JP2016046421A - Cooler module and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooler module 1 capable of restraining the number of parts from increasing.SOLUTION: In the cooler module 1, an inverter plate 40 is connected with a supply pipe 31 and a discharge pipe 32. The inverter plate 40 includes a refrigerant supply passage 43 and a refrigerant discharge passage 44. The inverter plate 40 and a seal member 50 are sandwiched between a laminated cooler 30 and an inner wall 82 of a case 80. Thus, a tightening member for fixing the inverter plate 40 on the case 80 can be eliminated.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cooler module and a method for manufacturing the cooler module.

  2. Description of the Related Art Conventionally, in a cooler module for automobiles, there is a case in which a plurality of electronic components are housed in a case, and a stacked cooler cools the plurality of electronic components (for example, see Patent Document 1). .

  The stacked cooler includes a plurality of heat exchange tubes stacked in a predetermined direction, a supply tank connected to one end side of the plurality of heat exchange tubes and supplying a refrigerant to the plurality of heat exchange tubes, And a discharge tank that is connected to the other end of the heat exchange tubes and collects the refrigerant flowing from the plurality of heat exchange tubes.

  Electronic components are arranged between two heat exchange tubes for every two adjacent heat exchange tubes among the plurality of heat exchange tubes. The plurality of heat exchange tubes are compressed in the heat exchange tube lamination direction, and the plurality of electronic components are sandwiched by the two heat exchange tubes, respectively. Thereby, a some electronic component is closely_contact | adhered to two adjacent heat exchange tubes.

  In the stacked cooler configured as described above, the refrigerant is distributed from the supply tank to each of the plurality of heat exchange tubes. The refrigerant passes through the plurality of heat exchange tubes and is collected in the discharge tank. At this time, each of the plurality of electronic components is cooled by the refrigerant flowing through the two adjacent heat exchange tubes.

JP 2002-26215 A

  In the cooler module of Patent Document 1, the present inventors connect a supply pipe that supplies refrigerant to the supply tank to the supply tank, and connects a discharge pipe that collects the refrigerant discharged from the discharge tank to the discharge tank. The structure to be studied was examined.

  For example, in the process of assembling the cooler module in the vehicle, if a load is applied to the front end side of the supply pipe or the discharge tank, the load is transmitted to the stacked cooler and the stacked cooler may be deformed.

  On the other hand, like the cooler 1A shown in FIGS. 14 and 15, the closing member 40A through which the supply pipe 31 and the discharge pipe 32 penetrate is disposed in the opening 86A of the case 80B, so that the opening of the case 80B. A structure in which 86A is closed by the closing member 40A is conceivable.

  In this structure, the closing member 40A supports the supply pipe 31 and the discharge pipe 32, so that even if a load is applied to the front end side of the supply pipe 31 or the discharge tank 32, the load is prevented from being transmitted to the stacked cooler 30A. Although it is possible, a fastening member is required to fix the closing member 40A to the case 80B. For this reason, the number of parts increases.

  Further, since the plurality of heat exchange tubes 2c are stored in the case 80B in a compressed state, elastic force is applied to the closing member 40A from the plurality of heat exchange tubes 2c, and the closing member 40A bends. For this reason, the sealing performance of the closing member 40A is deteriorated, and a gap is generated between the case 80A and the closing member 40A. Along with this, the sealing inside the case 80B by the closing member 40A is lowered.

  An object of this invention is to provide the cooler module which suppressed the increase in the number of components, and the manufacturing method of a cooler module, maintaining the airtightness of the inside of a case in view of the said point.

In order to achieve the above object, according to the first aspect of the present invention, in the cooler module, the cooler module has the coolant channel (2c) and cools the object (4) to be cooled by the coolant in the coolant channel. (30),
A supply pipe (31) for supplying the refrigerant to the refrigerant inlet (24a) of the refrigerant flow path of the cooler and a discharge pipe (collecting the refrigerant discharged from the refrigerant outlet (24b) of the refrigerant flow path of the cooler) 32) and a joining member (40) to which
A case (80) for housing the object to be cooled, the cooler, and the joining member;
A first seal member (50) housed in the case and tightly contacting the joining member and the first inner wall (82) of the case;
The supply pipe and the discharge pipe are disposed so as to penetrate the case and the first seal member, respectively.
The joining member has a first refrigerant introduction channel (43) for guiding the refrigerant flowing from the supply pipe to the refrigerant inlet of the refrigerant channel, and the refrigerant flowing from the refrigerant outlet of the refrigerant channel to the discharge pipe. A second refrigerant introduction channel (44) is provided,
The joining member and the first seal member are sandwiched between the cooler and the first inner wall of the case.

  According to the first aspect of the present invention, the joining member and the first seal member are sandwiched between the cooler and the inner wall of the case. For this reason, it is not necessary to use a fastening member for fixing the joining member to the case, and an increase in the number of parts can be suppressed.

  In addition, since the joining member and the first seal member are sandwiched between the cooler and the first inner wall of the case, the joining member can be applied even if a force is applied to the joining member from the cooler. Is supported by the first inner wall of the case. For this reason, since it is suppressed that the joining member bends, the state which contact | adhered between the member for joining and the inner wall of a case is maintained. The airtightness inside the case can be maintained.

  As described above, it is possible to provide a cooler capable of suppressing an increase in the number of parts while maintaining the airtightness inside the case.

In invention of Claim 7, It is a manufacturing method of the cooler module as described in any one of Claim 4 thru | or 6, Comprising:
Among the plurality of heat exchange tubes, compressing the cooler by applying pressure to the cooler in a state where at least the first seal member, the joining member, and the cooler are housed in the case. It has the process (S130) which makes the said to-be-cooled object and said two heat exchange tubes closely_contact | adhere for every two adjacent heat exchange tubes.

