 6,
When bonding the layers 7 and 8 to each other, the Al surface formed in advance is placed in an ultra-high vacuum (10 ⁻⁸ Torr or less) under Ar ⁺
Sputtering (acceleration voltage: 2 kV) is performed, and then bonding is quickly performed as described above without being taken out of the vacuum chamber. The adhesion of the thin plate microchannel plate 5, 6, 7, 8 with each other as described above, result to obtain a large microchannel plate having an aspect ratio (~ 40) comes out as.

As shown in FIG. 9, the electron flow of the microchannel manufactured as described above is based on an electron acceleration power source 1 in which incident electrons are applied to both ends of each of the thin plate microchannel plates 5, 6, 7, and 8. , 2, 3, and 4, the electrons are multiplied by the number of electrons while colliding with the wall of the microchannel one after another, and flow through the microchannel hole. As a result, the incident electrons are multiplied.

When the applied voltage is 1 kV, the micro-channel plate prepared in this way can receive approximately 1
0 to enable the electron multiplier of ^2.

On the other hand, in the case of a microchannel plate as shown in FIGS. 11 and 12, electron multiplication is enabled for incident electrons in the same manner as in the case of the microchannel plate. 11 and 12 correspond to FIGS. 8 and 9 respectively.
Is the same as each number.

[0014]

As described above, according to the method for manufacturing a laminated microchannel of the present invention, the following excellent effects can be obtained: By stacking microchannel plates having a small aspect ratio, a microchannel plate having a large aspect ratio is formed, so that a large-area microchannel plate can be manufactured without increasing the manufacturing cost. 2. Since the cross-sectional shape parallel to the axis of one microchannel hole is in the form of a pin with a wide-mouthed end, it is easy to align the microchannel holes when laminating the microchannel plates. 3. The cross-sectional shape parallel to the axis of one microchannel hole is wide at one end, and tapered at the other end, so that when the microchannel plates are stacked together, the wide mouth and narrow mouth face each other. By stacking on
The alignment of the microchannel holes is easy. 4. Low temperature (approximately 2
(00 ° C.), so that the thermal distortion of the microchannel plate can be reduced, and the alignment of the microchannel holes becomes easy.

[Brief description of the drawings]

FIG. 1 is an external view of a laminated microchannel plate embodying the present invention.

FIG. 2 is a cross-sectional view of FIG.
-A arrow view.

FIG. 3 is an enlarged view of a portion B in FIG. 2;

FIG. 4 is a view showing a thin microchannel plate before lamination.

FIG. 5 is a sectional view taken along the line A′-A ′ of FIG. 1 when the microchannels are laminated and adhered in a chevron type when viewed in the z direction and viewed from the y direction.

FIG. 6 is an enlarged view of a portion B ′ in FIG. 5;

FIG. 7 is an external view of a stacked microchannel plate according to a second embodiment of the present invention.

FIG. 8 is a cross-sectional view of FIG.
-A arrow view.

FIG. 9 is an enlarged view of a portion B in FIG. 8;

FIG. 10 shows each thin microchannel plate before lamination.

11 is a sectional view taken along the line A′-A of FIG. 7 when the microchannels are laminated and adhered in a chevron type when viewed in the z direction and viewed from the y direction.

FIG. 12 is an enlarged view of a portion B ′ in FIG. 11;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Power supply for electron acceleration 2 Power supply for electron acceleration 3 Power supply for electron acceleration 4 Power supply for electron acceleration 5 Thin micro channel plate 6 Thin micro channel plate 7 Thin micro channel plate 8 Thin micro channel plate 9 Micro channel hole 9 _{IN Wide} mouth of microchannel 9 _Narrow mouth of _OUT microchannel 9 _Wide mouth of _INT microchannel 9 _Narrow mouth of _OUTT microchannel 10 Electrode 11 Electrode as adhesive layer 12 Electrode as adhesive layer 13 Electrode as adhesive layer 14 Electrode 15 Strip current layer

Claims (5)

(57) [Claims] 1. Manufacture of a laminated microchannel plate
In the method , in bonding the microchannel plates in a stacked manner, conductive layers having conductivity are provided on both sides of each of the stacked microchannel plates, and the conductive layers are adjacent to each other.
The conductive layers to each other in two states in which the voltage is applied to the conductive layers of the microchannel plate by cold joining in ultrahigh vacuum laminated microchannel plates, characterized in that adhering to each other the microchannel plate Production method. 2. The laminated micro-channel according to claim 1 ,
A method of manufacturing a stacked microchannel plate , wherein the conductive layer is an Al thin film. 3. The laminated micro-channel according to claim 1 ,
In the manufacturing method of Le plate, the conductive layer was formed with Al, after morphism irradiated with Ar ^+, the two previous adjacent to each other
Stacked Mai to bond the serial micro channel plate to each other
A method for manufacturing a cross channel plate . 4. The laminated micro-channel according to claim 1 ,
In the method of manufacturing a microplate, the microchannel
A method of manufacturing a laminated microchannel plate in which each microchannel hole of the plate is tapered so that the entrance side is wide and the exit side is narrow with respect to the traveling direction of electrons. 5. The laminated micro-channel according to claim 1 ,
In the method of manufacturing a microplate, the microchannel
A method for manufacturing a laminated microchannel plate in which each microchannel hole of the plate has a wide-open hole at both ends.