JP2016019556A - Ultrasonic probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress temperature rise of an ultrasonic transmission/reception surface due to heat generated in a main heat generation source in an ultrasonic probe.SOLUTION: A front side heat conductor 32 provided on the front part of an ultrasonic probe 10 absorbs heat from a vibrator 50 provided on the front part of the ultrasonic probe or heat transmitted from the rear part of the ultrasonic probe 10 and transmits a part of the heat to a front side case 14 to release the heat. A rear side heat conductor 34 provided on the rear part of the ultrasonic probe 10 absorbs heat from an electronic circuit being a main heat source provided on the rear part of the ultrasonic probe 10 and transmits a part of the heat to a rear side case 16 to release the heat. A heat conduction restriction structure having a spatial gap 88 restricts heat conduction between the front side heat conductor 32 and the rear side heat conductor 34. With this configuration, the heat from the main heat source that is transmitted to the rear side heat conductor 34 is suppressed from being conducted to the front side heat conductor 32 and thereby temperature rise of the ultrasonic transmission/reception surface provided on the front part of the ultrasonic probe 10 is reduced.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an ultrasonic probe, and more particularly to a technique for suppressing a temperature rise of an ultrasonic wave transmitting / receiving surface.

  An ultrasound diagnostic apparatus is an apparatus that transmits and receives ultrasound to and from a subject and forms an ultrasound image based on a reception signal obtained thereby. The ultrasonic diagnostic apparatus includes an ultrasonic probe that transmits and receives ultrasonic waves. Some ultrasonic probes include an electronic circuit in addition to a transducer that transmits and receives ultrasonic waves. The electronic circuit includes an ASIC (Application Specific Integrated Circuit) for supplying a transmission signal to the vibrator or processing a reception signal from the vibrator, a battery provided when the ultrasonic probe is a wireless probe, and the like. When such an ultrasonic probe operates, heat is generated in the vibrator and the electronic circuit.

  The heat generated in the vibrator and the electronic circuit is transmitted to the ultrasonic wave transmitting / receiving surface that is in contact with the subject, so that the temperature of the ultrasonic wave transmitting / receiving surface rises. There is a provision for the surface temperature of the ultrasonic probe. For example, IEC (International Electrotechnical Commission) stipulates that the surface temperature of the ultrasonic probe used for a patient should not exceed 43 ° C. at the part where the patient contacts in a normal state. Therefore, in order to prevent the ultrasonic wave transmitting / receiving surface from becoming hot, a technique for preventing the heat generated in the ultrasonic probe from being transferred to the ultrasonic wave transmitting / receiving surface by radiating or accumulating heat is required.

  For example, Patent Document 1 describes a technique for storing heat generated in a probe by filling a phase change member that causes a phase change from solid to liquid at a specific temperature in the probe.

International Publication WO2006 / 033181

  As described above, examples of the heat source in the ultrasonic probe include a vibrator and an electronic circuit. For example, in an ultrasonic probe in which the transducer has a very large number of channels, the amount of signal processing in the ASIC increases, and the amount of heat generated by the ASIC is greater than the amount of heat generated by the transducer. In such an ultrasonic probe, it is necessary to limit the movement of heat from the ASIC to the ultrasonic wave transmitting / receiving surface.

  An object of the present invention is to suppress an increase in the temperature of an ultrasonic wave transmitting / receiving surface due to heat generated in a main heat source in an ultrasonic probe. Alternatively, an object of the present invention is to limit the heat generated in the main heat source in the ultrasonic probe from moving to the ultrasonic wave transmitting / receiving surface.

  An ultrasonic probe according to the present invention is provided in a probe case, a front part in the probe case, an ultrasonic transducer for transmitting and receiving ultrasonic waves, a front part in the probe case, and the ultrasonic wave A front heat conductor through which heat from the vibrator is transmitted, an electronic circuit as a heat source provided at the rear part in the probe case, and a rear side provided at the rear part in the probe case and through which heat from the electronic circuit is transmitted A heat conduction limiting structure provided across the heat conductor, the front heat conductor and the rear heat conductor, and restricting heat conduction from the rear heat conductor to the front heat conductor; , Has.