  Accordingly, it is an object of the present invention to provide a method for manufacturing a cooler module that suppresses an increase in the number of parts while maintaining the airtightness inside the case.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is a figure which shows the whole structure of the cooler module in 1st Embodiment of this invention. It is the figure which looked at the inverter plate single-piece | unit of the cooler module in 1st Embodiment from the one side of the tube lamination direction. It is the figure which looked at the inverter plate and laminated | stacked cooler in 1st Embodiment from the one side of the tube width direction DRw. It is sectional drawing which shows the supply tank part vicinity of FIG. In FIG. 3, it is the figure showing the intermediate | middle plate and the inner fin attached to it. It is a flowchart which shows the manufacturing process of the cooler module in 1st Embodiment. It is a figure which shows the whole structure of the cooler module in the modification of 1st Embodiment. It is a figure which shows the inverter plate and laminated | stacked cooler of the cooler module in 2nd Embodiment of this invention. It is a figure which shows the whole structure of the cooler module in 3rd Embodiment of this invention. It is a flowchart which shows the manufacturing process of the cooler module in 3rd Embodiment. It is a figure which shows the sealing member in 3rd Embodiment. It is a figure which shows the sealing member in the 1st modification of 3rd Embodiment. It is a figure which shows the whole structure of the cooler module in the 2nd modification of 3rd Embodiment. It is a figure which shows the whole structure of the cooler module in the comparative example of this invention. It is XIII-XIII sectional drawing in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a diagram showing an overall configuration of a cooler module 1 according to this embodiment of the present invention. FIG. 2 is a diagram of the inverter plate 40 alone of the cooler module 1 viewed from one side in the tube stacking direction DRst. FIG. 3 is a view of the inverter plate 40 and the stacked cooler 30 as viewed from one side in the tube width direction DRw.

  The stacked cooler 30 is a heat exchanger that cools the heat exchange target by exchanging heat between the refrigerant circulating inside and the heat exchange target. Specifically, the heat exchange object, that is, the object to be cooled is a plurality of electronic parts 4 formed in a plate shape, and the stacked cooler 30 cools the electronic parts 4 from both sides. As the refrigerant of the stacked cooler 30, for example, water mixed with an ethylene glycol antifreeze, that is, cooling water is used. Note that the tube stacking direction DRst, the tube longitudinal direction DRtb, and the tube width direction DRw of FIG. 5 to be described later are all orthogonal to each other.

  Specifically, the electronic component 4 as the object to be cooled contains a power element for controlling high power and is formed in a flat rectangular parallelepiped shape. In the electronic component 4, the power electrode extends from one long side outer peripheral surface, and the control electrode extends from the other long side outer peripheral surface. Specifically, the electronic component 4 is a semiconductor module including a semiconductor element such as an IGBT (Insulated Gate Bipolar Transistor) and a diode. And the semiconductor module comprises the power converter for the motor for driving | running | working a motor vehicle with the capacitor | condenser 70 mentioned later. The power conversion device is a circuit that converts DC power into AC power and outputs the AC power to a traveling motor.

  As shown in FIG. 3, the stacked cooler 30 is configured by stacking a plurality of cooling pipes 2 in the tube stacking direction DRst. Each cooling pipe 2 has a supply tank constituting portion 2a at one end portion in the tube longitudinal direction DRtb and a discharge tank constituting portion 2b at the other end portion in the tube longitudinal direction DRtb. Further, a flat heat exchange tube 2c is formed between the supply tank component 2a and the discharge tank component 2b, which connects them and forms a tube refrigerant channel 2d (see FIG. 4) through which the refrigerant flows. doing.

  The supply tank constituting section 2a is laminated in the tube lamination direction DRst, thereby constituting a supply tank 11 for supplying the refrigerant to the tube refrigerant flow path 2d. That is, the supply tank 11 includes a plurality of supply tank components 2a, and one ends of the plurality of heat exchange tubes 2c are connected to each other.

  The discharge tank component 2b is stacked in the tube stacking direction DRst, thereby configuring the discharge tank 12 into which the refrigerant discharged from the tube refrigerant flow path 2d flows. That is, the discharge tank 12 is composed of a plurality of discharge tank components 2b, and the other ends of the plurality of heat exchange tubes 2c are connected to each other.

  The heat exchange tube 2c is in contact with one main plane of the electronic component 4 at one flat surface (cooling surface) thereof, and is also in contact with another main surface of another electronic component 4 at the other flat surface (cooling surface). Is arranged. That is, the plurality of electronic components 4 and the plurality of heat exchange tubes 2c are alternately stacked in the tube stacking direction DRst. And the heat exchange tube 2c is further arrange | positioned at the both ends of the tube lamination direction DRst in the assembly body which laminated | stacked and arrange | positioned the some electronic component 4 and the some heat exchange tube 2c. With such a stacked arrangement, the heat exchange tube 2c causes the refrigerant flowing in the tube refrigerant flow path 2d to dissipate heat to the electronic component 4, and cools the plurality of electronic components 4 from both sides.

  FIG. 4 is a cross-sectional view showing the vicinity of the supply tank 11 of the stacked cooler 30. The cooling pipe 2 is configured by laminating metal plates having high thermal conductivity such as an aluminum alloy and joining these plates by a joining technique such as brazing. Specifically, as shown in FIGS. 4 and 5, the cooling pipe 2 includes a pair of outer shell plates 27 and an intermediate plate 28. The pair of outer shell plates 27 form the outer shell of the cooling pipe 2 and are arranged side by side in the tube stacking direction DRst. The intermediate plate 28 is disposed between the pair of outer shell plates 27.

  In other words, the heat exchange tube 2c includes a pair of outer shell plates 27 and an intermediate plate 28, and the pair of outer shell plates 27 extend to the supply tank component 2a and the discharge tank component 2b, respectively. . The intermediate plate 28 extends from the heat exchange tube 2c into the supply tank component 2a and the discharge tank component 2b.

  The outer shell plate 27 has a protruding tube portion 22 provided so as to protrude in the tube stacking direction DRst at a portion constituting the supply tank constituting portion 2a and the discharge tank constituting portion 2b. The protruding tube portion 22 opens in the tube stacking direction DRst. Then, the protruding pipe portions 22 of the plurality of cooling pipes 2 are joined to each other, whereby the plurality of cooling pipes 2 are connected in the tube stacking direction DRst, and the supply tank 11 and the discharge tank 12 are configured.

  The outer shell plate 27 has a diaphragm portion 23 formed in an annular shape with a predetermined radial width around the base portion of the protruding tube portion 22, that is, around the base portion of the protruding tube portion 22. The diaphragm portion 23 is recessed in the tube stacking direction DRst toward the inside of the tank constituting portions 2a and 2b in the supply tank constituting portion 2a and the discharge tank constituting portion 2b.

  Each diaphragm portion 23 of the present embodiment constitutes an easily deformable portion that can be easily deformed by a pressing force in the tube stacking direction DRst when the cooler module 1 is assembled. Each diaphragm part 23 is smaller in rigidity than parts other than each diaphragm part 23 in the supply tank 11 (or the discharge tank 12).

  In addition, the protruding tube portion 22 of the outer shell plate 27 is connected in a row. That is, of the two projecting tube portions 22 connected in the tube stacking direction DRst, one projecting tube portion 22 is a stepped large-diameter projecting tube portion 223 disposed outside in the spigot connection, The protruding tube portion 22 is a small-diameter protruding tube portion 222 that is inserted and arranged inside the large-diameter protruding tube portion 223. Accordingly, one of the pair of outer shell plates 27 constituting the cooling pipe 2 has a large-diameter protruding tube portion 223 as the protruding tube portion 22, and the other of the pair of outer shell plates 27 is the protruding tube portion 22. A small-diameter protruding tube portion 222 is provided.

  In each of the supply tank 11 and the discharge tank 12, the small-diameter protruding tube portion 222 is fitted into the large-diameter protruding tube portion 223, so that the small-diameter protruding tube portion 222 and the large-diameter protruding tube portion 223 have one tube. A path forming unit 224 is configured. The pipe line forming part 224 forms a circular tank pipe line 224a for flowing the refrigerant in the tube stacking direction DRst in each of the tanks 11 and 12.

  However, as shown in FIG. 3, the outer shell plates 27 (see FIG. 4) for the end portions provided at both ends of the stacked cooler 1 in the tube stacking direction DRst do not have the protruding tube portions 22. . That is, the outer shell plate 27 for one end, which is the upper side of FIG. 3, has a refrigerant inlet 24a and a refrigerant outlet 24b to which a refrigerant supply passage 43 and a refrigerant discharge passage 44 of an inverter plate 40 described later are connected. have. The outer shell plate 27 for one end, which is the lower side of FIG. 3, does not have the protruding tube portion 22 and is closed.

  As shown in FIG. 4, the large-diameter protruding tube portion 223 receives the small-diameter protruding tube portion 222 therein. The step portion formed in the large-diameter protruding tube portion 223 functions as a restricting portion for restricting the insertion length of the small-diameter protruding tube portion 222. The tip of the small-diameter protruding tube portion 222 abuts on the stepped portion, and the insertion length of the small-diameter protruding tube portion 222 in the axial direction, that is, the tube stacking direction DRst is regulated. Between the inner surface of the large-diameter protruding tube portion 223 and the outer surface of the small-diameter protruding tube portion 222, there is a gap that can be inserted in the assembly process, but both are joined by brazing, and the gap is closed, Sealed.

  The projecting tube portion 22 after joining provides a rigidity that does not buckle even in the axial direction of the tube, that is, the tube stacking direction DRst, even if the diaphragm portion 23 receives a pressing force that causes plastic deformation.

  As shown in FIG. 4, an outer peripheral wall surface 274 that rises in the tube stacking direction DRst and a narrow flange portion 275 that extends outward from the outer peripheral wall surface 274 are formed on the outer edge of the outer shell plate 27. The flange portion 275 provides a flat surface extending in a direction perpendicular to the stacking direction.

  The pair of outer shell plates 27 are arranged so that the flange portions 275 face each other and the edge portions of the intermediate plate 28 are sandwiched between the flange portions 275. The pair of outer shell plate 27 and intermediate plate 28 are joined by brazing.

  As described above, the projecting pipe portions 22 of the adjacent cooling pipes 2 are fitted to each other and the side walls of the projecting pipe portions 22 are joined to each other so that the supply tank components 2a communicate with each other, and the discharge tanks of each other. The components 2b communicate with each other. Thereby, the supply tank 11 and the discharge tank 12 are formed.

  Further, as shown in FIG. 4, in the cooling pipe 2, a diaphragm part 23 that is deformed in the tube stacking direction DRst is formed around the protruding pipe part 22. The diaphragm portion 23 faces the inner side of the cooling pipe 2 in the tube stacking direction DRst when the interval between the two adjacent cooling pipes 2 is narrowed when the electronic component 4 is disposed in the laminated cooler 30. And deform.

  Further, as shown in FIG. 5 which is a perspective view of the heat exchange tube 2c, the cooling pipe 2 is laminated in a portion of the heat exchange tube 2c in the tube lamination direction DRst with the intermediate plate 28 interposed therebetween. Inner fins 29 are provided. The inner fin 29 is disposed between the intermediate plate 28 and the outer shell plate 27 and is formed into a wave shape to promote heat exchange of the refrigerant. In other words, the tube refrigerant flow path 2d is formed between the intermediate plate 28 and the outer shell plate 27 in the heat exchange tube 2c, and the inner fins 29 are disposed in the tube refrigerant flow path 2d. The outer shell plate 27, the intermediate plate 28, and the inner fin 29 are brazed to each other to constitute the cooling pipe 2.

  A refrigerant inlet 30a and a refrigerant outlet 30b are formed in the heat exchange tube 2c on one side of the tube stacking direction DRst among the plurality of heat exchange tubes 2c. The refrigerant inlet 30a is located on one side of the supply tank 11 in the tube stacking direction DRst. The refrigerant outlet 30b is located on one side of the discharge tank 12 tube stacking direction DRst. The refrigerant inlet 30a and the refrigerant outlet 30b are open to one side in the tube stacking direction DRst.

  The supply tank 11, the discharge tank 12, and the plurality of heat exchange tubes 2 c configured in this way constitute a stacked cooler 30 that cools the plurality of electronic components 4 with a refrigerant.

  As shown in FIG. 1, the cooler module 1 of the present embodiment includes a stacked cooler 30, an inverter plate 40, a seal member 50, a compression member 60, a capacitor 70, and a case 80.

  The inverter plate 40 is disposed on one side of the tube stacking direction DRst with respect to the stacked cooler 30. The inverter plate 40 of this embodiment is connected to the stacked cooler 30 by a joining technique such as brazing.

  Here, the dimension in the tube width direction DRw of the inverter plate 40 is larger than the dimension in the tube width direction DRw of the heat exchange tube 2c (or the cooling pipe 2), and the dimension in the tube longitudinal direction DRtb of the inverter plate 40 is It is larger than the dimension in the tube longitudinal direction DRtb of the heat exchange tube 2c (or the cooling tube 2). The dimension Lc in the tube stacking direction DRst of the inverter plate 40 is larger than the dimension in the tube stacking direction DRst of the heat exchange tube 2c (or the cooling pipe 2). The inverter plate 40 is made of a metal plate having high thermal conductivity such as an aluminum alloy.

  The inverter plate 40 is provided with through holes 41 and 42 penetrating in the tube stacking direction DRst. The supply pipe 31 is fitted to one side of the through hole 41 in the tube stacking direction DRst. The other side of the through hole 41 in the tube stacking direction DRst with respect to the supply pipe 31 constitutes a refrigerant supply flow path 43. The refrigerant supply passage 43 is formed between the supply pipe 31 and the refrigerant inlet 24a of the stacked cooler 30 and guides the refrigerant flowing from the supply pipe 31 to the refrigerant inlet 24a of the stacked cooler 30. It is.

  A discharge pipe 32 is fitted to one side of the through hole 42 in the tube stacking direction DRst. The other side of the through hole 42 in the tube stacking direction DRst with respect to the discharge pipe 32 constitutes a refrigerant discharge channel 44. The refrigerant discharge passage 44 is formed between the discharge pipe 32 and the refrigerant outlet 24b of the stacked cooler 30 and guides the refrigerant flowing from the refrigerant outlet 24b of the stacked cooler 30 to the discharge pipe 32. It is.

  The supply pipe 31 is disposed so as to protrude to the outside of the case 80 through the through hole 83 of the case 80 through the first through hole of the seal member 50. Accordingly, the hole forming portion 83 a that forms the through hole 83 in the case 80 supports the supply pipe 31.

  The discharge pipe 32 is disposed so as to protrude through the through hole 84 of the case 80 through the second through hole of the seal member 50 and project outside the case 80. Accordingly, the hole forming portion 84 a that forms the through hole 84 in the case 80 supports the discharge pipe 32.

  The supply pipe 31 and the discharge pipe 32 of the present embodiment are each connected to the inverter plate 40 by a joining technique such as brazing.

  The through holes 83 and 84 are formed between the inner wall 82 and the outer wall of the case 80 so as to penetrate in the tube stacking direction DRst. The first and second through holes in the seal member 50 are formed so as to penetrate in the tube stacking direction DRst. The seal member 50 isolates the inside and outside of the case 80 by closely contacting the inverter plate 40 and the inner wall 82 of the case 80 with the first and second through holes sealed. That is, the seal member 50 seals the inside of the case 80 in a state where the first and second through holes are sealed.

  The capacitor 70 is arranged on the inner wall 81 side of the case 80. The inner wall 81 is formed to face the inner wall 82. The compression member 60 is composed of a spring or the like, and is disposed between the capacitor 70 and the multilayer cooler 30 in the case 80 to give an elastic force to the multilayer cooler 30. The case 80 houses the multilayer cooler 30, the inverter plate 40, the seal member 50, the compression member 60, and the capacitor 70.

  The case 80 is integrally formed so as to surround the stacked cooler 30, the inverter plate 40, the seal member 50, the compression member 60, and the capacitor 70 from the tube stacking direction DRst and the tube longitudinal direction DRtb. The case 80 of the present embodiment is made of a metal material having high thermal conductivity such as an aluminum alloy. The case 80 includes inner walls 81, 82, 86, 87 and an opening 85.

  The opening 85 opens to one side of the case 80 in the tube width direction DRw (the front side in the direction perpendicular to the paper surface of FIG. 1). The inner wall 81 is formed on the other side of the tube stacking direction DRst with respect to the opening 85. The inner wall 82 is formed on one side of the tube stacking direction DRst with respect to the opening 85. The inner wall 86 is formed on one side (right side in FIG. 1) in the tube longitudinal direction DRtb with respect to the opening 85. The inner wall 87 is formed on the other side (left side in FIG. 1) in the tube longitudinal direction DRtb with respect to the opening 85.

  Next, the operation of the cooler module 1 of the present embodiment will be described.

  First, the refrigerant flows from the supply pipe 31 into the refrigerant inlet 24 a of the stacked cooler 30 through the refrigerant supply passage 43 of the inverter plate 40. The refrigerant flowing into the refrigerant inlet 24a is introduced into the supply tank 11. The refrigerant is distributed from the supply tank 11 to each of the plurality of heat exchange tubes 2c. The distributed refrigerant passes through the plurality of heat exchange tubes 2c and is then collected in the discharge tank 12. The recovered refrigerant is discharged from the refrigerant outlet 24 b of the stacked cooler 30 to the discharge pipe 32 through the refrigerant discharge passage 44 of the inverter plate 40. As the refrigerant flows in this manner, the plurality of electronic components 4 are cooled by the refrigerant in the two adjacent heat exchange tubes 2c among the plurality of heat exchange tubes 2c.

  Next, assembly of the cooler module 1 of the present embodiment will be described.

  First, in the first step, the stacked cooler 30, the plurality of electronic components 4, the seal member 50, and the compression member 60 before the diaphragm portion 23 is deformed are separately prepared (step 100). At this time, for example, the stacked cooler 30 to which the inverter plate 40 is connected is used.

  Next, in the second step, the seal member 50, the inverter plate 40, and the stacked cooler 30 are disposed between the inner wall 82 and the capacitor 70 in the case 80. At this time, the seal member 50, the inverter plate 40, and the multilayer cooler 30 are arranged in the order of the seal member 50 → the inverter plate 40 → the multilayer cooler 30 from the inner wall 82 side toward the capacitor 70 (inner wall 81) side.

  Here, in a state where the supply pipe 31 is passed through the first through hole of the seal member 50, the supply pipe 31 is passed through the through hole 83 from the inside of the case 80 and protrudes to the outside of the case 80. In a state where the discharge pipe 32 is passed through the second through hole of the seal member 50, the discharge pipe 32 is passed through the through hole 84 from the inside of the case 80 and protrudes to the outside of the case 80 (step 110).

  Next, in the third step, the electronic component 4 is placed between the two adjacent heat exchange tubes 2c among the two adjacent heat exchange tubes 2c among the plurality of heat exchange tubes 2c of the stacked cooler 30. (Step 120).

  Next, in a fourth step, a hook-shaped jig (not shown) is hooked on the other side of the tube stacking direction DRst in the stacked cooler 30, and the stacked cooler 30 is moved to the stacked cooler 30 by the hook-shaped jig. On the other hand, a pressing force is applied from the other side in the tube stacking direction DRst to the inverter plate 40 side.

  This pressing force compresses the stacked cooler 30 in the tube stacking direction DRst. Specifically, when the pressing force is applied to the diaphragm portion 23 through the protruding tube portion 22, the diaphragm portion 23 is deformed toward the inside of the cooling tube 2 as shown in FIG. 4.

  That is, due to the pressing force, the diaphragm part 23 for each outer shell plate 27 is recessed in the tube stacking direction DRst toward the inside of the tank constituent parts 2a and 2b in the supply tank constituent part 2a and the discharge tank constituent part 2b. At this time, the space | interval between the two adjacent cooling pipes 2 (namely, two adjacent heat exchange tubes 2c) among the several cooling pipes 2 is narrowed. That is, when the diaphragm portion 23 is deformed, the interval between the two adjacent heat exchange tubes 2c is narrowed. Therefore, the two adjacent heat exchange tubes 2c and the electronic component 4 are in close contact with each other, and the electronic component 4 is sandwiched between the two adjacent heat exchange tubes 2c (step 130).

  In addition, the effect | action which narrows the space | interval between the cooling pipes 2 (namely, heat exchange tube 2c) with pressing force, and makes the cooling pipe 2 and the electronic component 4 contact | adhere is the same as that of Unexamined-Japanese-Patent No. 2006-5014.

  Next, in the fifth step, the compression member 60 is inserted between the multilayer cooler 30 and the capacitor 70. The compression member 60 applies the elastic force to one side of the tube stacking direction DRst with respect to the stacked cooler 30, the inverter plate 40, and the seal member 50. For this reason, the stacked cooler 30 is sandwiched between the inner wall 82 and the condenser 83 in a compressed state. For this reason, the state where the two adjacent heat exchange tubes 2c and the electronic component 4 are in close contact with each other for each of the two adjacent cooling tubes 2 is maintained. Accordingly, the seal member 50 and the inverter plate 40 are sandwiched between the stacked cooler 30 and the inner wall 82 of the case 80 (step 140).

  According to the embodiment described above, in the multilayer cooler 1, the plurality of electronic components 4, the multilayer cooler 30, the inverter plate 40, and the seal member 50 are accommodated in the case 80. The stacked cooler 30 cools the plurality of electronic components 4 as the objects to be cooled by the refrigerant in the refrigerant flow path 2c. Connected to the inverter plate 40 are a supply pipe 31 for supplying a refrigerant to the refrigerant inlet 24a of the stacked cooler 30 and a discharge pipe 32 for collecting the refrigerant discharged from the refrigerant outlet 24b of the stacked cooler 30. Yes. The seal member 50 closely contacts the inverter plate 40 and the inner wall 82 of the case 80 to isolate the inside and the outside of the case 80. The supply pipe 31 is disposed so as to protrude to the outside of the case 80 through the through hole 83 of the case 80 through the first through hole of the seal member 50. The discharge pipe 32 is disposed so as to protrude through the through hole 84 of the case 80 through the second through hole of the seal member 50 and project outside the case 80. The inverter plate 40 is provided with a refrigerant supply passage 43 and a refrigerant discharge passage 44. The refrigerant supply channel 43 guides the refrigerant flowing out from the supply pipe 31 to the refrigerant inlet 24 a of the stacked cooler 30. The refrigerant discharge passage 44 leads to the discharge pipe 32 that flows out from the refrigerant outlet 24 b of the stacked cooler 30.

  As described above, the inverter plate 40 and the seal member 50 are sandwiched between the stacked cooler 30 and the inner wall 82 of the case 80. For this reason, it is not necessary to use a fastening member for fixing the inverter plate 40 to the case 80, and an increase in the number of parts can be suppressed.

  In addition, the inverter plate 40 and the seal member 50 are sandwiched between the laminated cooler 30 and the inner wall 82 of the case 80. For this reason, even if a force is applied to the inverter plate 40 from the stacked cooler 30 side, the inverter plate 40 is supported by the inner wall 82 of the case 80. Therefore, since the inverter plate 40 is suppressed from being bent, a state in which the inverter plate 40 and the inner wall 82 of the case 80 are in close contact with each other is maintained. Therefore, the airtightness inside the case 80 can be maintained.

  As described above, it is possible to provide the cooler module 1 and the method for manufacturing the cooler module 1 that can suppress an increase in the number of components while maintaining the airtightness inside the case 80.

  In the present embodiment, the supply pipe 31 and the discharge pipe 32 are connected to the inverter plate 40. In addition, the hole forming portions 83 a and 84 a of the case 80 can support the supply pipe 31 and the discharge pipe 32. Thereby, even if a load is applied to the front end side of the supply pipe 31 and the discharge pipe 32, the hole forming portions 83a and 84a of the case 80 can suppress the displacement of the supply pipe 31 and the discharge pipe 32. Therefore, it is possible to prevent the stacked cooler 30 from being deformed by a load applied to the leading end side of the supply pipe 31 and the discharge pipe 32.

  In the present embodiment, the stacked cooler 30, the inverter plate 40, the seal member 50, and the compression member 60 are sandwiched between the inner wall 82 of the case 80 and the capacitor 70 without using a lid member. Therefore, the number of parts can be reduced without using fastening parts for fixing the lid member to the case 80.

  In the present embodiment, the inverter plate 40 and the seal member 50 are sandwiched between the stacked cooler 30 and the inner wall 82 of the case 80 as described above, so that the inverter plate 40 is prevented from being bent. For this reason, as shown in FIG. 7, the dimension La of the tube stacking direction DRst in the inverter plate 40 can be reduced. FIG. 7 shows an example in which the dimension La in the tube stacking direction DRst of the inverter plate 40 is made smaller than that of the inverter plate 40 of FIG.

(Second Embodiment)
In the first embodiment, the example in which the seal member 50 is arranged on one side of the tube stacking direction DRst with respect to the inverter plate 40 has been described. In addition to this, between the inverter plate 40 and the stacked cooler 30, The second embodiment in which the seal member 50A is arranged will be described.

  FIG. 8 shows a state where the case 80 is removed from the cooler module 1 according to the second embodiment of the present invention. 8, the same reference numerals as those in FIG. 1 denote the same components.

  In the cooler module 1 of the present embodiment, a seal member 50A is added between the inverter plate 40 and the stacked cooler 30 in the cooler module 1 of the first embodiment.

  The seal member 50A is provided with first and second through holes. The first through hole communicates between the refrigerant supply passage 43 of the inverter plate 40 and the refrigerant inlet 24 a of the stacked cooler 30. The second through hole communicates between the refrigerant discharge passage 44 of the inverter plate 40 and the refrigerant outlet 24 b of the stacked cooler 30.

  As in the first embodiment, the seal member 50A is sandwiched by the pressing force applied from the compression member 60 between the inverter plate 40 and the stacked cooler 30 while being accommodated in the case 80. become. As a result, the seal member 50A communicates between the refrigerant supply flow path 43 and the refrigerant inlet 24a, and communicates between the refrigerant discharge flow path 44 and the refrigerant outlet 24b, and the inverter plate 40 and the stacked cooler. 30 can be brought into close contact with each other. That is, the seal member 50A brings the inverter plate 40 and the stacked cooler 30 into close contact with the first and second through holes sealed.

  Next, the operation of the cooler module 1 of the present embodiment will be described.

  First, the refrigerant flows from the supply pipe 31 into the refrigerant inlet 24a of the stacked cooler 30 through the refrigerant supply passage 43 of the inverter plate 40 and the first through hole of the seal member 50A. The refrigerant flowing into the refrigerant inlet 24a is introduced into the supply tank 11. The refrigerant is distributed from the supply tank 11 to each of the plurality of heat exchange tubes 2c. The distributed refrigerant passes through the plurality of heat exchange tubes 2c and is then collected in the discharge tank 12. The recovered refrigerant is discharged to the discharge pipe 32 through the refrigerant outlet 24b of the stacked cooler 30, the second through hole of the seal member 50A, and the refrigerant discharge passage 44 of the inverter plate 40. As the refrigerant flows in this manner, the plurality of electronic components 4 are cooled by the refrigerant in the two adjacent heat exchange tubes 2c among the plurality of heat exchange tubes 2c.

  In the present embodiment described above, the seal member 50A communicates between the refrigerant supply channel 43 and the refrigerant inlet 24a and communicates between the refrigerant discharge channel 44 and the refrigerant outlet 24b as described above. The inverter plate 40 and the stacked cooler 30 can be brought into close contact with each other.

  Accordingly, the stacked cooler 30, the inverter plate 40, and the seal members 50 and 50A are applied to the cooler 1A of the comparative example of FIGS. 14 and 15 in addition to the cooler module 1 of the first embodiment. be able to. Therefore, the versatility of the stacked cooler 30, the inverter plate 40, and the seal members 50 and 50A can be improved.

  The inverter plate 40 in FIG. 8 corresponds to the closing member 40A in FIGS. 14 and 15, and the stacked cooler 30 in FIG. 8 corresponds to the stacked cooler 30A in FIGS.

(Third embodiment)
In the third embodiment, an example in which the stacked cooler 30 is compressed using a case lid in the cooler module 1 of the first embodiment will be described.

  FIG. 9 shows the overall configuration of the cooler module 1 according to the third embodiment of the present invention. 9, the same reference numerals as those in FIG. 1 denote the same components.

  The cooler module 1 of the present embodiment includes a case 80A that replaces the case 80 in the cooler module 1 of the first embodiment. The case 80A includes a case main body 80a and a lid member 80b. The case main body 80a is a housing having openings 85 and 88. The opening 88 opens to one side (upper side in FIG. 9) in the tube stacking direction DRst. The opening 85 opens on one side of the tube width direction DRw (the front side in the direction perpendicular to the paper surface in FIG. 9). The case body 80 a constitutes inner walls 81, 86, 87. The lid member 80b closes the opening 86 of the case main body 80a. The lid member 80b constitutes an inner wall 82. The inner walls 81, 82, 86, 87 in FIG. 9 are the same as the inner walls 81, 82, 86, 87 in FIG. Through holes 83 and 84 are formed in the lid member 80b. The lid member 80b is fixed to the case main body 80a by a plurality of fastening members 90. As the fastening member 90, for example, a screw or a bolt is used.

  Here, the dimension in the tube width direction DRw of the lid member 80b is larger than the dimension in the tube width direction DRw of the heat exchange tube 2c (or the cooling pipe 2), and the dimension in the tube longitudinal direction DRtb of the lid member 80b is It is larger than the dimension in the tube longitudinal direction DRtb of the heat exchange tube 2c (or the cooling tube 2). The dimension Lc in the tube stacking direction DRst of the lid member 80b is larger than the dimension in the tube stacking direction DRst of the heat exchange tube 2c (or the cooling pipe 2).

  Note that the case main body 80a and the lid member 80b of the present embodiment are made of a metal plate having high thermal conductivity such as an aluminum alloy.

  Of the cooler module 1 of the present embodiment, the stacked cooler 30, inverter plate 40, and seal member 50 other than the case 80A are the stacked cooler 30, inverter plate 40, and seal member 50 of the first embodiment. It is the same. Since the operation of the cooler module 1 of the present embodiment is the same as the operation of the cooler module 1 of the first embodiment, the description thereof is omitted.

  Next, the assembly of the cooler module 1 of this embodiment will be described with reference to FIG.

  First, in the first step, as in the first embodiment, the stacked cooler 30, the plurality of electronic components 4, the inverter plate 40, the seal member 50, the compression member 60, and the case 80A are prepared (step 100). .

  Next, in the second step, the seal member 50, the inverter plate 40, the stacked cooler 30, and the compression member 60 are accommodated in the case body 80a. At this time, the seal member 50, the inverter plate 40, the stacked cooler 30, and the compression member 60 are directed from the capacitor 70 side to the opening 86 side, so that the compression member 60 → the stacked cooler 30 → the inverter plate 40 → the seal member. They are arranged in the order of 5.

  Here, in a state where the supply pipe 31 is passed through the first through hole of the seal member 50, the supply pipe 31 is projected from the inside of the case 80A through the through hole 83 of the lid member 80b to the outside of the case 80A. In a state where the discharge pipe 32 is passed through the second through hole of the seal member 50, the discharge pipe 32 is projected from the inside of the case 80A through the through hole 84 of the lid member 80b to the outside of the case 80 (step 110).

  Next, in the third step, the electronic component 4 is placed between every two adjacent heat exchange tubes 2c between the two adjacent heat exchange tubes 2c among the plurality of heat exchange tubes 2c of the stacked cooler 30. Arrange (step 120).

