JP2016028267A - アルカリ水溶性uv遮断組成物および水溶性uv透明フィルムを用いた基材上の撮像 - Google Patents
アルカリ水溶性uv遮断組成物および水溶性uv透明フィルムを用いた基材上の撮像 Download PDFInfo
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- JP2016028267A JP2016028267A JP2015108413A JP2015108413A JP2016028267A JP 2016028267 A JP2016028267 A JP 2016028267A JP 2015108413 A JP2015108413 A JP 2015108413A JP 2015108413 A JP2015108413 A JP 2015108413A JP 2016028267 A JP2016028267 A JP 2016028267A
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- Prior art keywords
- soluble
- water
- substrate
- acid
- photosensitive material
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0585—Second resist used as mask for selective stripping of first resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Chemical & Material Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
【解決手段】プリント回路基板等の基材は、水性アルカリで現像可能なUV感光性材料でコーティングされ、続いてそのUV感光性材料をコーティングするために水溶性UV透明フィルムを塗布する。アルカリ水溶性UV遮断組成物は、マスクとして機能するためにUV遮断フィルムの表面に選択的に塗布される。UV光は、このマスクによって覆われていないUV感光性材料の部分に当てられる。UV遮断組成物、UV透明フィルム、およびUV感光性材料の選択部分は、基材上に画像を形成するために水性アルカリ現像液で同時に除去される。
【選択図】なし
Description
Claims (10)
- a.1つ以上の開孔を備える基材を提供することと、
b.前記1つ以上の開孔を備える前記基材の表面に隣接してアルカリ水溶性UV感光性材料を塗布することと、
c.前記アルカリ水溶性UV感光性材料に隣接して水溶性UV透明フィルムを塗布することと、
d.前記水溶性UV透明フィルムに隣接してアルカリ水溶性UV遮断組成物を選択的に塗布することと、
e.前記アルカリ水溶性UV遮断組成物で覆われた領域を除いて、前記アルカリ水溶性UV感光性材料をUV照射に露光することと、
f.前記アルカリ水溶性UV遮断組成物、前記水溶性UV透明フィルム、および前記アルカリ水溶性UV感光性材料の選択部分をアルカリ性水溶液で同時に除去することと、を含む、方法。 - 前記基材の表面上の基準を捕捉し、かつデジタルアルカリ水溶性UV感光性材料データをスケーリングする視覚システムを提供することをさらに含む、請求項1に記載の方法。
- 前記アルカリ水溶性UV遮断組成物は、1つ以上のロジン樹脂、1つ以上の脂肪酸、および1つ以上のUV遮断剤を含む、請求項1に記載の方法。
- 前記1つ以上のUV遮断剤は、ベンゾフェノン、ベンゾフェノン誘導体、トリアジン、桂皮酸塩、サリチル酸塩、クリレン(crylenes)、シアノアクリレート、マロン酸塩、オキサニリド、ホルムアミド、アントラキノン、置換アントラキノン、有機色素、および有機顔料を含む、請求項3に記載の方法。
- 前記1つ以上のロジン樹脂は、完全に水素化および部分的に水素化したロジン樹脂を含む、請求項3に記載の方法。
- 前記1つ以上の脂肪酸は、カプリル酸、カプリン酸、ラウリン酸、リノール酸、ミリスチン酸、オレイン酸、パルミチン酸、およびステアリン酸、ならびにこれらの塩を含む、請求項3に記載の方法。
- 前記1つ以上のロジン樹脂は、前記水性アルカリUV遮断組成物の15%〜50%の量である、請求項3に記載の方法。
- 前記アルカリ水溶性UV遮断組成物は、着色剤のうちの1つ以上をさらに含む、請求項3に記載の方法。
- 前記アルカリ水溶性UV透明フィルムは、ポリビニルアルコール、水溶性セルロースエーテル、水溶性カルボキシアルキルセルロースエーテル、カルボキシアルキルセルロースの水溶性塩、カルボキシアルキルデンプンの水溶性塩、ポリビニルピロリドン、ポリアクリルアミド、水溶性ポリアミド、ポリアクリル酸の水溶性塩、ゼラチン、およびエチレンオキシドポリマーを含む、請求項1に記載の方法。
- 前記基材は、プリント回路基板である、請求項1に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462006056P | 2014-05-31 | 2014-05-31 | |
US62/006,056 | 2014-05-31 |
Publications (2)
Publication Number | Publication Date |
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JP2016028267A true JP2016028267A (ja) | 2016-02-25 |
JP6549417B2 JP6549417B2 (ja) | 2019-07-24 |
Family