  According to the above configuration, heat at the front part of the ultrasonic probe, such as heat from the ultrasonic transducer, is absorbed by the front heat conductor, and part of it is transferred to the probe case and radiated. In addition, heat at the rear part of the ultrasonic probe, such as heat from an electronic circuit that is a main heat source in the ultrasonic probe, is absorbed by the rear heat conductor, and part of the heat is transferred to the probe case and radiated. Examples of the electronic circuit include the ASIC and the battery described above.

  The heat conduction restriction structure provided across the front heat conductor and the rear heat conductor restricts heat conduction from the rear heat conductor to the front heat conductor. The heat conduction limiting structure is a structure having a thermal gap between the front heat conductor and the rear heat conductor, for example, by providing a spatial gap between the front heat conductor and the rear heat conductor. It is. The heat conduction limiting structure limits the conduction of heat from the electronic circuit as the main heat generation source to the front heat conductor. That is, the heat conduction limiting structure restricts the heat generated in the electronic circuit from being directly transferred to the front heat conductor via the rear heat conductor, and the heat generated in the rear is as far back as possible. It is confined and the heat radiation is developed around the rear. This restricts the temperature of the ultrasonic wave transmitting / receiving surface located on the front side of the probe case from rising due to heat from the electronic circuit that is the main heat generation source.

  Preferably, the rear heat conductor has an outer peripheral surface in contact with the inner peripheral surface of the probe case, and heat is transmitted from the outer peripheral surface to the inner peripheral surface.

  Preferably, the rear heat conductive member further includes a heat conductive block having a heat conductive surface in contact with the electronic circuit and extending from the heat conductive surface to the rear side. According to the heat conduction block, the heat from the electronic circuit can be transmitted to the rear side, that is, the direction opposite to the ultrasonic wave transmitting / receiving surface. Thereby, the heat from the electronic circuit further restricts the conduction to the front heat conductor, that is, the front side of the probe case.

  Desirably, it further has a heat dissipating structure that is provided at a rear end portion of the rear heat conductor and releases heat to the probe cable extending outside the probe case. According to the heat dissipation structure, the heat transferred from the electronic circuit to the rear heat conductor is dissipated not only from the probe case but also from the probe cable to the outside of the ultrasonic probe.

  Preferably, the heat conduction limiting structure is a structure having a spatial gap between the front heat conductor and the rear heat conductor.

  Preferably, the heat conduction limiting structure is provided on a protrusion provided on one of the front heat conductor and the rear heat conductor, and on the other of the front heat conductor and the rear heat conductor, And a support portion that supports the protrusion, and the support portion supports the protrusion, whereby the spatial gap is generated between the front heat conductor and the rear heat conductor. .

  Preferably, the protrusion has a support function between the front heat conductor and the rear heat conductor.

  ADVANTAGE OF THE INVENTION According to this invention, the temperature rise of the ultrasonic transmission / reception surface by the heat | fever which generate | occur | produced in the main heat generation source in an ultrasonic probe can be suppressed. Or according to this invention, it can restrict | limit that the heat | fever which generate | occur | produced in the main heat generation source in an ultrasonic probe moves to an ultrasonic wave transmission / reception surface.

It is an external appearance perspective view of the ultrasonic probe concerning this embodiment. It is a disassembled perspective view of the ultrasonic probe which concerns on this embodiment. FIG. 3 is an enlarged view of a transmission / reception unit portion of FIG. 2. It is a perspective view which shows the structure of a back side heat conductor. It is a vertical sectional view of an ultrasonic probe concerning this embodiment. It is a horizontal sectional view of the ultrasonic probe concerning this embodiment. It is a figure which shows the other example of a heat conduction limiting structure. In the example of FIG. 7, it is a figure which shows the state with which the front side heat conductor and the back side heat conductor were combined. It is sectional drawing of the rearmost part of a rear side case.

  Hereinafter, embodiments of the ultrasonic probe for use according to the present invention will be described. In addition, this invention is not limited to the following embodiment.