  Next, in the fourth step, a pressing force is applied to the other side of the tube stacking direction DRst with respect to the stacked cooler 30 through the inverter plate 40 by the lid member 80b. Similar to the first embodiment, this pressing force compresses the laminated cooler 30 in the tube laminating direction DRst, and the diaphragm portion 23 for each outer shell plate 27 includes the supply tank constituting portion 2a and the discharge tank constituting portion 2b. In this case, the tube is recessed in the tube stacking direction DRst toward the inside of the tank constituent portions 2a and 2b. At this time, the interval between two adjacent cooling pipes 2 among the plurality of cooling pipes 2 is narrowed. Therefore, the two adjacent cooling pipes 2 and the electronic component 4 are in close contact with each other, and the electronic component 4 is sandwiched between the two adjacent cooling pipes 2 (step 130).

  Next, in the fifth step, the lid member 80b is fixed to the case main body 80a by a plurality of fastening members 90 with the opening 88 closed by the lid member 80b. Accordingly, the stacked cooler 30 is held between the lid member 80b and the inner wall 81 in a compressed state. For this reason, in the stacked cooler 30, the state in which the two adjacent heat exchange tubes 2c and the electronic component 4 among the plurality of heat exchange tubes 2c are in close contact with each other is maintained. Accordingly, the seal member 50 and the inverter plate 40 are sandwiched between the stacked cooler 30 and the inner wall 82 of the lid member 80b (step 140).

  According to the present embodiment described above, in the cooler module 1, the inverter plate 40 and the seal member 50 are sandwiched between the stacked cooler 30 and the inner wall 82 of the lid member 80b. For this reason, it is not necessary to use a fastening member for fixing the inverter plate 40 to the case 80A, and an increase in the number of parts can be suppressed.

  In addition, the inverter plate 40 and the seal member 50 are sandwiched between the stacked cooler 30 and the inner wall 82 of the case 80A. For this reason, even if a force is applied to the inverter plate 40 from the stacked cooler 30 side, the inverter plate 40 is supported by the inner wall 82 of the lid member 80b. Therefore, since the inverter plate 40 is restrained from being bent, the seal member 50 maintains a state where the inverter plate 40 and the inner wall 82 of the lid member 80b are in close contact with each other. Therefore, the airtightness inside the case 80A can be maintained.

  As described above, it is possible to provide the cooler module 1 in which the increase in the number of components is suppressed while maintaining the hermeticity inside the case 80A.

  In the present embodiment, the supply pipe 31 protrudes outside the case 80A through the through hole 83 of the lid member 80b. For this reason, the hole forming portion 83 a that forms the through hole 83 in the lid member 80 b can support the supply pipe 31. The discharge pipe 32 passes through the through hole 84 of the lid member 80 b and protrudes outside the case 80. For this reason, the hole forming portion 84 a that forms the through hole 84 in the lid member 80 b can support the discharge pipe 32. Thereby, even if a load is applied to the front end side of the supply pipe 31 and the discharge pipe 32, the hole forming portions 83a and 84a of the lid member 80b can suppress the displacement of the supply pipe 31 and the discharge pipe 32. Therefore, it is possible to prevent the stacked cooler 30 from being deformed by a load applied to the leading end side of the supply pipe 31 and the discharge pipe 32.

  In the present embodiment, since the diaphragm member 23 and the heat exchange tube 2c (cooling pipe 2) are deformed using the lid member 80b, the treatment for deforming the diaphragm portion 23 and the heat exchange tube 2c (cooling pipe 2) is performed. No tools are needed.

(Other embodiments)
In the first embodiment, the example in which the inverter plate 40 is connected to the case 80 in the case 80 is described as the stacked cooler 30 in the first step. However, the first step is not limited thereto. The stacked cooler 30 and the inverter plate 40 may be stored in the case 80 in an independent state, and the stacked cooler 30 and the inverter plate 40 may be connected after the storage.

  In the first embodiment, the example in which, in the fourth step, the stacked cooler 30 is compressed by applying pressure to the stacked cooler 30 from the other side in the tube stacking direction DRst has been described. Instead, the stacked cooler 30 may be compressed by applying pressure to the stacked cooler 30 from one side in the tube stacking direction DRst.

  In the third embodiment, as the seal member 50, an example in which a single sheet-like member (see FIG. 11) having first and second through holes 41 and 42 that penetrate the supply pipe 31 and the discharge pipe 32 is used. However, instead of this, two seal members 50A and 50B shown in FIG. 12 may be used. The seal member 50 </ b> A is a sheet-like member having a first through hole 41 that allows the supply pipe 31 to pass therethrough. The seal member 50 </ b> B is a sheet-like member having a second through hole 42 that allows the discharge pipe 32 to pass therethrough.

  In the third embodiment, the example in which the dimension in the tube longitudinal direction DRtb of the inverter plate 40 is larger than the dimension in the tube longitudinal direction DRtb of the stacked cooler 30 (that is, the cooling pipe 2) has been described. As shown in FIG. 13, the dimension of the inverter plate 40 in the tube longitudinal direction DRtb may be smaller than the dimension of the stacked cooler 30 in the tube longitudinal direction DRtb.

  This is because the dimension in the tube longitudinal direction DRtb of the lid member 80b is larger than the dimension in the tube longitudinal direction DRtb of the stacked cooler 30. For this reason, when pressure is applied to the laminated cooler 30 from the lid member 80b, more pressure than necessary can be applied to the laminated cooler 30 over a wide range in the tube longitudinal direction DRtb. .

  FIG. 13 shows the cooler module 1 in which the dimension of the inverter plate 40 in the tube longitudinal direction DRtb is smaller than the dimension of the stacked cooler 30 in the tube longitudinal direction DRtb.

  Also in the first embodiment, similarly, the dimension of the inverter plate 40 in the tube longitudinal direction DRtb may be made smaller than the dimension of the stacked cooler 30 in the tube longitudinal direction DRtb.

  In the third embodiment, the lid member 80b applies pressure to the multilayer cooler 30 through the inverter plate 40 to compress the multilayer cooler 30, and then the opening 88 of the case body 80a is closed by the lid member 80b. Although an example has been described, the following may be used instead.

  That is, the stacked cooler 30 may be compressed by applying pressure to the stacked cooler 30 in a state where the opening 88 of the case body 80a is closed by the lid member 80b.

  In the first to third embodiments, the example in which the cooler according to the present invention is the cooler module 1 for automobiles has been described. Instead, the cooler according to the present invention is used as a stacked cooler for automobiles. Other coolers may be used.