ID=53719600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015108413A Active JP6549417B2 (ja) | 2014-05-31 | 2015-05-28 | アルカリ水溶性uv遮断組成物および水溶性uv透明フィルムを用いた基材上の撮像 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9661754B2 (ja) |
EP (1) | EP2950144B1 (ja) |
JP (1) | JP6549417B2 (ja) |
KR (1) | KR102420276B1 (ja) |
CN (1) | CN105319853B (ja) |
TW (1) | TWI591441B (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH09205256A (ja) * | 1996-01-24 | 1997-08-05 | Canon Inc | フレキシブルプリント基板 |
JP2001326447A (ja) * | 2000-05-18 | 2001-11-22 | Rohm Co Ltd | プリント回路基板の製造方法およびプリント回路基板 |
JP2005187792A (ja) * | 2003-12-24 | 2005-07-14 | Rohm & Haas Electronic Materials Llc | マスク |
JP2006089719A (ja) * | 2004-07-29 | 2006-04-06 | Rohm & Haas Electronic Materials Llc | 溶融物 |
JP2011040755A (ja) * | 2009-08-17 | 2011-02-24 | Palo Alto Research Center Inc | 固形インク組成物、プリントマスク、及びパターン形成方法 |
WO2014024951A1 (ja) * | 2012-08-08 | 2014-02-13 | 旭化成イーマテリアルズ株式会社 | 感光性フィルム積層体、フレキシブルプリント配線板、及び、その製造方法 |
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2015
- 2015-05-27 EP EP15169451.0A patent/EP2950144B1/en active Active
- 2015-05-28 KR KR1020150074904A patent/KR102420276B1/ko active IP Right Grant
- 2015-05-28 JP JP2015108413A patent/JP6549417B2/ja active Active
- 2015-05-28 TW TW104117131A patent/TWI591441B/zh not_active IP Right Cessation
- 2015-05-29 CN CN201510289298.7A patent/CN105319853B/zh active Active
- 2015-06-01 US US14/726,602 patent/US9661754B2/en active Active
Patent Citations (6)
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JPH09205256A (ja) * | 1996-01-24 | 1997-08-05 | Canon Inc | フレキシブルプリント基板 |
JP2001326447A (ja) * | 2000-05-18 | 2001-11-22 | Rohm Co Ltd | プリント回路基板の製造方法およびプリント回路基板 |
JP2005187792A (ja) * | 2003-12-24 | 2005-07-14 | Rohm & Haas Electronic Materials Llc | マスク |
JP2006089719A (ja) * | 2004-07-29 | 2006-04-06 | Rohm & Haas Electronic Materials Llc | 溶融物 |
JP2011040755A (ja) * | 2009-08-17 | 2011-02-24 | Palo Alto Research Center Inc | 固形インク組成物、プリントマスク、及びパターン形成方法 |
WO2014024951A1 (ja) * | 2012-08-08 | 2014-02-13 | 旭化成イーマテリアルズ株式会社 | 感光性フィルム積層体、フレキシブルプリント配線板、及び、その製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20150351249A1 (en) | 2015-12-03 |
JP6549417B2 (ja) | 2019-07-24 |
CN105319853B (zh) | 2020-06-30 |
EP2950144A1 (en) | 2015-12-02 |
KR20150138066A (ko) | 2015-12-09 |
EP2950144B1 (en) | 2016-12-14 |
TWI591441B (zh) | 2017-07-11 |
TW201610589A (zh) | 2016-03-16 |
US9661754B2 (en) | 2017-05-23 |
CN105319853A (zh) | 2016-02-10 |
KR102420276B1 (ko) | 2022-07-13 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |