JP2014017906A - Electric power conversion apparatus and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion apparatus which is excellent in assembling workability, and a method for manufacturing the same.SOLUTION: There is provided an electric power conversion apparatus 10 configured by fixing a semiconductor lamination unit 4 in which a plurality of semiconductor modules and a plurality of cooling pipes are alternately laminated and the cooling pipes are in fluid communication with an inflow pipe 1A and an outflow pipe 1B, to the inside of a case 5. An end of the inflow pipe 1A where a coolant inflow hole 1Aa is provided and an end of the outflow pipe 1B where a coolant outflow hole 1Ba is provided are arranged so as to pass through a first side face 5A. A rib 7 projecting from the bottom face 5D of the case 5 is inserted between a first cooling pipe 2A and a second cooling pipe 2B adjacent to the first cooling pipe 2A. A spacer 6 is interposed between the first side face 5A and the first cooling pipe 2A. A pressing member 8 is interposed between a second side face 5B opposed to the first side face 5A and an n-th cooling pipe 2H. The first cooling pipe 2A is tightened by the rib 7 and the spacer 6 by the pressing force Q by the pressing member 8. The two ends of the semiconductor lamination unit 4 are fixed at the tightened portion and a pressed portion pressed by the pressing member 8.

Description

  The present invention relates to a power conversion device constituting a power conversion circuit and a manufacturing method thereof.

  Semiconductor modules (or power cards) with built-in switching elements and cooling pipes are stacked alternately as a power converter installed between an AC motor, which is a power source of a hybrid vehicle or an electric vehicle, and an in-vehicle DC battery A form in which a semiconductor laminated unit is accommodated in a case is generally applied.

  Recently, how to reduce or cool the amount of heat generated by a semiconductor module that increases with an increase in driving force required for an AC motor has become an important solution in the technical field. Since the cooling pipe is in close contact with the module, the temperature rise of the semiconductor module due to heat generation of the semiconductor module can be effectively suppressed.

  Moreover, the power converter device of the said structure is disclosed by patent document 1. FIG. The power conversion device disclosed in Patent Document 1 supports one end surface in the stacking direction of the semiconductor stacking unit at one end (supporting portion) of the frame, and the semiconductor stacking unit in the stacking direction on the other end surface in the stacking direction of the semiconductor stacking unit. It is an apparatus provided with a leaf spring member for pressurization. Further, the leaf spring member is fastened by a bolt that is a screwing member screwed into the frame in the stacking direction.

  The power conversion device disclosed in Patent Document 1 has a configuration of a power conversion device corresponding to the prior art listed in the device, specifically, a leaf spring member disposed in a case and the leaf spring member fixed to a pin. It has a form to be supported by. This device is intended to solve the problem that a space in the case is required for arranging the fixing pin in the case, which leads to an increase in the size of the power conversion device. In order to solve such problems of the prior art, the size of the device can be reduced by fastening the leaf spring member with a screwing member screwed in the stacking direction with respect to the frame, and fastening with bolts. Therefore, the assembly workability is also excellent.

  However, in the power conversion device disclosed in Patent Document 1, when the semiconductor laminated unit is assembled in the frame, more specifically, the semiconductor laminated unit is arranged in the frame, and the bolts are further arranged in a state where the leaf spring member is arranged. When assembling the power conversion device by fastening, no measures have been taken to eliminate the misalignment of the semiconductor laminated unit with respect to the frame.

  In order to eliminate the misalignment of the semiconductor laminate unit with respect to the frame, temporarily fix the semiconductor laminate unit in the frame using a fixing jig, and maintain the temporarily fixed posture at the end of the semiconductor laminate unit. It is considered that an assembling method in which a leaf spring member is disposed and a bolt is screwed in while maintaining this posture is applied.

  In this way, it is easy to perform relative positioning of at least three members of the frame, the semiconductor laminated unit, and the leaf spring member until the bolt is tightened, and to perform screwing of the bolt while maintaining this positioning posture. It is not work. In addition, it is sufficiently assumed that the relative position is shifted while the relative positioning of at least three members is maintained for a certain period of time. When the relative position is shifted, the positioning posture of each member is assumed. Since it is necessary to form the film again, the production efficiency is not preferable. From such a point of view, the power conversion device disclosed in Patent Document 1 is a technology that has much room for improvement in its assembly workability.