  In the first to third embodiments, the example in which the cooler of the present invention is a stacked cooler has been described, but instead of this, the cooler of the present invention is a type of cooling other than the stacked cooler. It is good also as a vessel.

  In the first to third embodiments, the example in which the object to be cooled according to the present invention is the electronic component 4 has been described. Instead, the object to be cooled according to the present invention is a heating element other than the electronic component 4. It is good.

In the said 1st-3rd embodiment, although the example which applied the cooler module of this invention to the power converter device which converts direct-current power into alternating current power was demonstrated, it replaced with this,
You may apply the cooler module of this invention to the power converter device which converts alternating current power into direct current power. Or you may apply the cooler of this invention to apparatuses other than a power converter device.

  In the first to third embodiments, the diaphragm portion 23 is deformed, and the example in which the interval between two adjacent cooling pipes 2 among the plurality of cooling pipes 2 is narrowed is described. Instead, instead of the projecting pipe portion 22, a bellows pipe formed in a bellows shape may be used as follows.

  That is, the longitudinal direction one side of each of the plurality of cooling pipes 2 connects the two adjacent cooling pipes 2 of the plurality of cooling pipes 2 via bellows pipes, thereby providing the supply tank 11. Configure. The other longitudinal side of each of the plurality of cooling pipes 2 constitutes a discharge tank 12 by connecting two adjacent cooling pipes 2 of the plurality of cooling pipes 2 via bellows pipes. .

  When compressing the stacked cooler 30 in the tube stacking direction DRst, the pressing force compresses and deforms the plurality of bellows pipes. Thereby, the space | interval between the two adjacent heat exchange tubes 2c among the several heat exchange tubes 2c is narrowed. Therefore, the two adjacent heat exchange tubes 2c and the electronic component 4 can be in close contact with each other.

  In addition, this invention is not limited to above-described embodiment, In the range described in the claim, it can change suitably. Further, the above embodiments are not irrelevant to each other, and can be combined as appropriate unless the combination is clearly impossible. In each of the above-described embodiments, it is needless to say that elements constituting the embodiment are not necessarily essential unless explicitly stated as essential and clearly considered essential in principle. Yes.

1 Cooler module 2c Heat exchange tube 4 Electronic component (to be cooled)
11 Supply tank 12 Collection tank 30 Multilayer cooler 40 Inverter plate (joining member)
43 Refrigerant supply passage (first refrigerant introduction passage)
44 Refrigerant discharge passage (second refrigerant introduction passage)
50 Seal member (first seal member)
50A Seal member (second seal member)
80 Case 81 Inner wall (second inner wall)
82 inner wall (first inner wall)

Claims (7)

A cooler (30) having a refrigerant flow path (2c) and cooling the object (4) to be cooled by the refrigerant in the refrigerant flow path;
A supply pipe (31) for supplying the refrigerant to the refrigerant inlet (24a) of the refrigerant flow path of the cooler and a discharge pipe (collecting the refrigerant discharged from the refrigerant outlet (24b) of the refrigerant flow path of the cooler) 32) and a joining member (40) to which
A case (80) for housing the object to be cooled, the cooler, and the joining member;
A first seal member (50) housed in the case and tightly contacting the joining member and the first inner wall (82) of the case;
The supply pipe and the discharge pipe are disposed so as to penetrate the case and the first seal member, respectively.
The joining member has a first refrigerant introduction channel (43) for guiding the refrigerant flowing from the supply pipe to the refrigerant inlet of the refrigerant channel, and the refrigerant flowing from the refrigerant outlet of the refrigerant channel to the discharge pipe. A second refrigerant introduction channel (44) is provided,
The cooler module, wherein the joining member and the first seal member are sandwiched between the cooler and the first inner wall of the case. The cooler is
A plurality of heat exchange tubes (2c) laminated in a predetermined direction;
A supply tank (11) that is connected to one longitudinal end of each of the plurality of heat exchange tubes and distributes the refrigerant supplied from the supply pipe through the refrigerant inlet to the plurality of heat exchange tubes;
Recovery that is connected to the other longitudinal end of each of the plurality of heat exchange tubes, collects the refrigerant flowing from the plurality of heat exchange tubes, and discharges the collected refrigerant from the refrigerant outlet to the discharge pipe A tank (12),
Between the two heat exchange tubes adjacent among the plurality of heat exchange tubes, the object to be cooled is arranged for each of the two heat exchange tubes,
The cooler according to claim 1, wherein the object to be cooled is cooled by the refrigerant in the two adjacent heat exchange tubes for each of the two adjacent heat exchange tubes. module.   The dimension of the longitudinal direction of the said heat exchange tube among the said members for joining is smaller than the dimension of the longitudinal direction of the said heat exchange tube among the said coolers, The Claim 1 or 2 characterized by the above-mentioned. Cooler module. The case (80) has a second inner wall (81) together with the first inner wall, and is integrally formed so as to surround the first seal member, the joining member, and the cooler. Yes,
The first seal member, the joining member, and the cooler are narrowly arranged in the order of the first seal member, the joining member, and the cooler between the first and second inner walls. The cooler module according to claim 2, wherein the cooler module is held. The case (80A) has an opening (88), a case main body (80a) for housing the object to be cooled, the cooler, the joining member, and the first seal member; A lid (80b) that closes the opening;
The lid is fixed to the case body by a fastening member (90) with the lid part closing the opening of the case body,
The lid portion constitutes one inner wall of the first and second inner walls,
The case body constitutes an inner wall other than the one inner wall of the first and second inner walls,
In a state where the first seal member, the joining member, and the cooler are arranged in order of the first seal member, the joining member, and the cooler between the first and second inner walls. 4. The cooler module according to claim 2, wherein the cooler module is sandwiched.   In the case, disposed between the cooler and the joining member, seals between the refrigerant inlet of the cooler and the first refrigerant introduction flow path, and the refrigerant outlet of the cooler and the The cooler module according to any one of claims 1 to 5, further comprising a second seal member (50A) for sealing between the second refrigerant introduction flow paths. A method of manufacturing a cooler module according to any one of claims 4 to 6,
Among the plurality of heat exchange tubes, compressing the cooler by applying pressure to the cooler in a state where at least the first seal member, the joining member, and the cooler are housed in the case. A method for manufacturing a cooler module, comprising a step (S130) of bringing the object to be cooled and the two heat exchange tubes into close contact with each other for two adjacent heat exchange tubes.

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