  FIG. 1 is an external perspective view of an ultrasonic probe 10 according to this embodiment. The ultrasonic probe 10 according to the present embodiment transmits and receives ultrasonic waves from an ultrasonic wave transmitting / receiving surface 12 provided at the forefront. The ultrasonic probe 10 has a front case 14 and a rear case 16 as a waterproof or antibacterial skin. The front case 14 and the rear case 16 are combined to be integrated. This constitutes a probe case. The front case 14 and the rear case 16 are preferably made of a highly waterproof, antibacterial, and highly insulating material. In the present embodiment, the front case 14 and the rear case 16 are made of resin. A cable 18 connected to the ultrasonic diagnostic apparatus is extended from the last part of the ultrasonic probe 10. A cable protection boot 20 is provided to protect the joint between the cable 18 and the rear case 16. In the present specification, in the ultrasonic probe 10, the side where the ultrasonic wave transmitting / receiving surface 12 is provided (the positive direction side of the y axis) is the “front side” and the opposite direction (the negative direction side of the y axis). It is described as “rear side”.

  FIG. 2 is an exploded perspective view of the ultrasonic probe 10. The ultrasonic probe 10 includes a transmission / reception unit 30 including a vibrator and an electronic circuit serving as a heat source, a front thermal conductor 32 that transmits heat from the vibrator to the front case 14, and a heat from the electronic circuit. A rear heat conductor 34 that is transmitted to the side case 16, an FPC 42 that is electrically connected to an electronic circuit via a relay substrate and serves as a signal path from the ultrasonic diagnostic apparatus body, a wire 44 connected to the FPC 42, and the FPC 42; A connector 46 that relays the wire 44 is included. Hereinafter, each component included in the ultrasonic probe 10 will be described in detail.

  FIG. 3 is an enlarged view of a portion of the transmission / reception unit 30 in FIG. As shown in FIG. 3, the wave transmitting / receiving unit 30 includes a vibrator 50 that includes a plurality of vibration elements and transmits / receives ultrasonic waves, an ASIC 52 as an electronic circuit, and each vibration element included in the vibrator 50 and the ASIC 52. And connecting the FPC 42 and the ASIC 52 electrically, the backing material 56 for suppressing unnecessary vibration of the vibrator 50, and matching the acoustic impedance between the vibrator 50 and the subject. An acoustic matching layer 58 that suppresses reflection of sound waves and a lens 60 are included.

  The ASIC 52 functions as a transmission sub beam former and a reception sub beam former. The transmission sub-beamformer generates a plurality of transmission signals having a delay relationship in each vibration element included in the transducer 50. The reception sub-beamformer performs a phasing addition process on a plurality of reception signals obtained from each vibration element to generate a reception signal. The received signal is sent to the ultrasonic diagnostic apparatus main body via the FPC 42 or the wire 44 and is processed in the apparatus main body to generate one beam data. As the ASIC 52 performs the above processing, the number of signal lines between the ultrasonic probe 10 and the apparatus main body is reduced.

  Among the components included in the transmission / reception unit 30, the vibrator 50 and the ASIC 52 are heat sources. However, in the ultrasonic probe 10, the heat generation amount of the ASIC 52 is several times or a dozen times larger than the heat generation amount of the vibrator 50. Therefore, the main heat source in the ultrasonic probe 10 is the ASIC 52.

  As shown in FIGS. 2 and 3, in the wave transmitting / receiving unit 30, the lens 60, the acoustic matching layer 58, the transducer 50, the backing material 56, the relay substrate 54, and the ASIC 52 are arranged in this order from the front side. Therefore, the vibrator 50 is provided on the front side, that is, closer to the ultrasonic wave transmitting / receiving surface than the ASIC 52, and the ASIC 52 that is the main heat source is located on the rear side of the vibrator 50, that is, farther from the ultrasonic wave transmitting / receiving surface. Provided.

  FIG. 4 is a view showing the structure of the rear heat conductor 34. The structure of the rear heat conductor 34 will be described with reference to FIG. As shown in FIG. 4, the rear heat conductor 34 includes a main frame 36, an upper frame 38, and a lower frame 40. The main frame 36, the upper frame 38, and the lower frame 40 have shapes that can be combined with each other, and the rear heat conductor 34 is configured by combining these. Specifically, the main frame 36 has a structure in which the upper and lower sides are released, and the plate-like upper frame 38 is combined so as to cover the upper release portion of the main frame 36, and the plate-like lower frame 40 is also formed. Are combined so as to cover the lower open part of the main frame 36.

  In the present embodiment, a convex portion 74 and a concave portion 76 are provided at the rear portion of the main frame 36. The rear portion of the upper frame 38 is provided with a concave portion 80 at a position facing the convex portion 74, and a convex portion 78 is provided at a position facing the concave portion 76. The convex portion 74 and the concave portion 80 are fitted into the concave portion 76 and the convex portion 78, respectively. Further, projecting sides 82 are provided on both sides of the upper frame 38. A groove portion 84 is provided at a position facing the protruding side 82 of the main frame 36. The protruding side 82 and the groove 84 are fitted together. With the above structure, the main frame 36 and the upper frame 38 are combined. Similarly, the lower frame 40 is combined with the main frame 36.

  The rear heat conductor 34 in which the main frame 36, the upper frame 38, and the lower frame 40 are combined has an elliptical outline in the xz cross section. Similarly, the xz cross section of the inner peripheral surface of the rear case 16 is also elliptical, so that the outer peripheral surface of the rear heat conductor 34 is just within the inner peripheral surface of the rear case 16. Thereby, the contact area between the rear heat conductor 34 and the rear case 16 is increased, and the heat transferred to the rear heat conductor 34 can be transferred to the rear case 16 more efficiently. However, the xz cross-sectional contour of the rear heat conductor 34 does not necessarily have an elliptical shape, and it is sufficient that at least a part of the outer peripheral surface is in contact with the inner peripheral surface of the rear case 16. Of course, since it is preferable that the contact area between the rear case 16 and the rear heat conductor 34 is large, the shape of the rear heat conductor 34 conforms to the inner peripheral surface of the rear case 16 as described above. It is preferable.

  The main frame 36 has a front side surface 70 in contact with the ASIC 52 at the foremost part. When the front side surface 70 is in direct or indirect contact with the ASIC 52, heat generated in the ASIC 52 can be transmitted to the rear side of the ASIC 52. This prevents heat from the ASIC 52 from being transmitted to the ultrasonic wave transmitting / receiving surface side. Further, the main frame 36 has a block 72 extending from the front side surface 70 to the rear side. By having the block 72, the rear heat conductor 34 is not a cylindrical hollow structure but a solid structure that is filled to some extent. As a result, the volume of the rear heat conductor 34 increases, so that the heat capacity increases, and consequently the heat absorption or heat conductivity of the rear heat conductor 34 is improved. Considering only the heat absorption rate and the heat transfer rate, it is preferable that the rear heat conductor 34 has a completely solid structure, and such a mode can also be adopted. However, in this embodiment, a certain amount of space (gap) is left in order to reduce the weight of the ultrasonic probe or to accommodate the FPC 42, the wire 44, or the connector 46 in the rear heat conductor.

  As described above, when the main frame 36, the upper frame 38, and the lower frame 40 are combined, between the block 72 and the upper frame 38, between the block 72 and the lower frame 40, and A gap portion is formed in a portion on the rear side from the rear end portion. The FPC 42, the connector 46, and the wire 44 are disposed in the gap portion. As a result, the FPC 42, the connector 46 and the wire 44 are also arranged inside the rear heat conductor 34, so that the FPC 42, the connector 46 and the wire 44 contact the rear heat conductor 34 and the rear case 16. Will not be hindered.

  The rear heat conductor 34 is preferably made of a material having good heat conductivity. Further, it is preferable that the ultrasonic probe 10 is made of a material having a low specific gravity in order to reduce the weight. In the present embodiment, aluminum that satisfies the above requirements is used as the material of the rear heat conductor 34, but other metals such as copper may be used.

  FIG. 5 is a yz sectional view of the ultrasonic probe 10. FIG. 6 is an xy sectional view of the ultrasonic probe 10. With reference to FIGS. 5 and 6, the structure of the front heat conductor 32 and the positional relationship between the front heat conductor 32 and the rear heat conductor 34 will be described. The front heat conductor 32 is provided between the wave transmitting / receiving unit 30 and the front case 14. The front heat conductor 32 is provided to absorb heat from the vibrator 50 or heat from the ASIC 52 transmitted to the front side and transport a part thereof to the front case 14. The front heat conductor 32 also needs to have at least a part of the outer peripheral surface that contacts the inner peripheral surface of the front case 14, but the front heat conductor 32 can efficiently transfer heat to the front case 14. The contact area between the front case 14 and the front case 14 is preferably large. In the present embodiment, the front heat conductor 32 has a cylindrical shape, and has an outer peripheral surface that follows the inner peripheral surface of the front case 14. By arranging the outer peripheral surface of the front heat conductor 32 along the inner peripheral surface of the front case 14, the contact area with the outer peripheral surface of the front heat conductor 32 is improved.

