CN101464535A - Etalon and method for producing the same - Google Patents

Abstract

An etalon and a manufacturing method thereof relate to the optical field, in particular to the field of etalons. Ultra-thin film solid and hollow etalons are manufactured by binding plating with deepening optical cement and optical cement. After an optical medium with a certain thickness is directly plated on a reflecting film or a high reflecting film at the cavity part of the etalon, the solid etalon is formed by the optical cement and the deepening optical cement of another film layer in the cavity of the etalon or after a homogeneous dielectric film is placed in the non-central area of the film surface of the cavity of the etalon by adopting the shading or the photo etching method, the ultra-thin etalon with an air gap at the center is formed by the mutual optical cement and the deepening optical cement again. The invention discloses a novel etalon by adopting the technical proposal. The etalon has a small thickness, can achieve a plurality of um magnitudes, is bonded together by adopting the optical cement method and the deepening optical cement method, and can be manufactured more conveniently. Furthermore, the ultra-thin etalon has larger free spectral range and is suitable for laser mode selection and other aspects.

Description

A kind of etalon and preparation method thereof

Technical field

The present invention relates to optical field, relate in particular to the etalon field.

Background technology

Etalon is to realize multiple-beam interference by two plating metal on surface films or multilayer dielectric reflectance coating at flat board, utilize the multiple-beam interference principle to produce very thin sharp striped, can select the light beam of specific wavelength to pass through etalon, the then basic loss fully of other wavelength with high-transmission rate.The making of etalon requires the distance between two boards constant and strict parallel.Its light path principle figure as shown in Figure 1, simple analysis can draw, the position of every light is compared last light and is fallen behind: $\mathrm{\δ}=\frac{2\mathrm{\π}}{{\mathrm{\λ}}_0}\mathrm{\ΔL}=\frac{4\mathrm{\π}}{{\mathrm{\λ}}_0}n\′h\cos \mathrm{\θ}\′;$ Therefore the complex amplitude of transmitted ray is a geometric progression, and common ratio is R ²e ^{I δ}, therefore can obtain transmissivity and be:

$T=1-\frac{4R{\sin }^2(\mathrm{\δ}/2)}{{(1-R)}^2+4R{\sin }^2(\mathrm{\δ}/2)},$ As seen its transmissivity is a wavelength X ₀, thickness h, reflectivity R function.

Common etalon is as shown in Figure 2:

Among Fig. 2 (a), 101 is solid etalon, and s1, s2 are the etalon reflectance coating; 102,103 for there being the etalon chamber sheet of reflectance coating among Fig. 2 (b), and 104 is the etalon bracing frame.

D among Fig. 2 (a) ₁Size is generally bigger, d among same Fig. 2 (b) ₂Also thicker.But when many times needing big Free Spectral Range, then need d ₁, d ₂Very thin.Work as d ₁, d ₂When very thin, these two kinds of structures just are difficult to make in actual fabrication.

Summary of the invention

At the problems referred to above, the present invention discloses a kind of novel ultra-thin etalon, and discloses its method for making.

The present invention adopts following technical scheme:

Etalon of the present invention comprises:

First substrate is coated with the specific wavelength reflectance coating on it;

The optical medium thin layer, it is plated on the plated film face of described first substrate;

Second substrate is coated with the specific wavelength reflectance coating on it, the plated film face and by optical cement or the in-depth optical cement be glued at described optical medium thin layer.

If described optical medium thin layer is complete lamina plane, then constitute solid etalon.

If described optical medium thin layer is the lamina plane of central area disappearance, then constitute the cavity etalon.

Further, the thickness of described optical medium thin layer is micron dimension; The material of described optical medium thin layer is SiO ₂Or other uniform optical media.

Further, be air or vacuum or specific gas in the space of described cavity etalon central area disappearance.

The outer logical light face of the non-plated film of substrate of described two kinds of etalons forms a little angle of wedge, and described angle of wedge scope is about 1 '-10 '.Perhaps, the outer logical light face plating anti-reflection film of the non-plated film of substrate of described etalon.With thinking the interference that prevents surface reflection.

Make the method for described solid etalon, step is as follows:

Step 1: make substrate earlier, and on substrate, plate the high-reflecting film or the partial reflection film of specific wavelength;

Step 2: will plate certain thickness optical medium thin layer through the plated film face of the substrate after the step 1;

Step 3: glue together by optical cement or in-depth optical cement with described optical medium thin layer and through another substrate after the step 1.