JP 2011-103728 A

  The present invention has been made in view of the above-described problems, and an object thereof is to provide a power conversion device excellent in assembly workability and a manufacturing method thereof.

  In order to achieve the above object, according to the power converter of the present invention, an inflow pipe into which a refrigerant flows and an outflow pipe from which the refrigerant flows out are arranged at intervals, and a plurality of semiconductor modules and a plurality of cooling pipes are arranged at the intervals. (First cooling pipe to n-th cooling pipe) are alternately laminated and disposed, and a semiconductor lamination unit in which each cooling pipe is in fluid communication with an inflow pipe and an outflow pipe has at least a side surface and a bottom surface. A power conversion device that is fixed in a case constituted by: an end portion having a refrigerant inflow hole of the inflow pipe and an end portion having a refrigerant outflow hole of the outflow pipe are both inflow of the side surface of the case Between the first cooling pipe located closest to the first side face and the second cooling pipe adjacent to the first cooling pipe. In the side position of the semiconductor module Ribs projecting from the bottom surface or side surface of the sleeve enter, a spacer is interposed between the first side surface and the first cooling pipe, and the second side surface facing the first side surface and the second side A pressing member is interposed between the nth cooling pipes located closest to the side surface, and the first cooling pipe is clamped by the rib and the spacer by the pressing force of the pressing member, and the tightened portion and the pressing member The both ends of the semiconductor laminated unit are fixed at the pressed location by.

  The power conversion device of the present invention projects from the bottom surface or side surface of the case between two cooling pipes (a first cooling pipe and a second cooling pipe adjacent to the two cooling pipes) at the end of the semiconductor multilayer unit. The rib enters, the spacer is interposed between the side surface of the case and the first cooling pipe, and the semiconductor module is fixed in the case in a posture pressed by the pressing member. By sandwiching the first cooling pipe at the end between the rib and the spacer, it is possible to guarantee the positioning of the semiconductor module in the case before the final assembly by pressing with the pressing member in the manufacturing process of the power conversion device. it can.

  The inflow pipe and the outflow pipe constituting the semiconductor laminated unit are arranged in a posture that penetrates the through hole provided in the first side surface of the case, but the outer diameters (or outer dimensions) of the inflow pipe and the outflow pipe In general, the inner diameter (or inner dimension) of the through-hole is made larger than that of the semiconductor, so it is not necessary to simply attach the inflow pipe and the outflow pipe to the first side surface of the case and pass through the semiconductor. The positioning of the stacked unit is not guaranteed.

  Here, all of the case, the cooling pipe, the inflow pipe and the outflow pipe can be formed of aluminum or an alloy thereof.

  A semiconductor module (or power card) is disposed between adjacent cooling pipes. Here, the arrangement form of the semiconductor modules is arbitrary, but for example, a form in which two semiconductor modules are arranged in the cooling pipe at an interval may be mentioned.

  In addition, each of the inflow pipe and the outflow pipe is in the form of a single pipe in which the inflow pipe and the outflow pipe are in fluid communication with a plurality of cooling pipes, and a unique connection pipe is disposed between the plurality of cooling pipes. There exists a form which consists of a combination of an end inflow pipe or an end outflow pipe into which refrigerant flows in or out. That is, in the latter form, the inflow pipe or the outflow pipe is configured in such a manner that the end inflow pipe or the end outflow pipe and a plurality of unique connection pipes are separated from each other via the cooling pipe. Further, in the latter form, for example, by providing a diaphragm at a location where the connecting pipe and the cooling pipe are attached, the interval between the adjacent cooling pipes can be changed to some extent.

  Moreover, it is preferable that the “spacer” has a rigidity capable of maintaining its shape and dimensions without being compressed and deformed when the semiconductor laminated unit is pressed by the pressing member.

  The “ribs” are also formed from the same material as the bottom and side surfaces constituting the case, and are preferably integrally formed at the stage of manufacturing the case. It may be retrofitted by fitting or the like.

  Furthermore, examples of the “pressing member” include a coil resin and a leaf spring, and a fixed resin member having a deformability compared to a cooling pipe or the like.

  In the case where the inflow pipe or the outflow pipe has a combination of the connecting pipe and the end inflow pipe or the end outflow pipe into which the refrigerant flows in or out (the latter form described above), the semiconductor stack is formed by the pressing member. When the unit is pressed, the connecting pipe slides, and in response to this slide, each cooling pipe (and the semiconductor module sandwiched between the cooling pipes) slides, and finally each cooling pipe and each semiconductor module are mutually connected. The power conversion device is configured in a state where it is pressed with a predetermined pressing force. In the power conversion device of the present invention, since the first cooling pipe at the end portion constituting the semiconductor multilayer unit is assembled (fixed) to the case by the rib and the spacer, the member constituting the semiconductor multilayer unit Even when the two slide with each other as described above, the positioning of the semiconductor stacked unit can be guaranteed from the initial stage of manufacturing the device.

  The present invention also extends to a method for manufacturing a power converter, which includes an inflow pipe into which a refrigerant flows in and an outflow pipe from which a refrigerant flows out at a distance from each other, and a plurality of such intervals are provided. The semiconductor module and the plurality of cooling pipes (first cooling pipe to nth cooling pipe) are alternately stacked and disposed, and each cooling pipe is in fluid communication with the inflow pipe and the outflow pipe. A method of manufacturing a power conversion device in which a stacked unit is fixed in a case composed of at least a side surface and a bottom surface, comprising an end portion having a refrigerant inlet hole of the inlet pipe and a refrigerant outlet hole of the outlet pipe A first cooling pipe located at a position closest to the first side face, the end portion being disposed so as to penetrate the first side face through which the inflow pipe and the outflow pipe pass through the side face of the case; Between the second cooling pipes adjacent to A rib protruding from the bottom surface or side surface of the case is inserted into a side position of the semiconductor module, and a spacer is interposed between the first side surface and the first cooling pipe, so that the semiconductor multilayer unit is disposed inside the case. A step of temporarily fixing one end and positioning thereof, by pressing a pressing member between the second side surface facing the first side surface and the nth cooling pipe located closest to the second side surface, The first cooling pipe is tightened by the rib and the spacer by the pressing force by the pressing member, and the both ends of the semiconductor laminated unit are fixed at the tightened portion and the pressing portion by the pressing member.

  In the manufacturing method of the present invention, the semiconductor cooling unit is temporarily fixed by sandwiching the first cooling pipe located at the end of the semiconductor stacking unit between the rib and the spacer fixed to the case, and the positioning is guaranteed, In this method, the semiconductor laminate unit and the case are permanently fixed by the pressing member.

  Since the ribs and spacers are already fixed to the case and the semiconductor cooling unit is temporarily fixed with the first cooling pipe interposed therebetween, it is very easy to hold the positioning posture of the multiple members in the pre-assembly stage by the pressing member. It becomes. In addition, even when the temporarily assembled device is moved in a state where the positioning posture is maintained, the assembly posture can be maintained, and the handling property in a state where the positioning posture is maintained is excellent.

  As described above, according to the manufacturing method of the present invention, the first cooling pipe located at the end of the semiconductor multilayer unit is temporarily fixed to the case by the rib and the spacer provided in the case, and then pressed by the pressing member. Since the case and the semiconductor laminated unit are fixed to each other, the positioning posture of the members in the manufacturing process can be maintained, and excellent assembling workability can be achieved.

  As can be understood from the above description, according to the power conversion device and the manufacturing method thereof of the present invention, the two cooling pipes (the first cooling pipe and the second cooling pipe adjacent to the two cooling pipes at the end) constituting the semiconductor multilayer unit. Ribs that protrude from the bottom or side of the case enter between the cooling pipes), and a spacer is interposed between the side of the case and the first cooling pipe, and the end of the semiconductor multilayer unit is manufactured using these ribs and spacers. Since it can be temporarily fixed from the beginning and positioned, it can guarantee the positioning of the members in the manufacturing process until the final assembly is performed by pressing with the pressing member, improving the handling in the manufacturing process And excellent assembly workability can be realized.

It is a top view explaining the 1st step of the manufacturing method of the power converter of the present invention. It is an II-II arrow line view of FIG. It is the III-III arrow line view of FIG. It is the side view explaining the 2nd step of the manufacturing method of a power converter device. It is a top view of the manufactured power converter of the present invention. It is VI-VI arrow line view of FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a power conversion device manufacturing method and a power conversion device manufactured by the manufacturing method according to the present invention will be described with reference to the drawings.

(Manufacturing method of power converter)
FIG. 1 is a plan view illustrating a first step of a method for manufacturing a power conversion device according to the present invention, FIG. 2 is a view taken along arrows II-II in FIG. 1, and FIG. 3 is a view taken along arrows III-III in FIG. FIG. FIG. 4 is a side view for explaining the second step of the method for manufacturing the power converter.

  First, as a first step, the semiconductor laminated unit 4 temporarily assembled is disposed in the case 5 and temporarily fixed.

  The semiconductor stacked unit 4 includes a plurality of cooling pipes (a first cooling pipe 2A, a second cooling pipe 2B, hereinafter, 2C to 2G, and an nth cooling pipe 2H in order), which are connected to each other with connecting pipes 1A ′ and 1B. The first cooling pipe 2A is further fixed to the end inflow pipe 1A and the end outflow pipe 1B so as to constitute the whole.

  The first cooling pipe 2A, the end inflow pipe 1A and the end outflow pipe 1B, and the other cooling pipes and the connection pipe are all configured so that the hollows of them are in fluid communication with each other. ing. Specifically, diaphragms (not shown) are provided at the attachment points of the connecting pipes 1A ′ and 1B ′ and the cooling pipes 2A to 2H, and this connecting structure can change the distance between adjacent cooling pipes to some extent. It is possible.

  Each of the cooling pipes 2A to 2H, the connecting pipes 1A 'and 1B', the end inflow pipe 1A and the end outflow pipe 1B are made of aluminum or an alloy thereof.

  On the other hand, the case 5 includes a first side surface 5A that constitutes four side surfaces, a second side surface 5B that faces the first side surface 5A, another side surface 5C that is orthogonal to these, and a semiconductor stacked unit mounting jig. It is comprised from bottom face 5D (refer FIG.2, 3) provided with the jig | tool entrance opening 5b which made J enter / exit freely.

  The case 5 is also formed from aluminum or an alloy thereof.

  In the first side surface 5A, two pipe through holes 5a through which the end inflow pipe 1A and the end outflow pipe 1B pass are formed.

  Further, ribs 7 and 7 are provided on the inner surface of the bottom surface 5D so as to sandwich part of the connecting pipes 1A 'and 1B' specific to the end inflow pipe 1A and the end outflow pipe 1B. Although the rib 7 in the illustrated example has a form projecting from the bottom surface 5D of the case 5, for example, a form projecting from the side surface 5C of the case 5 and sandwiching part of the connecting pipes 1A ′ and 1B ′ may be used. Good.

  The semiconductor laminated unit 4 assembled in advance is transferred to the inside of the case 5, and the connecting pipes 1A 'and 1B' between the first cooling pipe 2A and the second cooling pipe 2B are sandwiched between the ribs 7 and 7, In the gap between the first cooling pipe 2A and the first side surface 5A of the case 5, a spacer 6 that is relatively hard and has a width t1 in the plan view of FIG. The spacer 6 can be formed of a metal material such as aluminum or an alloy thereof, a hard resin material, a ceramic material, or the like.

  At this time, the semiconductor multilayer unit mounting jig J that temporarily supports the semiconductor multilayer unit 4 is positioned in the case 5 through the jig access opening 5b, and the semiconductor multilayer unit 4 is mounted thereon. The semiconductor cooling unit 4 is temporarily fixed in the case 5 by sandwiching the first cooling pipe 2 </ b> A between the rib 7 and the spacer 6. Here, the semiconductor laminated unit mounting jig J is composed of a plane on which each cooling pipe is mounted and a projection that protrudes from the plane and supports the semiconductor module 3.

  A gap is provided between adjacent cooling pipes, and two semiconductor modules 3 (or power cards) are disposed in the gap with a gap therebetween. In the first step shown in the figure, the semiconductor module 3 is provided with a margin in the gap between the cooling pipes, but since it is supported from below by the semiconductor laminated unit mounting jig J, the arrangement state of the semiconductor module 3 is also maintained.

  Further, when the semiconductor multilayer unit 4 is temporarily fixed in the case 5 in the first step, the space between the nth cooling pipe 2H located at the end of the semiconductor multilayer unit 4 and the second side surface 5B of the case 5 is A gap S is formed in the. In the illustrated example, the nth cooling pipe 2H is the eighth cooling pipe from the first cooling pipe 2A, but the number of cooling pipes constituting the semiconductor stacked unit is not limited to the illustrated example. Absent.

  Next, as a second step, as shown in FIG. 4, the pressing member 8 is fitted into the gap S formed between the nth cooling pipe 2H and the second side surface 5B of the case 5 (Y1 direction).

  Although the illustrated pressing member 8 is formed from a leaf spring, other than this, the pressing member 8 may be formed from a fixed resin member or the like having deformability compared to a coil spring, a cooling pipe, or the like.

  By removing the semiconductor laminate unit mounting jig J that supports the semiconductor laminate unit 4 from below so as to correspond to the fitting of the pressing member 8 into the gap S (Y2 direction), The semiconductor multilayer unit mounting jig J is prevented from obstructing the sliding of the constituent members of the semiconductor multilayer unit 4 by the fitting of the pressing member 8 (Z direction).

  By fitting the pressing member 8, the gap between the adjacent cooling pipes is narrowed by the connecting structure of the diaphragms provided at the attachment locations of the connecting pipes 1A 'and 1B' and the cooling pipes 2A to 2H, and the gaps between the cooling pipes are reduced. The semiconductor module 3 disposed with sufficient margin is in close contact with the cooling tube being sandwiched from both sides.

  On the other hand, the relatively hard spacer 6 maintains the initial thickness t1, and therefore the position of the first cooling pipe 2A sandwiched between the rib 7 fixed to the bottom surface 5D and the spacer 6 is the position of the initial temporary fixing stage. Without sliding, the other cooling pipe is pushed into the first cooling pipe 2A and slides.

  By this second step, the first cooling pipe 2A is clamped by the rib 7 and the spacer 6 by the pressing force of the pressing member 8, and the both ends of the semiconductor multilayer unit 4 are connected between the tightened portion and the pressing portion by the pressing member 8. The power converter is manufactured by fixing.

  According to the method for manufacturing the power conversion device shown in the figure, the case 5 is provided between the two cooling pipes (the first cooling pipe 2A and the second cooling pipe 2B adjacent thereto) at the end of the semiconductor stacked unit 4. Ribs 7 projecting from the bottom surface 5D of the semiconductor device 5 are inserted, and spacers 6 are interposed between the first side surface 5A of the case 5 and the first cooling pipe 2A. The part can be temporarily fixed from the beginning of production and positioned. Therefore, it is possible to guarantee the positioning of the members in the production process until the final assembly is performed by pressing with the pressing member 8, the handling property in the production process can be improved, and excellent assembling workability is realized. be able to. Next, the configuration of the manufactured power conversion device will be described below.

(Power converter)
FIG. 5 is a plan view of the manufactured power converter of the present invention, and FIG. 6 is a view taken along the line VI-VI in FIG.

  In the power converter 10 shown in the figure, in the case 5, the semiconductor laminated unit 4 receives the pressing force Q by the pressing member 8, while the pressed portion by the pressing member 8 and the first cooling pipe 2 </ b> A are formed by the rib 7 and the spacer 6. The whole of the semiconductor laminated unit 4 is generally configured with the clamped portion as a fixed end.

  The refrigerant is provided from the inflow end 1Aa of the refrigerant inflow hole 1A that loosely fits the pipe through-hole 5a of the first side surface 5A (in the X1 direction), and flows through the cooling pipes 2A to 2H through the connecting pipes 1A ′ ( X2 direction), the semiconductor module 3 is cooled in this process, and the refrigerant heated in the semiconductor module 3 flows through each connecting pipe 1B ′, and the refrigerant is discharged from the refrigerant outlet hole 1Ba of the end outlet pipe 1B. (X3 direction).

  Here, examples of the refrigerant used include water and ammonia, water mixed with an ethylene glycol antifreeze, a fluorocarbon refrigerant such as fluorinate, methanol, alcohol, and acetone.

  Although not shown, a lid having a vent hole may be attached to the upper end of the case 5.

  The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and there are design changes and the like without departing from the gist of the present invention. They are also included in the present invention.

DESCRIPTION OF SYMBOLS 1A ... End part inflow pipe, 1A '... Connection pipe, 1B ... End part outflow pipe, 1B' ... Connection pipe, 2A ... 1st cooling pipe (cooling pipe), 2a ... Flow path, 2B ... 2nd cooling pipe (Cooling pipe), 2C to 2G ... cooling pipe, 2H ... nth cooling pipe (cooling pipe), 3 ... semiconductor module (or power card), 4 ... semiconductor laminated unit, 5 ... case, 5A ... first side surface 5B ... Second side surface, 5C ... Side surface, 5D ... Bottom surface, 5a ... Pipe through hole, 5b ... Jig access opening, 6 ... Spacer, 7 ... Rib, 8 ... Pressing member, 10 ... Power conversion device, J ... Semiconductor stacking unit mounting jig

Claims (2)

An inflow pipe into which the refrigerant flows and an outflow pipe from which the refrigerant flows out are arranged at intervals, and a plurality of semiconductor modules and a plurality of cooling pipes (the first cooling pipe to the nth cooling pipe) are alternately arranged at the intervals. A power conversion device in which a semiconductor laminated unit in which each cooling pipe is fluidly connected to an inflow pipe and an outflow pipe is fixed in a case composed of at least a side surface and a bottom surface. There,
The end portion of the inflow pipe having the refrigerant inflow hole and the end portion of the outflow pipe having the refrigerant outflow hole are both disposed so as to penetrate the first side surface of the case through which the inflow tube and the outflow tube penetrate. Has been
A rib projecting from the bottom surface or side surface of the case between the first cooling pipe closest to the first side face and the second cooling pipe adjacent to the first cooling pipe and on the side of the semiconductor module Enters,
A spacer is interposed between the first side surface and the first cooling pipe;
A pressing member is interposed between the second side surface facing the first side surface and the nth cooling pipe located closest to the second side surface;
A power conversion device in which a first cooling pipe is fastened by a rib and a spacer by a pressing force by a pressing member, and both ends of the semiconductor multilayer unit are fixed at the tightened portion and a pressing portion by the pressing member. An inflow pipe into which the refrigerant flows and an outflow pipe from which the refrigerant flows out are arranged at intervals, and a plurality of semiconductor modules and a plurality of cooling pipes (the first cooling pipe to the nth cooling pipe) are alternately arranged at the intervals. Of a power conversion device in which a semiconductor lamination unit in which each cooling pipe is fluidly connected to an inflow pipe and an outflow pipe is fixed in a case composed of at least a side surface and a bottom surface. A production method,
The end of the inflow pipe having the refrigerant inflow hole and the end of the outflow pipe having the refrigerant outflow hole are both disposed so as to penetrate the first side surface of the case through which the inflow pipe and the outflow pipe penetrate. In addition, the first cooling pipe closest to the first side surface and the second cooling pipe adjacent to the first cooling pipe project from the bottom surface or side surface of the case at a side position of the semiconductor module. A step of temporarily fixing one end of the semiconductor stacked unit in the case by inserting a rib to be inserted and interposing a spacer between the first side surface and the first cooling pipe,
By pressing the pressing member between the second side surface facing the first side surface and the nth cooling tube located closest to the second side surface, the first cooling tube is moved by the pressing force of the pressing member. A method of manufacturing a power conversion device, comprising: a step of fastening by a rib and a spacer, and fixing both ends of the semiconductor multilayer unit at the tightened portion and a pressed portion by a pressing member.

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