  In order to efficiently transfer heat from the vibrator 50 to the front heat conductor 32, it is preferable that the vibrator 50 and the front heat conductor 32 are in direct contact with each other. When it is difficult to bring the vibrator 50 and the front heat conductor 32 into direct contact, such as when the lens 60 is provided so as to cover the vibrator 50, the vibration from the vibrator 50 to the front heat conductor 32 can be avoided. A mechanism for efficiently transferring heat from the vibrator 50 to the front heat conductor 32 may be provided in the heat conduction path. For example, a copper foil or a graphite sheet, which is a substance having a high heat transfer coefficient, may be adhered around the backing material 56 and the graphite sheet may be connected to the front heat conductor 32.

  Like the rear heat conductor 34, the front heat conductor 32 is preferably made of a material having good heat conductivity and light weight. In the present embodiment, aluminum that satisfies the above requirements is used as the material of the front heat conductor 32, but other metals such as copper may be used.

  The ultrasonic probe 10 has a heat conduction limiting structure that limits the heat conduction between the front heat conductor 32 and the rear heat conductor 34. As described above, the main heat source in the ultrasonic probe 10 is the ASIC 52, and the heat from the ASIC 52 is transferred to the rear heat conductor 34. Therefore, if the heat is transmitted from the rear heat conductor 34 to the front heat conductor 34, the heat from the ASIC 52, which is the main heat source, is transmitted to the front heat conductor 34, and as a result, the temperature of the ultrasonic wave transmitting / receiving surface is increased. become. In order to prevent such a situation, the ultrasonic probe 10 restricts the heat conduction between the front heat conductor 32 and the rear heat conductor 34, and the heat from the ASIC 52 is transmitted to the front heat conductor 32. Restricted.

  In the present embodiment, a spatial gap 88 is provided between the front thermal conductor 32 and the rear thermal conductor 34 in order to limit the heat conduction between the front thermal conductor 32 and the rear thermal conductor 34. Is provided. The length of the spatial gap 88 is better when considering only thermal limitation, but is preferably set to an appropriate size in consideration of the size or strength of the ultrasonic probe 10. Appropriate in consideration, that is, the front heat conductor 32 is disposed at a position spaced apart from the rear heat conductor, and the two are not in contact except for a part thereof. It is a restricted structure. Further, in order to provide a spatial gap as described above and to match the potential (ground potential) between the front thermal conductor 32 and the rear thermal conductor 34, both may be electrically connected by a wire or the like. Good. Also in this case, it is preferable to use a wire made of a material having low thermal conductivity (for example, iron, titanium, etc.). Further, instead of or in addition to the spatial gap 88, a material having low thermal conductivity may be provided between the front thermal conductor 32 and the rear thermal conductor 34.

  FIG. 7 is a diagram showing another example of the heat conduction limiting structure. In the example shown in FIG. 7, a protrusion 90 extending toward the rear side is provided on the front thermal conductor 32 a. The projecting portion 90 includes a claw portion 92 and a support portion 94 that supports the claw portion 92. The protrusion length of the claw portion 92 (the protrusion length from the surface facing the rear heat conductor 34a of the front heat conductor 32a) is d1. In this example, two protrusions 90 are provided on opposite sides of the front heat conductor 32a, but the number of protrusions 90 is not limited to this.

  In the rear heat conductor 34a, a groove 96 is provided at a position corresponding to the protrusion 90. The width of the groove 96 is substantially the same as or slightly larger than the width of the claw 92, and the claw 92 can be fitted therein. The depth d2 of the groove portion 96 (the distance from the front side surface 70a of the rear heat conductor 34a to the deepest portion of the groove portion 96) is smaller than the protruding length d1 of the claw portion 92.