Make the method for described cavity etalon, step is as follows:

Step 1: make substrate earlier, and on substrate, plate the high-reflecting film or the partial reflection film of specific wavelength;

Step 2: in substrate of substrate membrane centre of surface zone pad of plated film;

Step 3: will plate certain thickness optical medium thin layer through the plated film face of the substrate after the step 2;

Step 4: the substrate of removing substrate membrane centre of surface zone;

Step 5: glue together by optical cement or in-depth optical cement with described optical medium thin layer and through another substrate after the step 1.

Make the another kind of method of described cavity etalon, step is as follows:

Step 1: make substrate earlier, and on substrate, plate the high-reflecting film or the partial reflection film of specific wavelength;

Step 2: will plate certain thickness optical medium thin layer through the plated film face of the substrate after the step 1;

Step 3: substrate membrane centre of surface zone is removed by photolithographicallpatterned;

Step 4: glue together by optical cement or in-depth optical cement with described optical medium thin layer and through another substrate after the step 1.

The present invention adopts as above technical scheme, discloses a kind of novel etalon.This etalon thickness is very little, can reach the magnitude of several um, by optical cement or the in-depth optical cement method bond together, make more convenient.And the Free Spectral Range of this ultra-thin etalon is bigger, is applicable to aspects such as laser modeling.

Description of drawings

Fig. 1 is the multiple-beam interference synoptic diagram;

Fig. 2 (a) is common solid etalon structural representation;

Fig. 2 (b) is common cavity etalon structural representation;

Fig. 3 is the theoretical transmission curve of etalon of the present invention;

Fig. 4 is a solid etalon structural representation of the present invention;

Fig. 5 is a cavity etalon structural representation of the present invention.

Embodiment

The present invention is further described for existing accompanying drawings and embodiment.

Etalon of the present invention comprises:

First substrate is coated with specific wavelength reflection or partial reflection film on it; The optical medium thin layer, it is plated on the plated film face of described first substrate, determines this optical medium thickness of coating according to the thickness of designed etalon; Second substrate is coated with specific wavelength reflection or partial reflection film on it, the plated film face is glued at described optical medium thin layer by optical cement or in-depth optical cement.

If described optical medium thin layer is complete lamina plane, then constitute solid etalon.

If described optical medium thin layer is the lamina plane of central area disappearance, then constitute the cavity etalon.

The material of described substrate is K9 glass or other optical materials.The thickness of described optical medium thin layer is micron dimension; The material of described optical medium thin layer is SiO ₂Or other uniform optical media.

This etalon thickness is very little, can reach the magnitude of several μ m, by optical cement or the in-depth optical cement method bond together, make more convenient.And the Free Spectral Range of this ultra-thin etalon is bigger, is applicable to aspects such as laser modeling.

Illustrate, if the material of solid etalon is a fused quartz, refractive index is constant n=1.45843, wavelength X=1112nm, and high-reflecting film is to the reflectivity R=80% of λ, thickness h=5um, the transmissivity T of etalon.

As shown in Figure 3, when the film leaning angle is θ '=7.634 °, T ₁₁₁₂=99.999%.And as can be seen, the about 1204nm-1112nm=92nm of Free Spectral Range.

Be solid etalon of the present invention as shown in Figure 4, wherein 401,403 is surface plating partial reflection film or the K9 of high-reflecting film or the substrate of other materials; 402 is SiO ₂Or the ultra-thin rete of other optical materials, form by plated film.

Make the method for described solid etalon, step is as follows:

Step 1: make substrate earlier, and on substrate, plate the high-reflecting film or the partial reflection film of specific wavelength;

Step 2: will plate certain thickness optical medium thin layer 402 through the plated film face of the substrate 401 after the step 1;

Step 3: glue together by optical cement or in-depth optical cement with described optical medium thin layer 402 and through another substrate 403 after the step 1.

Be cavity etalon of the present invention as shown in Figure 5, wherein 501 and 503 is the K9 of surface coating or the substrate of other materials, be that with solid etalon difference shown in Figure 4 first substrate 501 and second substrate 503 are separated by by ultra-thin rete, form the air-gap etalon.The advantage of this etalon is: owing to be the air-gap etalon, air is basic identical to the refractive index of each wavelength, all approaches 1, has therefore eliminated the influence of chromatic dispersion substantially.The air-gap etalon can also be made into vacuum or fill the etalon of specific gas.

Make the method for described cavity etalon, step is as follows:

Step 1: make substrate earlier, and on substrate, plate the high-reflecting film or the partial reflection film of specific wavelength;

Step 2: in substrate of substrate 501 film centre of surfaces zone pad of plated film;

Step 3: will plate certain thickness optical medium thin layer 502 through the plated film face of the substrate 501 after the step 2;

Step 4: the substrate of removing substrate membrane centre of surface zone;

Step 5: glue together by optical cement or in-depth optical cement with described optical medium thin layer 502 and through another substrate 503 after the step 1.

Make the another kind of method of described cavity etalon, step is as follows:

Step 1: make substrate earlier, and on substrate, plate the high-reflecting film or the partial reflection film of specific wavelength;

Step 2: will plate certain thickness optical medium thin layer 502 through the plated film face of the substrate 501 after the step 1;

Step 3: substrate membrane centre of surface zone is removed by photolithographicallpatterned;

Step 4: glue together by optical cement or in-depth optical cement with described optical medium thin layer 502 and through another substrate 501 after the step 1.

Although specifically show and introduced the present invention in conjunction with preferred embodiment; but the those skilled in the art should be understood that; in the spirit and scope of the present invention that do not break away from appended claims and limited; can make various variations to the present invention in the form and details, be protection scope of the present invention.

Claims (10)

1. an etalon is characterized in that: comprise

First substrate is coated with the specific wavelength reflectance coating on it;

The optical medium thin layer, it is plated on the plated film face of described first substrate;

Second substrate is coated with the specific wavelength reflectance coating on it, the plated film face is glued at described optical medium thin layer by optical cement or in-depth optical cement.

2. etalon as claimed in claim 1 is characterized in that: described optical medium thin layer is complete lamina plane, constitutes solid etalon.

3. etalon as claimed in claim 1 is characterized in that: described optical medium thin layer is the lamina plane of central area disappearance, constitutes the cavity etalon.

4. as claim 1 or 2 or 3 described etalons, it is characterized in that: the thickness of described optical medium thin layer is micron dimension; The material of described optical medium thin layer is SiO ₂Or other uniform optical media.

5. as claim 1 or 3 described etalons, it is characterized in that: be air or vacuum or specific gas in the space of described cavity etalon central area disappearance.

6. as claim 1 or 2 or 3 described etalons, it is characterized in that: the outer logical light face of the non-plated film of substrate of described etalon forms a little angle of wedge, and described angle of wedge scope is about 1 '-10 '.

7. as claim 1 or 2 or 3 described etalons, it is characterized in that: the outer logical light face plating anti-reflection film of the non-plated film of substrate of described etalon.

8. make the method for etalon as claimed in claim 1 or 2, it is characterized in that:

Step 1: make substrate earlier, and on substrate, plate the high-reflecting film or the partial reflection film of specific wavelength;

Step 2: will plate certain thickness optical medium thin layer through the plated film face of the substrate after the step 1;

Step 3: glue together by optical cement or in-depth optical cement with described optical medium thin layer and through another substrate after the step 1.

9. make method, it is characterized in that as claim 1 or 3 described etalons:

Step 1: make substrate earlier, and on substrate, plate the high-reflecting film or the partial reflection film of specific wavelength;

Step 2: in substrate of substrate membrane centre of surface zone pad of plated film;

Step 3: will plate certain thickness optical medium thin layer through the plated film face of the substrate after the step 2;

Step 4: the substrate of removing substrate membrane centre of surface zone;

Step 5: glue together by optical cement or in-depth optical cement with described optical medium thin layer and through another substrate after the step 1.

10. make method, it is characterized in that as claim 1 or 3 described etalons:

Step 1: make substrate earlier, and on substrate, plate the high-reflecting film or the partial reflection film of specific wavelength;

Step 2: will plate certain thickness optical medium thin layer through the plated film face of the substrate after the step 1;

Step 3: substrate membrane centre of surface zone is removed by photolithographicallpatterned;

Step 4: glue together by optical cement or in-depth optical cement with described optical medium thin layer and through another substrate after the step 1.

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