  FIG. 8 is a view showing a state in which the front heat conductor 32a and the rear heat conductor 34a are combined. As shown in FIG. 8, the nail | claw part 92 provided in the front side heat conductor 32a is fitted by the groove part 96 provided in the back side heat conductor 34a, Therefore The front side heat conductor 32a and the back side heat conductor 34a Are combined. As described above, since the depth d2 of the groove portion 96 is smaller than the protruding length d1 of the claw portion 92, a spatial gap 100 is generated between the front heat conductor 32a and the rear heat conductor 34a in the combined state. . The distance of the spatial gap 100 is a value obtained by subtracting the depth d2 of the groove 96 from the protruding length d1 of the claw 92.

  The spatial gap 100 formed as described above limits the heat conduction between the front heat conductor 32a and the rear heat conductor 34a. That is, the spatial gap 100 plays a role similar to the spatial gap 88 shown in FIGS. In the example shown in FIG. 8, since the front heat conductor 32a and the rear heat conductor 34a are in contact with each other at the claw portion 92 and the groove portion 96, the potentials of both heat conductors can be matched at this point. It becomes possible. Further, the claw portion 92 also has a function as a support between the front heat conductor 32a and the rear heat conductor 34a. By having the claw portion 92, it is possible to prevent the positional deviation between the two heat conductors while limiting the heat conduction between the front heat conductor 32a and the rear heat conductor 34a. The strength as a whole is improved. Furthermore, the strength of the ultrasonic probe 10 can be further improved by providing the support portion 94 that supports the claw portion 92.

  Returning to FIG. 5 and FIG. 6, the gap portion 86 between the wave transmitting / receiving unit 30 and the front heat conductor 32 may be filled with a filler containing a heat storage material. The heat storage material contained in the filler absorbs heat in the ultrasonic probe 10. The heat storage material is preferably a phase change material that changes phase from a solid to a liquid as the temperature rises, for example. Phase change materials have the property of absorbing heat during a phase change from a solid to a liquid. Therefore, in the vicinity of the phase change temperature, which is the temperature at which the phase change material changes from a solid to a liquid, the phase change material absorbs heat, so that an increase in temperature in the ultrasonic probe 10 can be suppressed. Thereby, the temperature rise of an ultrasonic wave transmission / reception surface is suppressed.

  As the filler, for example, a microcapsule in which a phase change material as a heat storage material is sealed in an insulating and viscous base material such as silicon, epoxy, or urethane. In this embodiment, paraffin is used as the phase change material. The temperature at which the phase change material changes from a solid to a liquid may be appropriately selected according to the amount of heat generated in the ultrasonic probe 10 or the like. The filler is preferably filled in the gap 86 as much as possible, but is preferably filled to the extent that it does not interfere with the spatial gap 88 so as not to impair the function of the above-described heat conduction limiting structure.

  In this embodiment, the gap 86 is filled with the filler, but the same filler may be filled in the space inside the rear heat conductor 34. Thereby, the heat from the ASIC 52 can be absorbed by the heat storage material, and the conduction of the heat from the ASIC 52 to the ultrasonic wave transmitting / receiving surface can be further restricted.

  FIG. 9 is a yz sectional view of the rearmost part of the rear case 16. A heat radiating structure for releasing the heat of the rear heat conductor 34 to the cable 18 will be described with reference to FIG. The rearmost part of the rear heat conductor 34 and the rearmost part of the rear case 16 have a substantially circular hole in the xz cross section, and the cable 18 extends from the hole to the outside of the ultrasonic probe 10. Further, as described above, the cable protection boot 20 is provided to protect the joint portion between the cable 18 and the rear case 16. An end portion of the cable protection boot 20 on the ultrasonic probe 10 side has a flange portion 110 having a diameter larger than that of other portions in the xz cross section. The cable protection boot 20 is held by the collar portion 110 being engaged with the step portion 112 provided at the rearmost portion of the rear heat conductor 34.

  The cable 18 includes a wire 44, but includes a ground sheath 114 immediately below the outer sheath of the cable 18. The ground sheath 114 is a net-like electric wire and is generally connected to an earth potential in order to shield the cable 18. In the present embodiment, the ground sheath 114 and the rear thermal conductor 34 are thermally connected, and the heat of the rear thermal conductor 34 is radiated to the ground sheath 114 side (that is, outside the ultrasonic probe 10).

  In the present embodiment, the ground sheath 114 is pulled out from the end of the cable 18 on the ultrasonic probe 10 side, and the drawn portion is thermally connected to the rear heat conductor 34. Specifically, the ground sheath 114 pulled out together with the collar portion 110 of the cable protection boot 20 is engaged with the step portion 112 of the rear heat conductor 34, and the ground sheath 114 and the rear heat conductor 34 are contacted at the contact portion 116. Contact.

  According to the heat dissipation structure shown in FIG. 9, the heat of the rear heat conductor 34 is transmitted to the ground sheath 114 via the contact portion 116, and the heat is dissipated outside the ultrasonic probe 10 via the ground sheath 114. . As a result, heat from the ASIC, which is the main heat source, is transmitted not only to the rear case 16 but also to the ground sheath 114 via the rear heat conductor 34, and heat from the ASIC is transmitted to the ultrasonic wave transmitting / receiving surface. Conduction can be further suppressed.

  In the above-described embodiment, the ASIC 52 is the main heat source. However, the present invention is also effective when the ultrasonic probe 10 is a wireless probe having a battery and the battery is the main heat source. For example, a battery is disposed inside the rear heat conductor 34, and the heat conduction between the front heat conductor 32 and the rear heat conductor 34 is limited by the above-described heat conduction limiting structure. Thereby, it can restrict | limit that the heat from a battery is transmitted to the front side heat conductor 32, and can radiate | emit the heat from a battery via the rear side case 16. FIG.

  DESCRIPTION OF SYMBOLS 10 Ultrasonic probe, 12 Ultrasonic transmission / reception surface, 14 Front case, 16 Rear case, 18 Cable, 20 Cable protection boot, 30 Transmission / reception unit, 32 Front thermal conductor, 34 Rear thermal conductor, 36 Main frame, 38 Upper frame, 40 Lower frame, 42 FPC, 44 Wire material, 46 Connector, 50 Vibrator, 52 ASIC, 54 Relay board, 56 Backing material, 58 Acoustic matching layer, 60 Lens, 70 Front side, 72 Block, 74, 78 Convex part, 76, 80 Concave part, 82 Protruding side, 84,96 Groove part, 86 Gap part, 88,100 Spatial gap, 90 Protruding part, 92 Claw part, 94 Support part, 110 Collar part, 112 Step part, 114 Ground sheath, 116 contact portion.

Claims (7)

A probe case,
An ultrasonic transducer that is provided at a front portion in the probe case and transmits and receives ultrasonic waves;
A front heat conductor that is provided at a front portion in the probe case and that transmits heat from the ultrasonic transducer;
An electronic circuit as a heat source provided at the rear in the probe case;
A rear heat conductor that is provided at a rear portion in the probe case and transmits heat from the electronic circuit;
A heat conduction limiting structure that is provided across the front heat conductor and the rear heat conductor and restricts heat conduction from the rear heat conductor to the front heat conductor;
An ultrasonic probe comprising: The rear heat conductor has an outer peripheral surface in contact with the inner peripheral surface of the probe case, and heat is transferred from the outer peripheral surface to the inner peripheral surface.
The ultrasonic probe according to claim 1. The rear heat conductor has a heat conduction surface in contact with the electronic circuit, and a heat conduction block extending rearward from the heat conduction surface,
The ultrasonic probe according to claim 2, further comprising: A heat dissipating structure that is provided at the rear end of the rear heat conductor and releases heat to the probe cable extending outside the probe case,
The ultrasonic probe according to claim 1, further comprising: The heat conduction limiting structure is a structure having a spatial gap between the front heat conductor and the rear heat conductor.
The ultrasonic probe according to claim 1. The heat conduction limiting structure is
A protrusion provided on one of the front thermal conductor and the rear thermal conductor;
A support portion that is provided on the other of the front heat conductor and the rear heat conductor and supports the protrusion;
Including
The spatial gap is generated between the front heat conductor and the rear heat conductor by the support portion supporting the protrusion.
The ultrasonic probe according to claim 5. The protrusion has a support function between the front heat conductor and the rear heat conductor.
The ultrasonic probe according to claim 6.